TW202436404A - 感光化射線性或感放射線性樹脂組成物、光阻膜、圖案形成方法、電子器件之製造方法 - Google Patents

感光化射線性或感放射線性樹脂組成物、光阻膜、圖案形成方法、電子器件之製造方法 Download PDF

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TW202436404A
TW202436404A TW113100844A TW113100844A TW202436404A TW 202436404 A TW202436404 A TW 202436404A TW 113100844 A TW113100844 A TW 113100844A TW 113100844 A TW113100844 A TW 113100844A TW 202436404 A TW202436404 A TW 202436404A
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Taiwan
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TW113100844A
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Chinese (zh)
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後藤研由
川端健志
楜澤佑真
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日商富士軟片股份有限公司
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Publication of TW202436404A publication Critical patent/TW202436404A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10—Esters
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW113100844A 2023-01-11 2024-01-09 感光化射線性或感放射線性樹脂組成物、光阻膜、圖案形成方法、電子器件之製造方法 TW202436404A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023002187 2023-01-11
JP2023-002187 2023-01-11

Publications (1)

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TW202436404A true TW202436404A (zh) 2024-09-16

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TW113100844A TW202436404A (zh) 2023-01-11 2024-01-09 感光化射線性或感放射線性樹脂組成物、光阻膜、圖案形成方法、電子器件之製造方法

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JP (1) JPWO2024150663A1 (https=)
TW (1) TW202436404A (https=)
WO (1) WO2024150663A1 (https=)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220119336A1 (en) * 2018-12-27 2022-04-21 Mitsubishi Gas Chemical Company, Inc. Compound, (co)polymer, composition, method for forming pattern, and method for producing compound
CN115023652A (zh) * 2020-01-31 2022-09-06 富士胶片株式会社 正型抗蚀剂组合物、抗蚀剂膜、图案形成方法及电子器件的制造方法

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JPWO2024150663A1 (https=) 2024-07-18
WO2024150663A1 (ja) 2024-07-18

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