TW266318B - - Google Patents

Info

Publication number
TW266318B
TW266318B TW083104077A TW83104077A TW266318B TW 266318 B TW266318 B TW 266318B TW 083104077 A TW083104077 A TW 083104077A TW 83104077 A TW83104077 A TW 83104077A TW 266318 B TW266318 B TW 266318B
Authority
TW
Taiwan
Prior art keywords
contour
cavity
wafer
portable object
support
Prior art date
Application number
TW083104077A
Other languages
English (en)
Original Assignee
Leroux Gilles Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leroux Gilles Sa filed Critical Leroux Gilles Sa
Application granted granted Critical
Publication of TW266318B publication Critical patent/TW266318B/zh

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Casings For Electric Apparatus (AREA)
  • Laser Beam Processing (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Pressure Sensors (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Adornments (AREA)
  • Die Bonding (AREA)
TW083104077A 1993-04-06 1994-05-05 TW266318B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9304072A FR2703806B1 (fr) 1993-04-06 1993-04-06 Objet portatif et procede de fabrication.

Publications (1)

Publication Number Publication Date
TW266318B true TW266318B (zh) 1995-12-21

Family

ID=9445810

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083104077A TW266318B (zh) 1993-04-06 1994-05-05

Country Status (10)

Country Link
US (1) US5563444A (zh)
EP (1) EP0623897B1 (zh)
JP (1) JPH07117386A (zh)
KR (1) KR100328427B1 (zh)
AT (1) ATE182704T1 (zh)
CA (1) CA2120583C (zh)
DE (1) DE69419659T2 (zh)
ES (1) ES2136174T3 (zh)
FR (1) FR2703806B1 (zh)
TW (1) TW266318B (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19502398A1 (de) * 1995-01-26 1996-08-01 Giesecke & Devrient Gmbh Verfahren zur Montage eines elektronischen Moduls in einem Kartenkörper
FR2736867B1 (fr) * 1995-07-19 1997-10-10 Leroux Gilles Sa Objet portatif comportant un micromodule a circuit integre, et procede de fabrication par moulage dudit objet
DE19528730A1 (de) * 1995-08-04 1997-02-06 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines Datenträgers
US6306240B1 (en) * 1996-08-05 2001-10-23 Gemplus Method for making smart cards, and resulting cards
DE19720226C5 (de) * 1997-05-14 2007-11-22 Künnecke Verwaltungs GmbH & Co. Holding KG Verfahren und Vorrichtung zur Herstellung von Chipkarten
WO1999004367A1 (en) * 1997-07-18 1999-01-28 Dai Nippon Printing Co., Ltd. Ic module, ic card, sealing resin for ic module, and method for manufacturing ic module
US6213376B1 (en) 1998-06-17 2001-04-10 International Business Machines Corp. Stacked chip process carrier
US6173632B1 (en) * 1998-11-23 2001-01-16 Semiconductor Technologies & Instruments, Inc. Single station cutting apparatus for separating semiconductor packages
EP1033676A1 (de) * 1999-03-04 2000-09-06 Sempac SA Verfahren für die Herstellung eines Chipobjektes
EP1033677A1 (de) * 1999-03-04 2000-09-06 ESEC Management SA Verfahren für die Herstellung eines Chipobjektes
DE60110906T2 (de) * 2000-04-04 2006-04-27 Toray Engineering Co., Ltd. Verfahren zur herstellung eines cof-gehäuses
US6821812B1 (en) * 2002-12-13 2004-11-23 Kla-Tencor Technologies Corporation Structure and method for mounting a small sample in an opening in a larger substrate
FR2925969B1 (fr) * 2007-12-26 2010-01-22 Datacard Corp Procede et dispositif d'encartage d'un module ou puce.
DE102008018491B3 (de) * 2008-04-11 2009-09-17 Giesecke & Devrient Gmbh Verfahren und Vorrichtung zum Implantieren eines Chipmoduls in einen Chipkartenkörper
DE102008027771A1 (de) * 2008-06-11 2009-12-17 Giesecke & Devrient Gmbh Verfahren zum Einbauen eines Chipmoduls in einen Chipkartenkörper
DE102009037627A1 (de) * 2009-08-14 2011-02-17 Giesecke & Devrient Gmbh Portabler Datenträger
JP2013109489A (ja) * 2011-11-18 2013-06-06 Toppan Printing Co Ltd Ｉｃカード
DE102016201976B3 (de) * 2016-02-10 2017-02-16 Bundesdruckerei Gmbh Vorrichtung und Verfahren zur Bearbeitung eines Substrats

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3248385A1 (de) * 1982-12-28 1984-06-28 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit integriertem schaltkreis
FR2538930B1 (fr) * 1983-01-05 1989-05-19 Seiichiro Aigo Carte d'information
FR2625350B1 (fr) * 1987-12-29 1991-05-24 Bull Cp8 Carte a microcircuits electroniques et procede de fabrication de cette carte
FR2665281B1 (fr) * 1990-07-30 1993-11-19 Gemplus Card International Procede de fabrication d'une carte a microcircuit et carte obtenue par ce procede.
US5233500A (en) * 1992-06-01 1993-08-03 Conductus, Inc. Package for cascaded microwave devices

Also Published As

Publication number Publication date
CA2120583A1 (fr) 1994-10-07
EP0623897A1 (fr) 1994-11-09
FR2703806A1 (fr) 1994-10-14
EP0623897B1 (fr) 1999-07-28
FR2703806B1 (fr) 1995-07-13
DE69419659T2 (de) 2000-01-13
CA2120583C (fr) 2004-10-26
ES2136174T3 (es) 1999-11-16
DE69419659D1 (de) 1999-09-02
KR100328427B1 (ko) 2002-07-27
JPH07117386A (ja) 1995-05-09
ATE182704T1 (de) 1999-08-15
US5563444A (en) 1996-10-08

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