TW202444865A - 研磨用組成物 - Google Patents

研磨用組成物 Download PDF

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Publication number
TW202444865A
TW202444865A TW113112055A TW113112055A TW202444865A TW 202444865 A TW202444865 A TW 202444865A TW 113112055 A TW113112055 A TW 113112055A TW 113112055 A TW113112055 A TW 113112055A TW 202444865 A TW202444865 A TW 202444865A
Authority
TW
Taiwan
Prior art keywords
polishing
weight
less
particles
resin
Prior art date
Application number
TW113112055A
Other languages
English (en)
Chinese (zh)
Inventor
古本有加里
史
市坪大輝
土屋公亮
Original Assignee
日商福吉米股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商福吉米股份有限公司 filed Critical 日商福吉米股份有限公司
Publication of TW202444865A publication Critical patent/TW202444865A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW113112055A 2023-03-30 2024-03-29 研磨用組成物 TW202444865A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023056598 2023-03-30
JP2023-056598 2023-03-30

Publications (1)

Publication Number Publication Date
TW202444865A true TW202444865A (zh) 2024-11-16

Family

ID=92906162

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113112055A TW202444865A (zh) 2023-03-30 2024-03-29 研磨用組成物

Country Status (3)

Country Link
JP (1) JPWO2024203749A1 (https=)
TW (1) TW202444865A (https=)
WO (1) WO2024203749A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005236275A (ja) * 2004-01-23 2005-09-02 Jsr Corp 化学機械研磨用水系分散体および化学機械研磨方法
JP2007134598A (ja) * 2005-11-11 2007-05-31 Toshiba Corp 半導体装置の製造方法
JP2014038906A (ja) * 2012-08-13 2014-02-27 Fujimi Inc 研磨用組成物、当該研磨用組成物の製造方法、及び当該研磨用組成物を用いた半導体基板の製造方法
JP7534283B2 (ja) * 2019-03-28 2024-08-14 株式会社フジミインコーポレーテッド 研磨用組成物
WO2022070801A1 (ja) * 2020-09-29 2022-04-07 株式会社フジミインコーポレーテッド 研磨用組成物およびその利用

Also Published As

Publication number Publication date
JPWO2024203749A1 (https=) 2024-10-03
WO2024203749A1 (ja) 2024-10-03

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