TW202410170A - Breaking device and breaking method - Google Patents

Breaking device and breaking method Download PDF

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TW202410170A
TW202410170A TW112130568A TW112130568A TW202410170A TW 202410170 A TW202410170 A TW 202410170A TW 112130568 A TW112130568 A TW 112130568A TW 112130568 A TW112130568 A TW 112130568A TW 202410170 A TW202410170 A TW 202410170A
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workpiece
unit
line
load
frame
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TW112130568A
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小林弘明
有賀真也
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日商迪思科股份有限公司
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Abstract

[課題]可抑制確認工件是否已被分割之作業時間。[解決手段]斷裂裝置具備:框架固定單元,其將由沿著分割預定線形成有分割起點之工件、已黏貼工件之薄片及已黏貼薄片的外周之框架所構成之工件單元的框架進行固定;檢測單元,其檢測工件的分割預定線;夾持單元,其從上下夾持與應分割之分割預定線相鄰之區域的工件;推壓構件,其夾著應分割之分割預定線並在夾持單元的相反側推壓與應分割之分割預定線相鄰之區域的工件而使工件斷裂;負載計,其測量推壓構件推壓工件之負載;以及控制單元,其基於以負載計所測量到之負載值而判斷應分割之分割預定線是否已被分割的分割結果。[Topic] It is possible to reduce the time required to check whether a workpiece has been split. [Solution] The breaking device comprises: a frame fixing unit, which fixes a frame of a workpiece unit formed by a workpiece having a splitting starting point formed along a splitting predetermined line, a sheet to which the workpiece is pasted, and a frame of the periphery to which the sheet is pasted; a detection unit, which detects the splitting predetermined line of the workpiece; a clamping unit, which clamps the workpiece in an area adjacent to the splitting predetermined line to be split from above and below; a pushing member, which clamps the splitting predetermined line to be split and pushes the workpiece in an area adjacent to the splitting predetermined line to be split on the opposite side of the clamping unit to split the workpiece; a load meter, which measures the load of the pushing member pushing the workpiece; and a control unit, which determines the splitting result of whether the splitting predetermined line to be split has been split based on the load value measured by the load meter.

Description

斷裂裝置以及斷裂方法Fracturing device and fracturing method

本發明係關於一種斷裂裝置以及斷裂方法。The present invention relates to a breaking device and a breaking method.

玻璃、藍寶石、SiC等工件係沿著所設定之分割預定線被分割,而形成多個晶片。分割工件之情形,例如在沿著分割預定線照射雷射光束而在工件內部形成改質層之後,利用以往各種斷裂裝置進行分割(例如,參照專利文獻1)。 [習知技術文獻] [專利文獻] Workpieces such as glass, sapphire, and SiC are divided along a predetermined dividing line to form a plurality of chips. In the case of dividing the workpiece, for example, after a modified layer is formed inside the workpiece by irradiating a laser beam along the predetermined dividing line, the workpiece is divided using various conventional fracture devices (for example, refer to Patent Document 1). [Known Technical Document] [Patent Document]

[專利文獻1]日本特開2019-71390號公報[Patent Document 1] Japanese Patent Application Publication No. 2019-71390

[發明所欲解決的課題] 專利文獻1所示之斷裂裝置係藉由以推壓構件推壓在內部沿著分割預定線形成有分割起點之工件而進行分割。但是,有時會在工件內形成未被分割之區域。以往,在以推壓構件對全部的分割預定線進行推壓之後,操作員確認是否已沿著工件的全部分割預定線進行分割,而耗費作業時間並迫切盼望改善。 [Problem to be solved by the invention] The breaking device shown in Patent Document 1 performs splitting by pushing a workpiece with a splitting starting point formed inside along a predetermined splitting line with a pushing member. However, an unsplit area may be formed in the workpiece. In the past, after the pushing member is pushed on all the predetermined splitting lines, the operator confirms whether the splitting has been performed along all the predetermined splitting lines of the workpiece, which consumes working time and urgently hopes for improvement.

本發明之目的在於提供一種提供斷裂裝置及斷裂方法,其等可抑制確認工件是否已被分割之作業時間。The object of the present invention is to provide a breaking device and a breaking method, which can reduce the operation time for confirming whether a workpiece has been divided.

[解決課題的技術手段] 為了解決上述之課題並達成目的,本發明的斷裂裝置的特徵在於具備:框架固定單元,其將由工件、已黏貼該工件之薄片及已黏貼該薄片的外周之框架所構成之工件單元的該框架進行固定,所述工件設定有多條分割預定線且沿著各該分割預定線形成有分割起點;檢測單元,其檢測該框架已被該框架固定單元固定之工件單元的分割預定線;夾持單元,其從該工件單元的上下夾持與應分割之分割預定線相鄰之區域的工件;以及推壓構件,其夾著該應分割之分割預定線並在該夾持單元的相反側推壓與該應分割之分割預定線相鄰之區域的工件而沿著該應分割之分割預定線使工件斷裂,並且,所述斷裂裝置具備:負載計,其測量該推壓構件推壓工件之負載;以及控制器,其基於以該負載計所測量到之負載值而判斷工件是否已沿著該應分割之分割預定線被分割的分割結果。 [Technical means to solve the problem] In order to solve the above-mentioned problems and achieve the object, the breaking device of the present invention is characterized by having a frame fixing unit, which is a workpiece unit composed of a workpiece, a sheet to which the workpiece is pasted, and a frame to which the outer periphery of the sheet is pasted. For fixing, the workpiece is set with a plurality of planned division lines and a starting point for division is formed along each of the planned division lines; a detection unit that detects the planned division lines of the workpiece unit that the frame has been fixed by the frame fixing unit; clamping a unit that clamps the workpiece in an area adjacent to the planned dividing line to be divided from the upper and lower sides of the workpiece unit; and a pushing member that clamps the planned dividing line to be divided and pushes the workpiece on the opposite side of the clamping unit The workpiece is pressed in an area adjacent to the planned division line to be divided and the workpiece is broken along the planned division line to be divided, and the breaking device is provided with a load meter that measures the force of the pressing member pushing the workpiece. a load; and a controller that determines the segmentation result of whether the workpiece has been segmented along the scheduled segmentation line that should be segmented based on the load value measured by the load meter.

在所述斷裂裝置中,該控制器可在負載值上升後並轉成下降之後,基於在預定時間中之負載值的降低的狀態而判斷該分割結果。In the rupture device, the controller may determine the segmentation result based on a decreasing state of the load value within a predetermined time after the load value increases and then turns to decrease.

在所述斷裂裝置中,該控制器可基於以該負載計所測量到之負載值,對工件的全部的分割預定線,判斷分割結果為未被分割、已被分割或有可能一部分未被分割,並進行記憶。In the breaking device, the controller can judge the segmentation results of all the predetermined segmentation lines of the workpiece as unsegmented, segmented, or possibly partially unsegmented based on the load value measured by the load meter, and store them.

在所述斷裂裝置中,可具備顯示單元,該顯示單元顯示包含各該分割預定線之晶圓整體圖,且顯示對於各該分割預定線之分割結果。The breaking device may be provided with a display unit that displays an overall image of the wafer including each of the predetermined separation lines and displays the separation results for each of the predetermined separation lines.

在所述斷裂裝置中,該檢測單元可包含攝像攝影機,在將框架已被該框架固定單元固定之工件單元的晶圓整體圖顯示於該顯示單元之狀態下,將該攝像攝影機定位於與顯示於該顯示單元之該晶圓整體圖上所指定之分割預定線對應之該工件單元的該分割預定線,而拍攝該分割預定線。In the fracture device, the detection unit may include a camera, and in a state where an overall view of the wafer unit having a frame fixed by the frame fixing unit is displayed on the display unit, the camera may be positioned to display The planned dividing line corresponding to the planned dividing line of the workpiece unit is photographed on the wafer overall view of the display unit, and the planned dividing line is photographed.

本發明的斷裂方法的特徵在於具備:工件單元形成步驟,其形成由工件、已黏貼該工件之薄片及已黏貼該薄片的外周之框架所構成之工件單元,所述工件沿著分割預定線而形成有分割起點;框架固定步驟,其以框架固定單元固定該工件單元的該框架;檢測步驟,其從該框架已被該框架固定單元固定之該工件單元檢測應分割之分割預定線;夾持步驟,其在實施該檢測步驟之後,從該工件單元的上下以夾持單元夾持與該應分割之分割預定線相鄰之區域的工件;分割步驟,其在實施該夾持步驟之後,夾著該應分割之分割預定線並在該夾持單元的相反側以推壓構件推壓與該應分割之分割預定線相鄰之區域的工件而沿著該應分割之分割預定線使工件斷裂;負載檢測步驟,其在該分割步驟的實施期間檢測該推壓構件推壓工件之負載值;以及判斷步驟,其基於以該負載檢測步驟所檢測到之負載值而判斷工件是否已沿著該應分割之分割預定線被分割的分割結果。The breaking method of the present invention is characterized by comprising: a workpiece unit forming step, in which a workpiece unit is formed by a workpiece, a sheet to which the workpiece is attached, and a frame to which the sheet is attached, wherein the workpiece has a splitting starting point formed along a predetermined splitting line; a frame fixing step, in which the frame of the workpiece unit is fixed by a frame fixing unit; a detection step, in which the predetermined splitting line to be split is detected from the workpiece unit to which the frame has been fixed by the frame fixing unit; and a clamping step, in which after the detection step is performed, the workpiece unit is clamped from the top and bottom with a clamping unit to separate the sheet from the workpiece unit. A workpiece in an area adjacent to a predetermined dividing line; a dividing step, after the clamping step is performed, clamping the predetermined dividing line to be divided and pushing the workpiece in an area adjacent to the predetermined dividing line to be divided with a pushing member on the opposite side of the clamping unit to break the workpiece along the predetermined dividing line to be divided; a load detection step, during the implementation of the dividing step, detecting the load value of the pushing member pushing the workpiece; and a judging step, based on the load value detected by the load detection step, judging whether the workpiece has been divided along the predetermined dividing line to be divided.

[發明功效] 本發明發揮可抑制確認工件是否已被分割之作業時間之效果。 [Invention effect] The present invention has the effect of reducing the work time required to confirm whether a workpiece has been divided.

針對用於實施本發明的方式(實施方式),一邊參照圖式一邊進行詳細說明。本發明並不受限於以下的實施方式所記載之內容。並且,在以下所記載之構成要素中,包含本發明所屬技術領域中具有通常知識者可輕易思及者、實質上相同者。再者,以下所記載之構成能適當組合。並且,在不脫離本發明的主旨之範圍內,可進行構成的各種省略、取代或變更。The method for implementing the present invention (implementation method) is described in detail with reference to the drawings. The present invention is not limited to the contents described in the following implementation methods. Moreover, the constituent elements described below include those that are easily conceivable by a person having ordinary knowledge in the technical field to which the present invention belongs and are substantially the same. Furthermore, the constituent elements described below can be appropriately combined. Moreover, various omissions, substitutions, or changes in the constituent elements can be made without departing from the scope of the present invention.

〔實施方式一〕 基於圖式而說明本發明的實施方式一之斷裂裝置。圖1係示意性地表示實施方式一之斷裂裝置的構成例之立體圖。圖2係示意性地表示具備實施方式一之斷裂裝置的分割對象的工件之工件單元之立體圖。 [Embodiment 1] A breaking device according to Embodiment 1 of the present invention will be described based on the drawings. FIG. 1 is a perspective view schematically showing a structural example of a breaking device according to Embodiment 1. FIG. 2 is a perspective view schematically showing a workpiece unit including a workpiece to be divided by the breaking device according to the first embodiment.

(工件單元) 實施方式一之圖1所示之斷裂裝置1係將圖2所示之工件單元200的工件201分割成一個個晶片210之裝置。圖2所示之工件單元200具備工件201、薄片202及框架203。 (Workpiece unit) The breaking device 1 shown in FIG. 1 of the first embodiment is a device for dividing the workpiece 201 of the workpiece unit 200 shown in FIG. 2 into individual chips 210. The workpiece unit 200 shown in FIG. 2 includes a workpiece 201, a wafer 202, and a frame 203.

工件201例如為將玻璃、藍寶石、SiC等作為基板204之圓板狀的半導體晶圓或光元件晶圓等晶圓。如圖2所示,工件201係在正面205設定有互相交叉之多條分割預定線206,且在藉由分割預定線206所劃分之區域形成有元件207。此外,在本發明中,工件201的基板204亦可利用玻璃、藍寶石、SiC以外的材質所構成,亦可不形成有元件207。The workpiece 201 is, for example, a wafer such as a semiconductor wafer or an optical element wafer in a circular plate shape using glass, sapphire, SiC, etc. as a substrate 204. As shown in FIG. 2 , the workpiece 201 has a plurality of mutually intersecting predetermined dividing lines 206 set on the front surface 205, and components 207 are formed in the areas divided by the predetermined dividing lines 206. In addition, in the present invention, the substrate 204 of the workpiece 201 may also be made of materials other than glass, sapphire, and SiC, and may not have the components 207 formed thereon.

元件207例如為IC(Integrated Circuit,積體電路)或LSI(Large Scale Integration,大型積體電路)等積體電路、CCD(Charge Coupled Device,電荷耦合元件)或CMOS(Complementary Metal Oxide Semiconductor,互補金屬氧化物半導體)等影像感測器、LED(Light-Emitting Diode,發光二極體)等光學元件或記憶體(半導體記憶裝置)。The element 207 is, for example, an integrated circuit such as IC (Integrated Circuit) or LSI (Large Scale Integration), an image sensor such as CCD (Charge Coupled Device) or CMOS (Complementary Metal Oxide Semiconductor), an optical element such as LED (Light-Emitting Diode), or a memory (semiconductor memory device).

並且,工件201係沿著分割預定線206形成有分割起點208。在實施方式一中,分割起點208雖為在基板204的內部沿著分割預定線206所形成之改質層,但在本發明中,除了改質層以外,亦可為從正面205凹陷的加工槽。此外,改質層意指密度、折射率、機械強度、其他物理特性成為與周圍不同之狀態之區域,可示例熔融處理區域、裂痕區域、絕緣破壞區域、折射率變化區域及此等區域混合存在之區域等。改質層的機械強度低於基板204的其他處。Furthermore, the workpiece 201 has a dividing starting point 208 formed along the planned dividing line 206 . In the first embodiment, the dividing starting point 208 is a modified layer formed along the planned dividing line 206 inside the substrate 204. However, in the present invention, in addition to the modified layer, it may also be a process of recessing from the front surface 205. groove. In addition, the modified layer means a region where the density, refractive index, mechanical strength, and other physical properties are different from those of the surroundings. Examples include a melted processing region, a crack region, a dielectric breakdown region, a refractive index change region, and a mixture of these regions. area, etc. The mechanical strength of the modified layer is lower than other parts of the substrate 204 .

薄片202被形成為直徑大於工件201的圓板狀,並在外周黏貼框架203,在中央部黏貼工件201。在實施方式一中,薄片202黏貼於工件201的背面209。薄片202為:具備基材層與糊層且糊層黏貼於工件201及框架203之黏著膠膜,所述基材層係藉由具有非黏著性與可撓性之樹脂所構成,所述糊層係層積於基材層且藉由具有黏著性與可撓性之樹脂所構成;或者,不具備糊層而僅由基材層所構成之薄片,所述基材層係藉由熱可塑性樹脂所構成且熱壓接於工件201及框架203。The sheet 202 is formed into a circular plate with a diameter larger than the workpiece 201, and the frame 203 is adhered to the periphery and the workpiece 201 is adhered to the center. In the first embodiment, the sheet 202 is adhered to the back surface 209 of the workpiece 201. The sheet 202 is an adhesive film having a base layer and a paste layer, and the paste layer is adhered to the workpiece 201 and the frame 203, the base layer is composed of a non-adhesive and flexible resin, and the paste layer is laminated on the base layer and is composed of an adhesive and flexible resin; or, a sheet having no paste layer and consisting only of a base layer, the base layer is composed of a thermoplastic resin and is hot-pressed to the workpiece 201 and the frame 203.

框架203被形成為內徑大於工件201的外徑的圓環狀,並黏貼薄片202的外周。框架203係藉由非可撓性的硬質的材料所構成,在實施方式一中係藉由具有磁性之金屬所構成。The frame 203 is formed into a ring shape with an inner diameter larger than the outer diameter of the workpiece 201, and is attached to the outer periphery of the sheet 202. The frame 203 is made of a non-flexible hard material, and in the first embodiment, is made of a magnetic metal.

工件單元200係在工件201的背面209黏貼薄片202,在薄片202的外周黏貼框架203,並藉由薄片202將工件201支撐於框架203的開口內而構成。The workpiece unit 200 is composed of a sheet 202 attached to the back surface 209 of the workpiece 201, a frame 203 attached to the outer periphery of the sheet 202, and the sheet 202 supporting the workpiece 201 in the opening of the frame 203.

(斷裂裝置) 實施方式一之斷裂裝置1係將分割起點208作為起點而分割工件單元200的工件201,而將工件201分割成一個個晶片210之裝置。此外,晶片210具備基板204的一部分與形成於基板204的正面之元件207。如圖1所示,斷裂裝置1具備框架固定單元10、檢測單元20、夾持單元40、推壓構件60、控制器亦即控制單元100、顯示單元110及未圖示之輸入單元。 (Breaking device) The breaking device 1 of the first embodiment is a device that uses the splitting starting point 208 as a starting point to split the workpiece 201 of the workpiece unit 200, and splits the workpiece 201 into individual chips 210. In addition, the chip 210 has a portion of the substrate 204 and an element 207 formed on the front surface of the substrate 204. As shown in FIG1, the breaking device 1 has a frame fixing unit 10, a detection unit 20, a clamping unit 40, a pressing member 60, a controller, i.e., a control unit 100, a display unit 110, and an input unit not shown.

框架固定單元10固定工件單元200的框架203。框架固定單元10具備:移動框架11,其藉由X軸移動單元30而在與水平方向平行的X軸方向移動自如地設於裝置本體2上;以及框架固定構件12,其配設於移動框架11上。The frame fixing unit 10 fixes the frame 203 of the workpiece unit 200. The frame fixing unit 10 includes a moving frame 11 movably provided on the device body 2 in an X-axis direction parallel to the horizontal direction by the X-axis moving unit 30 and a frame fixing member 12 disposed on the moving frame 11.

框架固定構件12被形成為內外徑與框架203的內外徑相等的圓環狀,且上表面成為透過薄片202的外周而載置工件單元200的框架203之保持面13。保持面13係沿著水平方向呈平坦。在實施方式一中,框架固定構件12在保持面13開孔有與未圖示之吸引源連接之吸引孔。The frame fixing member 12 is formed into a ring shape with an inner and outer diameter equal to that of the frame 203, and the upper surface is formed into a holding surface 13 of the frame 203 for placing the workpiece unit 200 through the outer periphery of the sheet 202. The holding surface 13 is flat along the horizontal direction. In the first embodiment, the frame fixing member 12 has a suction hole opened on the holding surface 13 to be connected to a suction source not shown in the figure.

框架固定單元10係藉由吸引孔被吸引源吸引,而透過薄片202將載置於保持面13之框架203吸引並固定於保持面13。此外,在本發明中,在框架203係藉由磁性體所構成之情形中,框架固定單元10可預先將磁鐵(永久磁鐵或電磁鐵)配設於框架固定構件12內,以磁力吸附並固定載置於保持面13之框架203,在框架203係藉由非磁性體所構成之情形中,框架固定單元10可具備在與保持面13之間夾持框架203而固定框架203之夾具機構。並且,框架固定單元10係藉由未圖示之旋轉驅動機構而繞著與Z軸方向(亦稱為鉛直方向)平行的軸心旋轉自如。The frame fixing unit 10 is attracted by the suction source through the suction hole, and the frame 203 placed on the holding surface 13 is attracted and fixed to the holding surface 13 through the sheet 202 . In addition, in the present invention, when the frame 203 is composed of a magnetic body, the frame fixing unit 10 can pre-dispose magnets (permanent magnets or electromagnets) in the frame fixing member 12 to attract and fix them with magnetic force. When the frame 203 placed on the holding surface 13 is made of a non-magnetic material, the frame fixing unit 10 may have a clamp mechanism that clamps the frame 203 between the holding surface 13 and the frame 203 to fix the frame 203 . Furthermore, the frame fixing unit 10 is freely rotatable around an axis parallel to the Z-axis direction (also referred to as the vertical direction) by a rotational drive mechanism (not shown).

此外,X軸移動單元30設置於裝置本體2上,並具備:習知的滾珠螺桿,其被設成繞著軸心旋轉自如;習知的馬達,其藉由使滾珠螺桿繞著軸心旋轉,而使移動框架11及框架固定構件12在X軸方向移動;以及習知的導軌31,其將移動框架11支撐成在X軸方向移動自如。In addition, the X-axis moving unit 30 is arranged on the device body 2 and has: a known ball screw, which is configured to rotate freely around the axis; a known motor, which moves the moving frame 11 and the frame fixing member 12 in the X-axis direction by rotating the ball screw around the axis; and a known guide rail 31, which supports the moving frame 11 so that it can move freely in the X-axis direction.

檢測單元20檢測框架203已被框架固定單元10固定之工件單元200的工件201的分割預定線206。檢測單元20設置於移動台4,所述移動台4係在從裝置本體2跨越X軸移動單元30的導軌31而立設之門型的門型框架3,藉由Y軸移動單元32而在與水平方向平行且相對於X軸方向呈正交之Y軸方向移動。檢測單元20係藉由設置於移動台4而被配設成藉由Y軸移動單元32在Y軸方向移動自如。The detection unit 20 detects the planned division line 206 of the workpiece 201 of the workpiece unit 200 whose frame 203 has been fixed by the frame fixing unit 10 . The detection unit 20 is installed on the moving platform 4, which is a door-shaped portal frame 3 erected from the device body 2 across the guide rail 31 of the X-axis moving unit 30, and is moved with the Y-axis moving unit 32. The horizontal direction is parallel to the Y-axis direction and is orthogonal to the X-axis direction. The detection unit 20 is provided on the moving stage 4 and is disposed to be movable in the Y-axis direction by the Y-axis moving unit 32 .

檢測單元20包含攝像攝影機21,所述攝像攝影機21具備將物鏡在與鉛直方向平行的Z軸方向面對之物體進行拍攝之CCD(Charge Coupled Device,電荷耦合元件)攝像元件或CMOS(Complementary MOS,互補金屬氧化物半導體)攝像元件等攝像元件。檢測單元20取得攝像元件所拍攝到之圖像,將所取得之圖像輸出至控制單元100。並且,檢測單元20拍攝框架203已被框架固定單元10固定之工件單元200的工件201,而取得用於執行對準的圖像,所述對準係進行工件201的分割預定線206與推壓構件60等的對位。The detection unit 20 includes a camera 21, which has a CCD (Charge Coupled Device) camera element or a CMOS (Complementary MOS) camera element for photographing an object facing the objective lens in the Z-axis direction parallel to the vertical direction. The detection unit 20 obtains the image photographed by the camera element and outputs the obtained image to the control unit 100. In addition, the detection unit 20 photographs the workpiece 201 of the workpiece unit 200 whose frame 203 has been fixed by the frame fixing unit 10, and obtains an image for performing alignment, which is to align the predetermined dividing line 206 of the workpiece 201 with the pushing member 60, etc.

此外,門型框架3及移動台4的兩表面係與平行於鉛直方向的Z軸方向平行的平板狀且互相空開間隔而平行地重疊。Y軸移動單元32設置於門型框架3上,並具備:習知的滾珠螺桿,其被設成繞著軸心旋轉自如;習知的馬達,其藉由使滾珠螺桿繞著軸心旋轉,而使移動台4在Y軸方向移動;以及習知的導軌33,其將移動台4支撐成在Y軸方向移動自如。In addition, both surfaces of the portal frame 3 and the moving platform 4 are parallel to the Z-axis direction parallel to the vertical direction and overlapped in parallel with each other at a distance. The Y-axis moving unit 32 is provided on the portal frame 3 and has: a known ball screw, which is set to rotate freely around the axis; a known motor, which moves the moving platform 4 in the Y-axis direction by rotating the ball screw around the axis; and a known guide rail 33, which supports the moving platform 4 to move freely in the Y-axis direction.

接著,說明夾持單元40。圖3係示意性地表示圖1所示之斷裂裝置的夾持單元的下側夾持單元的構成之立體圖。圖4係以局部剖面示意性地表示圖1所示之斷裂裝置的夾持單元的上側夾持單元的構成之側視圖。Next, the clamping unit 40 will be described. Fig. 3 is a perspective view schematically showing the structure of the lower clamping unit of the clamping unit of the breaking device shown in Fig. 1. Fig. 4 is a side view schematically showing the structure of the upper clamping unit of the clamping unit of the breaking device shown in Fig. 1 in partial section.

夾持單元40係沿著工件單元200的Z軸方向從上下夾持工件201的與應分割之分割預定線206相鄰之區域的工件201的元件207。如圖1所示,夾持單元40具備下側夾持單元41與上側夾持單元50。The clamping unit 40 clamps the components 207 of the workpiece 201 in the area adjacent to the planned division line 206 to be divided from the top and bottom along the Z-axis direction of the workpiece unit 200 . As shown in FIG. 1 , the clamping unit 40 includes a lower clamping unit 41 and an upper clamping unit 50 .

下側夾持單元41配置於框架固定單元10的下方,並從下方推壓元件207,所述元件207係框架203已被框架固定單元10固定之工件單元200的工件201的與應分割之分割預定線206相鄰之區域。如圖3所示,下側夾持單元41具備:支架42,其被設成藉由Z軸移動單元34而在Z軸方向升降自如;旋轉體43,其繞著軸心旋轉自如地被支撐於支架42;以及多個矩形狀夾持構件44,其等從旋轉體4的外周面突出且長度互相不同。The lower clamping unit 41 is disposed below the frame fixing unit 10 and pushes the component 207 from below. The component 207 is a corresponding division of the workpiece 201 of the workpiece unit 200 in which the frame 203 has been fixed by the frame fixing unit 10. The area adjacent to the predetermined line 206. As shown in FIG. 3 , the lower clamping unit 41 includes a bracket 42 that can be freely raised and lowered in the Z-axis direction by the Z-axis moving unit 34 , and a rotary body 43 that is supported to be able to rotate around the axis. on the bracket 42; and a plurality of rectangular clamping members 44, which protrude from the outer peripheral surface of the rotating body 4 and have different lengths from each other.

旋轉體43被配設成軸心與Y軸方向平行,且兩端係旋轉自如地被支架42支撐。旋轉體43係藉由未圖示之旋轉機構而繞著軸心旋轉。多個矩形狀夾持構件44分別被形成為厚度固定的在Y軸方向直線狀的矩形板狀,且Y軸方向的長度各不相同,而被形成為各式各樣的長度。多個矩形狀夾持構件44之中最長的矩形狀夾持構件44的長度係與工件201的最長的分割預定線206的長度相等,最短的矩形狀夾持構件44的長度係與工件201的最短的分割預定線206的長度相等。The rotary body 43 is disposed so that its axis is parallel to the Y-axis direction, and both ends are rotatably supported by the bracket 42 . The rotating body 43 rotates around the axis by a rotating mechanism not shown in the figure. Each of the plurality of rectangular holding members 44 is formed in a linear rectangular plate shape with a fixed thickness in the Y-axis direction, and the lengths in the Y-axis direction are different from each other and are formed in various lengths. The length of the longest rectangular clamping member 44 among the plurality of rectangular clamping members 44 is equal to the length of the longest planned division line 206 of the workpiece 201 , and the length of the shortest rectangular clamping member 44 is equal to the length of the workpiece 201 . The shortest planned dividing lines 206 have the same length.

多個矩形狀夾持構件44係藉由旋轉體43的旋轉而變更突出之朝向。多個矩形狀夾持構件44之中被配置成從旋轉體43沿著Z軸方向朝上之矩形狀夾持構件44若藉由Z軸移動單元34而下降,則上端會位於比框架203已被框架固定單元10固定之工件單元200的薄片202更下方,若藉由Z軸移動單元34而上升,則上端會位於比框架203已被框架固定單元10固定之工件單元200的工件201更上方。多個矩形狀夾持構件44之中被配置成從旋轉體43沿著Z軸方向朝上之矩形狀夾持構件44若藉由Z軸移動單元34而上升,則以上端從背面209側往上方推壓工件201的應分割之分割預定線206的旁邊的元件207。The protruding direction of the plurality of rectangular holding members 44 is changed by the rotation of the rotary body 43 . Among the plurality of rectangular clamping members 44 , if the rectangular clamping member 44 arranged upward in the Z-axis direction from the rotating body 43 is lowered by the Z-axis moving unit 34 , the upper end thereof will be positioned farther than the frame 203 . The sheet 202 of the workpiece unit 200 fixed by the frame fixing unit 10 is lower. If it is raised by the Z-axis moving unit 34, the upper end will be located higher than the workpiece 201 of the workpiece unit 200 fixed by the frame fixing unit 10. . Among the plurality of rectangular clamping members 44 , when the rectangular clamping member 44 arranged upward in the Z-axis direction from the rotating body 43 is raised by the Z-axis moving unit 34 , its upper end moves upward from the back surface 209 side. The component 207 next to the planned division line 206 to be divided in the workpiece 201 is pushed upward.

亦即,下側夾持單元41係藉由變更繞著旋轉體43的軸心的朝向,而可選擇成為朝上之矩形狀夾持構件44的長度,並以其選擇之矩形狀夾持構件44從背面209側往上方推壓工件201的應分割之分割預定線206的旁邊的元件207。That is, the lower clamping unit 41 can select the length of the upward rectangular clamping member 44 by changing the orientation around the axis of the rotating body 43, and use the selected rectangular clamping member to 44. Push the component 207 next to the planned dividing line 206 of the workpiece 201 to be divided upward from the back surface 209 side.

此外,Z軸移動單元34具備:習知的滾珠螺桿,其被設成繞著軸心旋轉自如;習知的馬達,其藉由使滾珠螺桿繞著軸心旋轉,而使支架42在Z軸方向升降;以及習知的導軌35,其將支架42支撐成在Z軸方向升降自如。In addition, the Z-axis moving unit 34 includes: a conventional ball screw that is rotatable around an axis; a conventional motor that causes the bracket 42 to move up and down in the Z-axis direction by rotating the ball screw around the axis; and a conventional guide rail 35 that supports the bracket 42 so that it can move up and down in the Z-axis direction.

上側夾持單元50配置於框架固定單元10的上方,並在與下側夾持單元41之間夾持框架203已被框架固定單元10固定之工件單元200的工件201的應分割之分割預定線206的旁邊且被下側夾持單元41從下方推壓之元件207。上側夾持單元50設置於移動基台5,所述移動基台5係在移動台4藉由升降單元36而在Z軸方向移動。The upper clamping unit 50 is disposed above the frame fixing unit 10, and clamps the frame 203 between the lower clamping unit 41 and the workpiece 201 of the workpiece unit 200 fixed by the frame fixing unit 10, next to the predetermined dividing line 206 to be divided and the component 207 pushed from below by the lower clamping unit 41. The upper clamping unit 50 is set on the moving base 5, and the moving base 5 is moved in the Z-axis direction on the moving table 4 by the lifting unit 36.

移動基台5被形成為兩表面與Z軸方向平行的平板狀,並空開間隔而重疊於移動台4上。移動基台5固定有水平構件6,所述水平構件6的兩表面與水平方向平行。The moving base 5 is formed in a flat plate shape with both surfaces parallel to the Z-axis direction, and overlaps the moving base 4 with a gap therebetween. The mobile base 5 is fixed with a horizontal member 6, and both surfaces of the horizontal member 6 are parallel to the horizontal direction.

升降單元36設置於移動台4,並具備:習知的滾珠螺桿,其被設成繞著軸心旋轉自如;習知的馬達37,其藉由使滾珠螺桿繞著軸心旋轉,而使移動基台5在Z軸方向升降;以及習知的導軌38,其將移動基台5支撐成在Z軸方向升降自如。The lifting unit 36 is disposed on the moving platform 4 and includes: a conventional ball screw which is configured to be rotatable around an axis; a conventional motor 37 which causes the moving platform 5 to be lifted and lowered in the Z-axis direction by rotating the ball screw around the axis; and a conventional guide rail 38 which supports the moving platform 5 so that it can be lifted and lowered in the Z-axis direction.

如圖4所示,上側夾持單元50具備汽缸單元51、上側夾持構件52及滑動單元53。汽缸單元51具備:汽缸54,其固定於水平構件6;以及桿體55,其被形成為與Z軸方向平行的棒狀,並從汽缸54伸縮自如,且若從汽缸54伸長則下端下降。As shown in FIG. 4 , the upper clamping unit 50 includes a cylinder unit 51 , an upper clamping member 52 , and a sliding unit 53 . The cylinder unit 51 includes a cylinder 54 fixed to the horizontal member 6 and a rod 55 formed in a rod shape parallel to the Z-axis direction and capable of being telescopic from the cylinder 54 and having its lower end lowered when extended from the cylinder 54 .

上側夾持構件52被形成為厚度固定的在Y軸方向直線狀且兩表面與Z軸方向平行的矩形板狀,Y軸方向的長度係與工件201的最長的分割預定線206的長度相同。上側夾持構件52在上端固定汽缸單元51的桿體55的下端,並空開間隔而重疊於移動基台5。上側夾持構件52係與從旋轉體43朝上的矩形狀夾持構件44在Z軸方向面對。The upper clamping member 52 is formed into a rectangular plate shape with a fixed thickness and a straight line in the Y-axis direction and both surfaces parallel to the Z-axis direction. The length in the Y-axis direction is the same as the length of the longest planned dividing line 206 of the workpiece 201 . The upper clamping member 52 fixes the lower end of the rod 55 of the cylinder unit 51 at its upper end and overlaps the moving base 5 with a gap therebetween. The upper clamping member 52 faces the rectangular clamping member 44 upward from the rotating body 43 in the Z-axis direction.

並且,滑動單元53將上側夾持構件52支撐成相對於移動基台5相對地在Z軸方向滑動自如。滑動單元53具備:直線狀的導軌56,其固定於移動基台5與上側夾持構件52之中的一者亦即移動基台5,且與Z軸方向平行;以及滑件57,其固定於移動基台5與上側夾持構件52之中的另一者亦即上側夾持構件52,且在導軌56的長度方向亦即Z軸方向滑動自如地被支撐於此導軌56。Furthermore, the sliding unit 53 supports the upper clamping member 52 so as to be slidable in the Z-axis direction relative to the moving base 5 . The sliding unit 53 includes a linear guide rail 56 fixed to the moving base 5 , which is one of the moving base 5 and the upper clamping member 52 , and parallel to the Z-axis direction; and a slider 57 fixed to the moving base 5 . The other of the moving base 5 and the upper clamping member 52 , that is, the upper clamping member 52 , is supported by the guide rail 56 so as to be slidable in the length direction of the guide rail 56 , that is, in the Z-axis direction.

上側夾持構件52係在桿體55伸長之狀態下藉由升降單元36而上升,藉此下端位於比框架203已被框架固定單元10固定之工件單元200的工件201更上方,若藉由升降單元36而下降,則下端在與矩形狀夾持構件44之間夾持被矩形狀夾持構件44推壓之工件201的與應分割之分割預定線206的旁邊的元件207,所述矩形狀夾持構件44被配置成從旋轉體43沿著Z軸方向朝上。The upper clamping member 52 is raised by the lifting unit 36 when the rod 55 is extended, so that the lower end is located above the workpiece 201 of the workpiece unit 200 fixed to the frame 203 by the frame fixing unit 10. If it is lowered by the lifting unit 36, the lower end clamps the element 207 next to the predetermined dividing line 206 of the workpiece 201 pushed by the rectangular clamping member 44 and to be divided between the rectangular clamping member 44, and the rectangular clamping member 44 is configured to face upward along the Z-axis direction from the rotating body 43.

推壓構件60係夾著應分割之分割預定線206而在夾持單元40的夾持構件44、52的Y軸方向的相反側推壓與應分割之分割預定線206相鄰之區域的工件201的元件207,而沿著應分割之分割預定線206使工件201斷裂(亦稱為分割)。如圖4所示,推壓構件60設置於推壓移動基台62,所述推壓移動基台62係藉由第二X軸移動單元61而在X軸方向移動自如地設置於水平構件6。The pressing member 60 holds the planned dividing line 206 to be divided and presses the workpiece in the area adjacent to the planned dividing line 206 to be divided on the opposite side of the clamping members 44 and 52 of the clamping unit 40 in the Y-axis direction. 201 of the component 207, and the workpiece 201 is broken along the planned dividing line 206 to be divided (also called dividing). As shown in FIG. 4 , the pressing member 60 is provided on the pressing moving base 62 which is provided on the horizontal member 6 so as to be movable in the X-axis direction by the second X-axis moving unit 61 .

推壓移動基台62係兩表面與Z軸方向平行且一體地具備上端側的厚壁部63與下端側的薄壁部64而形成,並空開間隔而重疊於上側夾持構件52上。在實施方式一中,推壓移動基台62係厚壁部63與薄壁部64的遠離上側夾持構件52之側的表面被形成為相同平面狀,並在上側夾持構件52側形成有厚壁部63與薄壁部64之間的段差,並且,在實施方式一中,推壓移動基台62設有貫通薄壁部64之平面形狀為矩形的開口65。The push-and-move base 62 is formed by having two surfaces parallel to the Z-axis direction and integrally having a thick-walled portion 63 on the upper end side and a thin-walled portion 64 on the lower end side, and is overlapped with a spaced interval on the upper clamping member 52. In the first embodiment, the push-and-move base 62 is formed such that the surfaces of the thick-walled portion 63 and the thin-walled portion 64 on the side away from the upper clamping member 52 are formed into the same plane shape, and a step difference between the thick-walled portion 63 and the thin-walled portion 64 is formed on the side of the upper clamping member 52, and, in the first embodiment, the push-and-move base 62 is provided with an opening 65 having a rectangular plane shape that passes through the thin-walled portion 64.

第二X軸移動單元61具備:習知的滾珠螺桿,其設置於水平構件6,並被設成繞著軸心旋轉自如;習知的馬達66,其藉由使滾珠螺桿繞著軸心旋轉,而使推壓移動基台62在X軸方向移動;以及習知的導軌67,其將推壓移動基台62支撐成在X軸方向移動自如。The second X-axis moving unit 61 is provided with: a conventional ball screw, which is provided on the horizontal member 6 and is freely rotatable around the axis; and a conventional motor 66, which rotates the ball screw around the axis. to move the pressing and moving base 62 in the X-axis direction; and a conventional guide rail 67 to support the pressing and moving base 62 to move freely in the X-axis direction.

接著,說明推壓構件60。圖5係以局部剖面示意性地表示圖1所示之斷裂裝置的推壓構件之側視圖。圖6係以局部剖面示意性地表示從圖5所示之箭頭VI方向觀看之負載量測部之前視圖。圖7係表示圖6所示之負載量測部的負載計的測量結果的一例之圖。圖8係表示圖6所示之負載量測部的負載計的測量結果的另一例之圖。圖9係表示圖6所示之負載量測部的負載計的測量結果的再另一例之圖。Next, the pushing member 60 is explained. FIG5 is a side view schematically showing the pushing member of the fracture device shown in FIG1 in partial section. FIG6 is a front view schematically showing the load measuring portion viewed from the direction of arrow VI shown in FIG5 in partial section. FIG7 is a diagram showing an example of the measurement result of the load meter of the load measuring portion shown in FIG6. FIG8 is a diagram showing another example of the measurement result of the load meter of the load measuring portion shown in FIG6. FIG9 is a diagram showing still another example of the measurement result of the load meter of the load measuring portion shown in FIG6.

推壓構件60被形成為在Y軸方向直線狀且兩表面與Z軸方向平行的矩形板狀,且Y軸方向的長度係與工件201的最長的分割預定線206的長度相等。推壓構件60在下端部形成有隨著朝向下方而厚度逐漸地薄化之尖端部68。在實施方式一中,尖端部68的上側夾持構件52側的表面係沿著Z軸方向被形成為平坦,遠離上側夾持構件52之側的表面係隨著朝向下方而往靠近上側夾持構件52之方向相對於水平方向與Z軸方向兩者逐漸地傾斜。The pressing member 60 is formed into a rectangular plate shape that is linear in the Y-axis direction and has both surfaces parallel to the Z-axis direction. The length in the Y-axis direction is equal to the length of the longest planned division line 206 of the workpiece 201 . The pressing member 60 is formed with a tip portion 68 whose thickness gradually becomes thinner toward the lower end portion. In Embodiment 1, the surface of the tip portion 68 on the upper clamping member 52 side is formed flat along the Z-axis direction, and the surface on the side away from the upper clamping member 52 is clamped closer to the upper side as it goes downward. The direction of the member 52 is gradually inclined relative to both the horizontal direction and the Z-axis direction.

並且,推壓構件60係藉由一對滑動單元69而在Z軸方向滑動自如地被支撐於推壓移動基台62。一對滑動單元69係在Y軸方向空開間隔而配置。滑動單元69具備:直線狀的導軌691,其固定於推壓移動基台62與推壓構件60之中的一者亦即推壓移動基台62,且與Z軸方向平行;以及滑件692,其固定於推壓移動基台62與推壓構件60之中的另一者亦即推壓構件60,且在導軌691的長度方向亦即Z軸方向滑動自如地被支撐於此導軌691。Furthermore, the pressing member 60 is supported on the pressing moving base 62 by a pair of sliding units 69 so as to be slidable in the Z-axis direction. The pair of sliding units 69 are arranged with a gap in the Y-axis direction. The sliding unit 69 is provided with: a linear guide rail 691 fixed to the pressing moving base 62 which is one of the pressing moving base 62 and the pressing member 60 and parallel to the Z-axis direction; and a slider 692 , it is fixed to the pressing member 60 , which is the other one of the pressing moving base 62 and the pressing member 60 , and is supported by the guide rail 691 so as to be slidable in the length direction of the guide rail 691 , that is, the Z-axis direction.

推壓構件60係藉由升降單元36而上升,藉此下端位於比框架203已被框架固定單元10固定之工件單元200的工件201更上方,若藉由升降單元36而下降,則在Y軸方向將應分割之分割預定線206被定位於夾持構件44、52之間之工件201的元件207往下方推壓。在實施方式一中,推壓構件60將工件201的與上側夾持構件52的X軸方向的距離成為晶片210的寬度的75%~85%左右之位置往下方推壓。此外,在本發明中,推壓構件60只要將工件201的與上側夾持構件52的X軸方向的距離成為晶片210的寬度的65%~95%左右之位置往下方推壓即可。此外,推壓構件60所推壓之位置與上側夾持構件52在X軸方向的距離過近會難以破裂,過遠則推壓構件60退避至已破裂之分割預定線206側而不會破裂,因此,較佳為推壓構件60將工件201的與上側夾持構件52的X軸方向的距離成為晶片210的寬度的65%~95%左右之位置,較佳為將成為晶片210的寬度的75%~85%左右之位置往下方推壓。推壓構件60若藉由升降單元36而下降,則在Y軸方向將應分割之分割預定線206被定位於夾持構件44、52之間之工件201的元件207往下方推壓,而分割此應分割之分割預定線206。The pressing member 60 is raised by the lifting unit 36, so that the lower end is located above the workpiece 201 of the workpiece unit 200 where the frame 203 has been fixed by the frame fixing unit 10. The direction in which the planned dividing line 206 to be divided is pushed downward by the element 207 of the workpiece 201 positioned between the clamping members 44 and 52 . In Embodiment 1, the pressing member 60 presses downward the position where the distance in the X-axis direction of the workpiece 201 from the upper clamping member 52 is approximately 75% to 85% of the width of the wafer 210 . In addition, in the present invention, the pressing member 60 only needs to press downward the position where the distance between the workpiece 201 and the upper clamping member 52 in the X-axis direction is approximately 65% to 95% of the width of the wafer 210 . In addition, if the distance between the pressing position of the pressing member 60 and the upper clamping member 52 in the X-axis direction is too close, it will be difficult to break. If it is too far, the pressing member 60 will retreat to the side of the planned division line 206 that has been broken, and the break will not occur. , therefore, it is preferable that the pressing member 60 positions the distance between the workpiece 201 and the upper clamping member 52 in the X-axis direction to be approximately 65% to 95% of the width of the wafer 210 , and preferably becomes the width of the wafer 210 Push downward at about 75% to 85% of the position. When the pressing member 60 is lowered by the lifting unit 36, the element 207 of the workpiece 201 positioned between the clamping members 44 and 52 pushes the planned dividing line 206 to be divided downward in the Y-axis direction, thereby dividing it. The planned dividing line 206 should be divided.

並且,推壓構件60係藉由圖5所示之負載測量部70而固定於推壓移動基台62。負載測量部70配置於一對滑動單元69之間。如圖5及圖6所示,負載測量部70具備:負載計71,其測量推壓構件60推壓工件201之負載的值(以下,記為負載值);保持構件72;支撐構件73;彈簧75;以及支撐部74(僅在圖6表示)。Furthermore, the pressing member 60 is fixed to the pressing moving base 62 by means of a load measuring portion 70 shown in FIG5 . The load measuring portion 70 is disposed between a pair of sliding units 69. As shown in FIG5 and FIG6 , the load measuring portion 70 includes: a load meter 71 for measuring the value of the load (hereinafter referred to as the load value) of the pressing member 60 pressing the workpiece 201; a holding member 72; a supporting member 73; a spring 75; and a supporting portion 74 (only shown in FIG6 ).

負載計71測量Z軸方向的推壓構件60推壓工件201之負載值,在實施方式一中雖為習知的荷重元,但並不受限於荷重元。負載計71將量測結果亦即負載值輸出至控制單元100。負載計71配置於推壓移動基台62的開口65內。The load meter 71 measures the load value of the pushing member 60 pushing the workpiece 201 in the Z-axis direction. Although it is a known load cell in the first embodiment, it is not limited to a load cell. The load meter 71 outputs the measurement result, i.e., the load value, to the control unit 100. The load meter 71 is disposed in the opening 65 of the pushing movable base 62.

保持構件72係一端部固定於推壓構件60,且另一端部從推壓構件60朝向推壓移動基台62延伸而配置於推壓移動基台62的開口65內。保持構件72在另一端部支撐負載計71的下端。The holding member 72 has one end fixed to the pressing member 60, and the other end extending from the pressing member 60 toward the pressing moving base 62 and disposed in the opening 65 of the pressing moving base 62. The holding member 72 supports the lower end of the load meter 71 at the other end.

支撐構件73配置於推壓移動基台62的開口65內,上端固定於開口65的上側的內面,且下端支撐負載計71的上端。支撐部74配置於推壓移動基台62的開口65內,下端固定於開口65的下側的內面,且上端支撐保持構件72的下端部。The support member 73 is disposed in the opening 65 of the push-moving base 62, the upper end is fixed to the inner surface of the upper side of the opening 65, and the lower end supports the upper end of the load meter 71. The support portion 74 is disposed in the opening 65 of the push-moving base 62, the lower end is fixed to the inner surface of the lower side of the opening 65, and the upper end supports the lower end of the holding member 72.

彈簧75配置於開口65的下側的內面與保持構件72的另一端部之間,並透過保持構件72的另一端部而將推壓構件60相對於推壓移動基台62相對地往上方賦與勢能。在實施方式一中,彈簧75係以與推壓構件60、保持構件72及負載計71的合計質量對應之力,將保持構件72及推壓構件60往上方賦與勢能。藉由彈簧75以前述之力賦與勢能,而推壓構件60、保持構件72及負載計71的合計質量被抵消,負載計71可測量小於推壓構件60、保持構件72及負載計71的合計質量的負載值。如此,斷裂裝置1具備負載計71,所述負載計71測量推壓構件60推壓工件201之負載值。The spring 75 is disposed between the inner surface of the lower side of the opening 65 and the other end of the retaining member 72, and imparts potential energy to the pushing member 60 relatively upward relative to the pushing moving base 62 through the other end of the retaining member 72. In the first embodiment, the spring 75 imparts potential energy to the retaining member 72 and the pushing member 60 upward with a force corresponding to the total mass of the pushing member 60, the retaining member 72 and the load gauge 71. By imparting potential energy with the aforementioned force by the spring 75, the total mass of the pushing member 60, the retaining member 72 and the load gauge 71 is offset, and the load gauge 71 can measure a load value that is less than the total mass of the pushing member 60, the retaining member 72 and the load gauge 71. Thus, the fracture device 1 is provided with a load meter 71 for measuring the load value of the pressing member 60 pressing the workpiece 201 .

此外,如圖7、圖8及圖9所示,負載計71的測量結果的負載值在上側夾持構件52及推壓構件60藉由升降單元36而下降之際,推壓構件60接觸工件201為止之前為零,且若推壓構件60接觸工件201則上升。負載計71的測量結果的負載值為:若推壓構件60將應分割之分割預定線206分割,則成為最大值300,且分割以後從最大值300下降。負載計71的測量結果的負載值為:在固定時間之間,推壓構件60以等速下降而推壓工件201,在經過固定時間後,推壓構件60若撤離則成為零。此外,圖7、圖8及圖9的橫軸表示經過時間,縱軸表示負載計71的測量結果亦藉負載值。In addition, as shown in FIG. 7 , FIG. 8 and FIG. 9 , the load value of the measurement result of the load meter 71 is zero until the pressing member 60 contacts the workpiece 201 when the upper clamping member 52 and the pressing member 60 are lowered by the lifting unit 36, and rises when the pressing member 60 contacts the workpiece 201. The load value of the measurement result of the load meter 71 is a maximum value of 300 when the pressing member 60 divides the predetermined dividing line 206 to be divided, and decreases from the maximum value of 300 after the division. The load value of the measurement result of the load meter 71 is a load value when the pressing member 60 descends at a constant speed to press the workpiece 201 during a fixed time, and becomes zero when the pressing member 60 withdraws after a fixed time. In addition, the horizontal axis of FIG. 7 , FIG. 8 and FIG. 9 represents the elapsed time, and the vertical axis represents the measurement result of the load meter 71 in terms of the load value.

並且,若應分割之分割預定線206全體被分割(以下,記為完全分割),則如圖7所示,負載計71的測量結果的負載值中,分割後的負載值成為小於第一預定值301。此外,在實施方式一中,第一預定值301為最大值300的第一預定百分比(例如,30%),在本發明中,亦可為低於最大值300的第一預定負載值(例如,6N)。Furthermore, if the predetermined segmentation line 206 to be segmented is completely segmented (hereinafter referred to as completely segmented), as shown in FIG7 , the load value of the load value measured by the load meter 71 after segmentation becomes less than the first predetermined value 301. In addition, in the first embodiment, the first predetermined value 301 is a first predetermined percentage (for example, 30%) of the maximum value 300, and in the present invention, it may also be a first predetermined load value (for example, 6N) lower than the maximum value 300.

並且,若應分割之分割預定線206全體的一部分被分割,且剩餘維持未分割(以下,記為不完全分割),則如圖8所示,負載計71的測量結果的負載值中,分割後的負載值成為第一預定值301以上且小於第二預定值302。此外,第二預定值302為高於第一預定值301的值,而在實施方式一中,為最大值300的第二預定百分比(例如,80%),在本發明中,亦可為低於最大值300且高於第一預定負載值的第二預定負載值(例如,16N)。Furthermore, if a portion of the entire predetermined segmentation line 206 to be segmented is segmented and the remainder remains unsegmented (hereinafter referred to as incomplete segmentation), as shown in FIG8 , the load value of the load value measured by the load meter 71 after segmentation becomes greater than the first predetermined value 301 and less than the second predetermined value 302. In addition, the second predetermined value 302 is a value higher than the first predetermined value 301, and in the first embodiment, it is a second predetermined percentage (e.g., 80%) of the maximum value 300, and in the present invention, it may also be a second predetermined load value (e.g., 16N) that is lower than the maximum value 300 and higher than the first predetermined load value.

並且,若應分割之分割預定線206全體為未分割的狀態(以下,記為未分割),則如圖9所示,負載計71的測量結果的負載值中,分割後的負載值成為大致最大值300,並成為第二預定值302以上。Furthermore, if the predetermined division lines 206 to be divided are all in an undivided state (hereinafter referred to as undivided), then as shown in FIG. 9 , the load value of the load value measured by the load meter 71 after division becomes approximately the maximum value 300 and becomes greater than the second predetermined value 302.

控制單元100分別控制斷裂裝置1的上述之各構成要素,而使斷裂裝置1實施將工件201的各分割預定線206進行分割之分割動作。控制單元100係電腦,所述電腦具有:運算處理裝置,其具有如CPU(central processing unit,中央處理單元)般的微處理器;記憶裝置,其具有如ROM(read only memory,唯讀記憶體)或RAM(random access memory,隨機存取記憶體)般的記憶體;以及輸入輸出介面裝置。控制單元100的運算處理裝置遵循記憶於記憶裝置之電腦程式而實施運算處理,並將用於控制斷裂裝置1的控制訊號透過輸入輸出介面裝置而輸出至斷裂裝置1的上述之各單元。The control unit 100 controls each of the above-mentioned components of the breaking device 1 respectively, so that the breaking device 1 performs a dividing operation of dividing each planned dividing line 206 of the workpiece 201 . The control unit 100 is a computer, and the computer has: a processing device, which has a microprocessor like a CPU (central processing unit, central processing unit); a memory device, which has a ROM (read only memory, read-only memory). ) or RAM (random access memory, random access memory)-like memory; and input and output interface devices. The arithmetic processing device of the control unit 100 performs arithmetic processing according to the computer program stored in the memory device, and outputs the control signals for controlling the fracture device 1 to the above-mentioned units of the fracture device 1 through the input and output interface device.

顯示單元110係與控制單元100連接,並具備顯示各種資訊之顯示畫面111。輸入單元係在操作員將資訊等輸入斷裂裝置1的控制單元100之際使用。輸入單元係與控制單元100,並將所輸入之資訊朝向控制單元100輸出。輸入單元具備與顯示單元110的顯示畫面111重疊之觸控面板。The display unit 110 is connected to the control unit 100 and has a display screen 111 for displaying various information. The input unit is used when the operator inputs information, etc. into the control unit 100 of the rupture device 1. The input unit is connected to the control unit 100 and outputs the input information to the control unit 100. The input unit has a touch panel that overlaps with the display screen 111 of the display unit 110.

並且,控制單元100具備動作控制部101、判斷部102及記憶部103。動作控制部101分別控制斷裂裝置1的上述之各構成要素,而使斷裂裝置1實施將工件201的各分割預定線206進行分割之分割動作。Furthermore, the control unit 100 includes an operation control unit 101, a determination unit 102, and a storage unit 103. The operation control unit 101 controls each of the above-mentioned components of the breaking device 1 respectively, so that the breaking device 1 performs a dividing operation of dividing each planned dividing line 206 of the workpiece 201 .

判斷部102基於以負載計71所測量到之負載值,而判斷工件201是否已沿著應分割之分割預定線206被分割的分割結果,並將分割結果記憶於記憶部103。具體而言,判斷部102在負載計71的測量結果亦即負載值上升並從最大值300轉成下降之後,基於從最大值300經過預定時間400(圖7、圖8及圖9所示)後的負載值,而判斷應分割之分割預定線206的分割結果。The determination unit 102 determines the division result of whether the workpiece 201 has been divided along the planned division line 206 to be divided based on the load value measured by the load meter 71 , and stores the division result in the memory unit 103 . Specifically, after the load value, which is the measurement result of the load meter 71 , increases and changes from the maximum value 300 to the decrease, the determination unit 102 determines based on the elapse of a predetermined time 400 from the maximum value 300 (shown in FIGS. 7 , 8 and 9 ). The subsequent load value is used to determine the dividing result of the planned dividing line 206 that should be divided.

此外,在實施方式一中,預定時間400係比升降單元36將推壓構件60下降之時間更短的時間,在實施方式一中,例如為升降單元36將上側夾持構件52及推壓構件60下降之時間的30%的時間。並且,在本發明中,預定時間400亦可與升降單元36將推壓構件60下降之時間相同。In addition, in the first embodiment, the predetermined time 400 is a shorter time than the time for the lifting unit 36 to lower the pressing member 60. In the first embodiment, for example, the lifting unit 36 lowers the upper clamping member 52 and the pressing member. 60 drops 30% of the time. Furthermore, in the present invention, the predetermined time 400 may be the same as the time for the lifting unit 36 to lower the pressing member 60 .

在實施方式一中,例如,若從最大值300經過預定時間400後的負載值小於第一預定值301,則判斷部102判斷應分割之分割預定線206已被完全分割。並且,在實施方式一中,例如,若從最大值300經過預定時間400(圖7、圖8及圖9所示)後的負載值為第一預定值301以上且小於第二預定值302,則判斷部102判斷應分割之分割預定線206為不完全分割的狀態。並且,在實施方式一中,例如,若從最大值300經過預定時間400(圖7、圖8及圖9所示)後的負載值為第二預定值302以上,則判斷部102判斷應分割之分割預定線206為未分割的狀態。In the first embodiment, for example, if the load value after the predetermined time 400 elapses from the maximum value 300 is less than the first predetermined value 301, the determination unit 102 determines that the planned division line 206 that should be divided has been completely divided. Furthermore, in the first embodiment, for example, if the load value after a predetermined time 400 (shown in Figures 7, 8 and 9) has elapsed from the maximum value 300 is greater than the first predetermined value 301 and less than the second predetermined value 302, Then the determination unit 102 determines that the planned division line 206 that should be divided is in an incompletely divided state. Furthermore, in Embodiment 1, for example, if the load value after a predetermined time 400 (shown in FIGS. 7 , 8 and 9 ) has elapsed from the maximum value 300 is equal to or greater than the second predetermined value 302, the determination unit 102 determines that the division should be The planned division line 206 is in an undivided state.

此外,預定值301、302較佳為因應薄片202的種類、工件201的材質而預先適當設定。並且,即使在相同的工件201內,亦可因應分割預定線206的位置而設定預定值301、302(與分割預定線206的長度成比例)。In addition, the predetermined values 301 and 302 are preferably appropriately set in advance according to the type of the sheet 202 and the material of the workpiece 201. Moreover, even in the same workpiece 201, the predetermined values 301 and 302 can be set according to the position of the predetermined dividing line 206 (proportional to the length of the predetermined dividing line 206).

如此,在負載計71的測量結果亦即負載值上升並從最大值300轉成下降之後,判斷部102基於在預定時間400中之負載值的降低的狀態,而判斷各分割預定線206的分割結果,並將各分割預定線206與分割結果以一對一的方式相關連並記憶於記憶部103。並且,判斷部102基於以負載計71所測量到之負載值,對工件201的全部的分割預定線206,判斷分割結果為未分割(相當於未被分割)、完全分割(相當於已被分割)或不完全分割(相當於有可能一部分未被分割),並與各分割預定線206相關連而記憶於記憶部103。Thus, after the load value, which is the measurement result of the load meter 71, increases and turns to decrease from the maximum value 300, the determination unit 102 determines the segmentation result of each scheduled segmentation line 206 based on the state of the load value decrease in the predetermined time 400, and associates each scheduled segmentation line 206 with the segmentation result in a one-to-one manner and stores it in the storage unit 103. Furthermore, the determination unit 102 determines the segmentation result of all the scheduled segmentation lines 206 of the workpiece 201 as unsegmented (equivalent to not being segmented), completely segmented (equivalent to being segmented), or incompletely segmented (equivalent to the possibility that a part is not segmented) based on the load value measured by the load meter 71, and associates it with each scheduled segmentation line 206 and stores it in the storage unit 103.

此外,記憶部103的功能係藉由前述之記憶裝置而實現。動作控制部101及判斷部102的功能係藉由前述之運算處理裝置遵循記憶於記憶裝置之電腦程式實施運算處理而實現。In addition, the function of the memory unit 103 is realized by the aforementioned memory device. The functions of the motion control unit 101 and the determination unit 102 are realized by the aforementioned operation processing device performing operation processing according to the computer program stored in the memory device.

(斷裂方法) 接著,說明實施方式一之斷裂方法。圖10係表示實施方式一之斷裂方法的流程之流程圖。實施方式一之斷裂方法包含前述之斷裂裝置1將工件201的各分割預定線206進行分割之分割動作。如圖10所示,實施方式一之斷裂方法具備工件單元形成步驟1001、框架固定步驟1002、檢測步驟1003、夾持步驟1004、分割步驟1005、負載檢測步驟1006及判斷步驟1007。 (Breaking method) Next, the breaking method of the first embodiment is described. FIG. 10 is a flow chart showing the process of the breaking method of the first embodiment. The breaking method of the first embodiment includes the breaking device 1 described above to separate each predetermined separation line 206 of the workpiece 201. As shown in FIG. 10, the breaking method of the first embodiment has a workpiece unit forming step 1001, a frame fixing step 1002, a detection step 1003, a clamping step 1004, a segmentation step 1005, a load detection step 1006 and a judgment step 1007.

(工件單元形成步驟) 工件單元形成步驟1001係形成工件單元200之步驟,所述工件單元200係由下述所構成:工件201,其分割預定線206形成有分割起點208;薄片202,其已黏貼工件201;以及框架203,其已黏貼薄片202的外周。在實施方式一中,在工件單元形成步驟1001中,將薄片202黏貼於工件201的背面209,並將框架203黏貼於薄片202的外周,而形成圖2所示之工件單元200。 (Workpiece unit formation step) The workpiece unit forming step 1001 is a step of forming the workpiece unit 200. The workpiece unit 200 is composed of the following: a workpiece 201 whose planned dividing line 206 forms a dividing starting point 208; a sheet 202 to which the workpiece 201 has been pasted; and a frame. 203, which has been adhered to the outer periphery of the sheet 202. In the first embodiment, in the workpiece unit forming step 1001, the sheet 202 is pasted on the back 209 of the workpiece 201, and the frame 203 is pasted on the outer periphery of the sheet 202 to form the workpiece unit 200 shown in FIG. 2 .

(框架固定步驟) 圖11係以局部剖面示意性地表示圖10所示之斷裂方法的框架固定步驟後的斷裂裝置的主要部分之側視圖。框架固定步驟1002係以框架固定單元10固定工件單元200的框架203之步驟。 (Frame fixing step) FIG. 11 is a side view schematically showing a main part of the fracturing device after the frame fixing step of the fracturing method shown in FIG. 10 in a partial cross-section. The frame fixing step 1002 is a step of fixing the frame 203 of the workpiece unit 200 with the frame fixing unit 10.

在實施方式一中,在框架固定步驟1002中,斷裂裝置1中,首先操作員等操作輸入單元而輸入分割條件,控制單元100受理並登錄分割條件。此外,分割條件包含工件單元200的工件201的外徑、分割預定線206的數量、分割預定線206的寬度方向的中央間的距離、分割時的升降單元36的推壓構件60的下降量及下降時間、分割後的晶片210的寬度、將分割預定線206進行分割之順序等。In the first embodiment, in the frame fixing step 1002, in the breaking device 1, the operator or the like operates the input unit to input the splitting condition, and the control unit 100 accepts and registers the splitting condition. In addition, the splitting condition includes the outer diameter of the workpiece 201 of the workpiece unit 200, the number of the splitting predetermined lines 206, the distance between the centers of the width direction of the splitting predetermined lines 206, the descending amount and descending time of the pressing member 60 of the lifting unit 36 during splitting, the width of the wafer 210 after splitting, and the order of splitting the splitting predetermined lines 206.

在實施方式一中,在框架固定步驟1002中,若控制單元100受理來自操作員等的分割動作的開始指示,則斷裂裝置1開始分割動作,亦即在實施方式一中依序開始框架固定步驟1002、檢測步驟1003、夾持步驟1004、分割步驟1005、負載檢測步驟1006及判斷步驟1007等。In the first embodiment, in the frame fixing step 1002, if the control unit 100 receives a start instruction of the splitting action from the operator, the breaking device 1 starts the splitting action, that is, in the first embodiment, the frame fixing step 1002, the detection step 1003, the clamping step 1004, the splitting step 1005, the load detection step 1006 and the judgment step 1007 are started in sequence.

在實施方式一中,在框架固定步驟1002中,斷裂裝置1的控制單元100的動作控制部101控制Z軸移動單元34而使下側夾持單元41下降,控制上側夾持單元50的汽缸單元51而伸長桿體55,並控制升降單元36而使上側夾持單元50及推壓構件60上升。並且,在實施方式一中,在框架固定步驟1002中,斷裂裝置1的控制單元100的動作控制部101控制第二X軸移動單元61,以上側夾持構件52的下端與推壓構件60的下端的X軸方向的距離成為分割條件所包含之晶片210的寬度的75%~85%之方式,調整推壓構件60的X軸方向的位置。此外,在本發明中,只要以上側夾持構件52的下端與推壓構件60的下端的X軸方向的距離成為晶片210的寬度的65%~95%之方式調整推壓構件60的X軸方向的位置即可。In the first embodiment, in the frame fixing step 1002, the motion control unit 101 of the control unit 100 of the breaking device 1 controls the Z-axis moving unit 34 to lower the lower clamping unit 41, controls the cylinder unit 51 of the upper clamping unit 50 to extend the rod 55, and controls the lifting unit 36 to raise the upper clamping unit 50 and the pushing member 60. Furthermore, in the first embodiment, in the frame fixing step 1002, the motion control unit 101 of the control unit 100 of the breaking device 1 controls the second X-axis moving unit 61 to adjust the position of the pushing member 60 in the X-axis direction in such a way that the distance between the lower end of the upper side clamping member 52 and the lower end of the pushing member 60 in the X-axis direction becomes 75% to 85% of the width of the wafer 210 included in the splitting condition. In addition, in the present invention, the position of the pushing member 60 in the X-axis direction can be adjusted in such a way that the distance between the lower end of the upper side clamping member 52 and the lower end of the pushing member 60 in the X-axis direction becomes 65% to 95% of the width of the wafer 210.

並且,在實施方式一中,在框架固定步驟1002中,斷裂裝置1的控制單元100的動作控制部101控制X軸移動單元30,而使框架固定單元10從夾持單元41、50間撤離。在實施方式一中,在框架固定步驟1002中,斷裂裝置1將工件單元200的框架203載置於框架固定單元10的保持面13上,所述工件單元200的工件201的正面205上已被薄膜等未圖示之保護構件覆蓋。在實施方式一中,在框架固定步驟1002中,斷裂裝置1的控制單元100的動作控制部101使吸引源運作,而如圖11所示,將框架203吸引並固定於框架固定單元10的保持面13。Furthermore, in the first embodiment, in the frame fixing step 1002, the motion control unit 101 of the control unit 100 of the breaking device 1 controls the X-axis moving unit 30 to withdraw the frame fixing unit 10 from between the clamping units 41 and 50. In the first embodiment, in the frame fixing step 1002, the breaking device 1 places the frame 203 of the workpiece unit 200 on the holding surface 13 of the frame fixing unit 10, and the front surface 205 of the workpiece 201 of the workpiece unit 200 is covered by a protective member such as a film that is not shown. In the first embodiment, in the frame fixing step 1002, the motion control unit 101 of the control unit 100 of the breaking device 1 operates the suction source, and as shown in FIG. 11, the frame 203 is attracted and fixed to the holding surface 13 of the frame fixing unit 10.

(檢測步驟) 圖12係以局部剖面示意性地表示圖10所示之斷裂方法的檢測步驟之側視圖。檢測步驟1003係從框架203已被框架固定單元10固定之工件單元200檢測應分割之分割預定線206之步驟。 (Detection step) FIG. 12 is a side view schematically showing the detection step of the fracture method shown in FIG. 10 in partial section. The detection step 1003 is a step of detecting the predetermined dividing line 206 to be divided from the workpiece unit 200 fixed by the frame fixing unit 10 on the frame 203.

在實施方式一中,在檢測步驟1003中,斷裂裝置1的控制單元100的動作控制部101控制X軸移動單元30與Y軸移動單元32,並基於分割條件的進行分割之順序,而如圖12所示,將檢測單元20定位於應分割之分割預定線206(以下,以符號206-1標記)的上方,以檢測單元20的攝像攝影機21拍攝包含工件201的分割預定線206-1之分割預定線206-1的周圍。在實施方式一中,在檢測步驟1003中,斷裂裝置1的控制單元100的動作控制部101基於以檢測單元20的攝像攝影機21進行拍攝所得到之圖像,而檢測分割預定線206-1。In the first embodiment, in the detection step 1003, the motion control unit 101 of the control unit 100 of the fracture device 1 controls the X-axis moving unit 30 and the Y-axis moving unit 32, and based on the order of segmentation according to the segmentation conditions, the detection unit 20 is positioned above the predetermined segmentation line 206 (hereinafter, marked with the symbol 206-1) to be segmented, as shown in FIG. 12, and the camera 21 of the detection unit 20 photographs the area around the predetermined segmentation line 206-1 including the predetermined segmentation line 206-1 of the workpiece 201. In the first embodiment, in the detection step 1003, the motion control unit 101 of the control unit 100 of the fracture device 1 detects the predetermined dividing line 206-1 based on the image captured by the camera 21 of the detection unit 20.

(夾持步驟) 圖13係以局部剖面示意性地表示圖10所示之斷裂方法的夾持步驟之側視圖。夾持步驟1004係在實施檢測步驟1003之後,從工件單元200的上下以夾持單元41、50夾持與應分割之分割預定線206-1相鄰之區域的工件201的元件207之步驟。 (Clamping step) Fig. 13 is a side view schematically illustrating the clamping step of the fracture method shown in Fig. 10 with a partial cross-section. The clamping step 1004 is a step of clamping the components 207 of the workpiece 201 in the area adjacent to the planned dividing line 206-1 to be divided by the clamping units 41 and 50 from above and below the workpiece unit 200 after the detection step 1003 is performed.

在實施方式一中,在夾持步驟1004中,斷裂裝置1的控制單元100的動作控制部101控制旋轉機構,而將與分割預定線206對應之長度的矩形狀夾持構件44配置成從旋轉體43朝上,並控制旋轉驅動機構,而將工件201的分割預定線206-1定位成與Y軸方向平行。在實施方式一中,在夾持步驟1004中,斷裂裝置1的控制單元100的動作控制部101控制X軸移動單元30,而將上側夾持構件52的下端定位於與分割預定線206-1在圖1中X軸方向的裡側相鄰之元件207(相當於區域,以下,記為圖13所示之符號207-1)的上方,並將矩形狀夾持構件44的上端定位於與分割預定線206-1在圖1中X軸方向的裡側相鄰之元件207-1的下方,且將推壓構件60的下端定位於與分割預定線206-1在圖1中X軸方向的前側相鄰之元件207(相當於區域,以下,記為圖13所示之符號207-2)的上方。In the first embodiment, in the clamping step 1004, the operation control unit 101 of the control unit 100 of the fracture device 1 controls the rotation mechanism to arrange the rectangular clamping member 44 with a length corresponding to the planned dividing line 206 from the rotation The body 43 is directed upward, and the rotation drive mechanism is controlled to position the planned dividing line 206-1 of the workpiece 201 parallel to the Y-axis direction. In the first embodiment, in the clamping step 1004, the operation control unit 101 of the control unit 100 of the fracture device 1 controls the X-axis moving unit 30 to position the lower end of the upper clamping member 52 in line with the planned division line 206-1 The upper end of the rectangular clamping member 44 is positioned above the adjacent component 207 (corresponding to the area, hereinafter referred to as the symbol 207-1 shown in FIG. 13) on the inner side in the X-axis direction in FIG. The planned division line 206-1 is below the element 207-1 adjacent to the inner side in the X-axis direction in Fig. 1, and the lower end of the pressing member 60 is positioned in line with the planned division line 206-1 in the X-axis direction in Fig. 1 above the adjacent component 207 (corresponding to the area, hereafter, denoted by the symbol 207-2 shown in FIG. 13) adjacent to the front side.

在實施方式一中,在夾持步驟1004中,斷裂裝置1的控制單元100的動作控制部101控制Z軸移動單元34,而使旋轉體43及矩形狀夾持構件44上升,透過薄片202使與工件201的分割預定線206-1相鄰之元件207-1往上方推壓,而如圖13所示,透過未圖示之保護構件將工件201的與分割預定線206-1相鄰之元件207-1夾持於夾持構件44、52之間。此時,在實施方式一中,推壓構件60的下端位於比工件201的正面205更上方。在夾持步驟1004後,前進至分割步驟1005及負載檢測步驟1006。In the first embodiment, in the clamping step 1004, the operation control unit 101 of the control unit 100 of the fracture device 1 controls the Z-axis moving unit 34 to raise the rotating body 43 and the rectangular clamping member 44, and move the rotating body 43 through the sheet 202. The element 207-1 adjacent to the planned dividing line 206-1 of the workpiece 201 is pushed upward, and as shown in FIG. 13, the element 207-1 adjacent to the planned dividing line 206-1 of the workpiece 201 is protected through a protective member (not shown). Component 207-1 is clamped between clamping members 44, 52. At this time, in the first embodiment, the lower end of the pressing member 60 is located above the front surface 205 of the workpiece 201 . After the clamping step 1004, the process proceeds to the dividing step 1005 and the load detection step 1006.

(分割步驟及負載檢測步驟) 圖14係以局部剖面示意性地表示圖10所示之斷裂方法的分割步驟及負載檢測步驟之側視圖。分割步驟1005係在實施夾持步驟1004之後,夾著應分割之分割預定線206而在夾持單元41、50的相反側以推壓構件60推壓與應分割之分割預定線206相鄰之區域的工件201的元件207-2,而沿著應分割之分割預定線206使工件201斷裂之步驟。負載檢測步驟1006係在分割步驟1005的實施期間檢測推壓構件60推壓工件201之負載值之步驟。 (Separation step and load detection step) FIG. 14 is a side view schematically showing the separation step and load detection step of the fracture method shown in FIG. 10 in partial section. The separation step 1005 is a step of breaking the workpiece 201 along the predetermined separation line 206 to be separated by clamping the predetermined separation line 206 to be separated and pushing the element 207-2 of the workpiece 201 adjacent to the predetermined separation line 206 to be separated with the pushing member 60 on the opposite side of the clamping units 41 and 50 after the clamping step 1004. The load detection step 1006 is a step for detecting the load value of the pushing member 60 pushing the workpiece 201 during the implementation of the segmentation step 1005.

在實施方式一中,在分割步驟1005中,基於分割條件,斷裂裝置1的控制單元100的動作控制部101控制升降單元36,而使上側夾持單元50的移動基台5及推壓構件60下降。如此一來,因上側夾持構件52係在與矩形狀夾持構件44之間透過未圖示之保護構件而夾持工件201的與分割預定線206-1相鄰之元件207-1,故上側夾持構件52不會下降,汽缸單元51的桿體55會縮小,上側夾持構件52係藉由滑動單元53而相對於移動基台5相對地上升。In the first embodiment, in the dividing step 1005, based on the dividing conditions, the operation control unit 101 of the control unit 100 of the fracture device 1 controls the lifting unit 36 so that the moving base 5 and the pressing member 60 of the upper clamping unit 50 decline. In this way, the upper clamping member 52 clamps the component 207-1 of the workpiece 201 adjacent to the planned division line 206-1 between the upper clamping member 52 and the rectangular clamping member 44 through a protective member (not shown). The upper clamping member 52 does not lower, the rod 55 of the cylinder unit 51 shrinks, and the upper clamping member 52 rises relative to the moving base 5 by the sliding unit 53 .

並且,若上側夾持單元50的移動基台5及推壓構件60下降,則推壓構件60會下降,推壓構件60的下端係透過未圖示之保護構件而抵接於工件201的正面205的夾持單元41、50的相反側的與分割預定線206-1相鄰之元件207-2,且推壓構件60進一步下降,而如圖14所示,推壓構件60的下端位於比上側夾持構件52的下端更下方,將夾持構件44、52與推壓構件60之間的分割預定線206-1進行分割。在實施方式一中,在分割步驟1005中,斷裂裝置1的控制單元100的動作控制部101如同分割條件般將移動基台5及推壓構件60下降之後,控制升降單元36而使移動基台5及推壓構件60上升,且控制Z軸移動單元34而使旋轉體43及矩形狀夾持構件44下降。Furthermore, if the moving base 5 and the pressing member 60 of the upper clamping unit 50 move down, the pressing member 60 will move down, and the lower end of the pressing member 60 will contact the front surface of the workpiece 201 through a protective member (not shown). The component 207-2 adjacent to the planned division line 206-1 on the opposite side of the clamping units 41 and 50 of 205, and the pressing member 60 further descends, and as shown in Figure 14, the lower end of the pressing member 60 is located at The lower end of the upper clamping member 52 is further downward and divides the planned division line 206 - 1 between the clamping members 44 and 52 and the pressing member 60 . In Embodiment 1, in the dividing step 1005, the operation control unit 101 of the control unit 100 of the fracture device 1 lowers the moving base 5 and the pressing member 60 in accordance with the dividing conditions, and then controls the lifting unit 36 to move the moving base. 5 and the pressing member 60 rise, and the Z-axis moving unit 34 is controlled to lower the rotating body 43 and the rectangular clamping member 44.

並且,在實施方式一中,在分割步驟1005的實施期間的負載檢測步驟1006中,若推壓構件60的下端透過保護構件而抵接於工件201的正面205的夾持單元41、50的相反側的與分割預定線206-1相鄰之元件207-2,則負載計71的測量結果亦即負載值會從零上升。在實施方式一中,在分割步驟1005的實施期間的負載檢測步驟1006中,若推壓構件60將分割預定線206-1進行分割,則負載計71的測量結果亦即負載值會從最大值300下降。在實施方式一中,在分割步驟1005的實施期間的負載檢測步驟1006中,斷裂裝置1的控制單元100的動作控制部101將負載計71的測量結果亦即負載值與經過時間及分割預定線206-1相關連並暫時記憶於記憶部103。Furthermore, in the first embodiment, in the load detection step 1006 during the implementation of the splitting step 1005, if the lower end of the pressing member 60 abuts against the element 207-2 adjacent to the predetermined splitting line 206-1 on the opposite side of the clamping units 41, 50 of the front surface 205 of the workpiece 201 through the protective member, the measurement result of the load meter 71, that is, the load value, will increase from zero. In the first embodiment, in the load detection step 1006 during the implementation of the splitting step 1005, if the pressing member 60 splits the predetermined splitting line 206-1, the measurement result of the load meter 71, that is, the load value, will decrease from the maximum value of 300. In the first embodiment, in the load detection step 1006 during the implementation of the segmentation step 1005, the action control unit 101 of the control unit 100 of the rupture device 1 associates the measurement result of the load meter 71, i.e., the load value, with the elapsed time and the segmentation predetermined line 206-1 and temporarily stores it in the memory unit 103.

(判斷步驟) 判斷步驟1007係基於由負載檢測步驟1006所檢測到之負載值而判斷工件201是否已沿著應分割之分割預定線206-1被分割的分割結果之步驟。 (Judgment step) Judgment step 1007 is a step for judging whether the workpiece 201 has been divided along the predetermined dividing line 206-1 to be divided based on the load value detected by the load detection step 1006.

在實施方式一中,在判斷步驟1007中,斷裂裝置1的控制單元100的判斷部102計算暫時記憶於記憶部103之隨著經過時間而變化之負載值的最大值300。在計算最大值300之際,控制單元100的判斷部102以時間將隨著經過時間而變化之負載值進行微分,並將進行此微分所求得之值亦即負載值的變化量為最大的時間的負載值計算為最大值300。並且,在本發明中,控制單元100的動作控制部101亦可將負載值從上升轉成下降之時間的負載值計算為最大值300。In the first embodiment, in the judgment step 1007, the judgment unit 102 of the control unit 100 of the fracture device 1 calculates the maximum value 300 of the load value that changes with the elapsed time and is temporarily stored in the memory unit 103. When calculating the maximum value 300, the determination unit 102 of the control unit 100 differentiates the load value that changes with the elapsed time using time, and determines the value obtained by performing the differentiation, that is, the change amount of the load value to be the maximum. The load value for time is calculated to a maximum value of 300. Furthermore, in the present invention, the operation control unit 101 of the control unit 100 may calculate the load value at the time when the load value changes from rising to falling as the maximum value 300.

在實施方式一中,在判斷步驟1007中,斷裂裝置1的控制單元100的判斷部102判斷從最大值300經過預定時間400後的負載值為以下何者:小於第一預定值301;第一預定值301以上且小於第二預定值302;或第二預定值302以上。在實施方式一中,在判斷步驟1007中,若從最大值300經過預定時間400後的負載值小於第一預定值301,則斷裂裝置1的控制單元100的判斷部102判斷分割預定線206的分割結果為完全分割。In the first embodiment, in the judgment step 1007, the judgment unit 102 of the control unit 100 of the fracture device 1 judges that the load value after a predetermined time 400 elapses from the maximum value 300 is which of the following: less than the first predetermined value 301; The value is above 301 and less than the second predetermined value 302; or above the second predetermined value 302. In the first embodiment, in the judgment step 1007, if the load value after the predetermined time 400 elapses from the maximum value 300 is less than the first predetermined value 301, the judgment part 102 of the control unit 100 of the fracture device 1 judges whether the planned division line 206 is The segmentation result is complete segmentation.

在實施方式一中,在判斷步驟1007中,若從最大值300經過預定時間400後的負載值為第一預定值301以上且小於第二預定值302,則斷裂裝置1的控制單元100的判斷部102判斷分割預定線206的分割結果為不完全分割。在實施方式一中,在判斷步驟1007中,若從最大值300經過預定時間400後的負載值為第二預定值302以上,則斷裂裝置1的控制單元100的判斷部102判斷分割預定線206的分割結果為未分割。在實施方式一中,在判斷步驟1007中,斷裂裝置1將控制單元100的判斷部102所判斷之分割結果與分割預定線206相關連並記憶於記憶部103。In the first embodiment, in the determination step 1007, if the load value after the predetermined time 400 from the maximum value 300 is greater than the first predetermined value 301 and less than the second predetermined value 302, the determination unit 102 of the control unit 100 of the rupture device 1 determines that the segmentation result of the predetermined segmentation line 206 is incomplete segmentation. In the first embodiment, in the determination step 1007, if the load value after the predetermined time 400 from the maximum value 300 is greater than the second predetermined value 302, the determination unit 102 of the control unit 100 of the rupture device 1 determines that the segmentation result of the predetermined segmentation line 206 is not segmented. In the first embodiment, in the determination step 1007, the breaking device 1 associates the segmentation result determined by the determination unit 102 of the control unit 100 with the predetermined segmentation line 206 and stores the result in the storage unit 103.

之後,控制單元100的動作控制部101基於分割條件而判斷全部的分割預定線206的分割動作是否已完成(步驟1008)。若控制單元100的動作控制部101判斷全部的分割預定線206的分割動作未完成(步驟1008:否),則返回檢測步驟1003,並基於分割條件而接著實施對於應分割之分割預定線206之分割動作亦即檢測步驟1003、夾持步驟1004、分割步驟1005及負載檢測步驟1006。此外,在實施方式一中,斷裂裝置1從工件201的分割預定線206之中的端部的分割預定線206起依序實施分割動作。若控制單元100的動作控制部101判斷全部的分割預定線206的分割動作已完成(步驟1008:是),則斷裂裝置1結束分割動作。Thereafter, the operation control unit 101 of the control unit 100 determines whether the dividing operations of all planned dividing lines 206 have been completed based on the dividing conditions (step 1008 ). If the operation control unit 101 of the control unit 100 determines that the dividing operations of all the planned dividing lines 206 have not been completed (step 1008: No), it returns to the detection step 1003, and based on the dividing conditions, continues to perform the division of the planned dividing lines 206 that should be divided. The dividing operations are the detection step 1003, the clamping step 1004, the dividing step 1005 and the load detection step 1006. Furthermore, in Embodiment 1, the breaking device 1 sequentially performs the dividing operation starting from the planned dividing line 206 at the end of the planned dividing lines 206 of the workpiece 201 . If the operation control unit 101 of the control unit 100 determines that the dividing operations of all planned dividing lines 206 have been completed (step 1008: Yes), the breaking device 1 ends the dividing operations.

此外,在實施方式一中,在分割動作期間,若分割預定線206之中互相平行的一方向的全部的分割預定線206的分割動作結束,則將框架固定構件12繞著軸心旋轉90度,實施分割預定線206之中互相平行的另一方向的分割預定線206的分割動作。此時,在對另一方向的分割預定線206實施分割動作之際,因一方向的分割預定線206被分割,故容易產生成為不完全分割之分割預定線206。因此,在實施方式一中,斷裂裝置1較佳為對被判斷為未分割或不完全分割之分割預定線206再度實施分割動作。In addition, in the first embodiment, during the splitting operation, if the splitting operation of all the splitting predetermined lines 206 in one direction parallel to each other among the splitting predetermined lines 206 is completed, the frame fixing member 12 is rotated 90 degrees around the axis to perform the splitting operation of the splitting predetermined lines 206 in another direction parallel to each other among the splitting predetermined lines 206. At this time, when the splitting operation is performed on the splitting predetermined lines 206 in the other direction, the splitting predetermined lines 206 in one direction are split, so that the splitting predetermined lines 206 that are not completely split are easily generated. Therefore, in the first embodiment, the breaking device 1 preferably performs the splitting operation again on the splitting predetermined lines 206 that are judged to be unsplit or incompletely split.

並且,在實施方式一中,在分割動作期間,斷裂裝置1的顯示單元110可將圖15所示之分割狀況顯示資訊500顯示於顯示畫面111。此外,圖15係示意性地表示圖1所示之斷裂裝置的顯示單元在顯示畫面顯示之分割狀況顯示資訊的一例之圖。Moreover, in the first embodiment, during the dividing operation, the display unit 110 of the breaking device 1 can display the dividing status display information 500 shown in FIG. 15 on the display screen 111. In addition, FIG. 15 is a diagram schematically showing an example of division status display information displayed on the display screen by the display unit of the breaking device shown in FIG. 1 .

在實施方式一中,分割狀況顯示資訊500係藉由按下設定於顯示畫面111的下部之選單區域501的多個操作區域502之中任意一個操作區域502而被顯示於顯示畫面111。在實施方式一中,分割狀況顯示資訊500設定有晶圓整體圖顯示區域510與分割結果顯示區域520。In the first embodiment, the division status display information 500 is displayed on the display screen 111 by pressing any one of the plurality of operation areas 502 set in the menu area 501 at the lower part of the display screen 111 . In the first embodiment, the division status display information 500 is configured with a wafer overall image display area 510 and a division result display area 520.

晶圓整體圖顯示區域510顯示藉由控制單元100的動作控制部101所產生之晶圓整體圖511。晶圓整體圖511顯示控制單元100的動作控制部101基於分割條件所產生之工件201的外形與工件201的各分割預定線206的位置的各分割預定線206的分割結果。此外,圖15例如以虛線所示之白色表示分割動作未實施的分割預定線206,例如以實線所示之藍色表示分割結果為完全分割之分割預定線206,例如以一點鏈線所示之黃色表示分割結果為不完全分割之分割預定線206,例如以兩點鏈線所示之紅色表示分割結果為未分割之分割預定線206。The overall wafer image display area 510 displays the overall wafer image 511 generated by the operation control unit 101 of the control unit 100 . The overall wafer diagram 511 shows the segmentation results of the planned segmentation lines 206 of the workpiece 201 and the positions of the planned segmentation lines 206 of the workpiece 201 based on the operation control unit 101 of the control unit 100 based on the segmentation conditions. In addition, in FIG. 15 , the planned division line 206 for which the division operation has not been performed is shown as a dotted white line, for example, and the planned division line 206 for which the division result is a complete division is shown as a solid line, for example, as a dotted chain line. The yellow color indicates that the segmentation result is the planned segmentation line 206 that is incompletely segmented. For example, the red color shown by the two-dot chain line indicates that the segmentation result is the scheduled segmentation line 206 that is not segmented.

分割結果顯示區域520設定有:測量結果顯示區域521,其表示負載計71的測量結果;第一最大值顯示區域522,其以柱狀圖表示最近實施分割動作之多條分割預定線206的最大值300;負載值顯示區域523,其表示最近實施分割動作之多條分割預定線206的負載值的變化;以及第二最大值顯示區域524,其表示最近實施分割動作之一條分割預定線206的最大值300。如此,顯示單元110係藉由顯示分割狀況顯示資訊500,而顯示包含各分割預定線206之晶圓整體圖511,且顯示對於各分割預定線206之分割結果。The segmentation result display area 520 is provided with: a measurement result display area 521, which shows the measurement result of the load meter 71; a first maximum value display area 522, which shows the maximum value 300 of the plurality of segmentation scheduled lines 206 that have been recently segmented in a bar graph; a load value display area 523, which shows the change of the load value of the plurality of segmentation scheduled lines 206 that have been recently segmented; and a second maximum value display area 524, which shows the maximum value 300 of one segmentation scheduled line 206 that has been recently segmented. In this way, the display unit 110 displays the wafer overall image 511 including each segmentation scheduled line 206 by displaying the segmentation status display information 500, and displays the segmentation result for each segmentation scheduled line 206.

並且,若在暫時停止期間、分割動作完成後的未實施分割動作之狀態下按下顯示單元110的晶圓整體圖511上的任意的位置,則實施方式一之斷裂裝置1的控制單元100的動作控制部101控制X軸移動單元30及Y軸移動單元32,而將檢測單元20定位於工件201的所按下之位置的上方。斷裂裝置1的控制單元100的動作控制部101以檢測單元20的攝像攝影機21拍攝工件201的所按下之位置,而取得圖16中表示一例之圖像600。實施方式一之斷裂裝置1係藉由按下選單區域501的操作區域502等,而在顯示單元110的顯示畫面111顯示拍攝工件201的所按下之位置所取得之圖像600。Furthermore, if any position on the wafer overall view 511 of the display unit 110 is pressed during the temporary stop period or in a state where the dividing operation is not performed after the dividing operation is completed, the control unit 100 of the breaking device 1 of the first embodiment will The operation control unit 101 controls the X-axis movement unit 30 and the Y-axis movement unit 32 to position the detection unit 20 above the pressed position of the workpiece 201 . The operation control unit 101 of the control unit 100 of the fracture device 1 captures the pressed position of the workpiece 201 with the camera 21 of the detection unit 20, and obtains an image 600 shown in FIG. 16 as an example. The fracture device 1 of the first embodiment displays the image 600 obtained by photographing the pressed position of the workpiece 201 on the display screen 111 of the display unit 110 by pressing the operation area 502 of the menu area 501 or the like.

此外,圖16係示意性地表示圖1所示之斷裂裝置的顯示單元在顯示畫面顯示之攝像攝影機所拍攝到之工件的正面的一部分之圖。此外,圖16所示之圖像600包含形成於分割預定線206之分割工件201而成之槽211。如此,斷裂裝置1係在將框架203已被框架固定單元10固定之工件單元200的晶圓整體圖511顯示於顯示單元110之狀態下,將攝像攝影機21定位於與顯示於顯示單元110之晶圓整體圖511上所指定之分割預定線206對應之工件單元200的分割預定線206,並拍攝分割預定線206。In addition, FIG. 16 is a diagram schematically showing a part of the front side of the workpiece captured by the camera on the display screen of the display unit of the breaking device shown in FIG. 1 . In addition, the image 600 shown in FIG. 16 includes the groove 211 formed by dividing the workpiece 201 along the planned dividing line 206. In this way, the breaking device 1 displays the overall wafer view 511 of the workpiece unit 200 with the frame 203 fixed by the frame fixing unit 10 on the display unit 110, and positions the camera 21 to the wafer displayed on the display unit 110. The planned dividing line 206 of the workpiece unit 200 corresponds to the planned dividing line 206 specified on the circular overall diagram 511, and the planned dividing line 206 is photographed.

以上說明之實施方式一之斷裂裝置1及斷裂方法具備:負載計71,其測量推壓構件60推壓工件201之負載;以及判斷部102,其基於以負載計71所測量到之負載值而判斷工件201是否已沿著應分割之分割預定線206-1被分割的分割結果,因此發揮下述功效:可抑制確認工件201是否已被分割之操作員的作業時間。The breaking device 1 and breaking method of the first embodiment described above include: a load meter 71, which measures the load of the pushing member 60 pushing the workpiece 201; and a judgment unit 102, which judges whether the workpiece 201 has been split along the predetermined splitting line 206-1 to be split based on the load value measured by the load meter 71, thereby achieving the following effect: the operation time of the operator who confirms whether the workpiece 201 has been split can be reduced.

並且,實施方式一之斷裂裝置1及斷裂方法中,控制單元100的判斷部102係在負載計71的測量結果亦即負載值上升後並轉為下降之後,基於在預定時間400中之負載值的降低的狀態而判斷分割結果,因此可正確地判斷工件201的分割結果。Furthermore, in the breaking device 1 and the breaking method of the first embodiment, the judgment section 102 of the control unit 100 judges the segmentation result based on the decreasing state of the load value within a predetermined time 400 after the measurement result of the load meter 71, i.e., the load value, increases and then decreases, thereby being able to correctly judge the segmentation result of the workpiece 201.

並且,實施方式一之斷裂裝置1及斷裂方法中,控制單元100的判斷部102係基於以負載計71所測量到之負載值,對工件201的全部的分割預定線206,判斷分割結果為未分割、完全分割或不完全分割,並進行記憶,因此可掌握各分割預定線206的分割結果。Furthermore, in the breaking device 1 and the breaking method of the first embodiment, the judgment section 102 of the control unit 100 judges the segmentation results of all the predetermined segmentation lines 206 of the workpiece 201 as unsegmented, completely segmented or incompletely segmented based on the load value measured by the load meter 71, and memorizes them, so that the segmentation results of each predetermined segmentation line 206 can be grasped.

並且,實施方式一之斷裂裝置1及斷裂方法中,顯示單元110顯示晶圓整體圖511,所述晶圓整體圖511顯示各分割預定線206的分割結果,因此操作員可容易地掌握各分割預定線206的分割結果。Furthermore, in the rupture device 1 and the rupture method of the first embodiment, the display unit 110 displays the overall wafer diagram 511 which displays the division results of each planned division line 206, so the operator can easily grasp each division. The segmentation result of the predetermined line 206.

並且,實施方式一之斷裂裝置1及斷裂方法中,在將晶圓整體圖511顯示於顯示單元110之狀態下,攝像攝影機21拍攝顯示於顯示單元110之晶圓整體圖511上所指定之分割預定線206,因此操作員可掌握任意的位置的分割預定線206的分割結果。Furthermore, in the rupture device 1 and the rupture method of the first embodiment, while the overall wafer diagram 511 is displayed on the display unit 110, the camera 21 captures the specified divisions on the overall wafer diagram 511 displayed on the display unit 110. The operator can grasp the dividing result of the planned dividing line 206 at any position.

此外,本發明並不受限於上述實施方式。亦即,在不脫離本發明的主旨之範圍內,可進行各種變形並實施。例如,在本發明中,亦可將工件201的正面205黏貼於薄片202。此情形,斷裂裝置1較佳為將檢測單元20配置於比框架203被框架固定單元10固定之工件單元200更下方。In addition, the present invention is not limited to the above-described embodiment. That is, various modifications can be made and implemented without departing from the gist of the present invention. For example, in the present invention, the front surface 205 of the workpiece 201 can also be pasted on the sheet 202 . In this case, the breaking device 1 preferably disposes the detection unit 20 below the workpiece unit 200 where the frame 203 is fixed by the frame fixing unit 10 .

1:斷裂裝置 10:框架固定單元 20:檢測單元 21:攝像攝影機 40:夾持單元 60:推壓構件 71:負載計 100:控制單元(控制器) 102:判斷部 103:記憶部 110:顯示單元 200:工件單元 201:工件 202:薄片 203:框架 206:分割預定線 206-1:應分割之分割預定線 207:元件 207-1:元件(區域) 207-2:元件(區域) 208:分割起點 400:預定時間 511:晶圓整體圖 1001:工件單元形成步驟 1002:框架固定步驟 1003:檢測步驟 1004:夾持步驟 1005:分割步驟 1006:負載檢測步驟 1007:判斷步驟 1:Breaking device 10: Frame fixing unit 20:Detection unit 21:Camera 40: Clamping unit 60:Push member 71:Load meter 100: Control unit (controller) 102:Judgement Department 103:Memory Department 110:Display unit 200: Workpiece unit 201:Artifact 202:Thin slices 203:Frame 206: Split scheduled line 206-1: The planned division line that should be divided 207:Component 207-1:Component (area) 207-2:Component (area) 208: Split starting point 400: Scheduled time 511: Overall picture of wafer 1001: Workpiece unit formation steps 1002: Frame fixing steps 1003:Detection steps 1004: Clamping step 1005: Segmentation step 1006: Load detection step 1007: Judgment steps

圖1係示意性地表示實施方式一之斷裂裝置的構成例之立體圖。 圖2係示意性地表示具備實施方式一之斷裂裝置的分割對象的工件之工件單元之立體圖。 圖3係示意性地表示圖1所示之斷裂裝置的夾持單元的下側夾持單元的構成之立體圖。 圖4係以局部剖面示意性地表示圖1所示之斷裂裝置的夾持單元的上側夾持單元的構成之側視圖。 圖5係以局部剖面示意性地表示圖1所示之斷裂裝置的推壓構件之側視圖。 圖6係以局部剖面示意性地表示從圖5所示之箭頭VI方向觀看之負載量測部之前視圖。 圖7係表示圖6所示之負載量測部的負載計的測量結果的一例之圖。 圖8係表示圖6所示之負載量測部的負載計的測量結果的另一例之圖。 圖9係表示圖6所示之負載量測部的負載計的測量結果的再另一例之圖。 圖10係表示實施方式一之斷裂方法的流程之流程圖。 圖11係以局部剖面示意性地表示圖10所示之斷裂方法的框架固定步驟後的斷裂裝置的主要部分之側視圖。 圖12係以局部剖面示意性地表示圖10所示之斷裂方法的檢測步驟之側視圖。 圖13係以局部剖面示意性地表示圖10所示之斷裂方法的夾持步驟之側視圖。 圖14係以局部剖面示意性地表示圖10所示之斷裂方法的分割步驟及負載檢測步驟之側視圖。 圖15係示意性地表示圖1所示之斷裂裝置的顯示單元在顯示畫面顯示之分割狀況顯示資訊的一例之圖。 圖16係示意性地表示圖1所示之斷裂裝置的顯示單元在顯示畫面顯示之攝像攝影機所拍攝之工件的正面的一部分之圖。 FIG. 1 is a perspective view schematically showing a structural example of a breaking device according to Embodiment 1. FIG. 2 is a perspective view schematically showing a workpiece unit including a workpiece to be divided by the breaking device according to the first embodiment. FIG. 3 is a perspective view schematically showing the structure of a lower clamping unit of the clamping unit of the breaking device shown in FIG. 1 . FIG. 4 is a side view schematically showing, in partial cross-section, the structure of an upper clamping unit of the clamping unit of the breaking device shown in FIG. 1 . FIG. 5 is a side view schematically showing a pressing member of the breaking device shown in FIG. 1 with a partial cross-section. FIG. 6 is a partial cross-section schematically showing a front view of the load measuring unit viewed from the direction of arrow VI shown in FIG. 5 . FIG. 7 is a diagram showing an example of measurement results of the load meter of the load measuring unit shown in FIG. 6 . FIG. 8 is a diagram showing another example of measurement results of the load meter of the load measuring unit shown in FIG. 6 . FIG. 9 is a diagram showing still another example of the measurement results of the load meter of the load measuring unit shown in FIG. 6 . FIG. 10 is a flowchart showing the flow of the breaking method according to the first embodiment. FIG. 11 is a side view schematically showing, in partial cross-section, the main part of the breaking device after the frame fixing step of the breaking method shown in FIG. 10 . FIG. 12 is a side view schematically showing, in partial cross-section, the detection steps of the fracture method shown in FIG. 10 . Fig. 13 is a side view schematically illustrating the clamping step of the fracture method shown in Fig. 10 with a partial cross-section. FIG. 14 is a side view schematically showing, in partial cross-section, the dividing step and the load detection step of the fracture method shown in FIG. 10 . FIG. 15 is a diagram schematically showing an example of division status display information displayed on the display screen by the display unit of the breaking device shown in FIG. 1 . FIG. 16 is a diagram schematically showing a part of the front side of the workpiece captured by the camera on the display screen of the display unit of the breaking device shown in FIG. 1 .

60:推壓構件 60: Pushing component

61:第二X軸移動單元 61: Second X-axis moving unit

63:厚壁部 63: Thick wall part

64:薄壁部 64: Thin wall part

65:開口 65:Open your mouth

66:馬達 66: Motor

67:導軌 67: Guide rail

68:尖端部 68: Tip

70:負載測量部 70:Load measurement department

71:負載計 71: Load meter

72:保持構件 72:Keep components

73:支撐構件 73: Supporting components

75:彈簧 75: Spring

VI:箭頭 VI:arrow

Claims (6)

一種斷裂裝置,其具備:框架固定單元,其將由工件、已黏貼該工件之薄片及已黏貼該薄片的外周之框架所構成之工件單元的該框架進行固定,該工件設定有多條分割預定線且沿著各該分割預定線形成有分割起點;檢測單元,其檢測該框架已被該框架固定單元固定之該工件單元的該分割預定線;夾持單元,其從該工件單元的上下夾持與應分割之分割預定線相鄰之區域的該工件;以及推壓構件,其夾著該應分割之分割預定線並在該夾持單元的相反側推壓與該應分割之分割預定線相鄰之區域的該工件而沿著該應分割之分割預定線使該工件斷裂, 該斷裂裝置具備: 負載計,其測量該推壓構件推壓該工件之負載;以及 控制器,其基於以該負載計所測量到之負載值而判斷該工件是否已沿著該應分割之分割預定線被分割的分割結果。 A breaking device, which is provided with: a frame fixing unit, which fixes the frame of the workpiece unit composed of a workpiece, a sheet to which the workpiece has been pasted, and a frame to which the outer periphery of the sheet has been pasted, and the workpiece is set with a plurality of scheduled division lines And a starting point for dividing is formed along each planned dividing line; a detection unit that detects the planned dividing line of the workpiece unit in which the frame has been fixed by the frame fixing unit; and a clamping unit that clamps the workpiece unit from above and below the workpiece in an area adjacent to the planned dividing line that should be divided; and a pressing member that clamps the planned dividing line that should be divided and presses the workpiece on the opposite side of the clamping unit to the planned dividing line that should be divided The workpiece in the adjacent area is broken along the planned dividing line that should be divided, The breaking device has: A load meter that measures the load of the pushing member pushing the workpiece; and A controller determines the segmentation result of whether the workpiece has been segmented along the scheduled segmentation line that should be segmented based on the load value measured by the load meter. 如請求項1之斷裂裝置,其中,該控制器係在該負載值上升後並轉成下降之後,基於在預定時間中之該負載值的降低的狀態而判斷該分割結果。A rupture device as claimed in claim 1, wherein the controller determines the segmentation result based on a decreasing state of the load value within a predetermined time after the load value increases and then turns to decrease. 如請求項1之斷裂裝置,其中,該控制器基於以該負載計所測量到之該負載值,對該工件的全部的該分割預定線,判斷該分割結果為未被分割、已被分割或有可能一部分未被分割,並進行記憶。As in claim 1, the controller determines the segmentation result as unsegmented, segmented, or possibly partially unsegmented for all the predetermined segmentation lines of the workpiece based on the load value measured by the load meter, and stores the result. 如請求項1至3中任一項之斷裂裝置,其中,具備顯示單元, 該顯示單元顯示包含各該分割預定線之晶圓整體圖,且顯示對於各該分割預定線之該分割結果。 A breaking device as in any one of claims 1 to 3, wherein a display unit is provided, The display unit displays an overall image of the wafer including each of the predetermined splitting lines, and displays the splitting result for each of the predetermined splitting lines. 如請求項4之斷裂裝置,其中,該檢測單元包含攝像攝影機, 在將該框架已被該框架固定單元固定之該工件單元的該晶圓整體圖顯示於該顯示單元之狀態下,將該攝像攝影機定位於與顯示於該顯示單元之該晶圓整體圖上所指定之分割預定線對應之該工件單元的該分割預定線,而拍攝該分割預定線。 As in claim 4, the detection unit includes a camera, and when the overall wafer image of the workpiece unit fixed by the frame fixing unit is displayed on the display unit, the camera is positioned at the predetermined splitting line of the workpiece unit corresponding to the predetermined splitting line specified on the overall wafer image displayed on the display unit, and the predetermined splitting line is photographed. 一種斷裂方法,其具備: 工件單元形成步驟,其形成由工件、已黏貼該工件之薄片及已黏貼該薄片的外周之框架所構成之工件單元,該工件沿著分割預定線而形成有分割起點; 框架固定步驟,其以框架固定單元固定該工件單元的該框架; 檢測步驟,其從該框架已被該框架固定單元固定之該工件單元檢測應分割之分割預定線; 夾持步驟,其在實施該檢測步驟之後,從該工件單元的上下以夾持單元夾持與該應分割之分割預定線相鄰之區域的該工件; 分割步驟,其在實施該夾持步驟之後,夾著該應分割之分割預定線並在該夾持單元的相反側以推壓構件推壓與該應分割之分割預定線相鄰之區域的該工件而沿著該應分割之分割預定線使該工件斷裂; 負載檢測步驟,其在該分割步驟的實施期間檢測該推壓構件推壓該工件之負載值;以及 判斷步驟,其基於以該負載檢測步驟所檢測到之該負載值而判斷該工件是否已沿著該應分割之分割預定線被分割的分割結果。 A fracture method that has: A workpiece unit forming step, which forms a workpiece unit composed of a workpiece, a sheet to which the workpiece has been pasted, and an outer peripheral frame to which the sheet has been pasted, and the workpiece is formed with a starting point for segmentation along a planned segmentation line; a frame fixing step, which uses a frame fixing unit to fix the frame of the workpiece unit; a detection step that detects the planned division line that should be divided from the workpiece unit that the frame has been fixed by the frame fixing unit; A clamping step, which after performing the detection step, uses clamping units from above and below the workpiece unit to clamp the workpiece in the area adjacent to the planned division line to be divided; The dividing step includes, after performing the clamping step, sandwiching the planned dividing line to be divided and pressing the area adjacent to the planned dividing line to be divided with a pressing member on the opposite side of the clamping unit The workpiece is broken along the planned dividing line that should be divided; a load detection step that detects the load value of the pressing member pressing the workpiece during the implementation of the dividing step; and A judging step, which judges the dividing result of whether the workpiece has been divided along the planned dividing line that should be divided based on the load value detected in the load detecting step.
TW112130568A 2022-08-19 2023-08-15 Breaking device and breaking method TW202410170A (en)

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