TW202417365A - A wire sorting device and a wire sorting method - Google Patents

Abstract

The application relates to a wire sorting device and a wire sorting method. The wire sorting device comprises a base, a transmission component, a wire sorting component, a solder paste component and a solder paste component; The transmission component, wire sorting component, solder paste component and solder paste component are all installed on the base, and the wire is installed on the transmission component. The transmission component can drive the wire to move to the wire sorting component, solder paste component and solder paste component in turn. The technical solution of the application effectively solves the problem of low production efficiency of the conductor in the prior art when finishing and dipping tin.

Description

Wire arranging device and wire arranging method

The present invention relates to the technical field of wire soldering, and more particularly to a wire finishing device and a wire finishing method.

In the current wiring harness production process, the loose ground wire needs to be twisted into a wire harness of a predetermined diameter. In order to prevent the ground wire from loosening after twisting, the twisted ground wire will be soldered and the soldering size will be controlled to a predetermined length.

In actual operation, a worker holds the product in his left hand and clamps the loose root of the ground wire with a clip in his right hand, twisting the clip and pulling it back to tighten the ground wire. The product is then passed to the next worker, who first dips the twisted ground wire in solder paste and then inserts it into the soldering furnace to tin it to meet product requirements.

The main purpose of the present invention is to provide a wire arrangement device and a wire arrangement method to solve the problem of low production efficiency when arranging and soldering the wires in the prior art.

To achieve the above-mentioned purpose, the present invention provides a wire sorting device, including a base, a transmission assembly, a wire sorting assembly, a solder paste assembly and a soldering assembly; wherein the transmission assembly, the wire sorting assembly, the solder paste assembly and the soldering assembly are all installed on the base, the wire is installed on the transmission assembly, and the transmission assembly can drive the wire to move to the wire sorting assembly, the solder paste assembly and the soldering assembly in sequence.

During implementation, the wire tidying assembly includes a first driving structure and a wire retracting and fixing structure. The first driving structure is connected to the wire retracting and fixing structure to drive the wire retracting and fixing structure to move vertically.

During implementation, the wire collection and fixing structure includes a first clamping arm and a second clamping arm, and the first end of the first clamping arm and the first end of the second clamping arm have a state of fixing the loose wires close to each other and a state of fixing the loose wires far away from each other.

During implementation, the wire retraction and fixing structure also includes a first driving member, a pivot and a spring. The middle part of the first clamping arm and the middle part of the second clamping arm are both rotatably connected to the pivot. The first driving member is connected to the second end of the first clamping arm and the second end of the second clamping arm to drive the second end of the first clamping arm and the second end of the second clamping arm to approach each other. The first end of the spring is connected to the first clamping arm from the pivot to the first end of the first clamping arm, and the second end of the spring is connected to the second clamping arm from the pivot to the first end of the second clamping arm.

In implementation, the first driving member includes a driving body and two connecting arms, the first ends of the two connecting arms are connected to the driving body, the second ends of the two connecting arms respectively cooperate with the second end of the first clamping arm and the second end of the second clamping arm to fix the loose conductor, or the second ends of the two connecting arms are respectively separated from the second end of the first clamping arm and the second end of the second clamping arm to fix the loose conductor.

During implementation, the wire retracting and fixing structure further includes a rotary driving member, which is fixed on the base, and the rotating shaft of the rotary driving member is connected to the wire retracting and fixing structure.

During implementation, the wire retracting and fixing structure further includes a rotary driving member, which is fixed on the base, and the rotating shaft of the rotary driving member is connected to the wire retracting and fixing structure.

During implementation, the first clamping arm includes a first clamping arm body and a first clamping head, the first clamping head is located at the second end of the first clamping arm, the second clamping arm includes a second clamping arm body and a second clamping head, the second clamping head is located at the second end of the second clamping arm, the first clamping head includes a wire guide groove and a clamping plate, the second clamping head includes a wire mating groove and a mating plate, the clamping plate is located on a side of the wire guide groove close to the wire, the mating plate is located on a side of the wire mating groove close to the wire, the wire guide groove and the wire mating groove form a closed convergence through hole, and the clamping plate and the mating plate form a clamping fixing through hole.

During implementation, the solder paste assembly includes a second driving structure and a solder paste pool structure, the second driving structure is arranged on the base, the solder paste pool structure is installed on the second driving structure, and the second driving structure can drive the solder paste pool structure to a working position or an avoidance position.

During implementation, the soldering assembly includes a third driving structure and a soldering structure. The third driving structure is arranged on the base, and the soldering structure is arranged on the third driving structure. The third driving structure can drive the soldering structure to be in a working position or an avoidance position.

In practice, the soldering structure includes a soldering furnace and a soldering cup, and the soldering cup can move vertically in the soldering furnace.

During implementation, the wire arranging device further includes a grabbing assembly, which is arranged on the base and is located between the soldering assembly and the wire arranging assembly in the moving direction of the wire.

During implementation, the wire arranging device further includes a detection assembly, which is arranged on the base and is located between the grabbing assembly and the wire arranging assembly in the moving direction of the wire.

During implementation, the wire arranging device further includes a wire placement station, which is located between the detection component and the wire arranging component.

During implementation, the transmission assembly includes a turntable driving structure and a turntable structure, wherein the turntable driving structure is disposed on the base and connected to the turntable structure to drive the turntable structure to rotate.

During implementation, the turntable structure includes a turntable body and a wire fixing portion, the turntable body is connected to the turntable driving structure, and the wire fixing portion is fixedly arranged on the upper surface of the turntable.

During implementation, the turntable structure further includes a scattered wire limiting plate, which has a notch, through which the scattered wires of the wire extend downward, and the main body of the wire is supported on the scattered wire limiting plate.

During implementation, the turntable structure also includes a plurality of supporting parts and a plurality of supporting rollers, each supporting roller is arranged corresponding to each supporting part, the first end of the supporting part is fixed on the base, the supporting roller is rotatably connected to the second end of the supporting part, and the supporting roller contacts the lower surface of the turntable body.

According to another aspect of the present invention, a method for arranging wires is also provided. The method for arranging wires adopts the above-mentioned wire arranging device, and the method for arranging wires includes the following steps: S10: Installing wires; S20: The transmission component drives the wires to move to the wire arranging component, and the wire arranging component arranges the wires; S30: The transmission component drives the wires to move to the soldering paste component, and the arranged wires are dipped in solder paste; S40: The transmission component drives the wires to move to the soldering component, and the soldered wires are dipped in solder paste.

During implementation, after step S40, the method further includes taking out the wire and detecting the position of the taken out wire.

In order to further understand the present invention, the following preferred embodiments are given, and the specific structure and effects of the present invention are described in detail with reference to the drawings and figure numbers.

It should be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the present invention. Unless otherwise specified, all technical and scientific terms used herein have the same meanings as those commonly understood by ordinary technicians in the technical field to which the present invention belongs.

For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship of a device or feature to other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying figure is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways, rotated 90 degrees or in other orientations, and the spatially relative descriptions used here are interpreted accordingly.

As shown in FIGS. 1 to 5 , the wire arrangement device of the present embodiment includes a base 10, a transmission assembly 20, a wire arrangement assembly 30, a solder paste assembly 40, and a soldering assembly 50. The transmission assembly 20, the wire arrangement assembly 30, the soldering paste assembly 40, and the soldering assembly 50 are all mounted on the base 10, and the wire is mounted on the transmission assembly 20. The transmission assembly 20 can drive the wire to move to the wire arrangement assembly 30, the soldering paste assembly 40, and the soldering assembly 50 in sequence.

By applying the technical solution of this embodiment, the wires to be arranged are installed on the transmission assembly 20, and the transmission assembly 20 moves the wires to the wire arrangement assembly 30 to arrange the wires and arrange the scattered wires into a suitable wire harness. Then, the transmission assembly 20 moves the wires to the soldering paste assembly 40 for soldering. Then, the transmission assembly 20 moves the wires dipped with solder paste to the soldering assembly 50 for soldering. The above-mentioned soldering method is highly efficient and has controllable quality. The technical solution of this embodiment effectively solves the problem of low production efficiency in the prior art when the wires are arranged and soldered.

It should be noted that the wires arranged in this embodiment are relatively messy wires. The wire arranging assembly 30 is used to gather the multiple messy wires (hereinafter referred to as ground wires) together, and then the wires gathered together are twisted so that the multiple messy wires are entangled into a wire bundle.

As shown in FIG. 2 and FIG. 3 , in the technical solution of this embodiment, the wire organizing assembly 30 includes a first driving structure 31 and a wire retracting and fixing structure 32 , and the first driving structure 31 is connected to the wire retracting and fixing structure 32 to drive the wire retracting and fixing structure 32 to move vertically. The specific operation steps are as follows: the wire retracting and fixing structure 32 opens the wire entry channel, the first driving structure 31 drives the wire retracting and fixing structure 32 to move upward, and after the wire retracting and fixing structure 32 moves to the right position (the root of the ground wire), the wire retracting and fixing structure 32 is closed, so that the wire retracting and fixing structure 32 can restrain the wire, and then the first driving structure 31 drives the wire retracting and fixing structure 32 to move downward, so that the ground wires of the predetermined distance can be gathered together. It should be noted that the wire retracting and fixing structure 32 also rotates while moving downward, so that the gathered ground wires are not easy to rebound or scatter.

It should be noted that the wire organizing assembly 30 also includes a pressure structure, which is connected to the first driving structure 31. The pressure structure includes a pressure block. The first driving structure 31 can drive the pressure block to press the wire. The specific position of the pressed wire is at the point where the ground wire is led out from the main body of the wire and is located on the main body of the wire. The function of the pressure structure is to press the copper foil. The copper foil is fixed on the main body of the wire to ensure that the ground wire and other structures located on the outside of the main body of the wire will not affect the internal structure of the main body of the wire, for example, it will not easily cause the internal wire of the main body of the wire to twist, misalign, deform, etc. The pressure block is driven by the second driving part.

As shown in FIG. 4 and FIG. 5 , in the technical solution of this embodiment, the wire collecting and fixing structure 32 includes a first clamping arm 321 and a second clamping arm 322, and the first end of the first clamping arm 321 and the first end of the second clamping arm 322 have a state of fixing the scattered wires close to each other and a state of the scattered wires to be fixed far away from each other. The above structure is convenient to operate and compact. It should be noted that in this embodiment, the first clamping arm 321 and the second clamping arm 322 cooperate to form a function of collecting the multiple chaotic wires.

As shown in FIGS. 2 to 5 , in the technical solution of the present embodiment, the wire retracting and fixing structure 32 further includes a first driving member 323, a pivot shaft 324 and a spring 325. The middle portion of the first clamping arm 321 and the middle portion of the second clamping arm 322 are both rotatably connected to the pivot shaft 324. The first driving member 323 is connected to the second end of the first clamping arm 321 and the second end of the second clamping arm 322. The second ends are connected to drive the second end of the first clamping arm 321 and the second end of the second clamping arm 322 to approach each other, the first end of the spring 325 is connected to the first clamping arm 321 from the pivot 324 to the first end of the first clamping arm 321, and the second end of the spring 325 is connected to the second clamping arm 322 from the pivot 324 to the first end of the second clamping arm 322. The spring 325 is always in a stretched elastic state. When the force applied by the first driving member 323 to the first clamping arm 321 and the second clamping arm 322 is greater than the tension of the spring, the second end of the first clamping arm 321 and the second end of the second clamping arm 322 are opened. When the first driving member 323 stops applying the force to the first clamping arm 321 and the second clamping arm 322, the second end of the first clamping arm 321 and the second end of the second clamping arm 322 are closed. The above structure is compact and easy to operate.

It should be noted that the middle of the first clamping arm 321 mentioned above refers to the position between the first end of the first clamping arm 321 and the second end of the second clamping arm 322, and is not necessarily the middle position of the first clamping arm 321 or the middle of the second clamping arm 322.

As shown in FIGS. 2 to 5 , in the technical solution of this embodiment, the first driving member 323 includes a driving body and two connecting arms, the first ends of the two connecting arms are connected to the driving body, and the second ends of the two connecting arms respectively cooperate with the second ends of the first clamping arm 321 and the second ends of the second clamping arm 322 to fix the loose conductor, or the second ends of the two connecting arms are respectively separated from the second ends of the first clamping arm 321 and the second ends of the second clamping arm 322 to fix the loose conductor. The above structure can prevent the first driving member 323 from interfering with the first clamping arm 321 and the second clamping arm 322 when the first clamping arm 321 and the second clamping arm 322 rotate.

As shown in FIG. 2 , FIG. 3 and FIG. 5 , in the technical solution of this embodiment, the wire collection and fixing structure 32 further includes a rotary drive member 326, which is fixed on the base 10, and the rotary shaft of the rotary drive member 326 is connected to the wire collection and fixing structure 32. The rotary shaft of the rotary drive member 326 (which can be the rotary shaft itself or an extended shaft connected to the rotary shaft) is connected to the pivot shaft 324. The arrangement of the rotary drive member 326 allows the collected ground wires to be entangled together, so that the collected ground wires are not easily scattered again.

As shown in Figures 4 and 5, in the technical solution of the present embodiment, the first clamping arm 321 includes a first clamping arm body and a first clamping head, the first clamping head is located at the second end of the first clamping arm 321, the second clamping arm 322 includes a second clamping arm body and a second clamping head, the second clamping head is located at the second end of the second clamping arm 322, the first clamping head includes a wire guide groove and a clamping plate, the second clamping head includes a wire matching groove and a matching plate, the clamping plate is located on the side of the wire guide groove close to the wire, the matching plate is located on the side of the wire matching groove close to the wire, the wire guide groove and the wire matching groove form a closed convergence through hole, and the clamping plate and the matching plate form a clamping fixing through hole. The structures of the first clamping head and the second clamping head are relatively complex. The first clamping arm body and the first clamping head are separately arranged, which is convenient for processing. Similarly, the second clamping arm body and the second clamping head are separately arranged to play the same role. It should be noted that the axis of the convergence through hole and the axis of the clamping and fixing through hole are on the same vertical axis. The opening of the wire guide groove is located in the direction close to the wire matching groove, and the width of the wire guide groove gradually shrinks in the direction from close to the wire matching groove to away from the wire matching groove. The wire guide groove is located on the inner side of the wire matching groove.

As shown in FIG. 1 and FIG. 2 , in the technical solution of this embodiment, the solder paste assembly 40 includes a second driving structure 41 and a solder paste pool structure 42. The second driving structure 41 is arranged on the base 10, and the solder paste pool structure 42 is installed on the second driving structure 41. The second driving structure 41 can drive the solder paste pool structure 42 to be in a working position or an avoidance position. The setting of the solder paste assembly 40 is prepared for the next step of soldering. The second driving structure 41 drives the solder paste pool structure 42, so that the solder paste pool structure 42 can avoid and work on the wire. It should be noted that, under the control of the control component, the second driving structure 41 and the solder paste pool structure 42 can realize controllable rising and falling positions of the solder paste pool structure 42, so that the distance of the ground wire adhering to the solder paste can be controlled.

As shown in Figures 1 and 2, in the technical solution of this embodiment, the soldering assembly 50 includes a third driving structure 51 and a soldering structure 52. The third driving structure 51 is arranged on the base 10, and the soldering structure 52 is arranged on the third driving structure 51. The third driving structure 51 can drive the soldering structure 52 to be in a working position or an avoidance position. The setting of the soldering assembly 50 ensures that the ground wire will not be messy. It should be noted that the first driving structure 31, the second driving structure 41 and the third driving structure 51 are all driven by cylinder pistons, and the driving structure can be set to drive the driven part to move vertically and/or horizontally according to the specific situation.

As shown in FIG. 1 and FIG. 2 , in the technical solution of the present embodiment, the soldering structure 52 includes a soldering furnace and a soldering cup, and the soldering cup can move vertically in the soldering furnace. The above structure is conducive to saving energy and materials, and the operation is flexible and controllable. The independent control of the lifting and lowering of the soldering cup can realize the easy control of the length of the ground wire soldering. The volume of the soldering cup is smaller than the volume of the soldering furnace, so that the ground wire will not pollute the entire soldering furnace when being soldered. It should be noted that the soldering structure of the present embodiment also includes a protective cover, which is arranged above the soldering furnace, so as to protect the safety of machinery and equipment or operators and prevent the soldering structure 52 from splashing.

As shown in FIG1 , in the technical solution of this embodiment, the wire arranging device further includes a grabbing assembly 60, which is arranged on the base 10 and is located between the soldering assembly and the wire arranging assembly 30 in the wire moving direction. The soldered wire is taken out of the transmission assembly 20 through the grabbing assembly 60, so that the automated wire arranging device has a higher efficiency.

As shown in FIG1 , in the technical solution of this embodiment, the wire arranging device further includes a detection assembly 70, which is arranged on the base 10, and in the wire moving direction, the detection assembly 70 is located between the grabbing assembly 60 and the wire arranging assembly 30. The arrangement of the detection assembly 70 can detect the wires on the working station of the transmission assembly 20, and avoid the situation that the wires are not taken out by the grabbing assembly 60.

As shown in Fig. 1, in the technical solution of this embodiment, the wire arrangement device further includes a wire placement station, which is located between the detection assembly 70 and the wire arrangement assembly 30. The above structure is used to place wires.

As shown in FIGS. 1 to 3 , in the technical solution of this embodiment, the transmission assembly 20 includes a turntable drive structure 21 and a turntable structure 22. The turntable drive structure 21 is arranged on the base 10, and the turntable drive structure 21 is connected to the turntable structure 22 to drive the turntable structure 22 to rotate. The above structure is compact and occupies a small space. Through the rotation of the turntable structure 22, the wire can be operated at multiple stations, and this is convenient for the operation of the staff, and the whole process can be monitored and operated without moving a long distance.

As shown in FIG1 , in the technical solution of this embodiment, the turntable structure 22 includes a turntable body 221 and a wire fixing portion 222. The turntable body 221 is connected to the turntable driving structure 21, and the wire fixing portion 222 is fixedly arranged on the upper surface of the turntable. This embodiment has six workstations corresponding to the six wire fixing portions 222. The six workstations can operate at the same time, which greatly improves the working efficiency of the wire sorting device.

As shown in FIG. 2 , in the technical solution of this embodiment, the turntable structure 22 further includes a scattered wire limiting plate 223, which has a notch, and the scattered wires of the wire extend downward through the notch, and the main body of the wire is supported on the scattered wire limiting plate 223. The setting of the scattered wire limiting plate 223 can prevent the tin and solder paste from splashing out. In addition, the thickness of the ground wire of the soldering and soldering paste can be limited by setting the width of the notch. It should be noted that the diameter of the ground wire is twisted between 0.8 mm and 1.2 mm, and the soldering control length of the ground wire is between 7 mm and 13 mm.

As shown in FIG3 , in the technical solution of this embodiment, the turntable structure 22 further includes a plurality of supporting parts 224 and a plurality of supporting rollers 225, each supporting roller 225 is arranged corresponding to each supporting part 224, the first end of the supporting part 224 is fixed on the base 10, the supporting roller 225 is rotatably connected to the second end of the supporting part 224, and the supporting roller 225 is in contact with the lower surface of the turntable body 221. The above structure ensures the accuracy of the transmission assembly 20, that is, the turntable structure 22 is not easily deformed, and the arrangement of the supporting roller 225 can reduce friction. It should be noted that there are six supporting parts 224, that is, six corresponding workstations, one for each workstation. There are also six supporting rollers 225.

The present invention also provides a method for arranging wires, which adopts the above-mentioned wire arranging device, and the method for arranging wires includes the following steps: S10: Install the wires; S20: The transmission component 20 drives the wires to move to the wire arranging component 30, and the wire arranging component 30 arranges the wires; S30: The transmission component 20 drives the wires to move to the soldering paste component 40, and the arranged wires are dipped in solder paste; S40: The transmission component 20 drives the wires to move to the soldering component 50, and the soldered wires are dipped in solder paste.

It should be noted that after step S40, the wire is taken out and the position of the taken out wire is detected.

Thus, by applying the technical solution of the present invention, the wires to be arranged are installed on the transmission assembly, and the transmission assembly moves the wires to the wire arrangement assembly to arrange the wires and arrange the scattered wires into a suitable wire harness. Then, the transmission assembly moves the wires to the soldering paste assembly for soldering. Then, the transmission assembly moves the wires dipped with solder paste to the soldering assembly for soldering. The above-mentioned soldering method is highly efficient and has controllable quality. The technical solution of the present invention effectively solves the problem of low production efficiency in the prior art when the wires are arranged and soldered.

It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present invention. As used herein, unless the context clearly indicates otherwise, the singular form is intended to include the plural form. In addition, it should be understood that when the terms "include" and/or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and/or combinations thereof.

It should be noted that the terms "first", "second", etc. in the specification and patent application of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or apparatus that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or apparatus.

The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may be modified and varied in various ways. Any modification, equivalent substitution, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

In summary, according to the contents disclosed above, the present invention can achieve the expected purpose of the invention and provide a wire arrangement device and a wire arrangement method, which are extremely practical and valuable for industrial use. Therefore, a patent application for the invention is filed in accordance with the law.

10: Base 20: Transmission assembly 21: Turntable drive structure 22: Turntable structure 221: Turntable body 222: Wire fixing part 223: Loose wire limit plate 224: Support part 225: Support roller 30: Wire sorting assembly 31: First drive structure 32: Wire collection and fixing structure 321: First clamping arm 322: Second clamping arm 323: First drive member 324: Pivot shaft 325: Spring 326: Rotary drive member 40: Solder paste assembly 41: Second drive structure 42: Solder paste pool structure 50: soldering assembly 51: third drive structure 52: soldering structure 60: grabbing assembly 70: detection assembly

FIG. 1 is a schematic diagram of the three-dimensional structure of the wire arranging device of the embodiment of the present invention from a top view; FIG. 2 is a schematic diagram of the three-dimensional structure of the wire arranging device of FIG. 1 from another angle from a top view; FIG. 3 is a schematic diagram of the three-dimensional structure of the wire arranging device of FIG. 1 from another angle; FIG. 4 is a schematic diagram of the three-dimensional structure of the wire retracting and fixing structure of the wire arranging device of FIG. 1; FIG. 5 is a schematic diagram of the three-dimensional structure of the wire retracting and fixing structure of FIG. 4 from another angle.

10: Base

20: Transmission components

30: Wire management assembly

40: Solder paste assembly

50: Soldering components

60: Grab components

70: Detection components

Claims (19)

A wire tidying device includes a base, a transmission assembly, a wire tidying assembly, a solder paste assembly and a soldering assembly; wherein, the transmission assembly, the wire tidying assembly, the solder paste assembly and the soldering assembly are all mounted on the base, the wire is mounted on the transmission assembly, and the transmission assembly can drive the wire to move to the wire tidying assembly, the solder paste assembly and the soldering assembly in sequence. A wire organizing device as described in claim 1, wherein the wire organizing assembly includes a first driving structure and a wire retracting and fixing structure, and the first driving structure is connected to the wire retracting and fixing structure to drive the wire retracting and fixing structure to move vertically. A wire organizing device as described in claim 2, wherein the wire collection and fixing structure includes a first clamping arm and a second clamping arm, and the first end of the first clamping arm and the first end of the second clamping arm have a state of fixing the loose wires close to each other and a state of moving away from each other for fixing the loose wires. A wire organizing device as described in claim 3, wherein the wire retracting and fixing structure further includes a first driving member, a pivot and a spring, the middle portion of the first clamping arm and the middle portion of the second clamping arm are both rotatably connected to the pivot, the first driving member is connected to the second end of the first clamping arm and the second end of the second clamping arm to drive the second end of the first clamping arm and the second end of the second clamping arm closer to each other, the first end of the spring is connected to the first clamping arm from the pivot to the first end of the first clamping arm, and the second end of the spring is connected to the second clamping arm from the pivot to the first end of the second clamping arm. A wire organizing device as described in claim 4, wherein the first driving member includes a driving body and two connecting arms, the first ends of the two connecting arms are connected to the driving body, the second ends of the two connecting arms respectively cooperate with the second end of the first clamping arm and the second end of the second clamping arm to fix the loose wires, or the second ends of the two connecting arms are respectively detached from the second end of the first clamping arm and the second end of the second clamping arm to fix the loose wires. A wire organizing device as described in claim 3, wherein the wire retracting and fixing structure further includes a rotating driving member, the rotating driving member is fixed on the base, and the rotating axis of the rotating driving member is connected to the wire retracting and fixing structure. A wire organizing device as described in claim 3, wherein the first clamping arm includes a first clamping arm body and a first clamping head, the first clamping head is located at the second end of the first clamping arm, the second clamping arm includes a second clamping arm body and a second clamping head, the second clamping head is located at the second end of the second clamping arm, the first clamping head includes a wire guide groove and a clamping plate, the second clamping head includes a wire mating groove and a mating plate, the clamping plate is located on a side of the wire guide groove close to the wire, the mating plate is located on a side of the wire mating groove close to the wire, the wire guide groove and the wire mating groove form a closed convergence through hole, and the clamping plate and the mating plate form a clamping fixing through hole. A wire finishing device as described in claim 1, wherein the solder paste assembly includes a second driving structure and a solder paste pool structure, the second driving structure is disposed on the base, the solder paste pool structure is installed on the second driving structure, and the second driving structure can drive the solder paste pool structure to a working position or an avoidance position. A wire organizing device as described in claim 1, wherein the soldering assembly includes a third driving structure and a soldering structure, the third driving structure is arranged on the base, the soldering structure is arranged on the third driving structure, and the third driving structure can drive the soldering structure to be in a working position or an avoidance position. A wire preparation device as described in claim 9, wherein the soldering structure includes a solder furnace and a solder cup, and the solder cup can move vertically in the solder furnace. A wire tidying device as described in claim 1, wherein the wire tidying device further includes a grabbing assembly, which is disposed on the base and is located between the soldering assembly and the wire tidying assembly in the direction of wire movement. A wire organizing device as described in claim 11, wherein the wire organizing device further includes a detection assembly, which is arranged on the base and is located between the grabbing assembly and the wire organizing assembly in the direction of movement of the wire. A wire organizing device as described in claim 12, wherein the wire organizing device further includes a wire placement station, which is located between the detection component and the wire organizing component. A wire organizing device as described in any one of claims 1 to 13, wherein the transmission assembly includes a turntable driving structure and a turntable structure, the turntable driving structure is disposed on the base, and the turntable driving structure is connected to the turntable structure to drive the turntable structure to rotate. A wire organizing device as described in claim 14, wherein the turntable structure includes a turntable body and a wire fixing portion, the turntable body is connected to the turntable driving structure, and the wire fixing portion is fixedly arranged on the upper surface of the turntable. A wire organizing device as described in claim 15, wherein the turntable structure further includes a scattered wire limiting plate, the scattered wire limiting plate having a notch, the scattered wires of the wire extending downward through the notch, and the main body of the wire is supported on the scattered wire limiting plate. A wire sorting device as described in claim 15, wherein the turntable structure further includes a plurality of supporting parts and a plurality of supporting rollers, each supporting roller is arranged corresponding to each supporting part, the first end of the supporting part is fixed on the base, the supporting roller is rotatably connected to the second end of the supporting part, and the supporting roller is in contact with the lower surface of the turntable body. A method for arranging wires, wherein the method for arranging wires adopts the wire arranging device described in any one of the above-mentioned claim items 1 to 17, and the method for arranging wires comprises the following steps: S10: Installing wires; S20: The transmission component drives the wires to move to the wire arranging component, and the wire arranging component arranges the wires; S30: The transmission component drives the wires to move to the soldering paste component, and the arranged wires are dipped in solder paste; S40: The transmission component drives the wires to move to the soldering component, and the soldered wires are dipped in solder paste. The wire arrangement method as described in claim 18, further comprising removing the wire after step S40 and detecting the position of the removed wire.

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