TW202600264A - 以銅為主成分的導電性粉末、導電性糊、電子零件之製造方法、導電性粉末之製造方法 - Google Patents

以銅為主成分的導電性粉末、導電性糊、電子零件之製造方法、導電性粉末之製造方法

Info

Publication number
TW202600264A
TW202600264A TW114108889A TW114108889A TW202600264A TW 202600264 A TW202600264 A TW 202600264A TW 114108889 A TW114108889 A TW 114108889A TW 114108889 A TW114108889 A TW 114108889A TW 202600264 A TW202600264 A TW 202600264A
Authority
TW
Taiwan
Prior art keywords
copper
conductive powder
powder
shrinkage rate
mass
Prior art date
Application number
TW114108889A
Other languages
English (en)
Chinese (zh)
Inventor
江崎聰一郎
秋本裕二
Original Assignee
日商昭榮化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商昭榮化學工業股份有限公司 filed Critical 日商昭榮化學工業股份有限公司
Publication of TW202600264A publication Critical patent/TW202600264A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/06—Metallic powder characterised by the shape of the particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Nanotechnology (AREA)
  • Conductive Materials (AREA)
  • Powder Metallurgy (AREA)
TW114108889A 2024-03-11 2025-03-11 以銅為主成分的導電性粉末、導電性糊、電子零件之製造方法、導電性粉末之製造方法 TW202600264A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US202463563885P 2024-03-11 2024-03-11
US63/563,885 2024-03-11
JP2024070985 2024-04-24
JP2024-070985 2024-04-24

Publications (1)

Publication Number Publication Date
TW202600264A true TW202600264A (zh) 2026-01-01

Family

ID=97063732

Family Applications (1)

Application Number Title Priority Date Filing Date
TW114108889A TW202600264A (zh) 2024-03-11 2025-03-11 以銅為主成分的導電性粉末、導電性糊、電子零件之製造方法、導電性粉末之製造方法

Country Status (3)

Country Link
JP (1) JPWO2025192533A1 (cg-RX-API-DMAC7.html)
TW (1) TW202600264A (cg-RX-API-DMAC7.html)
WO (1) WO2025192533A1 (cg-RX-API-DMAC7.html)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08180731A (ja) * 1994-12-26 1996-07-12 Murata Mfg Co Ltd 導電性厚膜組成物、厚膜電極、セラミック電子部品、および積層セラミックコンデンサ
JP4647224B2 (ja) * 2004-03-30 2011-03-09 昭栄化学工業株式会社 積層セラミック電子部品端子電極用導体ペースト
JP3994439B2 (ja) * 2004-06-17 2007-10-17 昭栄化学工業株式会社 積層セラミック電子部品端子電極用導体ペースト

Also Published As

Publication number Publication date
JPWO2025192533A1 (cg-RX-API-DMAC7.html) 2025-09-18
WO2025192533A1 (ja) 2025-09-18

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