TW273638B - - Google Patents
Info
- Publication number
- TW273638B TW273638B TW084105223A TW84105223A TW273638B TW 273638 B TW273638 B TW 273638B TW 084105223 A TW084105223 A TW 084105223A TW 84105223 A TW84105223 A TW 84105223A TW 273638 B TW273638 B TW 273638B
- Authority
- TW
- Taiwan
Links
Classifications
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- H10P72/74—
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- H10W70/093—
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
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- H10W72/01204—
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- H10W72/07251—
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- H10W72/20—
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP475194 | 1994-01-20 | ||
| JP7003679A JPH07249631A (ja) | 1994-01-20 | 1995-01-13 | はんだバンプ及びはんだボールの製造方法及び半導体装置の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW273638B true TW273638B (cg-RX-API-DMAC10.html) | 1996-04-01 |
Family
ID=26337314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW084105223A TW273638B (cg-RX-API-DMAC10.html) | 1994-01-20 | 1995-05-24 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH07249631A (cg-RX-API-DMAC10.html) |
| TW (1) | TW273638B (cg-RX-API-DMAC10.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105489511A (zh) * | 2015-11-30 | 2016-04-13 | 苏州瑞而美光电科技有限公司 | 标径bga封装金属焊球的制备方法及模具 |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3401391B2 (ja) * | 1996-04-16 | 2003-04-28 | 日本特殊陶業株式会社 | 半田バンプを有する基板の製造方法 |
| MY130223A (en) * | 1996-08-27 | 2007-06-29 | Nippon Steel Corp | Semiconductor device provided with low melting point metal bumps and process for producing same |
| DE19634646A1 (de) * | 1996-08-27 | 1998-03-05 | Pac Tech Gmbh | Verfahren zur selektiven Belotung |
| KR20010023027A (ko) * | 1997-08-19 | 2001-03-26 | 가나이 쓰토무 | 범프 전극 형성 방법 및 반도체 장치 제조 방법 |
| US6653219B2 (en) | 2000-01-13 | 2003-11-25 | Hitachi, Ltd. | Method of manufacturing bump electrodes and a method of manufacturing a semiconductor device |
| KR20030070342A (ko) * | 2002-02-25 | 2003-08-30 | 최록일 | 반도체 소자의 솔더볼 형성장치 및 그 탑재방법 |
| DE102004041026A1 (de) * | 2004-08-25 | 2005-11-03 | Infineon Technologies Ag | Verfahren zur Herstellung eines oder mehrerer Kontakthügel auf einer Substratscheibe |
| WO2015052780A1 (ja) * | 2013-10-08 | 2015-04-16 | リンテック株式会社 | 電子部品実装体の製造方法 |
| JP2017157626A (ja) * | 2016-02-29 | 2017-09-07 | 三菱マテリアル株式会社 | はんだバンプの形成方法 |
| WO2021131905A1 (ja) * | 2019-12-27 | 2021-07-01 | 昭和電工マテリアルズ株式会社 | はんだバンプ形成用部材、はんだバンプ形成用部材の製造方法、及びはんだバンプ付き電極基板の製造方法 |
| CN115152007A (zh) * | 2019-12-27 | 2022-10-04 | 昭和电工材料株式会社 | 焊料凸块形成用部件、焊料凸块形成用部件的制造方法及带焊料凸块的电极基板的制造方法 |
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1995
- 1995-01-13 JP JP7003679A patent/JPH07249631A/ja active Pending
- 1995-05-24 TW TW084105223A patent/TW273638B/zh active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105489511A (zh) * | 2015-11-30 | 2016-04-13 | 苏州瑞而美光电科技有限公司 | 标径bga封装金属焊球的制备方法及模具 |
| CN105489511B (zh) * | 2015-11-30 | 2019-01-25 | 苏州瑞而美光电科技有限公司 | 标径bga封装金属焊球的制备方法及模具 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07249631A (ja) | 1995-09-26 |