JPWO2024203749A1 - - Google Patents
Info
- Publication number
- JPWO2024203749A1 JPWO2024203749A1 JP2025510659A JP2025510659A JPWO2024203749A1 JP WO2024203749 A1 JPWO2024203749 A1 JP WO2024203749A1 JP 2025510659 A JP2025510659 A JP 2025510659A JP 2025510659 A JP2025510659 A JP 2025510659A JP WO2024203749 A1 JPWO2024203749 A1 JP WO2024203749A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023056598 | 2023-03-30 | ||
| PCT/JP2024/011096 WO2024203749A1 (ja) | 2023-03-30 | 2024-03-21 | 研磨用組成物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024203749A1 true JPWO2024203749A1 (https=) | 2024-10-03 |
Family
ID=92906162
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025510659A Pending JPWO2024203749A1 (https=) | 2023-03-30 | 2024-03-21 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2024203749A1 (https=) |
| TW (1) | TW202444865A (https=) |
| WO (1) | WO2024203749A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005236275A (ja) * | 2004-01-23 | 2005-09-02 | Jsr Corp | 化学機械研磨用水系分散体および化学機械研磨方法 |
| JP2007134598A (ja) * | 2005-11-11 | 2007-05-31 | Toshiba Corp | 半導体装置の製造方法 |
| JP2014038906A (ja) * | 2012-08-13 | 2014-02-27 | Fujimi Inc | 研磨用組成物、当該研磨用組成物の製造方法、及び当該研磨用組成物を用いた半導体基板の製造方法 |
| JP7534283B2 (ja) * | 2019-03-28 | 2024-08-14 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| WO2022070801A1 (ja) * | 2020-09-29 | 2022-04-07 | 株式会社フジミインコーポレーテッド | 研磨用組成物およびその利用 |
-
2024
- 2024-03-21 JP JP2025510659A patent/JPWO2024203749A1/ja active Pending
- 2024-03-21 WO PCT/JP2024/011096 patent/WO2024203749A1/ja not_active Ceased
- 2024-03-29 TW TW113112055A patent/TW202444865A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024203749A1 (ja) | 2024-10-03 |
| TW202444865A (zh) | 2024-11-16 |