CN119678227A - 导电糊、rfid嵌体和rfid嵌体的制造方法 - Google Patents

导电糊、rfid嵌体和rfid嵌体的制造方法 Download PDF

Info

Publication number
CN119678227A
CN119678227A CN202380059011.4A CN202380059011A CN119678227A CN 119678227 A CN119678227 A CN 119678227A CN 202380059011 A CN202380059011 A CN 202380059011A CN 119678227 A CN119678227 A CN 119678227A
Authority
CN
China
Prior art keywords
conductive
meth
conductive paste
less
acrylate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380059011.4A
Other languages
English (en)
Chinese (zh)
Inventor
小林洋
土桥悠人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of CN119678227A publication Critical patent/CN119678227A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202380059011.4A 2022-11-30 2023-11-29 导电糊、rfid嵌体和rfid嵌体的制造方法 Pending CN119678227A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-191057 2022-11-30
JP2022191057 2022-11-30
PCT/JP2023/042742 WO2024117182A1 (ja) 2022-11-30 2023-11-29 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法

Publications (1)

Publication Number Publication Date
CN119678227A true CN119678227A (zh) 2025-03-21

Family

ID=91323812

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380059011.4A Pending CN119678227A (zh) 2022-11-30 2023-11-29 导电糊、rfid嵌体和rfid嵌体的制造方法

Country Status (4)

Country Link
JP (1) JP7808188B2 (https=)
CN (1) CN119678227A (https=)
TW (1) TW202432780A (https=)
WO (1) WO2024117182A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025089237A1 (ja) * 2023-10-24 2025-05-01 株式会社レゾナック 接着剤組成物、接続構造体、及び接続構造体の製造方法
WO2026009765A1 (ja) * 2024-07-01 2026-01-08 積水化学工業株式会社 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2018181694A1 (ja) * 2017-03-30 2020-02-06 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP7534840B2 (ja) * 2017-06-12 2024-08-15 積水化学工業株式会社 樹脂粒子、導電性粒子、導電材料、接着剤、接続構造体及び液晶表示素子
JP7280864B2 (ja) * 2018-09-14 2023-05-24 積水化学工業株式会社 導電材料及び接続構造体
JP7606348B2 (ja) * 2019-05-14 2024-12-25 積水化学工業株式会社 樹脂粒子、導電性粒子、導電材料及び接続構造体

Also Published As

Publication number Publication date
JPWO2024117182A1 (https=) 2024-06-06
JP7808188B2 (ja) 2026-01-28
WO2024117182A1 (ja) 2024-06-06
TW202432780A (zh) 2024-08-16

Similar Documents

Publication Publication Date Title
CN119678227A (zh) 导电糊、rfid嵌体和rfid嵌体的制造方法
TWI629691B (zh) 電路連接材料、連接體以及製造連接體的方法
JP5067355B2 (ja) 回路接続材料及び回路部材の接続構造
KR20160135197A (ko) 이방성 도전 필름 및 그의 제조 방법
JP6337630B2 (ja) 回路接続材料及び回路接続構造体
CN103748637A (zh) 导电性粒子、导电材料及连接结构体
KR20170135963A (ko) 이방성 도전 필름 및 접속 구조체
CN118291047A (zh) 电路连接用粘接剂组合物和结构体
CN113823459B (zh) 导电粒子的分选方法、电路连接材料、连接结构体及其制造方法、以及导电粒子
WO2007062131A2 (en) Conductive ink compositions
JP7808189B2 (ja) 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法
JP7762209B2 (ja) 導電ペースト、ｒｆｉｄインレイ、ｒｆｉｄインレイの製造方法、チップを接着するための導電ペーストの使用、及びｒｆｉｄインレイを得るための導電ペーストの使用
CN119678228A (zh) 导电糊、rfid嵌体和rfid嵌体的制造方法
CN121713258A (zh) 导电糊、rfid嵌体及rfid嵌体的制造方法
JP2003208813A (ja) 導電性微粒子及び異方性導電材料
JP4902853B2 (ja) 樹脂微粒子及び導電性微粒子
JP7713118B1 (ja) 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法
JP6302336B2 (ja) 光硬化性導電材料用導電性粒子、光硬化性導電材料、接続構造体の製造方法及び接続構造体
WO2026009765A1 (ja) 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法
CN120836064A (zh) 导电糊、rfid嵌体和rfid嵌体的制造方法
KR20230009896A (ko) 도전성 접착제, 회로 접속 구조체의 제조 방법 및 회로 접속 구조체
HK1227549A1 (en) Anisotropic conductive film and manufacturing method thereof

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination