CN121444645A - 基板层叠体 - Google Patents

基板层叠体

Info

Publication number
CN121444645A
CN121444645A CN202480042424.6A CN202480042424A CN121444645A CN 121444645 A CN121444645 A CN 121444645A CN 202480042424 A CN202480042424 A CN 202480042424A CN 121444645 A CN121444645 A CN 121444645A
Authority
CN
China
Prior art keywords
substrate
resin layer
ring
compound
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480042424.6A
Other languages
English (en)
Chinese (zh)
Inventor
冈太航
茅场靖刚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Chemicals Inc
Original Assignee
Mitsui Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Publication of CN121444645A publication Critical patent/CN121444645A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H10W72/334—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W80/00—Direct bonding of chips, wafers or substrates
    • H10W80/211—Direct bonding of chips, wafers or substrates using auxiliary members, e.g. aids for protecting the bonding area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Laminated Bodies (AREA)
CN202480042424.6A 2023-06-28 2024-06-25 基板层叠体 Pending CN121444645A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023106422 2023-06-28
JP2023-106422 2023-06-28
PCT/JP2024/022999 WO2025005084A1 (ja) 2023-06-28 2024-06-25 基板積層体

Publications (1)

Publication Number Publication Date
CN121444645A true CN121444645A (zh) 2026-01-30

Family

ID=93939079

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480042424.6A Pending CN121444645A (zh) 2023-06-28 2024-06-25 基板层叠体

Country Status (5)

Country Link
JP (1) JPWO2025005084A1 (https=)
KR (1) KR20260016540A (https=)
CN (1) CN121444645A (https=)
TW (1) TW202501550A (https=)
WO (1) WO2025005084A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012174937A (ja) 2011-02-22 2012-09-10 Sony Corp 半導体装置、半導体装置の製造方法、半導体ウエハの貼り合わせ方法及び電子機器
JP7784240B2 (ja) * 2020-05-14 2025-12-11 三井化学株式会社 積層体、組成物及び積層体の製造方法
KR102796500B1 (ko) * 2020-09-10 2025-04-15 미쓰이 가가쿠 가부시키가이샤 조성물, 적층체 및 적층체의 제조 방법
JP7787390B2 (ja) * 2021-06-30 2025-12-17 ダイキン工業株式会社 積層体の製造方法および積層体
JPWO2024029390A1 (https=) * 2022-08-01 2024-02-08

Also Published As

Publication number Publication date
KR20260016540A (ko) 2026-02-03
TW202501550A (zh) 2025-01-01
WO2025005084A1 (ja) 2025-01-02
JPWO2025005084A1 (https=) 2025-01-02

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