TW202502548A - 轉印膜、積層體之製造方法、積層體 - Google Patents

轉印膜、積層體之製造方法、積層體 Download PDF

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Publication number
TW202502548A
TW202502548A TW113110833A TW113110833A TW202502548A TW 202502548 A TW202502548 A TW 202502548A TW 113110833 A TW113110833 A TW 113110833A TW 113110833 A TW113110833 A TW 113110833A TW 202502548 A TW202502548 A TW 202502548A
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TW
Taiwan
Prior art keywords
resin
containing layer
mass
compound
transfer film
Prior art date
Application number
TW113110833A
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English (en)
Chinese (zh)
Inventor
山口圭吾
Original Assignee
日商富士軟片股份有限公司
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Publication date
Application filed by 日商富士軟片股份有限公司 filed Critical 日商富士軟片股份有限公司
Publication of TW202502548A publication Critical patent/TW202502548A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/027—Thermal properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/12—Esters; Ether-esters of cyclic polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Laminated Bodies (AREA)
TW113110833A 2023-03-24 2024-03-22 轉印膜、積層體之製造方法、積層體 TW202502548A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-047949 2023-03-24
JP2023047949 2023-03-24

Publications (1)

Publication Number Publication Date
TW202502548A true TW202502548A (zh) 2025-01-16

Family

ID=92906324

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113110833A TW202502548A (zh) 2023-03-24 2024-03-22 轉印膜、積層體之製造方法、積層體

Country Status (4)

Country Link
JP (1) JPWO2024203822A1 (https=)
KR (1) KR20250130350A (https=)
TW (1) TW202502548A (https=)
WO (1) WO2024203822A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119978375A (zh) * 2025-04-15 2025-05-13 深圳市优和新材料有限公司 一种低介质损耗的有机硅树脂及其制备方法、涂层组合物

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004271788A (ja) * 2003-03-07 2004-09-30 Kyoto Elex Kk アルカリ現像型感光性樹脂組成物及びその樹脂組成物を用いたグリーンシート上へのパターン形成方法
JP4140838B2 (ja) * 2003-11-18 2008-08-27 日東電工株式会社 無機粉体含有樹脂組成物、転写シート、誘電体層形成基板の製造方法、および誘電体層形成基板
JP2005316174A (ja) * 2004-04-28 2005-11-10 Fuji Photo Film Co Ltd 感光性樹脂組成物およびクマリン化合物
JP2008108797A (ja) * 2006-10-23 2008-05-08 Fujifilm Corp 回路基板の製造方法及びそれにより得られた回路基板
JP2021148891A (ja) 2020-03-18 2021-09-27 東レ株式会社 感光性樹脂組成物、硬化膜、表示装置及び硬化膜の製造方法
JP7827689B2 (ja) * 2021-02-26 2026-03-10 富士フイルム株式会社 転写フィルム及び導体パターンの製造方法

Also Published As

Publication number Publication date
JPWO2024203822A1 (https=) 2024-10-03
KR20250130350A (ko) 2025-09-01
WO2024203822A1 (ja) 2024-10-03

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