TW221721B - - Google Patents
Info
- Publication number
- TW221721B TW221721B TW081108884A TW81108884A TW221721B TW 221721 B TW221721 B TW 221721B TW 081108884 A TW081108884 A TW 081108884A TW 81108884 A TW81108884 A TW 81108884A TW 221721 B TW221721 B TW 221721B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
- G03F1/30—Alternating PSM, e.g. Levenson-Shibuya PSM; Preparation thereof
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019910020350A KR930011099A (ko) | 1991-11-15 | 1991-11-15 | 위상 반전 마스크 제조방법 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW221721B true TW221721B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1994-03-11 |
Family
ID=19322893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW081108884A TW221721B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-11-15 | 1992-11-06 |
Country Status (5)
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0636993A (ja) * | 1992-05-21 | 1994-02-10 | Canon Inc | 露光装置及び半導体素子の製造方法 |
| KR0151427B1 (ko) * | 1994-03-04 | 1999-02-18 | 문정환 | 위상 반전마스크 및 그의 제조방법 |
| TW270219B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1994-05-31 | 1996-02-11 | Advanced Micro Devices Inc | |
| KR0152952B1 (ko) * | 1995-05-13 | 1998-10-01 | 문정환 | 위상반전 마스크 및 그 제조방법 |
| KR100399444B1 (ko) * | 1995-06-30 | 2004-04-29 | 주식회사 하이닉스반도체 | 에지강조형위상반전마스크및그제조방법 |
| KR0167249B1 (ko) * | 1995-07-31 | 1999-01-15 | 문정환 | 위상반전마스크 제조방법 |
| KR0179164B1 (ko) * | 1995-09-25 | 1999-04-01 | 문정환 | 위상 반전 마스크의 제조방법 |
| KR100195333B1 (ko) * | 1996-09-02 | 1999-06-15 | 구본준 | 위상반전마스크 및 그 제조방법 |
| US5958630A (en) * | 1997-12-30 | 1999-09-28 | Kabushiki Kaisha Toshiba | Phase shifting mask and method of manufacturing the same |
| KR20000045026A (ko) * | 1998-12-30 | 2000-07-15 | 전주범 | 드럼식 세탁기의 배수방법 |
| KR100388320B1 (ko) * | 1999-06-22 | 2003-06-25 | 주식회사 하이닉스반도체 | 위상반전마스크 형성방법 |
| US6777137B2 (en) * | 2002-07-10 | 2004-08-17 | International Business Machines Corporation | EUVL mask structure and method of formation |
| JP2014116283A (ja) * | 2012-11-15 | 2014-06-26 | Sumitomo Heavy Ind Ltd | 有機ｅｌ素子の製造方法、及び有機ｅｌ素子 |
| CN115202146A (zh) * | 2021-04-14 | 2022-10-18 | 上海传芯半导体有限公司 | 移相掩膜版及其制作方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2710967B2 (ja) * | 1988-11-22 | 1998-02-10 | 株式会社日立製作所 | 集積回路装置の製造方法 |
| JPH0359555A (ja) * | 1989-07-28 | 1991-03-14 | Fujitsu Ltd | 位相シフトマスク |
| JPH03123353A (ja) * | 1989-10-06 | 1991-05-27 | Oki Electric Ind Co Ltd | ホトマスク及びその作製方法 |
| JPH03172844A (ja) * | 1989-12-01 | 1991-07-26 | Oki Electric Ind Co Ltd | シフターパターン付き半導体マスクの作成方法 |
| JPH03211554A (ja) * | 1990-01-17 | 1991-09-17 | Fujitsu Ltd | 位相シフトマスクの製造方法 |
| JP2647232B2 (ja) * | 1990-04-25 | 1997-08-27 | 三菱電機株式会社 | 位相シフトマスク及びその製造方法 |
| JP2892765B2 (ja) * | 1990-04-27 | 1999-05-17 | 株式会社日立製作所 | パターン構造を有する素子の製造方法 |
| US5208125A (en) * | 1991-07-30 | 1993-05-04 | Micron Technology, Inc. | Phase shifting reticle fabrication using ion implantation |
-
1991
- 1991-11-15 KR KR1019910020350A patent/KR930011099A/ko not_active Ceased
-
1992
- 1992-11-06 TW TW081108884A patent/TW221721B/zh not_active IP Right Cessation
- 1992-11-13 US US07/976,020 patent/US5322749A/en not_active Expired - Lifetime
- 1992-11-13 DE DE4238441A patent/DE4238441C2/de not_active Expired - Fee Related
- 1992-11-16 JP JP32902392A patent/JP3292961B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR930011099A (ko) | 1993-06-23 |
| US5322749A (en) | 1994-06-21 |
| DE4238441A1 (en) | 1993-07-08 |
| JP3292961B2 (ja) | 2002-06-17 |
| DE4238441C2 (de) | 2003-09-25 |
| JPH06130650A (ja) | 1994-05-13 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |