TW221840B - - Google Patents

Info

Publication number
TW221840B
TW221840B TW081105867A TW81105867A TW221840B TW 221840 B TW221840 B TW 221840B TW 081105867 A TW081105867 A TW 081105867A TW 81105867 A TW81105867 A TW 81105867A TW 221840 B TW221840 B TW 221840B
Authority
TW
Taiwan
Application number
TW081105867A
Other languages
Chinese (zh)
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Application granted granted Critical
Publication of TW221840B publication Critical patent/TW221840B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
    • C03C10/0054—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing PbO, SnO2, B2O3
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Glass Compositions (AREA)
TW081105867A 1991-12-18 1992-07-24 TW221840B (oth)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/809,371 US5256469A (en) 1991-12-18 1991-12-18 Multi-layered, co-fired, ceramic-on-metal circuit board for microelectronic packaging

Publications (1)

Publication Number Publication Date
TW221840B true TW221840B (oth) 1994-03-21

Family

ID=25201184

Family Applications (1)

Application Number Title Priority Date Filing Date
TW081105867A TW221840B (oth) 1991-12-18 1992-07-24

Country Status (2)

Country Link
US (1) US5256469A (oth)
TW (1) TW221840B (oth)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
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US5682018A (en) * 1991-10-18 1997-10-28 International Business Machines Corporation Interface regions between metal and ceramic in a metal/ceramic substrate
JPH05335183A (ja) * 1992-05-28 1993-12-17 Murata Mfg Co Ltd 多層基板を備えた電子部品及びその製造方法
JP3110922B2 (ja) * 1993-08-12 2000-11-20 富士通株式会社 マルチチップ・モジュール
DE69623930T2 (de) * 1995-01-27 2003-05-15 Sarnoff Corp., Princeton Gläser mit niedrigem dielektrischem verlust
US5581876A (en) * 1995-01-27 1996-12-10 David Sarnoff Research Center, Inc. Method of adhering green tape to a metal support substrate with a bonding glass
US5874214A (en) 1995-04-25 1999-02-23 Irori Remotely programmable matrices with memories
US6025129A (en) * 1995-04-25 2000-02-15 Irori Remotely programmable matrices with memories and uses thereof
US5751629A (en) 1995-04-25 1998-05-12 Irori Remotely programmable matrices with memories
US6331273B1 (en) 1995-04-25 2001-12-18 Discovery Partners International Remotely programmable matrices with memories
US6416714B1 (en) 1995-04-25 2002-07-09 Discovery Partners International, Inc. Remotely programmable matrices with memories
US6017496A (en) 1995-06-07 2000-01-25 Irori Matrices with memories and uses thereof
US6329139B1 (en) 1995-04-25 2001-12-11 Discovery Partners International Automated sorting system for matrices with memory
US5644327A (en) * 1995-06-07 1997-07-01 David Sarnoff Research Center, Inc. Tessellated electroluminescent display having a multilayer ceramic substrate
JP3516367B2 (ja) * 1996-01-31 2004-04-05 エヌイーシー ショット コンポーネンツ株式会社 ガラス−セラミック複合体およびそれを用いたフラットパッケージ型圧電部品
US6323549B1 (en) 1996-08-29 2001-11-27 L. Pierre deRochemont Ceramic composite wiring structures for semiconductor devices and method of manufacture
US5801108A (en) * 1996-09-11 1998-09-01 Motorola Inc. Low temperature cofireable dielectric paste
KR100546471B1 (ko) * 1997-03-06 2006-01-26 샤프 가부시키가이샤 금속 다층 회로 기판상의 두꺼운 세라믹
US5953203A (en) * 1997-03-06 1999-09-14 Sarnoff Corporation Multilayer ceramic circuit boards including embedded capacitors
US5866240A (en) * 1997-03-06 1999-02-02 Sarnoff Corporation Thick ceramic on metal multilayer circuit board
US6055151A (en) * 1997-03-06 2000-04-25 Sarnoff Corp Multilayer ceramic circuit boards including embedded components
JPH11157953A (ja) * 1997-12-02 1999-06-15 Nhk Spring Co Ltd セラミックスと金属との構造体及びそれを用いた静電チャック装置
US6897855B1 (en) 1998-02-17 2005-05-24 Sarnoff Corporation Tiled electronic display structure
US6498592B1 (en) 1999-02-16 2002-12-24 Sarnoff Corp. Display tile structure using organic light emitting materials
US6455930B1 (en) * 1999-12-13 2002-09-24 Lamina Ceramics, Inc. Integrated heat sinking packages using low temperature co-fired ceramic metal circuit board technology
US7183640B2 (en) 1999-12-13 2007-02-27 Lamina Ceramics, Inc. Method and structures for enhanced temperature control of high power components on multilayer LTCC and LTCC-M boards
JP3676268B2 (ja) * 2001-08-01 2005-07-27 株式会社日立製作所 伝熱構造体及び半導体装置
US20040099999A1 (en) * 2002-10-11 2004-05-27 Borland William J. Co-fired capacitor and method for forming ceramic capacitors for use in printed wiring boards
EP1568070A4 (en) * 2002-11-12 2008-05-07 Lamina Ceramics Inc METHOD AND STRUCTURES FOR ADVANCED TEMPERATURE CONTROL OF HIGH-PERFORMANCE COMPONENTS ON MULTILAYER LTCC AND LTCC-M LADDER PLATES
US7387838B2 (en) * 2004-05-27 2008-06-17 Delaware Capital Formation, Inc. Low loss glass-ceramic materials, method of making same and electronic packages including same
US7186461B2 (en) * 2004-05-27 2007-03-06 Delaware Capital Formation, Inc. Glass-ceramic materials and electronic packages including same
US7550319B2 (en) * 2005-09-01 2009-06-23 E. I. Du Pont De Nemours And Company Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof
US7628021B2 (en) * 2006-06-12 2009-12-08 Texas Instruments Incorporated Solid state heat pump
US20100089620A1 (en) * 2006-11-30 2010-04-15 Richard Matz Electronic Component Module and Method for the Production Thereof
JP5585649B2 (ja) 2010-03-30 2014-09-10 株式会社村田製作所 金属ベース基板およびその製造方法
WO2011122407A1 (ja) * 2010-03-30 2011-10-06 株式会社村田製作所 金属ベース基板
AT512041B1 (de) * 2012-05-04 2013-05-15 Mikroelektronik Ges Mit Beschraenkter Haftung Ab Verfahren zur Herstellung eines metallisierten Substrats
JP6116037B2 (ja) 2013-03-29 2017-04-19 サン−ゴバン セラミックス アンド プラスティクス，インコーポレイティド 高温用途のためのサンボルナイト系ガラスセラミックシール
US20160377823A1 (en) * 2015-06-25 2016-12-29 Kyocera America Inc Optical module and optical module package incorporating a high-thermal-expansion ceramic substrate
US11222878B2 (en) 2019-04-30 2022-01-11 Ab Mikroelektronik Gesellschaft Mit Beschraenkter Haftung Electronic power module

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55140732A (en) * 1979-04-19 1980-11-04 Chloride Silent Power Ltd Sealing glass
US4256796A (en) * 1979-11-05 1981-03-17 Rca Corporation Partially devitrified porcelain composition and articles prepared with same
US4645552A (en) * 1984-11-19 1987-02-24 Hughes Aircraft Company Process for fabricating dimensionally stable interconnect boards
US4924590A (en) * 1988-01-08 1990-05-15 Siemens Aktiengesellschaft Method for making metal core printed circuit board
US4952531A (en) * 1988-03-17 1990-08-28 Olin Corporation Sealing glass for matched sealing of copper and copper alloys
US5043222A (en) * 1988-03-17 1991-08-27 Olin Corporation Metal sealing glass composite with matched coefficients of thermal expansion
US5047371A (en) * 1988-09-02 1991-09-10 Olin Corporation Glass/ceramic sealing system
US5041695A (en) * 1989-06-01 1991-08-20 Westinghouse Electric Corp. Co-fired ceramic package for a power circuit

Also Published As

Publication number Publication date
US5256469A (en) 1993-10-26

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