TW202429198A - 樹脂組成物、絕緣膜及再配線層用層間絕緣膜的製造方法 - Google Patents

樹脂組成物、絕緣膜及再配線層用層間絕緣膜的製造方法 Download PDF

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Publication number
TW202429198A
TW202429198A TW112136545A TW112136545A TW202429198A TW 202429198 A TW202429198 A TW 202429198A TW 112136545 A TW112136545 A TW 112136545A TW 112136545 A TW112136545 A TW 112136545A TW 202429198 A TW202429198 A TW 202429198A
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Taiwan
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resin composition
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compound
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TW112136545A
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English (en)
Chinese (zh)
Inventor
正木洋佑
野越啓介
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日商富士軟片股份有限公司
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Publication of TW202429198A publication Critical patent/TW202429198A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/04—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonamides, polyesteramides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/101—Esters; Ether-esters of monocarboxylic acids
    • C08K5/105—Esters; Ether-esters of monocarboxylic acids with phenols
    • C08K5/107—Esters; Ether-esters of monocarboxylic acids with phenols with polyphenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
TW112136545A 2022-09-30 2023-09-25 樹脂組成物、絕緣膜及再配線層用層間絕緣膜的製造方法 TW202429198A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022158657 2022-09-30
JP2022-158657 2022-09-30

Publications (1)

Publication Number Publication Date
TW202429198A true TW202429198A (zh) 2024-07-16

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TW112136545A TW202429198A (zh) 2022-09-30 2023-09-25 樹脂組成物、絕緣膜及再配線層用層間絕緣膜的製造方法

Country Status (3)

Country Link
JP (1) JPWO2024070713A1 (https=)
TW (1) TW202429198A (https=)
WO (1) WO2024070713A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026009853A1 (ja) * 2024-07-05 2026-01-08 富士フイルム株式会社 樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、及び、半導体デバイス、並びに、ポリイミド前駆体の合成方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000044517A (ja) * 1998-07-27 2000-02-15 Fuji Photo Film Co Ltd 光学補償シート、液晶表示素子、ディスコティック化合物、および液晶組成物
JP2008214605A (ja) * 2007-02-09 2008-09-18 Fujifilm Corp グリース組成物、及び機械要素
JP2010070709A (ja) * 2008-09-22 2010-04-02 Fujifilm Corp 組成物、カラーフィルタ、及びカラーフィルタの製造方法
JP5884258B2 (ja) * 2009-09-18 2016-03-15 Jnc株式会社 液晶配向剤、液晶配向膜、液晶配向膜の製造方法および液晶表示素子
KR20160124082A (ko) * 2014-02-10 2016-10-26 히다치 가세이듀퐁 마이쿠로시스데무즈 가부시키가이샤 폴리이미드 전구체를 포함하는 수지 조성물, 경화막의 제조 방법 및 전자 부품
JP6388640B2 (ja) * 2014-03-17 2018-09-12 旭化成株式会社 感光性樹脂組成物、硬化レリーフパターンの製造方法、並びに半導体装置
JP2022001901A (ja) * 2020-06-19 2022-01-06 住友化学株式会社 偏光板及びその製造方法
TWI904246B (zh) * 2020-09-29 2025-11-11 日商富士軟片股份有限公司 樹脂組成物、硬化物、積層體、硬化物的製造方法及半導體元件

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JPWO2024070713A1 (https=) 2024-04-04

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