TW262402B - - Google Patents

Info

Publication number
TW262402B
TW262402B TW083103101A TW83103101A TW262402B TW 262402 B TW262402 B TW 262402B TW 083103101 A TW083103101 A TW 083103101A TW 83103101 A TW83103101 A TW 83103101A TW 262402 B TW262402 B TW 262402B
Authority
TW
Taiwan
Application number
TW083103101A
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Application granted granted Critical
Publication of TW262402B publication Critical patent/TW262402B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0021—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by liquid gases or supercritical fluids
    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06F—LAUNDERING, DRYING, IRONING, PRESSING OR FOLDING TEXTILE ARTICLES
    • D06F19/00—Washing machines using vibrations for washing purposes
    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06F—LAUNDERING, DRYING, IRONING, PRESSING OR FOLDING TEXTILE ARTICLES
    • D06F43/00—Dry-cleaning apparatus or methods using volatile solvents
    • D06F43/08—Associated apparatus for handling and recovering the solvents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
TW083103101A 1993-04-12 1994-04-08 TW262402B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US4468493A 1993-04-12 1993-04-12

Publications (1)

Publication Number Publication Date
TW262402B true TW262402B (zh) 1995-11-11

Family

ID=21933740

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083103101A TW262402B (zh) 1993-04-12 1994-04-08

Country Status (5)

Country Link
EP (1) EP0624405B1 (zh)
JP (1) JP2857054B2 (zh)
CA (1) CA2120537A1 (zh)
DE (1) DE69401980T2 (zh)
TW (1) TW262402B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI419744B (zh) * 2004-06-14 2013-12-21 Ecoservices Llc 收集與處理清洗引擎之廢水的系統及裝置

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19509573C2 (de) 1995-03-16 1998-07-16 Linde Ag Reinigung mit flüssigem Kohlendioxid
US5881577A (en) * 1996-09-09 1999-03-16 Air Liquide America Corporation Pressure-swing absorption based cleaning methods and systems
EP0893166A4 (en) * 1996-09-25 2004-11-10 Shuzurifuresher Kaihatsukyodok WASHING SYSTEM USING LIQUID, HIGH DENSITY GAS
US6880560B2 (en) * 2002-11-18 2005-04-19 Techsonic Substrate processing apparatus for processing substrates using dense phase gas and sonic waves
CN102489478A (zh) * 2011-12-29 2012-06-13 镇江市港南电子有限公司 一种硅片清洗方法
CN106513376B (zh) * 2016-10-31 2022-05-31 辽宁工程技术大学 超声波清洗方法及装置
JP6979852B2 (ja) * 2017-10-26 2021-12-15 株式会社Ｓｃｒｅｅｎホールディングス 処理液供給装置、基板処理装置、および処理液供給方法
CN110201654B (zh) * 2019-07-11 2024-04-09 国家电网有限公司 基于超声空化效应的六氟化硫吸附剂回收处理系统及方法
CN117711991A (zh) * 2024-02-05 2024-03-15 苏州智程半导体科技股份有限公司 一种晶圆槽式清洗设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4618263A (en) * 1982-09-22 1986-10-21 Mccord James W Sound suppressor in a liquid medium
US5213619A (en) * 1989-11-30 1993-05-25 Jackson David P Processes for cleaning, sterilizing, and implanting materials using high energy dense fluids
JPH03190131A (ja) * 1989-12-19 1991-08-20 Iwatani Internatl Corp 半導体基板の洗浄装置
JPH05182943A (ja) * 1991-12-27 1993-07-23 Idemitsu Kosan Co Ltd 基板の処理方法および処理装置
US5316591A (en) * 1992-08-10 1994-05-31 Hughes Aircraft Company Cleaning by cavitation in liquefied gas
US5279316A (en) * 1992-08-18 1994-01-18 P.C.T. Systems, Inc. Multiprocessing sonic bath system for semiconductor wafers

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI419744B (zh) * 2004-06-14 2013-12-21 Ecoservices Llc 收集與處理清洗引擎之廢水的系統及裝置

Also Published As

Publication number Publication date
DE69401980D1 (de) 1997-04-17
DE69401980T2 (de) 1997-11-20
EP0624405B1 (en) 1997-03-12
JP2857054B2 (ja) 1999-02-10
CA2120537A1 (en) 1994-10-13
JPH0751645A (ja) 1995-02-28
EP0624405A1 (en) 1994-11-17

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