TW223732B - - Google Patents

Info

Publication number
TW223732B
TW223732B TW082105719A TW82105719A TW223732B TW 223732 B TW223732 B TW 223732B TW 082105719 A TW082105719 A TW 082105719A TW 82105719 A TW82105719 A TW 82105719A TW 223732 B TW223732 B TW 223732B
Authority
TW
Taiwan
Application number
TW082105719A
Original Assignee
Martin Marietta Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Martin Marietta Corp filed Critical Martin Marietta Corp
Application granted granted Critical
Publication of TW223732B publication Critical patent/TW223732B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/24—Curved surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
    • H01Q1/425—Housings not intimately mechanically associated with radiating elements, e.g. radome comprising a metallic grid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
    • H01Q15/0013—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices said selective devices working as frequency-selective reflecting surfaces, e.g. FSS, dichroic plates, surfaces being partly transmissive and reflective
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09018—Rigid curved substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09963—Programming circuit by using small elements, e.g. small PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/146—Laser beam

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Laser Beam Processing (AREA)
  • Details Of Aerials (AREA)
TW082105719A 1992-06-22 1993-07-19 TW223732B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US90178992A 1992-06-22 1992-06-22

Publications (1)

Publication Number Publication Date
TW223732B true TW223732B (zh) 1994-05-11

Family

ID=25414814

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082105719A TW223732B (zh) 1992-06-22 1993-07-19

Country Status (6)

Country Link
US (1) US5472828A (zh)
EP (1) EP0575848B1 (zh)
JP (1) JPH06226477A (zh)
DE (1) DE69306178T2 (zh)
IL (1) IL105925A (zh)
TW (1) TW223732B (zh)

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US5955776A (en) 1996-12-04 1999-09-21 Ball Semiconductor, Inc. Spherical shaped semiconductor integrated circuit
US5934965A (en) * 1997-04-11 1999-08-10 Hughes Electronics Corporation Apertured nonplanar electrodes and forming methods
US6071315A (en) * 1998-07-10 2000-06-06 Ball Semiconductor, Inc. Two-dimensional to three-dimensional VLSI design
TW420853B (en) * 1998-07-10 2001-02-01 Siemens Ag Method of manufacturing the wiring with electric conducting interconnect between the over-side and the underside of the substrate and the wiring with such interconnect
FR2782885B1 (fr) * 1998-08-25 2000-11-10 Gemplus Card Int Procede de fabrication d'une antenne pour un support d'informations comportant un circuit electronique
US6388230B1 (en) 1999-10-13 2002-05-14 Morton International, Inc. Laser imaging of thin layer electronic circuitry material
DE10106399C1 (de) * 2001-02-12 2002-09-05 Siemens Ag Verfahren zur Herstellung von Schaltungsträgern mit groben Leiterstrukturen und mindestens einem Bereich mit feinen Leiterstrukturen
JP4274784B2 (ja) * 2002-05-28 2009-06-10 新光電気工業株式会社 配線形成システムおよびその方法
US7959817B2 (en) 2004-01-09 2011-06-14 Masonite Corporation Door skin, a method of etching a plate, and an etched plate formed therefrom
US6988342B2 (en) 2003-01-17 2006-01-24 Masonite Corporation Door skin, a method of etching a plate for forming a wood grain pattern in the door skin, and an etched plate formed therefrom
US7161552B2 (en) * 2003-08-08 2007-01-09 Lockheed Martin Corporation Electromagnetic interference protection for radomes
JP2005181958A (ja) * 2003-12-22 2005-07-07 Rohm & Haas Electronic Materials Llc レーザーアブレーションを用いる電子部品および光学部品の形成方法
JP4784115B2 (ja) * 2005-03-15 2011-10-05 横浜ゴム株式会社 レドーム
US8290239B2 (en) * 2005-10-21 2012-10-16 Orbotech Ltd. Automatic repair of electric circuits
US7867688B2 (en) * 2006-05-30 2011-01-11 Eastman Kodak Company Laser ablation resist
US7879685B2 (en) 2006-08-04 2011-02-01 Solyndra, Inc. System and method for creating electric isolation between layers comprising solar cells
US20080090396A1 (en) * 2006-10-06 2008-04-17 Semiconductor Energy Laboratory Co., Ltd. Light exposure apparatus and method for making semiconductor device formed using the same
US20080216304A1 (en) * 2007-03-06 2008-09-11 Chien Ming Lin Method of manufacturing antenna module by laser carving
US7979144B2 (en) * 2007-10-11 2011-07-12 Raytheon Company System for forming patterns on a multi-curved surface
JP5337432B2 (ja) 2007-11-30 2013-11-06 株式会社エヌ・ティ・ティ・ドコモ 無線通信システム
CN102694269B (zh) * 2012-04-13 2015-11-04 深圳光启创新技术有限公司 超材料人工微结构的制造方法和超材料天线罩及其制造方法
EP2930788B1 (en) 2012-11-20 2019-02-13 Kuang-Chi Innovative Technology Ltd. Metamaterial, metamaterial preparation method and metamaterial design method
JP6142522B2 (ja) * 2012-12-20 2017-06-07 横浜ゴム株式会社 周波数選択部材および曲面への周波数選択素子の配列決定方法
US9427909B2 (en) 2013-03-15 2016-08-30 Ii-Vi Incorporated Method of generating patterns on doubly-curved surfaces
LT2964417T (lt) * 2013-04-04 2022-04-11 Lpkf Laser & Electronics Ag Būdas kiaurinėms angoms pagrinde įvesti
CN106033837A (zh) * 2015-03-20 2016-10-19 深圳光启高等理工研究院 曲面基体超材料及其制造方法
DE102017006362A1 (de) * 2017-07-05 2019-01-10 Mbda Deutschland Gmbh Verfahren zur Herstellung eines Flugkörpersystembauteils, insbesondere Lenkflugkörperbauteils, Flugkörpersystembauteil, insbesondere Lenkflugkörperbauteil und Flugkörpersystemanordnung
JP7013834B2 (ja) * 2017-12-13 2022-02-01 中国電力株式会社 異常点検装置
CN108933335B (zh) * 2018-08-18 2020-12-22 南昌大学 一种调控雷达吸波材料吸收频率的新方法

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Also Published As

Publication number Publication date
JPH06226477A (ja) 1994-08-16
US5472828A (en) 1995-12-05
EP0575848B1 (en) 1996-11-27
EP0575848A3 (en) 1994-09-07
EP0575848A2 (en) 1993-12-29
DE69306178T2 (de) 1997-03-20
DE69306178D1 (de) 1997-01-09
IL105925A (en) 1997-01-10
IL105925A0 (en) 1993-10-20

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