KR20260016540A - 기판 적층체 - Google Patents

기판 적층체

Info

Publication number
KR20260016540A
KR20260016540A KR1020257043257A KR20257043257A KR20260016540A KR 20260016540 A KR20260016540 A KR 20260016540A KR 1020257043257 A KR1020257043257 A KR 1020257043257A KR 20257043257 A KR20257043257 A KR 20257043257A KR 20260016540 A KR20260016540 A KR 20260016540A
Authority
KR
South Korea
Prior art keywords
substrate
resin layer
ring
compound
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257043257A
Other languages
English (en)
Korean (ko)
Inventor
와타루 오카다
야스히사 가야바
Original Assignee
미쯔이가가꾸가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쯔이가가꾸가부시끼가이샤 filed Critical 미쯔이가가꾸가부시끼가이샤
Publication of KR20260016540A publication Critical patent/KR20260016540A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H10W72/334—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W80/00—Direct bonding of chips, wafers or substrates
    • H10W80/211—Direct bonding of chips, wafers or substrates using auxiliary members, e.g. aids for protecting the bonding area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Laminated Bodies (AREA)
KR1020257043257A 2023-06-28 2024-06-25 기판 적층체 Pending KR20260016540A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023106422 2023-06-28
JPJP-P-2023-106422 2023-06-28
PCT/JP2024/022999 WO2025005084A1 (ja) 2023-06-28 2024-06-25 基板積層体

Publications (1)

Publication Number Publication Date
KR20260016540A true KR20260016540A (ko) 2026-02-03

Family

ID=93939079

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257043257A Pending KR20260016540A (ko) 2023-06-28 2024-06-25 기판 적층체

Country Status (5)

Country Link
JP (1) JPWO2025005084A1 (https=)
KR (1) KR20260016540A (https=)
CN (1) CN121444645A (https=)
TW (1) TW202501550A (https=)
WO (1) WO2025005084A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012174937A (ja) 2011-02-22 2012-09-10 Sony Corp 半導体装置、半導体装置の製造方法、半導体ウエハの貼り合わせ方法及び電子機器

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7784240B2 (ja) * 2020-05-14 2025-12-11 三井化学株式会社 積層体、組成物及び積層体の製造方法
KR102796500B1 (ko) * 2020-09-10 2025-04-15 미쓰이 가가쿠 가부시키가이샤 조성물, 적층체 및 적층체의 제조 방법
JP7787390B2 (ja) * 2021-06-30 2025-12-17 ダイキン工業株式会社 積層体の製造方法および積層体
JPWO2024029390A1 (https=) * 2022-08-01 2024-02-08

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012174937A (ja) 2011-02-22 2012-09-10 Sony Corp 半導体装置、半導体装置の製造方法、半導体ウエハの貼り合わせ方法及び電子機器

Also Published As

Publication number Publication date
CN121444645A (zh) 2026-01-30
TW202501550A (zh) 2025-01-01
WO2025005084A1 (ja) 2025-01-02
JPWO2025005084A1 (https=) 2025-01-02

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PA0105 International application

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PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

Q12 Application published

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