KR20250095735A - 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성 방법, 및 프린트 배선판의 제조 방법 - Google Patents
감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성 방법, 및 프린트 배선판의 제조 방법 Download PDFInfo
- Publication number
- KR20250095735A KR20250095735A KR1020257017835A KR20257017835A KR20250095735A KR 20250095735 A KR20250095735 A KR 20250095735A KR 1020257017835 A KR1020257017835 A KR 1020257017835A KR 20257017835 A KR20257017835 A KR 20257017835A KR 20250095735 A KR20250095735 A KR 20250095735A
- Authority
- KR
- South Korea
- Prior art keywords
- mass
- resin composition
- photosensitive resin
- photosensitive
- resist pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials For Photolithography (AREA)
- Polymerisation Methods In General (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/047694 WO2024134889A1 (ja) | 2022-12-23 | 2022-12-23 | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法、及びプリント配線板の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20250095735A true KR20250095735A (ko) | 2025-06-26 |
Family
ID=91587907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020257017835A Pending KR20250095735A (ko) | 2022-12-23 | 2022-12-23 | 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성 방법, 및 프린트 배선판의 제조 방법 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP4607279A4 (https=) |
| JP (1) | JPWO2024134889A1 (https=) |
| KR (1) | KR20250095735A (https=) |
| CN (1) | CN120344917A (https=) |
| TW (1) | TW202437011A (https=) |
| WO (1) | WO2024134889A1 (https=) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009003177A (ja) | 2007-06-21 | 2009-01-08 | Hitachi Chem Co Ltd | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
| JP2013195712A (ja) | 2012-03-19 | 2013-09-30 | Hitachi Chemical Co Ltd | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2016104585A1 (ja) * | 2014-12-25 | 2017-10-05 | 日立化成株式会社 | 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法、及びプリント配線板の製造方法 |
| KR102654084B1 (ko) * | 2015-07-08 | 2024-04-04 | 가부시끼가이샤 레조낙 | 감광성 엘리먼트, 적층체, 레지스터 패턴의 형성 방법 및 프린트 배선판의 제조 방법 |
| TWI882983B (zh) * | 2019-02-05 | 2025-05-11 | 日商力森諾科股份有限公司 | 感光性樹脂組成物、感光性元件、阻劑圖案的形成方法及印刷線路板的製造方法 |
| WO2022030052A1 (ja) * | 2020-08-07 | 2022-02-10 | 昭和電工マテリアルズ株式会社 | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法、及びプリント配線板の製造方法 |
| WO2022030053A1 (ja) * | 2020-08-07 | 2022-02-10 | 昭和電工マテリアルズ株式会社 | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法、及びプリント配線板の製造方法 |
-
2022
- 2022-12-23 JP JP2024565554A patent/JPWO2024134889A1/ja active Pending
- 2022-12-23 EP EP22969272.8A patent/EP4607279A4/en active Pending
- 2022-12-23 WO PCT/JP2022/047694 patent/WO2024134889A1/ja not_active Ceased
- 2022-12-23 CN CN202280102423.7A patent/CN120344917A/zh active Pending
- 2022-12-23 KR KR1020257017835A patent/KR20250095735A/ko active Pending
-
2023
- 2023-12-18 TW TW112149242A patent/TW202437011A/zh unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009003177A (ja) | 2007-06-21 | 2009-01-08 | Hitachi Chem Co Ltd | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
| JP2013195712A (ja) | 2012-03-19 | 2013-09-30 | Hitachi Chemical Co Ltd | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN120344917A (zh) | 2025-07-18 |
| EP4607279A1 (en) | 2025-08-27 |
| WO2024134889A1 (ja) | 2024-06-27 |
| JPWO2024134889A1 (https=) | 2024-06-27 |
| EP4607279A4 (en) | 2025-08-27 |
| TW202437011A (zh) | 2024-09-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |