TW225006B - The exposure device - Google Patents

The exposure device

Info

Publication number
TW225006B
TW225006B TW082110177A TW82110177A TW225006B TW 225006 B TW225006 B TW 225006B TW 082110177 A TW082110177 A TW 082110177A TW 82110177 A TW82110177 A TW 82110177A TW 225006 B TW225006 B TW 225006B
Authority
TW
Taiwan
Prior art keywords
thin film
frame
base plate
bottom plate
exposure
Prior art date
Application number
TW082110177A
Other languages
Chinese (zh)
Inventor
Shigemi Sunamoto
Original Assignee
Seikosya Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seikosya Kk filed Critical Seikosya Kk
Application granted granted Critical
Publication of TW225006B publication Critical patent/TW225006B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

One type of exposure device has the following features: 1. exposure parts with one pair of bottom plate thin film built on the top and bottom side of base plate to expose them simultaneously; 2. bottom frame to hold the lower bottom plate thin film; 3. top frame, opposite to the bottom frame, to hold the upper bottom plate thin film; 4. light sources installed on the both sides of base plate through the thin film for exposure; 5. frame positioning mechanism to adjust the relative position between top and bottom frame; 6. by the static electricity generated by the power the static electricity absorbing mechanism can absorb the base plate to the bottom frame firmly through the lower bottom plate thin film.
TW082110177A 1992-12-11 1993-12-02 The exposure device TW225006B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP33179592 1992-12-11
JP04125393A JP3321225B2 (en) 1992-12-11 1993-03-02 Exposure equipment

Publications (1)

Publication Number Publication Date
TW225006B true TW225006B (en) 1994-06-11

Family

ID=26380821

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082110177A TW225006B (en) 1992-12-11 1993-12-02 The exposure device

Country Status (3)

Country Link
JP (1) JP3321225B2 (en)
KR (1) KR970007787B1 (en)
TW (1) TW225006B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3624260B2 (en) * 1994-08-30 2005-03-02 信越ポリマー株式会社 Cutting method of printed circuit board
JP2001297971A (en) * 2000-04-14 2001-10-26 Ulvac Japan Ltd Aligner
CN100454141C (en) 2002-08-27 2009-01-21 奥博杜卡特股份公司 Device for transferring a pattern to an object
JP4381009B2 (en) * 2003-03-12 2009-12-09 新光電気工業株式会社 Pattern drawing apparatus, pattern drawing method, and inspection apparatus
CN102497738B (en) * 2011-12-19 2016-03-30 深圳市景旺电子股份有限公司 A kind of method applying outer semi-automatic exposure machine making core material
CN102768475A (en) * 2012-07-26 2012-11-07 四川聚能核技术工程有限公司 Alignment restoring system and method for exposure machines

Also Published As

Publication number Publication date
KR970007787B1 (en) 1997-05-16
KR940015696A (en) 1994-07-21
JP3321225B2 (en) 2002-09-03
JPH06230581A (en) 1994-08-19

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