TW202418929A - Cooling system - Google Patents

Abstract

The present disclosure provides a cooling system, including an air-cooling device and a water-cooling device. The air-cooling device includes a first fan, an evaporator, a first condenser, and a second fan. The first fan is configured to blow hot air inside a rack into a first cooling room. The second fan is configured to blow outside air into a second cooling room. When the evaporator receives the hot air, the evaporator is configured to heat refrigerant into gaseous state and transmit the refrigerant to the first condenser. When the first condenser receives the outside air, the first condenser is configured to condense the refrigerant into liquid state and transmit the refrigerant to the evaporator. The water-cooling device includes a hydronic coil. The hydronic coil is configured to receive hot liquid from an electronic device in the rack and transmit cold liquid to the electronic device. When the hydronic coil receives the outside air, the hydronic coil is configured to cool down the hot liquid to the cold liquid.

Description

Cooling system

This case relates to a cooling system, and more particularly to a cooling system comprising an air cooling device and a water cooling device.

Generally, communication cabinets installed outdoors contain power systems and switches. Traditionally, air cooling is used to provide cold air to these electronic components to cool them. However, as the performance of chips in electronic components increases, the heat generated by the chips also increases. If only traditional air cooling is used, it is not enough to effectively dissipate the heat of electronic components.

An embodiment of the present case provides a cooling system, including an air cooling device and a water cooling device. The air cooling device includes a first fan, an evaporator, a first condenser and a second fan. The first fan is arranged in the first cooling chamber and is used to blow the hot air in the cabinet into the first cooling chamber. The evaporator is arranged in the first cooling chamber. The first condenser is arranged in the second cooling chamber. The second fan is arranged in the second cooling chamber and is used to blow external gas into the second cooling chamber. When the evaporator receives hot air through the first fan, the evaporator is used to heat the refrigerant to a gaseous state and transfer the refrigerant to the first condenser through a first pipeline. When the first condenser receives external gas through the second fan, the first condenser is used to condense the refrigerant into a liquid state and transfer the refrigerant to the evaporator through a second pipeline. The water cooling device includes a water-cooled row. The water cooling radiator is arranged in the second cooling chamber and is used to receive hot liquid from the electronic equipment in the cabinet through the third pipeline and transmit cold liquid to the electronic equipment through the fourth pipeline. When the water cooling radiator receives external air through the second fan, the water cooling radiator is used to cool the hot liquid into cold liquid.

Another embodiment of the present case provides a cooling system, including a flat plate heat exchanger, a first fan, a second fan and a water cooling device. The flat plate heat exchanger includes a plurality of plates, and the plates are used to form at least one hot channel and at least one cold channel. The first fan is used to blow the hot air in the cabinet into at least one hot channel of the flat plate heat exchanger. The second fan is used to blow external gas into at least one cold channel of the flat plate heat exchanger. When the hot air flows through at least one hot channel and the external gas flows through at least one cold channel, the plates are used to cool the hot air. The water cooling device includes a radiator. The radiator is used to receive hot liquid from the electronic equipment in the cabinet through a first pipeline, and to transmit cold liquid to the electronic equipment through a second pipeline. When the radiator receives external gas through the second fan, the radiator is used to cool the hot liquid into cold liquid.

The following is a detailed description of the embodiments with the attached diagrams, but the embodiments provided are not intended to limit the scope of the disclosure, and the description of the structure operation is not intended to limit its execution order. Any device with equal functions produced by the re-combination of components is within the scope of the disclosure. In addition, the diagrams are for illustration purposes only and are not drawn according to the original size. For ease of understanding, the same or similar components in the following description will be marked with the same symbols.

In this document, unless the context specifically limits the article, "a", "an" and "the" may refer to one or more. In addition, "include", "include", "have", and similar words used in this document are used to specify the characteristics, regions, integers, steps, operations, elements and/or components recorded.

In this document, when an element is described as being "connected", "coupled" or "electrically connected" to another element, the element may be directly connected, directly coupled or directly electrically connected to the other element, or there may be an additional element between the two elements, and the element may be indirectly connected, indirectly coupled or indirectly electrically connected to the other element. In addition, although the terms "first", "second", etc. are used in this document to describe different elements, the terms are only used to distinguish elements or operations described with the same technical terms.

Some embodiments of the present disclosure provide a cooling system. Please refer to FIG. 1. FIG. 1 is a schematic diagram of a cooling system 100 according to some embodiments of the present disclosure. The cooling system 100 is used to cool the internal temperature of the cabinet RAK. In some embodiments, the cabinet RAK is set outdoors and is used to accommodate communication equipment. The power module SMR is used to convert AC power into DC power and transmit the DC power to the power system POW. The power system POW is used to provide power to the electronic devices ED1~ED3. The power module SMR, the power system POW and the electronic devices ED1~ED3 in the cabinet RAK will generate heat energy during operation, causing heat to be generated inside the cabinet RAK.

In some embodiments, the electronic devices ED1-ED3 are central processing units (CPUs), graphics processing units (GPUs) or other chips used for communication-related data calculations and data processing. In some embodiments, electronic devices ED1-ED3 with higher computing power or performance will generate more heat during operation.

As shown in FIG. 1 , the cooling system 100 includes a first fan 110 and a second fan 130, an evaporator 120, a first condenser 140, and a water-cooling radiator 160. The first fan 110 and the evaporator 120 are disposed in a first cooling chamber R1, and the second fan 130, the first condenser 140, and the water-cooling radiator 160 are disposed in a second cooling chamber R2. The evaporator 120 and the first condenser 140 are connected to each other through a first pipeline P1 and a second pipeline P2. The water-cooling radiator 160 is connected to the electronic devices ED1-ED3 through a third pipeline P3 and a fourth pipeline P4.

In some embodiments, as shown in FIG. 1 , the first cooling chamber R1 and the second cooling chamber R2 are disposed on the same side of the machine cabinet RAK, and the first cooling chamber R1 is disposed between the second cooling chamber R2 and the machine cabinet RAK.

In some embodiments, the air in the first cooling chamber R1 and the cabinet RAK flows through holes (not shown in the figure), and the air in the second cooling chamber R2 and external air of the external environment flows through holes (not shown in the figure).

In some embodiments, the cooling system 100 further includes an isolation wall ISO. As shown in FIG. 1 , the first cooling chamber R1 and the second cooling chamber R2 are separated by the isolation wall ISO. In other words, the isolation wall ISO is disposed between the first cooling chamber R1 and the second cooling chamber R2. The isolation wall ISO is used to prevent the hot air blown into the first cooling chamber R1 by the first fan 110 from flowing into the second cooling chamber R2, and to prevent the external air blown into the second cooling chamber R2 by the second fan 130 from flowing into the first cooling chamber R1.

In some embodiments, the isolation wall ISO has at least one through hole (not shown in the figure), and the at least one through hole is used to allow the first pipeline P1, the second pipeline P2, the third pipeline P3, and the fourth pipeline P4 to pass through the isolation wall ISO. In some embodiments, the isolation wall ISO has four through holes (not shown in the figure), and the four through holes are used to allow the first pipeline P1, the second pipeline P2, the third pipeline P3, and the fourth pipeline P4 to pass through the isolation wall ISO.

Therefore, the isolation wall ISO can prevent the air from flowing between the first cooling chamber R1 and the second cooling chamber R2, and allow the refrigerant to be transmitted between the evaporator 120 and the first condenser 140 through the first pipeline P1 and the second pipeline P2, and allow the liquid to be transmitted between the electronic devices ED1-ED3 and the radiator 160 through the third pipeline P3 and the fourth pipeline P4.

It should be noted that the configuration of the embodiment of FIG. 1 is merely illustrative and is not intended to limit the embodiments of the present disclosure. In different embodiments, the structure and position relationship of the first cooling chamber R1 and the second cooling chamber R2 and the cabinet RAK are different from the embodiment of FIG. 1.

In some embodiments, the cooling system 100 cools the internal temperature of the cabinet RAK through an air cooling device and a water cooling device. In other words, the components in the cooling system 100 can be classified as an air cooling device and a water cooling device. Since the first fan 110 and the second fan 130, the evaporator 120, the first condenser 140, and the first pipeline P1 and the second pipeline P2 use gas as a medium to bring the heat inside the cabinet RAK out of the cabinet RAK, these components are called air cooling devices. Since the water cooling radiator 160 and the third pipeline P3 and the fourth pipeline P4 use liquid as a medium to bring the heat inside the cabinet RAK out of the cabinet RAK, these components are called water cooling devices. The following paragraphs will explain in detail the operation of each component in the cooling system 100.

In some embodiments, as shown in FIG1 , the first fan 110 is disposed at a relatively high position, and the second fan 130 is disposed at a relatively low position. In other words, in a direction perpendicular to the ground, the first fan 110 is higher, and the second fan 130 is lower.

As shown in FIG. 1 , when the power module SMR, the power system POW, and the electronic devices ED1-ED3 in the cabinet RAK generate hot air, the first fan 110 is used to blow the hot air in the cabinet RAK into the first cooling chamber R1. In some embodiments, the first fan 110 is disposed in the first cooling chamber R1, and there is a through hole (not shown in the figure) between the first cooling chamber R1 and the cabinet RAK near the first fan 110, so that the first fan 110 can blow the hot air from the cabinet RAK into the first cooling chamber R1 through the through hole.

As shown in FIG. 1 , after the first fan 110 blows the hot air into the first cooling chamber R1, the isolation wall ISO is further used to allow the hot air to flow to the evaporator 120 along the isolation wall ISO.

As shown in FIG. 1 , when the hot air from the cabinet RAK is blown to the evaporator 120 by the first fan 110, the evaporator 120 is used to heat the refrigerant in the evaporator 120 to a gas state, and transmits the refrigerant to the first condenser 140 through the first pipeline P1. In some embodiments, the evaporator 120 is used to store liquid refrigerant. When the evaporator 120 receives the hot air from the cabinet RAK through the first fan 110 and the liquid refrigerant in the evaporator 120 is heated to a certain temperature, the liquid refrigerant will be converted into a gas state, and the gaseous refrigerant will rise along the first pipeline P1 and finally be transmitted to the first condenser 140.

Please refer to FIG. 2A and FIG. 2B. FIG. 2A and FIG. 2B are schematic diagrams of the first condenser 140 and the evaporator 120 in FIG. 1 according to some embodiments of the present disclosure. In some embodiments, the evaporator 120 in FIG. 1 has a structure of the condenser/evaporator 200 in FIG. 2A-2B. As shown in FIG. 2A and FIG. 2B, the condenser/evaporator 200 includes a plurality of parallel flow flat tubes 220 arranged adjacent to each other, and each parallel flow flat tube 220 is connected to a refrigerant inlet and a refrigerant outlet. Each parallel flow flat tube 220 includes a plurality of microchannels 240, and the microchannels 240 are used as refrigerant flow paths for transmitting refrigerant. A plurality of heat sink fins 260 are disposed between every two parallel flow-flat tubes 220 . The heat sink fins 260 are in contact with adjacent parallel flow-flat tubes 220 and are used to perform heat exchange between the liquid in the microchannels 240 and the air flowing through the heat sink fins 260 .

In some embodiments, when the refrigerant flows through the microchannels 240 in the parallel flow flat tubes 220, the hot air from the cabinet RAK flows through the air flow path and transfers heat to the heat sink fins 260. The heat sink fins 260 transfer heat to the parallel flow flat tubes 220, and the parallel flow flat tubes 220 transfer heat to the refrigerant in the microchannels 240. In this way, the condenser/evaporator 200 absorbs heat from the hot air and heats the refrigerant to a gaseous state.

In some embodiments, when the liquid refrigerant is heated to a certain temperature, the liquid refrigerant will be converted into a gaseous refrigerant. In some embodiments, when the gaseous refrigerant is cooled to below a certain temperature, the gaseous refrigerant will be converted into a liquid refrigerant.

Please refer to Figure 1 again. The second fan 130 is used to blow external air into the second cooling chamber R2. In some embodiments, the second fan 130 is disposed in the second cooling chamber R2, and the second cooling chamber R2 has a through hole (not shown) near the second fan 130, so that the second fan 130 can blow external air from the external environment into the second cooling chamber R2 through the through hole.

As shown in FIG. 1 , after the second fan 130 blows the external air into the second cooling chamber R2, the isolation wall ISO is further used to allow the external air to flow to the first condenser 140 along the isolation wall ISO.

As shown in FIG. 1 , after the first condenser 140 receives the gaseous refrigerant through the first pipeline P1, when the first condenser 140 receives external gas through the second fan 130, the first condenser 140 is used to condense the refrigerant into liquid, and transmit the refrigerant to the evaporator 120 through the second pipeline P2. In other words, when the gaseous refrigerant in the first condenser 140 is cooled to a certain temperature, the gaseous refrigerant will be converted into liquid, and the liquid refrigerant will flow down along the second pipeline P2 due to gravity, and finally be transmitted to the evaporator 120.

In some embodiments, the second cooling chamber R2 has a port (not shown) connected to the external environment near the first condenser 140. After the external air flows through the first condenser 140 and absorbs the heat of the refrigerant in the first condenser 140, the external air will be discharged to the outside of the second cooling chamber R2 through the port, thereby transferring the heat to the external environment.

In some embodiments, the first condenser 140 in FIG. 1 has a structure similar to the condenser/evaporator 200 in FIGS. 2A and 2B. When the refrigerant flows through the microchannels 240 in the parallel flow flat tubes 220 and the external gas flows through the air flow path of the condenser/evaporator 200, the heat sink fins 260 are used to transfer the heat from the refrigerant in the microchannels 240 to the external gas in contact with the heat sink fins 260. In this way, the condenser/evaporator 200 is used to transfer the heat of the gaseous refrigerant to the external gas, so that the gaseous refrigerant is cooled and condensed into a liquid refrigerant.

In some embodiments, as shown in FIG. 1 , after the first condenser 140 transfers the liquid refrigerant to the evaporator 120 through the second pipeline P2, when the evaporator 120 receives the liquid refrigerant from the second pipeline P2, the first fan 110 is further used to blow the cold air cooled by the refrigerant into the cabinet RAK.

In some embodiments, the first cooling chamber R1 and the cabinet RAK have a passage (not shown in the figure) near the evaporator 120. When the evaporator 120 receives the cooled liquid refrigerant, the wind blown by the first fan 110 will first pass through the evaporator 120 and then flow into the cabinet RAK from the passage. Since the evaporator 120 contains the cooled liquid refrigerant at this time, the wind flowing through the evaporator 120 will exchange heat with the refrigerant in the evaporator 120 and be cooled, so the cold wind will flow into the cabinet RAK.

Through the configuration of the first fan 110 and the second fan 130, the evaporator 120, the first condenser 140, and the first pipeline P1 and the second pipeline P2, the heat of the hot air in the cabinet RAK is first transferred to the refrigerant, and the refrigerant then transfers the heat to the external air, and the external air then discharges the heat to the external environment. In this way, the cooling system 100 discharges part of the heat in the cabinet RAK through the air cooling device.

As mentioned above, in some embodiments, since the electronic devices ED1-ED3 generate a large amount of heat during operation, the cooling system 100 discharges the heat generated by the electronic devices ED1-ED3 out of the rack RAK through a water cooling device. The operation of the water cooling device of the cooling system 100 is described below.

As shown in FIG. 1 , the radiator 160 is disposed in the second cooling chamber R2 and is used to receive hot liquid from the electronic devices ED1-ED3 in the rack RAK through the third pipeline P3 and to transmit cold liquid to the electronic devices ED1-ED3 through the fourth pipeline P4. In other words, the electronic devices ED1-ED3 generate heat during operation, and the third pipeline P3 and the fourth pipeline P4 are used to transmit liquid between the electronic devices ED1-ED3 and the radiator 160, so as to discharge the heat generated by the electronic devices ED1-ED3 out of the rack RAK through the liquid.

In some embodiments, after the liquid absorbs the heat generated by the electronic devices ED1-ED3, the third pipeline P3 is used to transfer the hot liquid to the radiator 160. After the radiator 160 cools the hot liquid into cold liquid, the fourth pipeline P4 is used to transfer the cold liquid back to the electronic devices ED1-ED3, so that the cold liquid exchanges heat with the electronic devices ED1-ED3 again.

In some embodiments, as shown in FIG. 1 , when the radiator 160 receives external air through the second fan 130, the radiator 160 is used to cool the hot liquid into cold liquid. In other words, when the external air flows through the radiator 160, the external air will exchange heat with the hot liquid in the radiator 160, so that the hot liquid is cooled into cold liquid.

In some embodiments, as shown in FIG. 1, through the configuration of the cooling system 100 shown in FIG. 1, after being blown in by the second fan 130, the external air will first flow through the water cooling radiator 160, then flow through the first condenser 140, and finally flow out to the external environment from the opening of the second cooling chamber R2 adjacent to the first condenser 140. In different embodiments, the cooling system 100 has a configuration different from the embodiment of FIG. 1, and after being blown in by the second fan 130, the external air will first flow through the first condenser 140, then flow through the water cooling radiator 160, and finally flow out to the external environment from the opening.

Please refer to FIG. 3. FIG. 3 is a schematic diagram of the water cooling radiator 160 in FIG. 1 according to some embodiments of the present disclosure. In some embodiments, the water cooling radiator 160 includes openings 162 and 168, a tubular structure 164, and a fin structure 166. The opening 162 is used to connect to the third pipeline P3 shown in FIG. 1 and receive hot liquid from the electronic devices ED1~ED3, and the opening 168 is used to connect to the fourth pipeline P4 shown in FIG. 1 and transmit the cooled cold liquid to the electronic devices ED1~ED3. The tubular structure 164 has a winding structure. The fin structure 166 is disposed outside the tubular structure 164 and is used to perform heat exchange between the liquid in the tubular structure 164 and the air flowing through the fin structure 166. For example, when external gas flows through the radiator 160 and contacts the fin structure 166 of the radiator 160, the external gas exchanges heat with the hot liquid in the tubular structure 164 of the radiator 160, so that the hot liquid is cooled down to become cold liquid.

In some embodiments, as shown in FIG. 1 , the cooling system 100 further includes a pump 150. The pump 150 is disposed at a portion of the fourth pipeline P4. When the cold liquid flows through the fourth pipeline P4 to the pump 150, the pump 150 is used to pressurize the cold liquid and increase the flow rate of the cold liquid so that the cold liquid flows to the electronic devices ED1 to ED3. In different embodiments, the pump 150 is disposed at a portion of the third pipeline P3. When the hot liquid flows through the third pipeline P3 to the pump 150, the pump 150 is used to increase the flow rate of the hot liquid.

Through the configuration of the water cooling radiator 160, the pump 150, the third pipeline P3 and the fourth pipeline P4, the heat generated by the electronic devices ED1-ED3 is transferred to the outside of the rack RAK through the circulation of liquid. In this way, the cooling system 100 discharges the heat generated by the electronic devices ED1-ED3 in the rack RAK through the water cooling device.

In some embodiments, the liquid transmitted by the third pipeline P3 and the fourth pipeline P4 in FIG. 1 is heat exchanged with the electronic devices ED1-ED3 through the cooling plate. Please refer to FIG. 4A. FIG. 4A is a partial schematic diagram of the cooling system 100 shown in FIG. 1 according to some embodiments of the present disclosure. FIG. 4A only shows the water cooling device in the cooling system 100 in FIG. 1, that is, the water cooling radiator 160, the pump 150, and the third pipeline P3 and the fourth pipeline P4, and omits the air cooling device in the cooling system 100.

As shown in FIG. 4A , in the container CON, the electronic device ED is disposed on the circuit board PCB, and the cooling plate 420 is disposed on the electronic device ED and in contact with the electronic device ED. The cooling plate 420 is used to transfer hot liquid to the water cooling radiator 160 through the third pipeline P3, receive cold liquid from the water cooling radiator 160 through the fourth pipeline P4, and perform heat exchange between the liquid and the electronic device ED by contacting with the electronic device ED.

Please refer to FIG. 4B. FIG. 4B is a schematic diagram of the cooling plate 420 in FIG. 4A according to some embodiments of the present disclosure. In some embodiments, the cooling plate 420 includes a tubular structure 426 and a plate structure 424. The tubular structure 426 has openings 422 and 428. The openings 422 and 428 are used to connect the third pipeline P3 and the fourth pipeline P4, respectively. The tubular structure 426 is disposed on the plate structure 424 and contacts the plate structure 424. The plate structure 424 is used to contact the electronic device ED. In some embodiments, the plate structure 424 is made of a material with high thermal conductivity.

As shown in FIG. 4A , when the cold liquid is transferred to the cooling plate 420 through the fourth pipeline P4, the cold liquid exchanges heat with the electronic device ED through the cooling plate 420, and the cold liquid absorbs the heat generated by the electronic device ED and is heated to hot liquid. The hot liquid is transferred to the water cooling radiator 160 through the third pipeline P3, and the water cooling radiator 160 cools the hot liquid to cold liquid according to the embodiment in the previous paragraph. In some embodiments, the cooling plate 420 is called a water cooling plate.

Please refer to FIG. 5. FIG. 5 is a partial schematic diagram of the cooling system 100 shown in FIG. 1 according to some embodiments of the present disclosure. FIG. 5 only shows the water cooling device in the cooling system 100 of FIG. 1, and omits the air cooling device in the cooling system 100. In some embodiments, as shown in FIG. 5, the container CON is used to store the dielectric liquid 520, and the electronic device ED is immersed in the dielectric liquid 520. In other words, the electronic device ED is immersed in the dielectric liquid 520 and directly contacts the dielectric liquid 520 for heat exchange. After the dielectric liquid 520 absorbs the heat generated by the electronic device ED, the third pipeline P3 is used to transfer the dielectric liquid 520 from the container CON to the water cooling radiator 160. After the water-cooling radiator 160 cools the dielectric liquid 520, the fourth pipeline P4 is used to transfer the cooled dielectric liquid 520 back to the container CON.

In some embodiments, the dielectric fluid 520 is a non-conductive liquid, such as oil, fluoride, and the like.

Please refer to FIG. 6A. FIG. 6A is a partial schematic diagram of the cooling system 100 shown in FIG. 1 according to some embodiments of the present disclosure. FIG. 6A only shows the water cooling device in the cooling system 100 in FIG. 1, and omits the air cooling device in the cooling system 100. In some embodiments, compared with the embodiment of FIG. 5, in the embodiment of FIG. 6A, the cooling system 100 further includes a second condenser 620. The second condenser 620 is disposed in the container CON and connected to the third pipeline P3 and the fourth pipeline P4.

In some embodiments, as shown in FIG. 6A , the boiling point of the dielectric liquid 520 in the container CON is less than 100 degrees Celsius, for example, the boiling point of the dielectric liquid 520 is 50 degrees Celsius to 65 degrees Celsius. When the dielectric liquid 520 is heated by the electronic device ED to exceed its boiling point, the dielectric liquid 520 will change from liquid to gaseous state, and at this time, the second condenser 620 is used to condense the dielectric liquid 520 into liquid state. In other words, the liquid dielectric liquid 520 is converted into gaseous dielectric liquid 520 after being heated and fills the air in the container CON. When the gaseous dielectric liquid 520 contacts the second condenser 620, the relatively high temperature gaseous dielectric liquid 520 will condense on the relatively low temperature surface or shell of the second condenser 620 because the cold liquid from the fourth pipeline P4 flows in the second condenser 620.

When the gaseous dielectric liquid 520 condenses on the second condenser 620, the dielectric liquid 520 and the liquid in the second condenser 620 will exchange heat, so that the cold liquid in the second condenser 620 is heated to hot liquid, and the second condenser 620 then transfers the hot liquid to the water cooling radiator 160 through the fourth pipeline P4. The dielectric liquid 520 condensed on the second condenser 620 will turn back into liquid and continue to be stored in the container CON.

Different from the embodiment of FIG. 5 , in the embodiment of FIG. 6A , the liquid in the third pipeline P3 and the fourth pipeline P4, the second condenser 620 and the radiator 160 is separated from the dielectric liquid 520 stored in the container CON. In the embodiment of FIG. 5 , the dielectric liquid 520 flows through the third pipeline P3 and the fourth pipeline P4 and the radiator 160.

Please refer to FIG. 6B at the same time. FIG. 6B is a schematic diagram of the second condenser 620 in FIG. 6A according to some embodiments of the present disclosure. In some embodiments, the second condenser 620 includes openings 622 and 626 and a tubular structure 624. The opening 626 is used to connect to the fourth pipeline P4 to receive cold liquid from the water-cooling radiator 160 and transfer it to the tubular structure 624. The opening 622 is used to connect to the third pipeline P3 to transfer hot liquid from the tubular structure 624 to the water-cooling radiator 160. When the liquid flows in the tubular structure 624, the tubular structure 624 is used to condense the heated and vaporized dielectric liquid 520 on its surface, so that the dielectric liquid 520 and the liquid in the tubular structure 624 perform heat exchange.

The three water cooling devices in the above-mentioned embodiments of FIG. 4A, FIG. 5 and FIG. 6A can all be used in the cooling system 100 shown in FIG. 1 to discharge the heat generated by the electronic devices ED1~ED3 in FIG. 1.

Some embodiments of the present disclosure also provide another cooling system. Please refer to FIG. 7A. FIG. 7A is a schematic diagram of a cooling system 700 according to some embodiments of the present disclosure. The cooling system 700 includes a first fan 710 and a second fan 730, a flat plate heat exchanger 720, a water cooling radiator 740 and a pump 750.

In some embodiments, as shown in FIG. 7A , the first fan 710 and the second fan 730 , the flat plate heat exchanger 720 , the radiator 740 , and the pump 750 are disposed in the cooling chamber R3 .

Please refer to FIG. 7B and FIG. 7C. FIG. 7B and FIG. 7C are schematic diagrams of the flat plate heat exchanger 720 in FIG. 7A according to some embodiments of the present disclosure. The flat plate heat exchanger 720 includes a plurality of plates 722, which are spaced apart from each other and used to form a hot channel P5 and a cold channel P6.

In some embodiments, as shown in FIG. 7C , hot air from the rack RAK will flow through the hot channel P5, and external air from the external environment will flow through the cold channel P6. When the hot air and the external air flow on both sides of the plate 722, the hot air and the external air exchange heat through the plate 722, so that the hot air transfers heat to the external air, and the hot air is cooled.

Please refer to Figure 7A again. When the power module SMR, power system POW and electronic devices ED1-ED3 in the cabinet RAK generate hot air, the first fan 710 is used to blow the hot air in the cabinet RAK into the cooling chamber R3. In some embodiments, the first fan 710 is disposed in the cooling chamber R3, and there is a passage (not shown in the figure) between the cooling chamber R3 and the cabinet RAK near the first fan 710, so that the first fan 710 can blow the hot air from the cabinet RAK into the cooling chamber R3 through the passage.

As shown in FIG. 7A , the hot air from the rack RAK is blown into the hot channel P5 of the flat plate heat exchanger 720 by the first fan 710 . For the sake of simplicity, FIG. 7A only schematically illustrates the hot channel P5 and the cold channel P6 . In some embodiments, a plurality of hot channels P5 and a plurality of cold channels P6 are formed between a plurality of plates 740 of the flat plate heat exchanger 720 .

As shown in FIG. 7A , the second fan 730 is used to blow external air from the external environment into the cooling chamber R3. The external air first flows through the water cooling radiator 740 and then flows into the cold channel P6 of the flat plate heat exchanger 720. In some embodiments, the cooling chamber R3 is provided with a port (not shown in the figure), and the external air can flow out to the external environment after flowing through the cold channel P6 of the flat plate heat exchanger 720.

In some embodiments, when hot air flows into the hot channel P5 of the flat plate heat exchanger 720 and external air flows into the cold channel P6 of the flat plate heat exchanger 720, the plates 722 of the flat plate heat exchanger 720 are used to cool the hot air, and the hot air exchanges heat with the external air, and the hot air transfers heat to the external air.

In some embodiments, the cooling chamber R3 is provided with a through hole (not shown in the figure), and after the hot air flows through the hot channel P5 of the flat plate heat exchanger 720 and is cooled into cold air, the first fan 710 is used to blow the cold air into the cabinet RAK.

Through the configuration of the first fan 710, the second fan 730, and the flat plate heat exchanger 720, the hot air from the rack RAK is cooled through the flat plate heat exchanger 720 and then flows into the rack RAK.

As shown in FIG. 7A , the water cooling radiator 740 is disposed in the cooling chamber R3 and is used to receive hot liquid from the electronic devices ED1-ED3 in the rack RAK through the first pipeline P7 and transmit cold liquid to the electronic devices ED1-ED3 through the second pipeline P8.

In some embodiments, after the liquid absorbs the heat generated by the electronic devices ED1-ED3, the first pipeline P7 is used to transfer the hot liquid to the water cooling radiator 740. After the water cooling radiator 740 cools the hot liquid into cold liquid, the second pipeline P8 is used to transfer the cold liquid back to the electronic devices ED1-ED3, so that the cold liquid exchanges heat with the electronic devices ED1-ED3 again.

In some embodiments, as shown in FIG. 7A , when the radiator 740 receives external air through the second fan 730, the radiator 740 is used to cool the hot liquid into cold liquid. In other words, when the external air flows through the radiator 740, the external air will exchange heat with the hot liquid in the radiator 740, so that the hot liquid is cooled into cold liquid.

In some embodiments, through the configuration of the cooling system 700 shown in FIG. 7A , after being blown in by the second fan 730, the external air will first flow through the water cooling radiator 740, then flow through the flat plate heat exchanger 720, and finally flow out to the external environment from the opening at the position of the cooling chamber R3 adjacent to the flat plate heat exchanger 720. In different embodiments, the cooling system 700 has a configuration different from the embodiment of FIG. 7A , and after being blown in by the second fan 730, the external air will first flow through the flat plate heat exchanger 720, then flow through the water cooling radiator 740, and finally flow out to the external environment from the opening.

In some embodiments, as shown in FIG. 7A , the pump 750 is disposed at a portion of the second pipeline P8. When the cold liquid flows through the second pipeline P8 to the pump 750, the pump 750 is used to pressurize the cold liquid and increase the flow rate of the cold liquid so that the cold liquid flows to the electronic devices ED1 to ED3. In different embodiments, the pump 750 is disposed at a portion of the first pipeline P7. When the hot liquid flows through the first pipeline P7 to the pump 750, the pump 750 is used to increase the flow rate of the hot liquid.

Compared with the cooling system 100 shown in FIG. 1 , the cooling system 700 uses a different air cooling device, using a flat plate heat exchanger 720. However, the cooling system 700 uses a water cooling device similar to the cooling system 100, that is, the heat generated by the electronic devices ED1-ED3 is discharged through the configuration of the water cooling radiator 740 and the first pipeline P7 and the second pipeline P8. In addition, the three water cooling devices in the embodiments of FIG. 4A, FIG. 5 and FIG. 6A can all be used in the cooling system 700 shown in FIG. 7 .

In summary, the present disclosure provides a cooling system including both an air cooling device and a water cooling device. The air cooling device may use a configuration combining an evaporator and a condenser, or a configuration of a flat plate heat exchanger. The water cooling device may use a configuration of a water cooling plate, or a configuration of immersing the electronic device in a dielectric fluid. In this way, the heat generated by the equipment in the cabinet can be effectively discharged outside the cabinet to maintain the performance of the equipment in the cabinet.

Although the content of this disclosure has been disclosed in the form of implementation as above, it is not intended to limit the present invention. Anyone skilled in the art can make various changes and modifications without departing from the spirit and scope of the content of this disclosure. The scope of protection of the content of this disclosure shall be determined by the scope of the attached patent application.

100: Cooling system 110: First fan 120: Evaporator 130: Second fan 140: First condenser 150: Pump 160: Radiator P1: First pipeline P2: Second pipeline P3: Third pipeline P4: Fourth pipeline R1: First cooling chamber R2: Second cooling chamber RAK: Cabinet SMR: Power module ED1, ED2, ED3: Electronic equipment POW: Power system 200: Condenser/evaporator 220: Parallel flow flat tube 240: Microchannel 260: Heat dissipation fin 162: Opening 164: Tubular structure 166: Fin structure 168: Opening PCB: Circuit board ED: electronic equipment 420: cooling plate 422: opening 424: plate structure 426: tubular structure 428: opening 520: dielectric fluid 620: second condenser 622: opening 624: tubular structure 626: opening 700: cooling system 710: first fan 720: flat plate heat exchanger 730: second fan 740: water cooling radiator 750: pump P5: hot channel P6: cold channel P7: first pipeline P8: second pipeline R3: cooling chamber 722: plate

FIG. 1 is a schematic diagram of a cooling system according to some embodiments of the present disclosure. FIG. 2A is a schematic diagram of the first condenser and the evaporator in FIG. 1 according to some embodiments of the present disclosure. FIG. 2B is a schematic diagram of the first condenser and the evaporator in FIG. 1 according to some embodiments of the present disclosure. FIG. 3 is a schematic diagram of the water cooling radiator in FIG. 1 according to some embodiments of the present disclosure. FIG. 4A is a partial schematic diagram of the cooling system shown in FIG. 1 according to some embodiments of the present disclosure. FIG. 4B is a schematic diagram of the cooling plate in FIG. 4A according to some embodiments of the present disclosure. FIG. 5 is a partial schematic diagram of the cooling system shown in FIG. 1 according to some embodiments of the present disclosure. FIG. 6A is a partial schematic diagram of the cooling system shown in FIG. 1 according to some embodiments of the present disclosure. FIG. 6B is a schematic diagram of the second condenser in FIG. 6A according to some embodiments of the present disclosure. FIG. 7A is a schematic diagram of a cooling system according to some embodiments of the present disclosure. FIG. 7B is a schematic diagram of a flat plate heat exchanger in FIG. 7A according to some embodiments of the present disclosure. FIG. 7C is a schematic diagram of a flat plate heat exchanger in FIG. 7A according to some embodiments of the present disclosure.

100: Cooling system

110: First Fan

120: Evaporator

130: Second Fan

140: First condenser

150: Pump

160: Water cooling radiator

P1: First pipeline

P2: Second pipeline

P3: The third pipeline

P4: The fourth pipeline

R1: First cooling room

R2: Second cooling room

RAK: Cabinet

SMR: Power module

ED1,ED2,ED3: Electronic equipment

POW: Power system

Claims (10)

A cooling system, comprising: An air cooling device, comprising: A first fan, arranged in a first cooling chamber, and used to blow hot air in a cabinet into the first cooling chamber; An evaporator, arranged in the first cooling chamber; A first condenser, arranged in a second cooling chamber; and A second fan, arranged in the second cooling chamber, and used to blow an external gas into the second cooling chamber; Wherein, when the evaporator receives the hot air through the first fan, the evaporator is used to heat a refrigerant to a gaseous state, and transmit the refrigerant to the first condenser through a first pipeline; When the first condenser receives the external gas through the second fan, the first condenser is used to condense the refrigerant into a liquid state, and transmit the refrigerant to the evaporator through a second pipeline; and A water cooling device, comprising: A water cooling radiator, arranged in the second cooling chamber, and used to receive a hot liquid from an electronic device in the cabinet through a third pipeline, and to transmit a cold liquid to the electronic device through a fourth pipeline; wherein, when the water cooling radiator receives the external gas through the second fan, the water cooling radiator is used to cool the hot liquid into the cold liquid. The cooling system as described in claim 1, wherein the water cooling device further comprises: A cooling plate in contact with the electronic device and used to transfer the hot liquid to the water cooling radiator through the third pipeline and receive the cold liquid from the water cooling radiator through the fourth pipeline. The cooling system as described in claim 1, wherein the water cooling device further comprises: A container for storing a dielectric liquid and immersing the electronic device in the dielectric liquid. The cooling system as described in claim 3, wherein the water cooling device further comprises: A second condenser, disposed in the container and connected to the third pipeline and the fourth pipeline; wherein when the dielectric fluid is heated to a gaseous state by the electronic device, the second condenser is used to condense the dielectric fluid into a liquid state. The cooling system as described in claim 1 further comprises: an isolation wall, disposed between the first cooling chamber and the second cooling chamber, and used to prevent the hot air blown into the first cooling chamber from flowing into the second cooling chamber, and to prevent the external gas blown into the second cooling chamber from flowing into the first cooling chamber; wherein the isolation wall has at least one through hole, and the at least one through hole is used to allow the first pipeline, the second pipeline, the third pipeline and the fourth pipeline to pass through the isolation wall; after the first fan blows the hot air into the first cooling chamber, the isolation wall is further used to allow the hot air to flow along the isolation wall to the evaporator; After the second fan blows the external gas into the second cooling chamber, the isolation wall is further used to make the external gas flow along the isolation wall to the first condenser; The first fan is set at a relatively high position, and the second fan is set at a relatively low position; and When the evaporator receives the liquid refrigerant from the second pipeline, the first fan is further used to blow a cold air cooled by the refrigerant into the cabinet. A cooling system, comprising: A flat plate heat exchanger, comprising a plurality of plates, wherein the plates are used to form at least one hot channel and at least one cold channel; A first fan, used to blow hot air in a cabinet into the at least one hot channel of the flat plate heat exchanger; A second fan, used to blow external gas into the at least one cold channel of the flat plate heat exchanger; wherein when the hot air flows through the at least one hot channel and the external gas flows through the at least one cold channel, the plates are used to cool the hot air; and A water cooling device, comprising: A water cooling row, used to receive a hot liquid from an electronic device in the cabinet through a first pipeline, and to transmit a cold liquid to the electronic device through a second pipeline; When the water cooling radiator receives the external air through the second fan, the water cooling radiator is used to cool the hot liquid into the cold liquid. The cooling system as described in claim 6, wherein the water cooling device further comprises: A cooling plate in contact with the electronic device and used to transfer the hot liquid to the water cooling radiator through the first pipeline and receive the cold liquid from the water cooling radiator through the second pipeline. The cooling system as described in claim 6, wherein the water cooling device further comprises: A container for storing a dielectric liquid and immersing the electronic device in the dielectric liquid. The cooling system as described in claim 8, wherein the water cooling device further comprises: A condenser, disposed in the container and connected to the first pipeline and the second pipeline; wherein when the dielectric fluid is heated to a gaseous state by the electronic device, the condenser is used to condense the dielectric fluid into a liquid state. A cooling system as described in claim 6, wherein after the hot air flows through the at least one hot channel and is cooled into cold air, the first fan is further used to blow the cold air into the cabinet.

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