TW259894B - - Google Patents
Info
- Publication number
- TW259894B TW259894B TW083102844A TW83102844A TW259894B TW 259894 B TW259894 B TW 259894B TW 083102844 A TW083102844 A TW 083102844A TW 83102844 A TW83102844 A TW 83102844A TW 259894 B TW259894 B TW 259894B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
- H10W72/01221—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition
- H10W72/01225—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition in solid form, e.g. by using a powder or by stud bumping
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/221—Structures or relative sizes
- H10W72/222—Multilayered bumps, e.g. a coating on top and side surfaces of a bump core
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5116266A JPH06333982A (ja) | 1993-05-19 | 1993-05-19 | 半導体集積回路装置の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW259894B true TW259894B (forum.php) | 1995-10-11 |
Family
ID=14682838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW083102844A TW259894B (forum.php) | 1993-05-19 | 1994-03-31 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPH06333982A (forum.php) |
| KR (1) | KR100379823B1 (forum.php) |
| TW (1) | TW259894B (forum.php) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH118270A (ja) * | 1997-06-16 | 1999-01-12 | Tokai Rika Co Ltd | 半導体チップの搭載方法、チップオンチップ構造体の製造方法及びチップオンボード構造体の製造方法 |
| WO2001026147A1 (en) * | 1999-10-04 | 2001-04-12 | Seiko Epson Corporation | Semiconductor device, method of manufacture thereof, circuit board, and electronic device |
| JP2002270630A (ja) * | 2001-03-13 | 2002-09-20 | Ngk Spark Plug Co Ltd | 平坦化装置及びヘッド |
| CH698718B1 (de) * | 2007-01-31 | 2009-10-15 | Oerlikon Assembly Equipment Ag | Vorrichtung für die Montage eines Flipchips auf einem Substrat. |
| JP4641551B2 (ja) * | 2008-06-13 | 2011-03-02 | 富士通株式会社 | 半導体装置の製造方法 |
| JP5971987B2 (ja) * | 2012-03-02 | 2016-08-17 | 新日本無線株式会社 | 半導体装置の製造方法 |
| JP2013030789A (ja) * | 2012-09-10 | 2013-02-07 | Seiko Epson Corp | 実装構造体及び実装構造体の製造方法 |
| JP6407102B2 (ja) * | 2014-07-30 | 2018-10-17 | 太陽誘電株式会社 | 弾性波デバイス及びその製造方法 |
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1993
- 1993-05-19 JP JP5116266A patent/JPH06333982A/ja not_active Withdrawn
-
1994
- 1994-03-31 TW TW083102844A patent/TW259894B/zh active
- 1994-05-06 KR KR1019940009859A patent/KR100379823B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR100379823B1 (ko) | 2003-06-02 |
| JPH06333982A (ja) | 1994-12-02 |
| KR940027134A (ko) | 1994-12-10 |