TW202304282A - Notebook computer - Google Patents

Abstract

The disclosure relates to a notebook computer accommodating at least one heat source and including a heat exchanger, an in-built liquid cooling system, and a liquid cooling connector, wherein the heat exchanger is configured to thermal contact the heat source, the in-built liquid cooling system is connected to the heat exchanger, and the liquid cooling connector is connected to the heat exchanger and configured for the heat exchanger to connect to an outer liquid cooling system.

Description

laptop

The invention relates to a notebook computer, in particular to a notebook computer with built-in air cooling and water cooling systems.

The operation of electronic devices is accompanied by the generation of a large amount of heat energy. If the heat energy cannot be effectively removed, the internal electronic components will overheat and cause problems such as function failure or shutdown. Therefore, an electronic device is usually equipped with a corresponding heat dissipation system to ensure that the operation of the components will not exceed the preset operating temperature range. Especially for high-efficiency electronic devices, in addition to air cooling, a water-cooling heat dissipation system is usually additionally equipped to enhance the heat dissipation effect.

Taking notebook computers as an example, traditional notebook computers have a built-in air cooling system consisting of heat pipes, fans and cooling fins. However, with the improvement of overall operating performance, it is necessary to introduce water cooling to enhance heat dissipation. efficiency. For this reason, in recent years, high-end notebook computers have added additional connectors that can be connected to external water cooling to enhance the heat dissipation of the system by introducing an external water cooling cycle, but the external water cooling will make the overall device bulky and not easy to carry. However, if there is no external water cooling, the heat dissipation capacity of the notebook computer itself is not enough to meet the heat dissipation requirements, resulting in a high dependence on the external water cooling system.

In view of this, the present invention provides a notebook computer, one purpose of which is to solve the aforementioned problems of the traditional notebook computer.

A notebook computer according to an embodiment of the present invention accommodates at least one heat source and includes a heat exchanger, a built-in water cooling system and an external water cooling joint. A heat exchanger is used to thermally contact the heat source. The built-in water cooling system connects the heat exchanger. The external water-cooling joint is connected to the heat exchanger for connecting the heat exchanger to an external water-cooling system.

The notebook computer disclosed in the foregoing embodiments of the present invention is equipped with an external water-cooling joint, so the notebook computer has the ability to expand the external water-cooling system, but at the same time, the notebook computer has a built-in water-cooling system, so it can be used without an external water-cooling system. still provide effective heat dissipation.

Compared with the traditional notebook computers that have the ability to connect external water cooling systems, since they only have an air cooling system and lack a built-in water cooling system, the overall heat dissipation efficiency is greatly reduced when the external water cooling system is not connected, resulting in a high degree of reliance on external water cooling As a result of the system, external water cooling is required during normal use, making the overall device bulky and not easy to carry. In contrast, the notebook computer disclosed in the above-mentioned embodiments of the present invention already has efficient heat dissipation capability and can still achieve a good heat dissipation effect when no external water cooling system is connected.

The above description of the disclosure of the present invention and the following description of the implementation are used to demonstrate and explain the spirit and principle of the present invention, and to provide a further explanation of the patent application scope of the present invention.

The detailed features and advantages of the present invention are described in detail below in the embodiments, the content of which is sufficient to enable anyone familiar with the relevant arts to understand the technical content of the present invention and implement it accordingly, and according to the content disclosed in this specification, the scope of the patent application and the drawings Any person skilled in the relevant art can easily understand the related objects and advantages of the present invention. The following examples are to further describe the concept of the present invention in detail, but not to limit the scope of the present invention in any way.

In addition, for the sake of cleanliness of the drawings, some commonly used structures and elements may be shown in a simple schematic manner in the drawings. Among them, some features in the drawings of this application may be slightly enlarged or their proportions or dimensions may be changed to facilitate understanding and viewing of the technical features of the present invention, but this is not intended to limit the present invention. In addition, the perspective of the drawings can be understood from the accompanying coordinate axes.

In addition, terms such as "end", "portion", "part", "region", and "place" may be used hereinafter to describe specific elements and structures or specific technical features on or between them, but these elements and structures are not limited by these terms. In addition, unless otherwise specified, "at least one" as used hereinafter means that the number of specified components and structures is one or more. Hereinafter, it may also be described that certain elements and structures are in "thermal contact" with another certain element and structure, but unless otherwise specified, this description is not limited to referring to direct or indirect heat transfer between certain elements and structures. Similarly, it is also possible to describe that a specific element or structure is "connected" or "connected" to another specific element and structure in the following text, but unless otherwise specified, this description is not limited to referring to whether the specific elements or structures are directly or indirectly connected to each other. Connected, wherein, unless otherwise stated, a specific element and structure "communicates" with another specific element and structure, which means that there may be a flow of liquid or gas between specific elements or structures.

First of all, please refer to FIGS. 1-3. This embodiment proposes a notebook computer 1. It should be explained that one of the spirits of the present invention lies in the design of the air-cooling and water-cooling systems inside the notebook computer 1. Therefore, the drawings are only Relevant parts of the notebook computer 1 are shown.

As shown in the figure, the notebook computer 1 may include a heat exchanger 20, an air cooling system (air cooling system) S1 and an in-built liquid cooling system (in-built liquid cooling system) S2 used in conjunction with the heat exchanger 20, and The heat exchanger 20 , the air cooling system S1 and the built-in water cooling system S2 are disposed in a shell 10 .

The shell 10 can be, but not limited to, a part commonly used in the outer shell of a notebook computer, which can support and accommodate related electronic/non-electronic components used to realize various other functions in the notebook computer 1, but can be It is to be understood that, in order to expose the interior of the case 10 , the shell portion on one side of the case 10 is omitted and not shown. Moreover, the shell 10 is only used to illustrate the air cooling system S1 and the built-in water cooling system S2, etc., and the present invention is not limited to the shell 10 and its size, material and design.

The heat exchanger 20 is commonly known as a "water cooling head", which is a hollow and sealed structure, and has a space for cooling liquid to circulate. The cooling liquid may be, but not limited to, any suitable liquid commonly used in water cooling, but the present invention is not limited to the cooling liquid and its type and composition. For the sake of brevity, the coolant is not shown in the figure.

Moreover, the heat exchanger 20 can be made of any suitable material with good thermal conductivity (such as copper), so it is suitable for direct or indirect thermal contact with a heat source (not shown) to remove heat energy. The heat source may be, but not limited to, any electronic component that needs to be dissipated in a notebook computer, such as a central processing unit, but the present invention is not limited to the heat source and its type, size and quantity.

Basically, the air cooling system S1 is in thermal contact with the heat exchanger 20 and the built-in water cooling system S2 is connected to the heat exchanger 20, and the air cooling system S1 is in thermal contact with the built-in water cooling system S2, so the heat energy absorbed by the heat exchanger 20 from the heat source can be simultaneously The heat is transmitted to the air-cooling system S1 and the built-in water-cooling system S2 , and the air-cooling system S1 can remove the heat absorbed by the built-in water-cooling system S2 from the heat exchanger 20 .

In detail, in this embodiment, the notebook computer 1 may further include at least one heat pipe 30 , a flow pipe 40 , at least one fan 50 , at least one cooling fin 60 , an external water cooling joint 70 and a water pump 80 .

A portion of the heat pipe 30 runs through the heat exchanger 20 and thermally contacts the bottom of the heat exchanger 20 and the cooling liquid inside. Specifically, the heat pipe 30 can be attached or welded to the inner bottom surface of the heat exchanger 20, whereby the heat energy generated by the heat source can be quickly transferred to the heat pipe 30 through the heat exchanger 20, and then transferred to the heat exchanger through the heat pipe 30 20 outside. Of course, in some other embodiments, the heat pipe 30 may not be in direct thermal contact with the inner bottom surface of the heat exchanger 20 . In this case, the heat exchanger 20 can still transfer heat energy to the heat pipe 30 through the flow of cooling liquid. Looking further, another part of the heat pipe 30 is embedded in the heat dissipation fin 60 on the fan 50 and is in thermal contact with the heat dissipation fin 60, whereby the heat energy absorbed by the heat pipe 30 can be transferred to the heat dissipation fin 60, and then by the fan The airflow generated by the 50° operation is exhausted outside. Here, the heat energy generated by the heat source can at least pass through the heat exchanger 20 , the heat pipe 30 , the cooling fins 60 and be removed with the help of the air flow of the fan 50 .

It is supplemented here that the heat pipe 30 can be made of any suitable material with good thermal conductivity, such as copper, but the present invention is not limited thereto; the fan 50 can be, but not limited to, any suitable fan commonly used in a notebook computer environment , but the present invention is not limited to the fan and its type, size and quantity; the heat dissipation fins 60 can be but not limited to any common heat dissipation fins, and the present invention is not limited to its size, material, etc.

On the other hand, the flow tube 40 communicates with both sides of the heat exchanger 20 , so as to form a closed space together with the inner space of the heat exchanger 20 to allow the cooling liquid to circulate. The water pump 80 can be arranged at any position of the flow path of the flow tube 40 so as to drive the cooling liquid to circulate in a specific direction in the enclosed space. In this way, the heat energy absorbed by the cooling liquid can be transferred to the heat pipe 30 , and then transferred to the outside of the heat exchanger 20 through the heat pipe 30 . Moreover, part of the flow tube 40 is in direct or indirect thermal contact with the aforementioned heat dissipation fins 60, whereby the heat energy absorbed by the cooling liquid can be thermally contacted through the flow tube 40 under the guidance of the flow tube 40 and driven by the cooling liquid. In the region of the heat dissipation fins 60 , the airflow generated by the operation of the fan 50 is discharged to the outside through the tube wall of the flow tube 40 to the heat dissipation fins 60 . Here, the heat energy generated by the heat source can also pass through the heat exchanger 20 , the flow pipe 40 , and the cooling fins 60 and be removed with the help of the airflow of the fan 50 .

Accordingly, in the notebook computer 1, the heat pipe 30, the fan 50, and the cooling fins 60 that are in thermal contact with the heat exchanger 20 can jointly constitute the aforementioned air cooling system S1, and at the same time communicate with the heat exchanger 20 and communicate with the heat sink. The flow tube 40 and the water pump 80 thermally contacted by the fin 60 can constitute the aforementioned built-in water cooling system S2 , so as to simultaneously perform dual heat dissipation of air cooling and water cooling during the operation of the notebook computer 1 .

In addition, in this embodiment, the heat exchanger 20 can also be connected with an external water-cooling joint 70 so that the notebook computer 1 can introduce an external water-cooling cycle when needed. In detail, the external water-cooling joint 70 may include a connecting head 71 and at least two pipe parts 72. The pipe parts 72 may be made of any suitable material for guiding the cooling liquid. One end of the pipe parts 72 is connected to the heat exchanger respectively. 20 and the heat exchanger 20 can form a connected external water cooling system S3, and the other end of the pipe part 72 can be collectively stored through the connector 71 and can be exposed to the outside through the shell 10, so as to connect the external water cooling system S3 to the outside A water cooling box (not shown) is connected. Therefore, when the external water-cooling tank is connected to the pipe portion 72 connected to the external water-cooling joint 70 , it can form a water-cooling cycle connected to the outside together with the heat exchanger 20 through the pipe portion 72 . It can be seen from this that the main function of the external water-cooling joint 70 is to connect the heat exchanger 20 to external water cooling. Therefore, under this premise, the configuration of the external water-cooling joint 70, the length of the pipe portion 72 and the connecting head 71 can be used. Adaptive adjustments are made according to actual needs; for example, the external water-cooling joint in other embodiments can also be replaced with two short tubes directly connected between the heat exchanger and the shell.

To sum up, since the notebook computer 1 is provided with the external water-cooling joint 70, it has the ability to expand the external water-cooling system. Efficient heat dissipation can still be provided when the notebook computer 1 is not connected with an external water cooling system. Compared with traditional notebook computers that have the ability to connect to an external water cooling system, since they only have an air cooling system and lack a built-in water cooling system, the overall heat dissipation efficiency drops significantly when the external water cooling system is not connected, resulting in a high degree of reliance on external cooling systems. The results of the water cooling system, but as mentioned above, because the notebook computer 1 of this embodiment has both built-in air cooling and water cooling systems, it already has efficient heat dissipation capability when no external water cooling system is connected, so it does not need to be used at any time. Equipped with a bulky external water cooler.

In addition, it is supplemented that when the notebook computer 1 is not connected to an external water-cooling box through the external water-cooling joint 70 and only uses the aforementioned air-cooling system S1 and built-in water-cooling system S2 to dissipate heat, the pipe portion 72 of the external water-cooling joint 70 The end (not shown, that is, the port exposed to the outside through the shell 10) can be temporarily sealed with a suitable plug, and the plug can be removed when needed. Moreover, in some embodiments, an electrically actuated valve V1 can be selectively provided between the heat exchanger 20 and the pipe portion 72 connected to the external water-cooling joint 70, so as to be closed when only the air-cooling system S1 and the built-in water-cooling system S2 are used. Prevent the cooling liquid from flowing into the pipe portion 72, and open it when it is necessary to connect to an external water-cooled tank so that the cooling liquid can flow into the pipe portion 72; in addition, in some other embodiments, the heat exchanger 20 and the flow pipe 40 can also be selected The electrically actuated valve V2 is permanently set to close the flow pipe 40 when the external water-cooling tank needs to be used, so that the cooling liquid is more concentrated for the external water-cooling system S3.

In addition, in this embodiment, a plurality of bosses 21 can also be selectively arranged in the heat exchanger 20, which can increase the contact area between the physical structure of the heat exchanger 20 and the cooling liquid, thereby increasing the efficiency of heat exchange. The present invention is not limited to the protrusions 21 and their quantity, size, distribution and arrangement.

The aforementioned embodiment is one example of the notebook computer of the present invention, but the present invention is not limited thereto. For example, please refer to FIG. 4, which depicts a partial schematic diagram of a notebook computer 1' applying an embodiment of the present invention. For the purpose of brief description, only the differences between the embodiments will be described below. As shown in the figure, the heat exchanger 20' of this embodiment is divided into two independent blocks by the heat pipe 30, one of which is connected to the flow pipe 40, and the other is connected to the pipe portion 72 connected to the external water-cooling joint 70, Thereby, the built-in water cooling system S2 formed by the heat exchanger 20' and the flow pipe 40 and the external water cooling system S3 formed by the heat exchanger 20' and the external water cooling joint 70 become two independent water cooling cycles to reduce the Chances of unnecessary interference with and without external water cooling loops.

For another example, please refer to FIG. 5 , which shows a partial schematic view of a notebook computer 1'' applying yet another embodiment of the present invention. For the purpose of brief description, only the differences between the embodiments will be described below. As shown in the figure, the external water-cooling joint 70' omits the aforementioned pipe portion 72 and is directly connected to the flow pipe 40, and can communicate with the heat exchanger 20 through the flow pipe 40. Under this configuration, the external water cooling system S3' formed by the heat exchanger 20, the flow pipe 40 and the external water cooling joint 70' shares the same circuit with the built-in water cooling system S2 formed by the heat exchanger 20 and the flow pipe 40, not only It helps to simplify the complexity of the water-cooling pipeline, and also helps to reduce the internal space occupied.

To sum up, the notebook computer disclosed in the foregoing embodiments of the present invention has the ability to expand the external water cooling system due to the external water cooling connector, but at the same time, the notebook computer has a built-in air cooling system and a water cooling system, so It can still provide effective heat dissipation when no external water cooling system is connected.

Compared with the traditional notebook computers that have the ability to connect external water cooling systems, since they only have an air cooling system and lack a built-in water cooling system, the overall heat dissipation efficiency is greatly reduced when the external water cooling system is not connected, resulting in a high degree of reliance on external water cooling As a result of the system, external water cooling is required during normal use, making the overall device bulky and not easy to carry. In contrast, the notebook computer disclosed in the above-mentioned embodiments of the present invention already has efficient heat dissipation capability and can still achieve a good heat dissipation effect when no external water cooling system is connected.

Although the present invention is disclosed by the aforementioned embodiments, they are not intended to limit the present invention. Without departing from the spirit and scope of the present invention, all changes and modifications are within the scope of patent protection of the present invention. For the scope of protection defined by the present invention, please refer to the appended scope of patent application.

1, 1’, 1’’: notebook computer 10: shell 20, 20': heat exchanger 21: Convex post 30: heat pipe 40: Flow tube 50: fan 60: cooling fins 70, 70': with external water cooling connector 71: connector 72: tube 80: water pump V1~V2: Electrically actuated valves S1: air cooling system S2: Built-in water cooling system S3, S3': with external water cooling system

FIG. 1 is a partial schematic diagram of a notebook computer applying an embodiment of the present invention. FIG. 2 is a schematic cut-away view of the notebook computer in FIG. 1 in a heat exchanger. FIG. 3 is a partially enlarged cutaway schematic diagram of the notebook computer in FIG. 2 along line 3-3. FIG. 4 is a partial schematic diagram of a notebook computer applying another embodiment of the present invention. FIG. 5 is a partial schematic diagram of a notebook computer applying yet another embodiment of the present invention.

1: Laptop

10: shell

20: heat exchanger

30: heat pipe

40: Flow tube

50: fan

60: cooling fins

70: Connecting to the external water-cooling joint

71: connector

72: tube

80: water pump

S1: air cooling system

S2: Built-in water cooling system

S3: with external water cooling system

Claims (10)

A notebook computer accommodates at least one heat source, including: a heat exchanger for thermally contacting the at least one heat source; a built-in water cooling system connected to the heat exchanger; and an external water cooling joint connected to the heat An exchanger for connecting the heat exchanger to an external water cooling system. The notebook computer according to claim 1 further includes an air cooling system, the built-in water cooling system includes a flow pipe, the flow pipe communicates with the heat exchanger, and the heat exchanger thermally contacts the air cooling system through the flow pipe. The notebook computer according to claim 2, wherein the external water-cooling joint is connected to the heat exchanger through the flow pipe. The notebook computer as described in claim 2, wherein the air cooling system includes a heat pipe, at least one fan and at least one heat dissipation fin, the at least one heat dissipation fin is adjacent to the at least one fan, and the heat pipe is connected to the heat exchanger and the heat exchanger is in thermal contact with the at least one cooling fin via the heat pipe and the flow pipe. The notebook computer according to claim 4, wherein the heat pipe separates the heat exchanger into two independent cycles respectively connecting the built-in water-cooling system and the external water-cooling joint. The notebook computer as described in claim 1, wherein the external water-cooling joint includes a connection head and two pipe parts, one end of the two pipe parts is respectively connected to the heat exchanger, and the other end of the two pipe parts is stored in the connection Head for connection to an external water cooler. The notebook computer as described in claim 1 further includes a water pump disposed in the built-in water cooling system. The notebook computer according to claim 1, wherein the heat exchanger further includes a plurality of protrusions. The notebook computer as described in claim 1, further comprising at least one electrically actuated valve connected between the external water-cooling joint and the heat exchanger, for connecting or disconnecting the heat exchanger to the connection External water cooling connector. The notebook computer as claimed in claim 2 further comprises at least one electrically actuated valve disposed in the built-in water cooling system for connecting or not connecting the heat exchanger to the flow pipe.

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