TW202505304A - 感光性樹脂組合物，膜狀樹脂和樹脂片 - Google Patents

感光性樹脂組合物，膜狀樹脂和樹脂片 Download PDF

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Publication number
TW202505304A
TW202505304A TW113122644A TW113122644A TW202505304A TW 202505304 A TW202505304 A TW 202505304A TW 113122644 A TW113122644 A TW 113122644A TW 113122644 A TW113122644 A TW 113122644A TW 202505304 A TW202505304 A TW 202505304A
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TW
Taiwan
Prior art keywords
photosensitive resin
composition
resin composition
enoate
monomer
Prior art date
Application number
TW113122644A
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English (en)
Chinese (zh)
Inventor
髙松宏樹
南拓也
澤木𤥨
戶田夏木
吉原謙介
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日商力森諾科股份有限公司
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Publication of TW202505304A publication Critical patent/TW202505304A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/02—Monomers containing only one unsaturated aliphatic radical
    • C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F212/06—Hydrocarbons
    • C08F212/08—Styrene
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Materials For Photolithography (AREA)
TW113122644A 2023-06-26 2024-06-19 感光性樹脂組合物，膜狀樹脂和樹脂片 TW202505304A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023104223 2023-06-26
JP2023-104223 2023-06-26

Publications (1)

Publication Number Publication Date
TW202505304A true TW202505304A (zh) 2025-02-01

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ID=93938937

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TW113122644A TW202505304A (zh) 2023-06-26 2024-06-19 感光性樹脂組合物，膜狀樹脂和樹脂片

Country Status (6)

Country Link
EP (1) EP4733840A1 (https=)
JP (1) JPWO2025004836A1 (https=)
KR (1) KR20260025405A (https=)
CN (1) CN121420246A (https=)
TW (1) TW202505304A (https=)
WO (1) WO2025004836A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120089246A (zh) * 2025-02-23 2025-06-03 上海大学 基于机器学习设计高玻璃化转变温度芯片底填胶的方法、系统及应用

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005257812A (ja) * 2004-03-09 2005-09-22 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP6136101B2 (ja) 2012-04-10 2017-05-31 日立化成株式会社 感光性樹脂組成物、フィルム状樹脂、樹脂シート、樹脂パターン、樹脂層付半導体ウェハ、樹脂層付透明基板、半導体装置及び半導体装置の製造方法
CN116209571A (zh) * 2020-08-07 2023-06-02 株式会社力森诺科 感光性树脂组合物、感光性元件、抗蚀剂图案的形成方法及印刷线路板的制造方法
JP2023104223A (ja) 2022-01-17 2023-07-28 ソニーグループ株式会社 導光板及び画像表示装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120089246A (zh) * 2025-02-23 2025-06-03 上海大学 基于机器学习设计高玻璃化转变温度芯片底填胶的方法、系统及应用

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Publication number Publication date
EP4733840A1 (en) 2026-04-29
KR20260025405A (ko) 2026-02-24
JPWO2025004836A1 (https=) 2025-01-02
WO2025004836A1 (ja) 2025-01-02
CN121420246A (zh) 2026-01-27

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