JPWO2025028255A1 - - Google Patents
Info
- Publication number
- JPWO2025028255A1 JPWO2025028255A1 JP2025537828A JP2025537828A JPWO2025028255A1 JP WO2025028255 A1 JPWO2025028255 A1 JP WO2025028255A1 JP 2025537828 A JP2025537828 A JP 2025537828A JP 2025537828 A JP2025537828 A JP 2025537828A JP WO2025028255 A1 JPWO2025028255 A1 JP WO2025028255A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023123344 | 2023-07-28 | ||
| PCT/JP2024/025592 WO2025028255A1 (ja) | 2023-07-28 | 2024-07-17 | 接合装置、接合システム、及び接合方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2025028255A1 true JPWO2025028255A1 (https=) | 2025-02-06 |
Family
ID=94394533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025537828A Pending JPWO2025028255A1 (https=) | 2023-07-28 | 2024-07-17 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2025028255A1 (https=) |
| TW (1) | TW202510160A (https=) |
| WO (1) | WO2025028255A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110037646A (ko) * | 2009-10-07 | 2011-04-13 | 삼성전자주식회사 | 반도체 다이 본딩 장치 |
| JP6470054B2 (ja) * | 2015-01-26 | 2019-02-13 | ファスフォードテクノロジ株式会社 | ダイボンダおよびボンディング方法 |
| JP6584234B2 (ja) * | 2015-08-31 | 2019-10-02 | ファスフォードテクノロジ株式会社 | ダイボンダ、ボンディング方法および半導体装置の製造方法 |
| US12261070B2 (en) * | 2018-08-31 | 2025-03-25 | Bondtech Co., Ltd. | Component mounting system and component mounting method |
| TW202127509A (zh) * | 2019-08-23 | 2021-07-16 | 日商東京威力科創股份有限公司 | 接合裝置，接合系統，及接合方法 |
| US20240429073A1 (en) * | 2021-11-16 | 2024-12-26 | Tokyo Electron Limited | Processing system, electrostatic carrier, and processing method |
-
2024
- 2024-07-17 JP JP2025537828A patent/JPWO2025028255A1/ja active Pending
- 2024-07-17 WO PCT/JP2024/025592 patent/WO2025028255A1/ja active Pending
- 2024-07-19 TW TW113127008A patent/TW202510160A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2025028255A1 (ja) | 2025-02-06 |
| TW202510160A (zh) | 2025-03-01 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20260115 |