TW259894B - - Google Patents

Info

Publication number
TW259894B
TW259894B TW083102844A TW83102844A TW259894B TW 259894 B TW259894 B TW 259894B TW 083102844 A TW083102844 A TW 083102844A TW 83102844 A TW83102844 A TW 83102844A TW 259894 B TW259894 B TW 259894B
Authority
TW
Taiwan
Application number
TW083102844A
Other languages
Chinese (zh)
Original Assignee
Hitachi Seisakusyo Kk
Hitachi Cho Lsi Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Seisakusyo Kk, Hitachi Cho Lsi Eng Co Ltd filed Critical Hitachi Seisakusyo Kk
Application granted granted Critical
Publication of TW259894B publication Critical patent/TW259894B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01221—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition
    • H10W72/01225—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition in solid form, e.g. by using a powder or by stud bumping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/221—Structures or relative sizes
    • H10W72/222—Multilayered bumps, e.g. a coating on top and side surfaces of a bump core
TW083102844A 1993-05-19 1994-03-31 TW259894B (env)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5116266A JPH06333982A (ja) 1993-05-19 1993-05-19 半導体集積回路装置の製造方法

Publications (1)

Publication Number Publication Date
TW259894B true TW259894B (env) 1995-10-11

Family

ID=14682838

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083102844A TW259894B (env) 1993-05-19 1994-03-31

Country Status (3)

Country Link
JP (1) JPH06333982A (env)
KR (1) KR100379823B1 (env)
TW (1) TW259894B (env)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH118270A (ja) * 1997-06-16 1999-01-12 Tokai Rika Co Ltd 半導体チップの搭載方法、チップオンチップ構造体の製造方法及びチップオンボード構造体の製造方法
WO2001026147A1 (en) * 1999-10-04 2001-04-12 Seiko Epson Corporation Semiconductor device, method of manufacture thereof, circuit board, and electronic device
JP2002270630A (ja) * 2001-03-13 2002-09-20 Ngk Spark Plug Co Ltd 平坦化装置及びヘッド
CH698718B1 (de) * 2007-01-31 2009-10-15 Oerlikon Assembly Equipment Ag Vorrichtung für die Montage eines Flipchips auf einem Substrat.
JP4641551B2 (ja) * 2008-06-13 2011-03-02 富士通株式会社 半導体装置の製造方法
JP5971987B2 (ja) * 2012-03-02 2016-08-17 新日本無線株式会社 半導体装置の製造方法
JP2013030789A (ja) * 2012-09-10 2013-02-07 Seiko Epson Corp 実装構造体及び実装構造体の製造方法
JP6407102B2 (ja) * 2014-07-30 2018-10-17 太陽誘電株式会社 弾性波デバイス及びその製造方法

Also Published As

Publication number Publication date
KR100379823B1 (ko) 2003-06-02
JPH06333982A (ja) 1994-12-02
KR940027134A (ko) 1994-12-10

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