TW221716B - - Google Patents

Info

Publication number
TW221716B
TW221716B TW081108385A TW81108385A TW221716B TW 221716 B TW221716 B TW 221716B TW 081108385 A TW081108385 A TW 081108385A TW 81108385 A TW81108385 A TW 81108385A TW 221716 B TW221716 B TW 221716B
Authority
TW
Taiwan
Application number
TW081108385A
Other languages
Chinese (zh)
Original Assignee
Shinetsu Chem Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chem Ind Co filed Critical Shinetsu Chem Ind Co
Application granted granted Critical
Publication of TW221716B publication Critical patent/TW221716B/zh

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/04Chromates
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0757Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G03F7/0758Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/36Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/41Compounds containing sulfur bound to oxygen
    • C08K5/42Sulfonic acids; Derivatives thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW081108385A 1992-01-27 1992-10-21 TW221716B (en, 2012)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4035670A JP2674415B2 (ja) 1992-01-27 1992-01-27 感光性樹脂組成物及び電子部品用保護膜

Publications (1)

Publication Number Publication Date
TW221716B true TW221716B (en, 2012) 1994-03-11

Family

ID=12448313

Family Applications (1)

Application Number Title Priority Date Filing Date
TW081108385A TW221716B (en, 2012) 1992-01-27 1992-10-21

Country Status (4)

Country Link
EP (1) EP0554040A3 (en, 2012)
JP (1) JP2674415B2 (en, 2012)
KR (1) KR930016828A (en, 2012)
TW (1) TW221716B (en, 2012)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2787531B2 (ja) * 1993-02-17 1998-08-20 信越化学工業株式会社 感光性樹脂組成物及び電子部品用保護膜
JP3324250B2 (ja) * 1993-02-25 2002-09-17 チッソ株式会社 感光性樹脂組成物
TW200512543A (en) * 2003-08-06 2005-04-01 Sumitomo Bakelite Co Polyamide resin, positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device
CN101373296B (zh) * 2007-08-24 2012-07-04 株式会社日立显示器 液晶显示装置及其制造方法
JP6487875B2 (ja) * 2016-04-19 2019-03-20 信越化学工業株式会社 テトラカルボン酸ジエステル化合物、ポリイミド前駆体の重合体及びその製造方法、ネガ型感光性樹脂組成物、ポジ型感光性樹脂組成物、パターン形成方法、及び硬化被膜形成方法
JP6637871B2 (ja) * 2016-10-27 2020-01-29 信越化学工業株式会社 テトラカルボン酸ジエステル化合物、ポリイミド前駆体の重合体及びその製造方法、ネガ型感光性樹脂組成物、パターン形成方法、及び硬化被膜形成方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63305348A (ja) * 1987-06-05 1988-12-13 Fuji Photo Film Co Ltd ポジ型フオトレジスト組成物
JPH0358048A (ja) * 1989-07-27 1991-03-13 Nitto Denko Corp ポジ型感光性ポリイミド組成物
EP0431971B1 (en) * 1989-12-07 1995-07-19 Kabushiki Kaisha Toshiba Photosensitive composition and resin-encapsulated semiconductor device
US5114826A (en) * 1989-12-28 1992-05-19 Ibm Corporation Photosensitive polyimide compositions
JP2606402B2 (ja) * 1990-03-23 1997-05-07 信越化学工業株式会社 硬化性樹脂及びその製造方法
EP0459395B1 (en) * 1990-05-29 1999-08-18 Sumitomo Bakelite Company Limited Positive photo-sensitive resin composition
JPH04313756A (ja) * 1991-04-11 1992-11-05 Shin Etsu Chem Co Ltd 感光材及びその製造方法

Also Published As

Publication number Publication date
KR930016828A (ko) 1993-08-30
EP0554040A2 (en) 1993-08-04
JP2674415B2 (ja) 1997-11-12
EP0554040A3 (en) 1993-12-29
JPH05204156A (ja) 1993-08-13

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