TW202501550A - 基板積層體 - Google Patents

基板積層體 Download PDF

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Publication number
TW202501550A
TW202501550A TW113124086A TW113124086A TW202501550A TW 202501550 A TW202501550 A TW 202501550A TW 113124086 A TW113124086 A TW 113124086A TW 113124086 A TW113124086 A TW 113124086A TW 202501550 A TW202501550 A TW 202501550A
Authority
TW
Taiwan
Prior art keywords
substrate
resin layer
ring
compound
group
Prior art date
Application number
TW113124086A
Other languages
English (en)
Chinese (zh)
Inventor
岡太航
茅場靖剛
Original Assignee
日商三井化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三井化學股份有限公司 filed Critical 日商三井化學股份有限公司
Publication of TW202501550A publication Critical patent/TW202501550A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H10W72/334—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W80/00—Direct bonding of chips, wafers or substrates
    • H10W80/211—Direct bonding of chips, wafers or substrates using auxiliary members, e.g. aids for protecting the bonding area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Laminated Bodies (AREA)
TW113124086A 2023-06-28 2024-06-27 基板積層體 TW202501550A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023106422 2023-06-28
JP2023-106422 2023-06-28

Publications (1)

Publication Number Publication Date
TW202501550A true TW202501550A (zh) 2025-01-01

Family

ID=93939079

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113124086A TW202501550A (zh) 2023-06-28 2024-06-27 基板積層體

Country Status (5)

Country Link
JP (1) JPWO2025005084A1 (https=)
KR (1) KR20260016540A (https=)
CN (1) CN121444645A (https=)
TW (1) TW202501550A (https=)
WO (1) WO2025005084A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012174937A (ja) 2011-02-22 2012-09-10 Sony Corp 半導体装置、半導体装置の製造方法、半導体ウエハの貼り合わせ方法及び電子機器
JP7784240B2 (ja) * 2020-05-14 2025-12-11 三井化学株式会社 積層体、組成物及び積層体の製造方法
KR102796500B1 (ko) * 2020-09-10 2025-04-15 미쓰이 가가쿠 가부시키가이샤 조성물, 적층체 및 적층체의 제조 방법
JP7787390B2 (ja) * 2021-06-30 2025-12-17 ダイキン工業株式会社 積層体の製造方法および積層体
JPWO2024029390A1 (https=) * 2022-08-01 2024-02-08

Also Published As

Publication number Publication date
CN121444645A (zh) 2026-01-30
KR20260016540A (ko) 2026-02-03
WO2025005084A1 (ja) 2025-01-02
JPWO2025005084A1 (https=) 2025-01-02

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