TW202432780A - 導電膏、rfid嵌體以及rfid嵌體之製造方法 - Google Patents

導電膏、rfid嵌體以及rfid嵌體之製造方法 Download PDF

Info

Publication number
TW202432780A
TW202432780A TW112146561A TW112146561A TW202432780A TW 202432780 A TW202432780 A TW 202432780A TW 112146561 A TW112146561 A TW 112146561A TW 112146561 A TW112146561 A TW 112146561A TW 202432780 A TW202432780 A TW 202432780A
Authority
TW
Taiwan
Prior art keywords
conductive paste
meth
conductive
acrylate
substrate
Prior art date
Application number
TW112146561A
Other languages
English (en)
Chinese (zh)
Inventor
小林洋
土橋悠人
Original Assignee
日商積水化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商積水化學工業股份有限公司 filed Critical 日商積水化學工業股份有限公司
Publication of TW202432780A publication Critical patent/TW202432780A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW112146561A 2022-11-30 2023-11-30 導電膏、rfid嵌體以及rfid嵌體之製造方法 TW202432780A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-191057 2022-11-30
JP2022191057 2022-11-30

Publications (1)

Publication Number Publication Date
TW202432780A true TW202432780A (zh) 2024-08-16

Family

ID=91323812

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112146561A TW202432780A (zh) 2022-11-30 2023-11-30 導電膏、rfid嵌體以及rfid嵌體之製造方法

Country Status (4)

Country Link
JP (1) JP7808188B2 (https=)
CN (1) CN119678227A (https=)
TW (1) TW202432780A (https=)
WO (1) WO2024117182A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025089237A1 (ja) * 2023-10-24 2025-05-01 株式会社レゾナック 接着剤組成物、接続構造体、及び接続構造体の製造方法
WO2026009765A1 (ja) * 2024-07-01 2026-01-08 積水化学工業株式会社 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2018181694A1 (ja) * 2017-03-30 2020-02-06 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP7534840B2 (ja) * 2017-06-12 2024-08-15 積水化学工業株式会社 樹脂粒子、導電性粒子、導電材料、接着剤、接続構造体及び液晶表示素子
JP7280864B2 (ja) * 2018-09-14 2023-05-24 積水化学工業株式会社 導電材料及び接続構造体
JP7606348B2 (ja) * 2019-05-14 2024-12-25 積水化学工業株式会社 樹脂粒子、導電性粒子、導電材料及び接続構造体

Also Published As

Publication number Publication date
JPWO2024117182A1 (https=) 2024-06-06
CN119678227A (zh) 2025-03-21
JP7808188B2 (ja) 2026-01-28
WO2024117182A1 (ja) 2024-06-06

Similar Documents

Publication Publication Date Title
TWI430726B (zh) 電路連接材料、使用其之薄膜狀電路連接材料、電路構件之連接構造及其製造方法
TW202432780A (zh) 導電膏、rfid嵌體以及rfid嵌體之製造方法
CN101849266A (zh) 电路连接材料以及电路部件的连接结构
CN112384994B (zh) 包覆颗粒
JP6165626B2 (ja) 導電性粒子、導電材料及び接続構造体
CN101682988A (zh) 电路连接材料及电路部件的连接结构
TW201330008A (zh) 電路連接材料、連接體以及製造連接體的方法
WO2018181694A1 (ja) 導電性粒子、導電材料及び接続構造体
JP6337630B2 (ja) 回路接続材料及び回路接続構造体
CN101690425A (zh) 电路部件的连接结构
TWI852907B (zh) 導電粒子的選別方法、電路連接材料、連接結構體及其製造方法
JP3898510B2 (ja) 導電性微粒子及び異方性導電材料
JP7808189B2 (ja) 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法
JP7808187B2 (ja) 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法
JP7762209B2 (ja) 導電ペースト、ｒｆｉｄインレイ、ｒｆｉｄインレイの製造方法、チップを接着するための導電ペーストの使用、及びｒｆｉｄインレイを得るための導電ペーストの使用
JP4902853B2 (ja) 樹脂微粒子及び導電性微粒子
TW202513746A (zh) 導電糊、rfid嵌體及rfid嵌體之製造方法
JP7713118B1 (ja) 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法
WO2026009765A1 (ja) 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法
JP2023094423A (ja) 接着剤組成物、異方性導電フィルム、接続構造体および接続構造体の製造方法
TW202513745A (zh) 導電糊、rfid嵌體及rfid嵌體之製造方法
JP7077963B2 (ja) 絶縁被覆導電粒子、異方導電フィルム、異方導電フィルムの製造方法、接続構造体及び接続構造体の製造方法
HK1227549A1 (en) Anisotropic conductive film and manufacturing method thereof
HK1229539A1 (en) Anisotropic conductive film and production method therefor