TW202510160A - 接合裝置、接合系統及接合方法 - Google Patents

接合裝置、接合系統及接合方法 Download PDF

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Publication number
TW202510160A
TW202510160A TW113127008A TW113127008A TW202510160A TW 202510160 A TW202510160 A TW 202510160A TW 113127008 A TW113127008 A TW 113127008A TW 113127008 A TW113127008 A TW 113127008A TW 202510160 A TW202510160 A TW 202510160A
Authority
TW
Taiwan
Prior art keywords
substrate
carrier
bare
bonding
transfer
Prior art date
Application number
TW113127008A
Other languages
English (en)
Chinese (zh)
Inventor
三根陽介
Original Assignee
日商東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW202510160A publication Critical patent/TW202510160A/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

Landscapes

  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW113127008A 2023-07-28 2024-07-19 接合裝置、接合系統及接合方法 TW202510160A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023123344 2023-07-28
JP2023-123344 2023-07-28

Publications (1)

Publication Number Publication Date
TW202510160A true TW202510160A (zh) 2025-03-01

Family

ID=94394533

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113127008A TW202510160A (zh) 2023-07-28 2024-07-19 接合裝置、接合系統及接合方法

Country Status (3)

Country Link
JP (1) JPWO2025028255A1 (https=)
TW (1) TW202510160A (https=)
WO (1) WO2025028255A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110037646A (ko) * 2009-10-07 2011-04-13 삼성전자주식회사 반도체 다이 본딩 장치
JP6470054B2 (ja) * 2015-01-26 2019-02-13 ファスフォードテクノロジ株式会社 ダイボンダおよびボンディング方法
JP6584234B2 (ja) * 2015-08-31 2019-10-02 ファスフォードテクノロジ株式会社 ダイボンダ、ボンディング方法および半導体装置の製造方法
US12261070B2 (en) * 2018-08-31 2025-03-25 Bondtech Co., Ltd. Component mounting system and component mounting method
TW202127509A (zh) * 2019-08-23 2021-07-16 日商東京威力科創股份有限公司 接合裝置，接合系統，及接合方法
US20240429073A1 (en) * 2021-11-16 2024-12-26 Tokyo Electron Limited Processing system, electrostatic carrier, and processing method

Also Published As

Publication number Publication date
WO2025028255A1 (ja) 2025-02-06
JPWO2025028255A1 (https=) 2025-02-06

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