KR20260025405A - 감광성 수지 조성물, 필름 형상 수지 및 수지 시트 - Google Patents
감광성 수지 조성물, 필름 형상 수지 및 수지 시트Info
- Publication number
- KR20260025405A KR20260025405A KR1020267001709A KR20267001709A KR20260025405A KR 20260025405 A KR20260025405 A KR 20260025405A KR 1020267001709 A KR1020267001709 A KR 1020267001709A KR 20267001709 A KR20267001709 A KR 20267001709A KR 20260025405 A KR20260025405 A KR 20260025405A
- Authority
- KR
- South Korea
- Prior art keywords
- enoate
- proposal
- composition
- less
- photosensitive resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F212/02—Monomers containing only one unsaturated aliphatic radical
- C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
- C08F212/06—Hydrocarbons
- C08F212/08—Styrene
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023104223 | 2023-06-26 | ||
| JPJP-P-2023-104223 | 2023-06-26 | ||
| PCT/JP2024/021577 WO2025004836A1 (ja) | 2023-06-26 | 2024-06-13 | 感光性樹脂組成物、フィルム状樹脂及び樹脂シート |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20260025405A true KR20260025405A (ko) | 2026-02-24 |
Family
ID=93938937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020267001709A Pending KR20260025405A (ko) | 2023-06-26 | 2024-06-13 | 감광성 수지 조성물, 필름 형상 수지 및 수지 시트 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP4733840A1 (https=) |
| JP (1) | JPWO2025004836A1 (https=) |
| KR (1) | KR20260025405A (https=) |
| CN (1) | CN121420246A (https=) |
| TW (1) | TW202505304A (https=) |
| WO (1) | WO2025004836A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN120089246B (zh) * | 2025-02-23 | 2025-12-05 | 上海大学 | 基于机器学习设计高玻璃化转变温度芯片底填胶的方法、系统及应用 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005257812A (ja) * | 2004-03-09 | 2005-09-22 | Hitachi Chem Co Ltd | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
| JP6136101B2 (ja) | 2012-04-10 | 2017-05-31 | 日立化成株式会社 | 感光性樹脂組成物、フィルム状樹脂、樹脂シート、樹脂パターン、樹脂層付半導体ウェハ、樹脂層付透明基板、半導体装置及び半導体装置の製造方法 |
| CN116209571A (zh) * | 2020-08-07 | 2023-06-02 | 株式会社力森诺科 | 感光性树脂组合物、感光性元件、抗蚀剂图案的形成方法及印刷线路板的制造方法 |
| JP2023104223A (ja) | 2022-01-17 | 2023-07-28 | ソニーグループ株式会社 | 導光板及び画像表示装置 |
-
2024
- 2024-06-13 CN CN202480042926.9A patent/CN121420246A/zh active Pending
- 2024-06-13 EP EP24831701.8A patent/EP4733840A1/en active Pending
- 2024-06-13 WO PCT/JP2024/021577 patent/WO2025004836A1/ja not_active Ceased
- 2024-06-13 JP JP2025529636A patent/JPWO2025004836A1/ja active Pending
- 2024-06-13 KR KR1020267001709A patent/KR20260025405A/ko active Pending
- 2024-06-19 TW TW113122644A patent/TW202505304A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EP4733840A1 (en) | 2026-04-29 |
| TW202505304A (zh) | 2025-02-01 |
| JPWO2025004836A1 (https=) | 2025-01-02 |
| WO2025004836A1 (ja) | 2025-01-02 |
| CN121420246A (zh) | 2026-01-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| P11 | Amendment of application requested |
Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| Q12 | Application published |
Free format text: ST27 STATUS EVENT CODE: A-1-1-Q10-Q12-NAP-PG1501 (AS PROVIDED BY THE NATIONAL OFFICE) |