TW202437011A - 感光性樹脂組成物、感光性元件、抗蝕劑圖案之形成方法、及印刷配線板之製造方法 - Google Patents

感光性樹脂組成物、感光性元件、抗蝕劑圖案之形成方法、及印刷配線板之製造方法 Download PDF

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Publication number
TW202437011A
TW202437011A TW112149242A TW112149242A TW202437011A TW 202437011 A TW202437011 A TW 202437011A TW 112149242 A TW112149242 A TW 112149242A TW 112149242 A TW112149242 A TW 112149242A TW 202437011 A TW202437011 A TW 202437011A
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TW
Taiwan
Prior art keywords
mass
resin composition
photosensitive resin
photosensitive
meth
Prior art date
Application number
TW112149242A
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English (en)
Chinese (zh)
Inventor
戸田夏木
澤木琢
吉原謙介
賀口陽介
油井基彰
Original Assignee
日商力森諾科股份有限公司
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Application filed by 日商力森諾科股份有限公司 filed Critical 日商力森諾科股份有限公司
Publication of TW202437011A publication Critical patent/TW202437011A/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
TW112149242A 2022-12-23 2023-12-18 感光性樹脂組成物、感光性元件、抗蝕劑圖案之形成方法、及印刷配線板之製造方法 TW202437011A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
WOPCT/JP2022/047694 2022-12-23
PCT/JP2022/047694 WO2024134889A1 (ja) 2022-12-23 2022-12-23 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法、及びプリント配線板の製造方法

Publications (1)

Publication Number Publication Date
TW202437011A true TW202437011A (zh) 2024-09-16

Family

ID=91587907

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112149242A TW202437011A (zh) 2022-12-23 2023-12-18 感光性樹脂組成物、感光性元件、抗蝕劑圖案之形成方法、及印刷配線板之製造方法

Country Status (6)

Country Link
EP (1) EP4607279A4 (https=)
JP (1) JPWO2024134889A1 (https=)
KR (1) KR20250095735A (https=)
CN (1) CN120344917A (https=)
TW (1) TW202437011A (https=)
WO (1) WO2024134889A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4924230B2 (ja) 2007-06-21 2012-04-25 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2013195712A (ja) 2012-03-19 2013-09-30 Hitachi Chemical Co Ltd 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JPWO2016104585A1 (ja) * 2014-12-25 2017-10-05 日立化成株式会社 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法、及びプリント配線板の製造方法
KR102654084B1 (ko) * 2015-07-08 2024-04-04 가부시끼가이샤 레조낙 감광성 엘리먼트, 적층체, 레지스터 패턴의 형성 방법 및 프린트 배선판의 제조 방법
TWI882983B (zh) * 2019-02-05 2025-05-11 日商力森諾科股份有限公司 感光性樹脂組成物、感光性元件、阻劑圖案的形成方法及印刷線路板的製造方法
WO2022030052A1 (ja) * 2020-08-07 2022-02-10 昭和電工マテリアルズ株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法、及びプリント配線板の製造方法
WO2022030053A1 (ja) * 2020-08-07 2022-02-10 昭和電工マテリアルズ株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法、及びプリント配線板の製造方法

Also Published As

Publication number Publication date
CN120344917A (zh) 2025-07-18
EP4607279A1 (en) 2025-08-27
WO2024134889A1 (ja) 2024-06-27
KR20250095735A (ko) 2025-06-26
JPWO2024134889A1 (https=) 2024-06-27
EP4607279A4 (en) 2025-08-27

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