TW202408806A - Electronic parts packaging sheet - Google Patents

Abstract

The present invention provides an electronic component packaging sheet that can maintain good formability while effectively suppressing the generation of burrs and lint. An electronic component packaging sheet comprises: a substrate sheet formed by alternately stacking substrate layers A and B; the difference in thermal deformation temperature between the substrate layers A and B is higher than 0°C and lower than 23°C; the thickness of each layer of the substrate layer A is 10-60 μm; the thickness of each layer of the substrate layer B is 1-50 μm; the average value of the thickness of each layer of the substrate layer A exceeds the average value of the thickness of each layer of the substrate layer B; the substrate layer A and the substrate layer B contain different thermoplastic resins as main components.

Description

Electronic parts packaging sheet

The present invention relates to a sheet for packaging electronic components.

Semiconductors, electronic parts, especially integrated circuits (ICs), electronic parts with ICs, etc. are packaged in trays (injection trays, vacuum formed trays, etc.), magazines, carriers (embossed carriers), etc. Thermoplastic resins used to form packaging containers for these electronic parts include polystyrene resins, ABS resins, polyvinyl chloride resins, polypropylene resins, polyester resins, polyphenylene ether resins, polycarbonate resins, etc. In addition, from the perspective of avoiding malfunction or damage to the IC due to static electricity, for example, there are proposals for providing a packaging container having a conductive layer made of a resin mixed with a conductive agent such as conductive carbon black on the surface of a base layer made of an ABS resin (Patent Documents 1, 2, etc.).

The above-mentioned packaging container is a sheet for packaging electronic parts. For example, the packaging sheet heated by hot air is attached to a mold and vacuumed to form the packaging sheet. The packaging sheet heated by contact heat is used to form the packaging container. It is formed by a known method such as clamping and pressing between a pair of molds. However, burrs and lint may sometimes be produced during its forming. If such burrs and lint fall off in the parts storage part (pocket) and adhere to the electronic parts, defects may occur in the electronic parts. In recent years, with the miniaturization of electronic components, there has been a stronger need to reduce defects caused by the adhesion of burrs and lint.

Furthermore, in recent years, due to development trends such as AI/IOT and automation in automobiles and communication equipment, the number of electronic components and semiconductors installed has increased, and the shapes of electronic components and semiconductors are also becoming complex and diversified. Therefore, there is a need for a sheet for electronic component packaging that has both the ability to reduce the generation of burrs and lint and the formability suitable for manufacturing packaging containers for components with complex and diverse shapes.

In response to this issue, some people have proposed to mix polyolefins, styrene-butadiene-styrene block copolymers or styrene-ethylene-butylene-styrene block copolymers in the base layer and the conductive layer (for example, patent documents 3, 4, etc.). However, the known methods are not ideal for suppressing burrs and lint. In addition, the method of suppressing the generation of burrs and lint by changing the resin composition sometimes reduces the formability of the sheet depending on its composition, making it difficult to form the bag into the desired shape.

Patent Document 1: Japanese Patent Application Laid-Open No. 9-174769 Patent Document 2: Japanese Patent Application Publication No. 2002-292805 Patent Document 3: International Publication No. 2006/030871 Patent Document 4: Japanese Patent Application Publication No. 2003-170547

Therefore, an object of the present invention is to provide an electronic component packaging sheet and an electronic component packaging sheet that can effectively suppress the generation of burrs and lint while maintaining good formability for manufacturing packaging containers suitable for components with complex and diversified shapes. A formed body made of the aforementioned sheet material.

In view of the above-mentioned problems, the inventors of this case have found through intensive research that if the electronic component packaging sheet is a substrate sheet having substrate layers A and B alternately stacked with different thermoplastic resins as main components, and the average value of the thickness of each layer of the aforementioned substrate layer A is set to be higher than the average value of the thickness of each layer of the aforementioned substrate layer B, and the difference in thermal deformation temperature between the substrate layer A and the substrate layer B is higher than 0°C and lower than 23°C, all the above-mentioned problems can be solved, and the present invention can be completed. That is, the present invention has the following aspects. [1] An electronic component packaging sheet, comprising: a substrate sheet formed by alternately stacking substrate layers A and B; The difference in thermal deformation temperature between substrate layers A and B is higher than 0°C and lower than 23°C; The thickness of each layer of the substrate layer A is 10-60 μm; the thickness of each layer of the substrate layer B is 1-50 μm; the average value of the thickness of each layer of the substrate layer A exceeds the average value of the thickness of each layer of the substrate layer B; The substrate layer A and the substrate layer B contain different thermoplastic resins as main components. [2] An electronic component packaging sheet as described in [1], wherein the number of layers formed by alternately stacking substrate layers A and B is 3-9. [3] An electronic component packaging sheet as described in [1] or [2], wherein the adhesion strength between the substrate layer A and the substrate layer B is 4N/20mm or more. [4] An electronic component packaging sheet as described in any one of [1] to [3], wherein the average value of the thickness of each layer of the substrate layer A is 1.001 times or more the average value of the thickness of each layer of the substrate layer B. [5] An electronic component packaging sheet as described in any one of [1] to [4], wherein the substrate layer A contains an ABS resin as a main component. [6] An electronic component packaging sheet as described in any one of [1] to [5], wherein the substrate layer B contains a thermoplastic resin other than a PC resin as a main component. [7] A molded product comprising the electronic component packaging sheet as described in any one of [1] to [6]. [8] The shaped body as in [7] is a container. [9] The shaped body as in [7] is a carrier.

According to the present invention, it is possible to provide a sheet for packaging electronic parts that can effectively suppress the generation of burrs and lint while maintaining good formability suitable for manufacturing packaging containers suitable for parts with complex and diversified shapes, and a sheet containing the foregoing. Formed body made of materials.

The present invention will be described in detail below, but the present invention is not limited to the following aspects. [Sheet for electronic parts packaging] The sheet for packaging electronic components (hereinafter, sometimes referred to as "sheet") of the present embodiment is a sheet for packaging electronic components and includes a base material sheet in which a base material layer A and a base material layer B are alternately laminated. , the heat deformation temperature difference between the aforementioned base material layer A and the aforementioned base material layer B is higher than 0°C and less than 23°C. The thickness of each layer of the aforementioned base material layer A is 10~60 μm, and the thickness of each of the aforementioned base material layer B is 10~60 μm. The thickness of the layer is 1 to 50 μm. The average thickness of the individual layers of the aforementioned base material layer A exceeds the average thickness of the individual layers of the aforementioned base material layer B. The aforementioned base material layer A and the aforementioned base material layer B contains different thermoplastic resins as main components. The electronic component packaging sheet of this embodiment can maintain good formability suitable for manufacturing packaging containers for components with complex and diversified shapes, while effectively suppressing the generation of burrs and lint.

[Substrate sheet] The electronic component packaging sheet of the present embodiment has a substrate sheet. The substrate sheet is a substrate sheet having a multi-layer structure in which substrate layers A and substrate layers B are alternately stacked. By having such a substrate sheet having a multi-layer structure, the electronic component packaging sheet of the present embodiment can effectively suppress the generation of burrs and lint. In addition, the formability of the electronic component packaging sheet is not reduced when it is formed into a carrier, etc., and a pocket of a desired shape can be formed. The number of layers in which substrate layers A and substrate layers B are alternately stacked, that is, the total number of stacked layers of the substrate sheet, is not particularly limited as long as the effect of the invention of the present embodiment is achieved. From the perspective of controlling the thickness of each layer when forming the substrate sheet, the total number of layers is preferably 2 to 70, more preferably 2 to 60, more preferably 3 to 30, more preferably 3 to 12, and more preferably 3 to 9. By setting the total number of layers of the substrate sheet to the above range, the generation of burrs and lint can be suppressed, and a substrate sheet of the desired thickness can be easily obtained. In one embodiment, the total number of layers of substrate layer A is preferably greater than the total number of layers of substrate layer B. By designing the total number of layers of substrate layer A to be greater than the total number of layers of substrate layer B, the resin layers constituting the two surfaces of the substrate sheet will each become substrate layer A. By having such a structure, for example, when other layers such as a conductive layer are provided on both surfaces of the substrate sheet, the interlayer adhesion between the substrate sheet and the other layers can be easily improved.

<Base layer A and base layer B> Base layer A and base layer B constituting the base sheet contain different thermoplastic resins as main components. Here, "containing... as main components" means that the ratio of the thermoplastic resin (thermoplastic resin contained as main component) in the resin composition (100% by mass) constituting base layer A or base layer B is higher than the ratios of the other components in the resin composition, for example, 50% by mass or more. In one embodiment, the ratio of the thermoplastic resin in the resin composition constituting base layer A or base layer B may be 100% by mass. In one embodiment, when the resin composition constituting the substrate layer A or the substrate layer B is composed of two thermoplastic resins, "containing ... as a main component" means that the ratio of one of the two thermoplastic resins (the thermoplastic resin contained as a main component) in the resin composition constituting the substrate layer A or the substrate layer B (100% by mass) is more than 50% by mass. In addition, "different thermoplastic resins" not only refers to different types of thermoplastic resins, but also includes thermoplastic resins with different physical properties. That is, the substrate layer A and the substrate layer B may contain different types of thermoplastic resins as the main component, or may contain the same thermoplastic resin with different physical properties as the main component. From the perspective of making it easy to check the thickness of each layer when forming the substrate sheet, the substrate layer A and the substrate layer B preferably contain different types of thermoplastic resins as main components.

Base material layer A and base material layer B have different heat deformation temperatures. The heat deformation temperature difference should be higher than 0°C and less than 23°C, preferably above 3°C and less than 23°C, and more preferably 4°C. ~20℃, more preferably 4.2℃~20℃. When the heat deformation temperature difference is 4.2℃~20℃, it can be 4.7℃~20℃, it can be 5℃~20℃, it can be 10℃~20℃, it can be higher than 10℃ and below 20℃, it can also be 19℃~20℃. By setting the heat deformation temperature difference between the base material layer A and the base material layer B to the aforementioned range, electronic component packaging sheets can be produced in high speed and in large quantities using not only the vacuum forming method, the pressure forming method, the vacuum pressure forming method, etc. The molding method makes it easier to maintain good formability even in molding methods such as press molding and matched molds molding that are suitable for manufacturing packaging containers that respond to parts with complex and diverse shapes. It becomes easy to effectively suppress the generation of burrs and lint. The heat distortion temperature of base material layer A and base material layer B, even if the heat distortion temperature of base material layer A is higher than the heat distortion temperature of base material layer B, or even if the heat distortion temperature of base material layer B is higher than base material layer A The thermal deformation temperature is within the range where the electronic parts packaging sheet has the effect of maintaining good formability suitable for manufacturing packaging containers for parts with complex and diversified shapes, and effectively suppressing the generation of burrs and lint. There is no limit, but it is preferable that the heat deformation temperature of base material layer B is higher than the heat deformation temperature of base material layer A, and the heat deformation temperature difference is higher than 0℃ and less than 23℃, preferably above 3℃ and Less than 23℃, more preferably 4℃~20℃, more preferably 4.2℃~20℃. When the heat deformation temperature difference is 4.2℃~20℃, it can be 4.7℃~20℃, it can be 5℃~20℃, it can be 10℃~20℃, it can be higher than 10℃ and below 20℃, it can also be 19℃~20℃. By setting the heat deformation temperature difference between the base material layer A and the base material layer B to the aforementioned range, electronic component packaging sheets can be produced in high speed and in large quantities using not only the vacuum forming method, the pressure forming method, the vacuum pressure forming method, etc. This molding method makes it easier to maintain good formability and become more efficient even in molding methods such as press molding methods and counter-mold molding methods that are suitable for manufacturing packaging containers that respond to parts with complex and diversified shapes. It effectively inhibits the generation of burrs and lint.

Here, as a method of manufacturing a packaging container using an electronic component packaging sheet containing a thermoplastic resin, there are methods such as vacuum molding, pressure molding, vacuum pressure molding, press molding, and counter-mold molding of the electronic component packaging sheet. Hot forming method for forming. When forming by such a thermoforming method, the electronic component packaging sheet may be heated and plasticized, or the mold may be heated. Here, vacuum forming refers to a molding method in which a thermoplastic resin sheet such as a thermoforming sheet is heated and softened to create a vacuum between the mold and the sheet, and the sheet is closely connected to the mold under atmospheric pressure to form. Pressure molding refers to a molding method in which a thermoplastic resin sheet such as a thermoforming sheet is heated and softened, and the pressure caused by compressed air is used to tightly contact the sheet with a mold to form it. Vacuum pressure forming refers to a hot forming method that combines vacuum forming and pressure forming. Press molding refers to a molding method in which a thermoplastic resin sheet such as a thermoforming sheet is heated and softened, and then the plasticized sheet is pressed and formed using upper and lower molds. Counter-mold molding refers to a molding method in which a pair of heated male and female molds are brought into contact with a thermoplastic resin sheet such as a thermoforming sheet and formed.

Generally speaking, vacuum forming method, pressure forming method, vacuum pressure forming method, because the electronic component packaging sheet is heated and softened with hot air at 400~600℃, and then the electronic component packaging sheet is closely attached to the mold and formed by air pressure such as vacuum or compressed air, it can be produced at high speed and in large quantities, but it is not suitable for the manufacture of packaging containers with complex and various shapes. On the other hand, generally speaking, the pressure forming method heats and softens the electronic component packaging sheet with contact heat at 100~300℃, makes the electronic component packaging sheet contact with a pair of molds, and appropriately pressurizes and forms it, so it can reproduce the details of the mold and is suitable for the manufacture of packaging containers with complex and various shapes. In addition, the die forming method heats a pair of dies to 100-300°C, brings the electronic component packaging sheet into contact with the dies, and then applies appropriate pressure and forms the dies. This allows the details of the dies to be reproduced, making it suitable for the manufacture of packaging containers of complex and diverse shapes.

In one embodiment, when the electronic component packaging sheet is formed by a press forming method in which the electronic component packaging sheet is softened by contact heat at 100 to 300°C and then brought into contact with a pair of dies for forming, or by a die forming method in which a pair of dies is heated to 100 to 300°C and then brought into contact with the dies for forming, it becomes easy to maintain good formability and to effectively suppress the generation of burrs and hair chips.

[Thermoplastic resin] Examples of thermoplastic resins include polystyrene resins (PS resins), ABS resins, polyester resins, polycarbonate resins (PC resins), and acrylonitrile-styrene copolymers (AS resins). These thermoplastic resins may be used alone or in combination of two or more. Examples of PS resins include polystyrene resins, rubber-modified styrene resins (rubber-g-styrene resins (GPPS) or high impact styrene resins (HIPS)). PS resins may be used alone or in combination of two or more. Aromatic vinyl monomers used to form PS resins include, for example, styrene, alkyl-substituted styrene (e.g., vinyl toluene, vinyl xylene, p-ethyl styrene, p-isopropyl styrene, butyl styrene, p-tert-butyl styrene, etc.), halogen-substituted styrene (e.g., chlorostyrene, bromostyrene, etc.), α-alkyl-substituted styrene with alkyl substitution at the α position (e.g., α-methyl styrene, etc.). These aromatic vinyl monomers can be used alone or in combination of two or more. Among these monomers, styrene, vinyl toluene, α-methyl styrene, etc. are generally used, and styrene is particularly preferred. The MFR of PS resins measured in accordance with ISO 1133 is preferably 1~30g/10min, preferably 2~25g/10min.

ABS resin refers to a ternary copolymer of diene rubber-aromatic vinyl monomer-cyanide vinyl monomer as the main component. The representative one is acrylonitrile-butadiene-styrene. A resin or resin composition with a tertiary copolymer as the main component. Specific examples thereof include: acrylonitrile-butadiene-styrene ternary copolymer, a mixture of acrylonitrile-butadiene-styrene ternary copolymer and acrylonitrile-styrene binary copolymer, etc. Among them, the ABS resin is preferably an acrylonitrile-butadiene-styrene ternary copolymer, and a combination of an acrylonitrile-butadiene-styrene ternary copolymer and an acrylonitrile-styrene binary copolymer is more suitable. mixture. In addition to the aforementioned monomer units, these polymers also include α-methylstyrene, vinyltoluene, dimethylstyrene, chlorostyrene, and vinyl as trace components of styrenic monomers. Naphthalene and other monomers. In addition, trace components of vinyl cyanide monomers also include monomers containing methacrylonitrile, ethacrylonitrile, fumaronitrile, etc. The description below omits the description of trace components, but those containing these components are also included in the range which does not impair the effect of the invention of this embodiment. ABS resin can be used individually by 1 type, or 2 or more types can be used together. The MFR of ABS resin measured in accordance with the specifications of ISO 1133 is preferably 1~30g/10min, more preferably 2~25g/10min.

Examples of polyester-based resins include polyester resins obtained from aromatic polyfunctional carboxylic acids, aliphatic polyfunctional carboxylic acids, and polyfunctional diols, and hydroxycarboxylic acid-based polyester resins. Polyester resin obtained from aromatic polyfunctional carboxylic acid, aliphatic polyfunctional carboxylic acid, and polyfunctional diol, for example: polyethylene terephthalate, polybutylene terephthalate, polynaphthalene Ethylene dicarboxylate, polybutylene naphthalate, polyethylene adipate, polybutylene adipate, and other copolymers other than these. Examples of other copolymers include polyester resins obtained by copolymerizing polyalkylene glycol, polycaprolactone, and the like. Examples of hydroxycarboxylic acid-based polyester resin include polylactic acid, polyglycolic acid, polycaprolactone, and the like. In this embodiment, a copolymer of each of the polyester resins exemplified above can also be used. One type of polyester resin may be used alone, or two or more types may be used in combination. The MFR of polyester resin measured in accordance with the specifications of ISO 1133 is preferably 1~30g/10min, more preferably 2~25g/10min.

PC-based resin is a resin derived from a dihydroxy compound. Among them, it is preferably a resin derived from an aromatic dihydroxy compound. In particular, two aromatic dihydroxy compounds are bonded through a certain bonding group. Bonded aromatic dihydroxy compounds (bisphenols). Those produced by known production methods can be used, and the production method is not particularly limited. In addition, commercially available resins can also be used. PC resin can be used individually by 1 type, or 2 or more types can be used together. The MFR of PC resin measured in accordance with the specifications of ISO 1133 is preferably 1~30g/10min, more preferably 2~25g/10min.

AS resins are resins containing a binary copolymer of acrylonitrile and styrene monomers as main components. Examples of styrene monomers include styrene, alkyl-substituted styrenes (e.g., vinyl toluene, vinyl xylene, p-ethylstyrene, p-isopropylstyrene, butylstyrene, p-tert-butylstyrene, etc.), halogen-substituted styrenes (e.g., chlorostyrene, bromostyrene, etc.), α-alkyl-substituted styrenes having an alkyl group substituted at the α position (e.g., α-methylstyrene, etc.). These styrene monomers may be used alone or in combination of two or more. Among these styrene monomers, styrene, vinyl toluene, α-methylstyrene, etc. are generally used, and styrene is particularly preferred.

The base material layer A or the base material layer B is preferably composed of a resin composition containing as a main component at least one resin selected from the aforementioned thermoplastic resins. For example, when the base material layer A or the base material layer B contains a PS-based resin as a main component in terms of thermoplastic resin, the PS-based resin may be contained in a ratio higher than that of other components in the resin composition, for example, 50 mass% or more, and contains one or more modified materials within the range of 50 mass% or less. As the modified material, for example, block copolymers of styrene and dienes such as styrene-butadiene (SB) block copolymers, olefin-styrene block copolymers which are hydrogenated products of these, Polyolefin. In one aspect, when the base material layer A or the base material layer B contains PS-based resin as the main component and contains one type of modified material, the base material layer A or the base material layer B may contain less than 50% by mass. Modified materials are included in the range. In addition, when the base material layer A or the base material layer B contains a polycarbonate-based (PC-based) resin as a main component of the thermoplastic resin, the above-mentioned components may be contained in a ratio higher than that of other components in the resin composition. PC-based resin contains, for example, 50% by mass or more and contains one or more modified materials within a range of 50% by mass or less. As the modified material, for example, ABS resin, polyethylene terephthalate resin, polybutylene terephthalate resin, etc. can be mixed. In one aspect, when the base material layer A or the base material layer B contains PC-based resin as the main component and contains one type of modified material, the base material layer A or the base material layer B can be used in less than 50 Contains modified materials within the range of mass %. Similarly, when the base material layer A or the base material layer B contains ABS-based resin, polyester-based resin, AS-based resin, etc. as a main component, one or more resin components may be added in a range of 50% by mass or less. Modified materials. Various additives such as lubricants, plasticizers, and processing aids can be added to the resin composition as needed.

In one aspect, the thermoplastic resin contained in the base material layer A is preferably an ABS resin. If the base material layer A is a layer containing an ABS-based resin as a main component, the formability of the obtained electronic component packaging sheet can be easily maintained, and burrs can be more effectively suppressed. The ratio of the ABS resin contained in the base material layer A should be set so that the heat deformation temperature difference between the base material layer A and the base material layer B is higher than 0°C and less than 23°C, relative to the constituent base material. The total mass of the resin composition of layer A is preferably 50 mass% or more, more preferably 60 to 100 mass%, more preferably 80 to 100 mass%, and more preferably 100 mass%. In addition, the above-mentioned ABS-based resin preferably has a butadiene rubber content ratio of 5 to 30% from the viewpoint of strength and formability.

When the substrate layer A is a layer containing ABS resin as a main component, the substrate layer A may also contain ABS resin and other thermoplastic resins. The aforementioned other thermoplastic resins are preferably resins compatible with ABS resins, preferably PC resins and AS resins. When the substrate layer A contains ABS resin and the aforementioned other thermoplastic resins, the mass ratio of ABS resin to the aforementioned other thermoplastic resins in the resin composition constituting the substrate layer A (ABS resin/other thermoplastic resins) may also be in the range of 99/1 to 50/50.

Furthermore, when the base material layer A is a layer containing an ABS-based resin as a main component, the base material layer B is preferably a layer containing a thermoplastic resin other than ABS-based resin as a main component. If the base material layer B is a layer containing a thermoplastic resin other than ABS resin as a main component, it becomes easier to suppress the generation of burrs and lint more effectively. The thermoplastic resin contained as the main component in the base material layer B includes, for example, PC resin, AS resin, PS resin, and polyester resin, but it is preferably one that can be prepared into the base material layer A and the base material layer B. Resins whose heat distortion temperature difference is higher than 0°C and less than 23°C are preferably resins other than PC-based resins, that is, AS-based resins, PS-based resins, polyester-based resins, and more preferably AS-based resins. When the base material layer B contains an AS-based resin as a main component, the ratio of the AS-based resin in the resin composition constituting the base material layer B is preferably 50% by mass or more relative to the total mass of the resin composition, and more preferably 60~100% by mass, more preferably 70~100% by mass. In one aspect, it is preferable that the base material layer A is a layer containing an ABS-based resin as a main component, and the base material layer B is a layer that contains an AS-based resin as a main component. By setting the base material layer A and the base material layer B to such a structure, it is easy to prepare the heat deformation temperature difference between the base material layer A and the base material layer B to be higher than 0°C and less than 23°C, and/or the base material The adhesion strength between the layer A and the base material layer B can be easily prepared to have sufficient strength.

In addition, when the base material layer B is a layer containing a thermoplastic resin other than ABS-based resin as a main component, the base material layer B may contain another thermoplastic resin different from the thermoplastic resin as its main component. For example, when the base material layer B contains AS-based resin as the main component, the other thermoplastic resins mentioned above may also contain ABS-based resin, PC-based resin, PS-based resin, or polyester-based resin, and preferably contain PC-based resin. At this time, the base material layer A may contain an ABS resin as a main component. By setting the base material layer A and the base material layer B to such a structure, it is easy to prepare the base material layer A and the base material layer B with a heat deformation temperature difference higher than 0°C and less than 23°C, and/in addition the base material The adhesion strength between the layer A and the base material layer B can be easily prepared to have sufficient strength.

[Recycled materials] In addition to the resins that are 100% by mass as described above, the substrate layer A and/or the substrate layer B may also contain recycled materials. Recycled materials are obtained by crushing and pelletizing the parts that do not become products at the time, such as the parts called "ears" that are produced by trimming the ends of the sheet extruded from the die when manufacturing the laminated sheet by extrusion molding during the manufacture of the electronic component packaging sheet, and the starting part when the sheet is rolled up. Even if recycled materials are added as described above, it is still very important from the perspective of productivity that the properties of the packaging sheet after manufacture are good. In one aspect, the recycled materials can be those from the manufactured electronic component packaging sheet. That is, the recycled material obtained by crushing and pelletizing the electronic component packaging sheet containing the substrate sheet of the present embodiment and any conductive layer and then including it in the substrate layer A and/or the substrate layer B. Here, the amount of recycled material contained in the substrate layer A or the substrate layer B is preferably set to a range in which the difference in thermal deformation temperature between the substrate layer A and the substrate layer B is higher than 0°C and less than 23°C, even when the recycled material is added, and is preferably 50 parts by mass or less, and more preferably 30 parts by mass or less, relative to 100 parts by mass of the substrate layer A or the substrate layer B. When the substrate layer A and/or the substrate layer B contains recycled material, its thermal deformation temperature can be calculated from the type and amount of the thermoplastic resin that is the material of the recycled material and the type and amount of the conductive layer. When the recycled materials contained in the substrate layer A and/or the substrate layer B are within the above range, the electronic component packaging sheet can be easily formed by not only vacuum forming methods, pressure forming methods, vacuum pressure forming methods, etc., which can be produced at high speed and in large quantities, but also by press forming methods, die forming methods, etc., which are suitable for manufacturing packaging containers for parts with complex and diverse shapes, and it becomes easy to effectively suppress the generation of burrs and lint.

[Thickness of layer] The thickness of individual layers constituting the base material layer A of the base material sheet is preferably 10 to 60 μm, more preferably 20 to 60 μm. In addition, the thickness of individual layers of the base material layer B is preferably 1 to 50 μm, more preferably 15 to 50 μm. Furthermore, in the electronic component packaging sheet of this embodiment, the average value of the thickness of the individual layers of the base material layer A exceeds the average value of the thickness of the individual layers of the base material layer B. As described above, the base material layers A and B containing different thermoplastic resins as main components are alternately laminated, and the average thickness of the individual layers of the base material layer A is set to exceed the thickness of the base material layer B. The average thickness of individual layers can effectively suppress the generation of burrs and lint during sheet punching. In addition, the "thickness of individual layers" in this specification refers to the maximum value of the thickness of each layer. The thickness of each of the base material layers A and B in the base material sheet can be measured, for example, by observing the cross section of the base material sheet using a microscope or the like. The individual layers of the base material layer A contained in the base material sheet may have exactly the same thickness, or may have different thicknesses in each layer. From the viewpoint of not easily leaving curl marks when the sheet is rolled up, individual layers of the base material layer A should have exactly the same thickness. Similarly, the individual layers of the base material layer B can have exactly the same thickness, or the thicknesses of each layer can be different. However, from the perspective of not easily leaving curl marks when the sheet is rolled up, the thickness of the base material layer B The individual layers should be exactly the same thickness.

[Layer thickness accuracy] The thickness of each layer constituting the base material sheet is as described in the above-mentioned "thickness of the layer" and can be measured by observation using a microscope or the like. For the measured layer thickness in this way, the layer thickness accuracy can be calculated based on the difference between the target thickness at the time of manufacturing the electronic component packaging sheet and the actual measured thickness. For example, when the sheet is film-formed, the difference between the target thickness of the surface layer and the base material layer of the sheet and the actual measured thickness is ±10% or more and 20% or less can be judged as "good", and those that do not reach ±10% can also be judged as "good". % is judged as "excellent", and anything exceeding ±20% is judged as "poor". The measurement position of the film of the layer only needs to measure the same part between the comparison objects. For example, it is also possible to measure both ends and/or the center of the cross section in the direction that is perpendicular to the longitudinal direction of the sheet (TD direction).

In addition, it is speculated that the burrs and lint generated when the sheet is formed are caused by the resin being stretched when the sheet is punched. If the thickness of the base material part of the sheet is thinned, the generation of burrs and lint will be relatively suppressed. However, if the thickness of the base material part is only thinned, it will be difficult to achieve the requirements for electronic component packaging sheets. Many physical properties. The inventors of this case discovered that by forming a base material sheet into a multi-layered structure and thinning the thickness of each layer, the generation of burrs and lint caused by the stretching of the resin can be suppressed. Furthermore, it was found that by alternately laminating two types of base material layers A and B containing different thermoplastic resins as main components and designing the average thickness of the individual layers of the base material layer A to be larger than the base material The average thickness of the individual layers of layer B can more effectively suppress the generation of burrs and lint. In the electronic component packaging sheet of this embodiment having such a structure, the base material layer B becomes a "separation layer" of the base material layer A, which can effectively suppress the stretching of the resin of the base material layer A. In addition, the electronic component packaging sheet having such a base material sheet according to this embodiment also has excellent formability suitable for manufacturing packaging containers corresponding to components with complex and diversified shapes.

The average value of the thickness of each layer of the substrate layer A is preferably 10 to 60 μm, more preferably 20 to 60 μm. In addition, the average value of the thickness of each layer of the substrate layer B is preferably 1 to 50 μm, more preferably 15 to 50 μm. Here, "the average value of the thickness of each layer of the substrate layer A" refers to the value obtained by dividing the total thickness of the substrate layer A in the substrate sheet by the number of stacked layers of the substrate layer A. In other words, it means the value calculated by (a1+a2+a3+･･･+an)/n when the thickness of one layer of the substrate layer A is set to "a1". Here, "n" refers to the total number of stacked layers of the substrate layer A in the substrate sheet. The same applies to the substrate layer B.

The average thickness of individual layers of base material layer A is preferably 1.001 times or more of the average thickness of individual layers of base material layer B. The upper limit is not particularly limited as long as the effect of the invention of this embodiment is achieved, but from the viewpoint of film forming properties, it is preferably 20 times or less. In one aspect, the average thickness of individual layers of base material layer A is preferably 1.001 to 20 times, more preferably 1.01 to 20 times the average thickness of individual layers of base material layer B. 15 times, more preferably 1.05~12 times, more preferably 1.2~10 times, more preferably 1.3~2 times. By setting the average value of the thicknesses of individual layers of the base material layer A to the aforementioned range, it becomes easier to suppress burrs and lint more effectively.

The thickness of the base material sheet is preferably 50 to 700 μm, more preferably 75 to 600 μm, more preferably 90 to 450 μm, more preferably 100 to 300 μm, in terms of strength and formability when made into a carrier tape. It is preferably 150~200μm, more preferably 160~180μm, more preferably 160~170μm. The electronic component packaging sheet of this embodiment may be composed only of the aforementioned base material sheet. When the electronic component packaging sheet of this embodiment is made into a conductive sheet, a conductive layer may be formed on at least one surface of the base sheet. In addition, any layer (eg, antifouling layer, etc.) may be provided on the base sheet.

[Conductive layer] The electronic component packaging sheet of this embodiment may also have a conductive layer on at least one surface of the aforementioned substrate sheet. The conductive layer is a layer composed of a resin composition containing a conductive component. The resin composition constituting the conductive layer is not particularly limited as long as it has the effect of the invention of this embodiment. For example, a resin composition containing 65-95% by mass, preferably 70-90% by mass of the aforementioned thermoplastic resin relative to the total mass of the resin composition, and containing 5-35% by mass, preferably 10-30% by mass of a conductive agent such as carbon black. Examples of carbon black include furnace black, channel black, acetylene black, etc., preferably having a large specific surface area and being able to obtain high conductivity with a small amount of addition. Specifically, the average primary particle size is preferably 20-100 nm, preferably 25-65 nm. The aforementioned average primary particle size refers to the average particle size measured using a transmission electron microscope. When the conductive layer is provided, its thickness is not particularly limited. From the perspective of easily improving the mechanical strength of the electronic component packaging sheet, the thickness of the conductive layer is preferably 3-100 μm, preferably 10-50 μm. When the thickness of the conductive layer is 10-50 μm, it can be 15-30 μm or 15-20 μm.

[Adhesion strength (adhesion between layers)] The electronic component packaging sheet according to this embodiment includes a base material sheet in which base material layers A and base material layers B are alternately laminated. When the sheet for packaging electronic components is, for example, formed into a carrier tape and used, the components are packaged by attaching a cover tape (cover tape) as a cover material to the storage carrier tape in the storage portion, and the cover tape is removed from the storage portion. The carrier tape is peeled off to remove parts. Therefore, during the steps of packaging and taking out such parts, it is appropriate to have a sufficient adhesion strength between the layers of the base materials of the carrier tape, and between the layers of the base material layer and the conductive layer, so that undesired peeling will not occur. In one embodiment, the adhesive strength of the base material layer A and the base material layer B of the electronic component packaging sheet is preferably higher than 0.6N/20mm, and more preferably 4N/20mm or more. When the adhesion strength between the base material layer A and the base material layer B is 4N/20mm or more, it may also be 10N/20mm or more, 20N/20mm or more, or 30N/20mm or more. When the base material layer A and the base material layer B have such adhesion strength, it is easy to suppress unintended peeling in the ordinary use of the electronic component packaging sheet as mentioned above, and it is easy to achieve stable packaging properties.

Here, the measurement of the adhesion strength can be performed, for example, by pressing and bonding the sheets of substrate layer A and substrate layer B, and then peeling the bonded sheets and measuring them. At this time, the pressing pressure and the tensile speed used for peeling are not limited as long as they can appropriately measure the adhesion strength of substrate layer A and substrate layer B in the sheet for electronic component packaging. Specifically, a Mini Test Press machine (manufactured by Toyo Seiki Co., Ltd., Catalog No. 519) is used to sandwich resin pellets between upper and lower pressing plates to produce evaluation sheets for substrate layer A and substrate layer B respectively. The pressing pressure at this time is 10 MPa. The temperature of the upper and lower plates of the hot pressing is set to a value that is 100°C higher than the thermal deformation temperature of the resin pellets used. The thickness of each sheet of substrate layer A and substrate layer B is set to 100μm. Then, the two sheets of substrate layer A and substrate layer B are bonded together using a Mini Test Press machine manufactured by Toyo Seiki Co., Ltd. The pressing pressure at this time is set to 0.1MPa, and the temperature of the upper and lower plates of the hot pressing is set to a value 100℃ higher than the thermal deformation temperature of substrate layer A. The size of the bonded sheet is set to length×width=150mm×20mm. When bonding, in order to smoothly measure the inter-layer adhesion strength, a heat-resistant sheet is sandwiched at the 20mm×20mm part of the end of the bonded sheet so that substrate layer A and substrate layer B will not bond to this part. Then, the bonded sheets were peeled off and the adhesion strength was measured using Strograph VE1D manufactured by Toyo Seiki Co., Ltd. at a temperature of 23°C, a humidity of 50%, a peeling speed of 300mm/min, and a peeling angle of 180°. The average adhesion strength N/20mm at this time was set as the adhesion strength N/20mm.

[Manufacturing method of electronic component packaging sheet] The manufacturing method of the electronic component packaging sheet of this embodiment can use the same method as the manufacturing method of a general multi-layer sheet. For example, the method described in Japanese Patent Publication No. 2007-307893 can be adopted. Specifically, the resin composition forming the substrate layer A and the resin composition forming the substrate layer B are each supplied to a separate extruder and melt-kneaded, and then supplied to a feed block, and the substrate layer A and the substrate layer B are stacked in an alternating manner. At this time, the thickness of each layer of the substrate layer A is in the range of 10 to 60 μm, and the thickness of each layer of the substrate layer B is in the range of 1 to 50 μm. The extrusion amount is adjusted so that the average thickness of each layer of the substrate layer A exceeds the average thickness of each layer of the substrate layer B, and the stacking is preferably 3 to 70 layers to form a multi-layered substrate sheet. When the electronic component packaging sheet of this embodiment is made into a conductive sheet, a resin composition for forming a conductive layer that has been melt-kneaded by another extruder can be stacked on one side or both sides of the aforementioned substrate sheet to form an electronic component packaging sheet.

[molded body] The molded article of this embodiment contains any of the electronic component packaging sheets described in the above-mentioned "electronic component packaging sheet". The electronic component packaging sheet can be formed into a molded body by a known thermoforming method such as vacuum forming, pressure forming, vacuum pressure forming, press forming, and counter-mold forming. Examples of molded bodies of sheets used for packaging electronic parts include: containers for storing electronic parts, carrier tapes (embossed carrier tapes), etc. In the electronic component packaging sheet according to this embodiment, when the sheet is slit or sprocket holes are punched, a molded article with minimal generation of burrs or lint in the cross section can be obtained. It is particularly advantageous in embossing of carrier tapes. Furthermore, by using such forming and secondary processing, it is possible to produce an embossed carrier tape with excellent dimensional accuracy such as slit width and punching hole diameter, and the occurrence of burrs during punching is significantly suppressed.

More specifically, in the secondary processing steps of slitting and punching of the embossed carrier tape of the formed body of the electronic component packaging sheet of the present embodiment, the punching processing conditions are that the single-side gap of the punching needle (pin)/mold is within a certain wide range of 5 to 50μm, and the punching speed is a wide range of punching such as 10~300mm/sec, so that a sprocket hole with a stable hole diameter and significantly suppressed burrs and burrs can be obtained. In addition, even in the slitting step using an annular combined blade, a slit end face with less burrs and burrs and a stable sheet width can be obtained.

Furthermore, since the electronic component packaging sheet of this embodiment also has good formability, when a bag for storing electronic components is molded, the bag can be formed into a desired shape. Specifically, it is possible to form a pocket with a desired angle required for stably storing electronic components without causing any holes in the bottom or wall portions.

In particular, the electronic component packaging sheet of the present embodiment has good formability not only in vacuum forming methods, pressure forming methods, vacuum pressure forming methods, etc., which can be produced at high speed and in large quantities, but also in press forming methods, die-to-die forming methods, etc., which are suitable for manufacturing packaging containers for parts with complex and diversified shapes. Here, the press forming method is to heat and soften the electronic component packaging sheet with contact heat of 100~300℃, then bring the electronic component packaging sheet into contact with a pair of molds, and appropriately pressurize and form. In addition, the die-to-die forming method is to heat a pair of molds to 100~300℃, then bring the electronic component packaging sheet into contact with the molds, and appropriately pressurize and form. Therefore, the press forming method and the die forming method can reproduce the detailed forming of the mold and are suitable for the manufacture of packaging containers with complex and diverse shapes.

Container and embossed carrier tape of this embodiment. After the electronic components are stored in the storage portion formed by the above-mentioned molding method, the carrier tape can be covered with a cover tape and rolled into a roll shape. This form can be used for storage and transportation of electronic components.

A more ideal aspect of the electronic component packaging sheet of this embodiment is to include a base material layer A containing an ABS resin as a main component, and a multi-layered base material layer B containing an AS resin as a main component, which are alternately laminated. Structure of the base material sheet, the two surfaces of the aforementioned base material sheet are composed of the aforementioned base material layer A, the difference in thermal deformation temperature of the aforementioned base material layer A and the aforementioned base material layer B is higher than 0°C and less than 23°C, and the aforementioned base material layer The thickness of individual layers of the material layer A is 10 to 60 μm, the thickness of the individual layers of the aforementioned base material layer B is 1 to 50 μm, and the average thickness of the individual layers of the aforementioned base material layer A exceeds that of the aforementioned base material. Sheet for electronic component packaging based on the average thickness of the individual layers of layer B. More preferably, the number of layers in which the base material layer A and the base material layer B are alternately laminated is 3 to 9, the adhesion strength of the base material layer A and the base material layer B is 4N/20mm or more, and/ Or the average value of the thickness of individual layers of the aforementioned base material layer A is 1.001 times or more and less than 10 times the average value of the thickness of individual layers of the aforementioned base material layer B. A more ideal aspect of the molded article of this embodiment has a multilayer structure in which a base material layer A containing an ABS resin as a main component and a base material layer B containing an AS resin as a main component are alternately laminated. Base material sheet. Both surfaces of the aforementioned base material sheet are composed of the aforementioned base material layer A. The difference in heat deformation temperature between the aforementioned base material layer A and the aforementioned base material layer B is higher than 0°C and less than 23°C. The aforementioned base material layer The thickness of individual layers of A is 10 to 60 μm, the thickness of individual layers of the aforementioned base material layer B is 1 to 50 μm, and the average thickness of the individual layers of the aforementioned base material layer A exceeds that of the aforementioned base material layer B. The average thickness of the individual layers is a molded article containing a sheet for packaging electronic components. More preferably, the number of layers in which the base material layer A and the base material layer B are alternately laminated is 3 to 9, the adhesion strength of the base material layer A and the base material layer B is 4N/20mm or more, and/ Or the average value of the thickness of individual layers of the aforementioned base material layer A is 1.001 times or more and less than 10 times the average value of the thickness of individual layers of the aforementioned base material layer B. [Example]

The present invention will be described in detail below using examples, but the present invention is not limited to the following description.

[Production of sheets for packaging electronic components] [Examples 1 to 8, Comparative Examples 1 to 10] Regarding Examples 1 to 3, 6, 7, and Comparative Examples 1 to 10, the raw materials shown in the compositions of the base material layer A and the base material layer B in Tables 1 to 2 were prepared. Examples 4 and 5 were based on 100 mass For b-3, 10 parts by mass and 30 parts by mass of b-4 (recycled material) were respectively measured. In Example 8, 15 parts by mass of b-4 were measured based on 100 parts by mass of the total of b-1 and b-3. (recycled material), uniformly mixed with a high-speed mixer to form base material layer B. In addition, the conductive layer uses 80% by mass of polycarbonate resin (manufactured by Teijin Co., Ltd., product name: "Panlite (registered trademark) L-1225L") and acetylene black (manufactured by Denka Co., Ltd., product name: "DENKA BLACK (registered trademark) granular form", average primary particle diameter: 35nm) 20% by mass, kneaded using a φ30mm vented twin-screw extruder, and pelletized by the strand cutting method Granulated resin composition. First, the resin composition and the resin composition of the conductive layer described in Tables 1 to 2 were processed using a φ65mm extruder (L/D=28), a φ50mm extruder (L/D=28), and a φ40mm extruder. Using the feeding block method of an extruder (L/D=26) and a T-shaped die with a width of 500mm, conductive layers are formed on both sides of the base material sheet in which base material layer A and base material layer B are alternately laminated. Obtain sheets for packaging electronic components. In addition, the thickness and number of individual layers of the base material layers A and B of the obtained electronic component packaging sheet, the thickness of the conductive layer, the thickness of the base material sheet, and the total thickness of the electronic component packaging sheet are As shown in Table 1~2.

(Example 2) Example 2 is an example of a sheet for packaging electronic components that does not have a conductive layer. The resin compositions listed in Table 1 were processed using the feeding block method using a φ65mm extruder (L/D=28), a φ50mm extruder (L/D=28) and a 500mm wide T-shaped die. , to prepare a base material sheet in which the base material layer A and the base material layer B are alternately laminated, and obtain a sheet for packaging electronic components. The thickness and number of individual layers of the base material layers A and B of the obtained electronic component packaging sheet, the thickness of the base material sheet, and the total thickness of the electronic component packaging sheet are shown in Table 1.

The details of the raw materials shown in Tables 1 and 2 are as follows. a-1: Acrylonitrile-butadiene-styrene copolymer (ABS): manufactured by Denka Co., Ltd., product name "SE-10". Heat deformation temperature 100°C. a-2: Polycarbonate resin (PC): manufactured by Teijin Co., Ltd., product name "Panlite L-1225L". Heat deformation temperature 150°C. a-3: Impact-resistant polystyrene resin (HIPS): manufactured by TOYO STYRENE Co., Ltd., product name "E640N". Heat deformation temperature 100°C. b-1: Polycarbonate resin (PC): manufactured by Teijin Co., Ltd., product name "Panlite L-1225L". Heat deformation temperature 150°C. b-2: Acrylonitrile-butadiene-styrene copolymer (ABS): manufactured by Denka, product name "SE-10". Heat deformation temperature 100°C. b-3: Acrylonitrile-styrene copolymer (AS): manufactured by Denka, product name "AS-EXS". Heat deformation temperature 105°C. b-4: Recycled material: When manufacturing laminated sheets by extrusion molding, the two ends (ears) of the sheet extruded from the die (T-die), or the starting end when the sheet is rolled up, etc., which are trimmed because they cannot be commercialized, are crushed and pelletized. The recycled materials used in Examples 4, 5, and 8 are recycled materials obtained in the manufacture of the electronic component packaging sheets of Examples 4, 5, and 8.

In addition, the average primary particle size of acetylene black in the conductive layer is obtained by the following method. First, acetylene black is dispersed in chloroform at 150kHz and 0.4kW for 10 minutes using an ultrasonic disperser to prepare a dispersion sample. The dispersion sample is sprinkled on a carbon-reinforced support film and fixed, and photographed using a transmission electron microscope (JEOL, JEM-2100). Using an image magnified 50,000 to 200,000 times, the particle size of more than 1,000 inorganic fillers is randomly measured using an Endter device (the maximum size is the case of shapes other than spheres), and the average value is defined as the average primary particle size.

[Evaluation of electronic component packaging sheets] The electronic component packaging sheets obtained in each example were cut in the extrusion direction of the sheet to make sheet samples, and placed in an environment with a temperature of 23°C and a relative humidity of 50% for 24 hours. Then, the formability and punching burr characteristics were evaluated under the following conditions.

(1) Measurement of layer thickness (individual layer thickness, total thickness of electronic component packaging sheet) The thickness of each layer constituting the substrate sheet can be measured by observation using a microscope, etc., as described in the above "Thickness of the layer". This measurement uses a shape measurement laser microscope (manufactured by KEYENCE, model: VK-X100) to cut a cross section of the substrate sheet with a single-edged knife to measure the layer thickness. The thickness is measured at both ends and the center of the cross section in the longitudinal direction (TD direction) of the sheet, and the average value is used for evaluation.

(2) Layer thickness accuracy The thickness of the layer is measured in the same manner as (1). As described in the "Layer Thickness Accuracy" above, the layer thickness accuracy is calculated based on the difference between the target thickness at the time of manufacturing the electronic component packaging sheet and the actual measured thickness. During sheet film production, if the difference between the target thickness of the surface layer of the sheet and each base material layer and the actual measured thickness is more than ±10% and less than 20%, it will be marked as "good", and if the difference is less than ±10%, it will be marked as "good". "Excellent", and those exceeding ±20% are marked as "poor". The surface layer and each base material layer constituting a sheet for packaging electronic components are evaluated for their respective layer thickness accuracy, and the evaluation of the layer thickness accuracy of the sheet for packaging electronic components is determined based on the average value, that is, "excellent", "excellent", "Good", "bad".

(3) Formability in vacuum forming method (hot air heating-vacuum forming) Cut and slit into sheet samples with a width of 8 mm, and use a vacuum rotary forming machine (manufactured by Muehlbauer Co., product name: "CT8/24") at a temperature of 23°C and a relative humidity of 50%, with a heater temperature of 450°C. The molding is carried out under the following conditions to produce a carrier tape with a width of 8mm. The pocket size of the carrier tape is 3mm in the vertical direction, 3mm in the width direction, and 1mm in the depth direction. The pocket of the obtained molded article was observed with a microscope, and the sharpness of the corner of the pocket (periphery of the bottom wall) was evaluated in five stages based on the evaluation criteria shown in Figure 1 . That is, with respect to the molded body (carrier tape) 10, the sharpness of the pocket corner 11 of the pocket 20 is visually confirmed, and whether it meets any of the evaluation criteria 1 to 5 is evaluated. In addition, visually confirm whether the pocket 20 has any holes. Based on these results, formability was evaluated based on the following criteria. Among the following criteria, those that are good or better are defined as passing (good formability). ＜Judgment Criteria＞ Excellent: The sharpness of the pocket corners is above the evaluation standard of 4, and there are no holes. Good: The sharpness of the pocket corners is 3 or more and less than 4 on the evaluation basis, and there are no holes. Poor: There are holes or no holes, but the sharpness of the corners of the pocket is 2 or less.

(4) Formability in the press forming method (contact heating-press forming) Sheet samples cut into 24 mm width were formed using our company's press forming machine at a temperature of 23°C and a relative humidity of 50%. The upper and lower heating heaters were set at 280°C, the mold temperature was 40°C, the heating time, the press time, and the mold cooling time were 4 seconds each, and the press pressure was 0.5 MPa. A carrier tape with a width of 24 mm was produced. The pocket size of the carrier tape was 12 mm in the longitudinal direction, 13 mm in the width direction, and 4 mm in the depth direction. The pocket of the formed body observed under a microscope was evaluated for sharpness of the corners (the periphery of the bottom wall) in 5 stages according to the evaluation criteria shown in Figure 1. That is, for the formed body (carrier tape) 10, the sharpness of the pocket corner 11 of the pocket 20 is visually confirmed to evaluate whether it meets any of the evaluation criteria 1 to 5. In addition, the pocket 20 is visually confirmed to be void. Based on these results, the formability is evaluated according to the following judgment criteria. Among the following judgment criteria, those that are good or above are defined as qualified (good formability). <Judgment Criteria> Excellent: The sharpness of the pocket corner is above the evaluation criteria 4 and there are no voids. Good: The sharpness of the pocket corner is above the evaluation criteria 3 and less than 4, and there are no voids. Poor: There are voids, or there are no voids, but the sharpness of the pocket corner is 2 or less.

(5) Punching burr characteristics Sheet samples were cut and slit into a width of 8 mm, punched using a vacuum rotary forming machine (manufactured by Muehlbauer Co., product name: "CT8/24") at a temperature of 23°C and a relative humidity of 50%, and the punched holes were evaluated. burrs and lint. In addition, punching is performed at a speed of 240m/h using a cylindrical punching needle with a sprocket hole punch tip diameter of 1.5mm and a mold hole with a diameter of 1.58mm. Holes were punched in the sheet formed above, using a micro-measuring machine (manufactured by Mitutoyo Co., Ltd., product name "MF-A1720H (imaging unit 6D)"), and measured at 0% for the reflection system, 40% for the transmission system, and 40% for the ring. ) is used for photography in 0% light source environment. Observe 10 holes with a diameter of 1.5mm and count the number of burrs and lint with a length of more than 0.15mm. In addition, evaluation is performed based on the following criteria, and those that are good or above are defined as passed (the generation of burrs and lint is suppressed). ＜Judgment Criteria＞ Excellent: The number of burrs and lint does not reach 6. Good: The number of burrs and lint is more than 6 and less than 10. Unsatisfactory: The number of burrs and lint is more than 10.

(6) Interlayer adhesion strength (interlayer adhesion) Using a Mini Test Press (manufactured by Toyo Seiki Co., Ltd., Catalog No. 519), resin pellets were sandwiched between the upper and lower pressing plates to prepare evaluation sheets for each of the base material layer A and the base material layer B. At this time, the pressing pressure is set to 10 MPa, and the hot pressing upper and lower plate temperatures are set to a value that is 100°C higher than the heat deformation temperature of the resin pellets used. The thickness of each sheet of base material layer A and base material layer B was set to 100 μm. Then, the two sheets of base material layer A and base material layer B were laminated together using a Mini Test Press machine manufactured by Toyo Seiki Co., Ltd. At this time, the pressing pressure is set to 0.1MPa, and the temperature of the hot pressing upper and lower plates is set to a value 100°C higher than the heat deformation temperature of the base material layer A. The size of the laminated sheet is length × width = 150mm × 20mm. During lamination, in order to smoothly measure the inter-layer adhesion strength, a heat-resistant sheet is sandwiched between the 20mm × 20mm portion of the end of the laminate sheet so that the base material layer A and the base material layer B are not laminated. In this section, and make a conforming sheet. Using StrographVE1D manufactured by Toyo Seiki Co., Ltd., the bonded sheet is peeled off at a peeling speed of 300mm/min and a peeling angle of 180° in an environment with a temperature of 23°C and a humidity of 50%. The average strength N at this time is defined as the adhesion strength N ( N/20mm).

The evaluation results of the sheets produced in each of the Examples and Comparative Examples are summarized and shown in Tables 1 and 2, respectively. [Table 1] Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 Base material sheet composition Base material layer A a-1 (ABS heat distortion temperature 100℃) (mass%) 100 100 100 100 100 100 100 100 a-2 (PC heat distortion temperature 150℃) a-3 (HIPS heat distortion temperature 100℃) Base material layer B b-1 (PC heat distortion temperature 150℃) 10 30 30 b-2 (ABS heat distortion temperature 100℃) b-3(AS heat distortion temperature 105℃) 100 100 100 100 100 90 70 70 b-4 (recycled materials) (parts by mass) 10 30 15 constitute Thickness of individual layers of base material layer A (μm) 60 60 20 60 60 60 60 60 Number of layers of base material layer A (-) 2 2 5 2 2 2 2 2 Thickness of individual layers of base material layer B (μm) 50 50 15 50 50 50 50 50 Number of layers of base material layer B (-) 1 1 4 1 1 1 1 1 The total number of layers of base material layer A and base material layer B (-) 3 3 9 3 3 3 3 3 Average thickness of individual layers of base material layer A/average thickness of individual layers of base material layer B (-) 2.000 2.000 1.333 2.000 2.000 2.000 2.000 2.000 The difference in thermal deformation temperature between base material layer A and base material layer B (℃) 5.0 5.0 5.0 4.7 4.2 10 19 20 Thickness of base material sheet (μm) 170 170 160 170 170 170 170 170 conductive layer constitute With or without conductive layer (both sides) (-) have without have have have have have have The average thickness of individual layers (μm) 15 15 20 15 15 15 15 15 Total thickness of electronic component packaging sheets (μm) 200 200 200 200 200 200 200 200 Evaluation Layer thickness accuracy during film production Excellent Excellent good good Excellent Excellent Excellent Excellent Interlayer adhesion (N/20mm) >30 >30 >30 >30 >30 >30 >30 >30 Formability (contact heating-press forming method) Excellent Excellent Excellent Excellent Excellent Excellent Excellent Excellent Formability (hot air heating-vacuum forming method) Excellent Excellent Excellent Excellent Excellent Excellent Excellent Excellent Punching burr characteristics good good good good good good Excellent Excellent (Number of burrs) 8 8 6 8 6 6 5 4

[Table 2] Comparison Example 1 Comparison Example 2 Comparison Example 3 Comparison Example 4 Comparison Example 5 Comparative Example 6 Comparison Example 7 Comparative Example 8 Comparative Example 9 Comparative Example 10 Substrate sheet Composition Substrate layer A a-1(ABS heat deformation temperature 100℃) (Mass%) 100 100 100 100 100 60 100 100 100 a-2(PC thermal deformation temperature 150℃) 40 a-3(HIPS heat deformation temperature 100℃) 100 Substrate layer B b-1(PC thermal deformation temperature 150℃) 100 100 100 100 100 100 60 100 100 b-2(ABS heat deformation temperature 100℃) 40 100 b-3(AS heat deformation temperature 105℃) b-4(recycled material) (Weight) Composition Thickness of individual layers of substrate layer A (μm) 60 40 20 14 30 20 20 60 20 20 Number of layers of substrate layer A (-) 2 3 5 7 4 5 5 1 5 5 The thickness of each layer of the substrate layer B (μm) 50 20 15 10 10 15 15 30 15 15 Number of layers of base layer B (-) 1 2 4 6 4 4 4 1 4 4 Total number of layers of substrate layer A and substrate layer B (-) 3 5 9 13 8 9 9 2 9 9 Average thickness of each layer of substrate layer A / Average thickness of each layer of substrate layer B (-) 1.200 2.000 1.333 1.400 3.000 1.333 1.333 2.000 1.333 1.333 Thermal deformation temperature difference between substrate layer A and substrate layer B (℃) 50 50 50 50 50 twenty three 30 50 0 50 Thickness of substrate (μm) 170 160 160 158 160 160 160 90 160 160 Conductive layer Composition Whether there is a conductive layer (both sides) (-) have have have have have have have have have without Average thickness of individual layers (μm) 15 20 20 twenty one 20 20 20 30 20 - Total thickness of electronic parts packaging sheet (μm) 200 200 200 200 200 200 200 150 200 160 Reviews Layer thickness accuracy during film production Excellent good good Poor good good good good good good Interlayer adhesion (N/20mm) >30 >30 >30 >30 >30 >30 >30 >30 0.6 >30 Formability (contact heating-pressing forming method) Poor Poor Poor Poor Poor Poor Poor Poor Poor Poor Formability (hot air heating-vacuum forming method) Excellent Excellent Excellent Excellent Excellent Excellent Excellent Excellent Excellent Excellent Punching Burr Characteristics Excellent Excellent Excellent Excellent Excellent Excellent Excellent Excellent good Excellent (Number of burrs) 4 2 0 0 1 0 2 4 8 0

As shown in Table 1, it can be seen that the electronic component packaging sheets of Examples 1 to 8 that meet the structure of the present invention have good formability during the forming in the press forming method (contact heating-press forming), and the generation of burrs and hair scraps during sheet punching can also be fully and effectively suppressed. The press forming method is a forming method suitable for the manufacture of packaging containers for parts with complex and diversified shapes. On the other hand, as shown in Table 2, the electronic component packaging sheets of Comparative Examples 1 to 10 that do not meet the structure of the present invention have poor formability in the press forming method (contact heating-press forming). From the above results, it is confirmed that the electronic component packaging sheet of the present invention maintains good formability during the forming in the press forming method, and can effectively suppress the generation of burrs and hair scraps. [Industrial Applicability]

According to this embodiment, it is possible to provide an electronic component packaging sheet and a molded body containing the sheet that maintain good formability suitable for the manufacture of packaging containers for parts with complex and diversified shapes, and that can effectively suppress the generation of burrs and lint, and have industrial applicability.

10: Molded products 11:Pocket corner 20: pocket

[Fig. 1] is a diagram showing evaluation criteria for the formability of electronic component packaging sheets according to Examples of the present invention.

Claims (9)

A sheet for packaging electronic parts, comprising: a substrate sheet formed by alternately stacking substrate layers A and B; The difference in thermal deformation temperature between the substrate layer A and the substrate layer B is higher than 0°C and lower than 23°C; The thickness of each layer of the substrate layer A is 10-60 μm; the thickness of each layer of the substrate layer B is 1-50 μm; the average value of the thickness of each layer of the substrate layer A exceeds the average value of the thickness of each layer of the substrate layer B; The substrate layer A and the substrate layer B contain different thermoplastic resins as main components. In the electronic component packaging sheet of claim 1, the number of layers formed by alternately stacking the substrate layer A and the substrate layer B is 3 to 9. The sheet for packaging electronic parts according to claim 1 or 2, wherein the adhesion strength of the base material layer A and the base material layer B is 4N/20mm or more. For example, the sheet for packaging electronic parts according to claim 1 or 2, wherein the average thickness of the individual layers of the base material layer A is more than 1.001 times the average thickness of the individual layers of the base material layer B. The sheet for packaging electronic parts according to claim 1 or 2, wherein the base material layer A contains ABS resin as a main component. The sheet for packaging electronic parts according to claim 1 or 2, wherein the base material layer B contains a thermoplastic resin other than PC resin as a main component. A formed body containing the electronic component packaging sheet according to claim 1 or 2. The shaped body as claimed in claim 7 is a container. As for the formed body of claim 7, it is a carrier.

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