TW202408722A - Polishing head and polishing device - Google Patents

Abstract

The present invention pertains to a polishing head for pressing a polishing tape against a substrate such as a wafer. The present invention also pertains to a polishing device for polishing a substrate using such a polishing head. The polishing head (10) for polishing the substrate (W) comprises: a pressing member (12) for pressing the polishing tape (2) against the substrate (W); a pressing member holder (30) for holding the pressing member (12); and an actuator (15) connected to the pressing member holder (30) and imparting a pressing force to the pressing member (12). The pressing member (12) is formed in a rod-shape having both ends (12a), and the pressing member (12) is fitted to a groove (50) formed in a pressing surface (30a) of the pressing member holder (30).

Description

Grinding head and grinding device

The present invention relates to a polishing head for pressing a polishing tape onto a substrate such as a wafer. Furthermore, the present invention relates to a polishing device for polishing a substrate using the polishing head.

In recent years, memory circuits, logic circuits, image detectors (such as CMOS detectors) and other components have become more integrated. During the process of forming these components, foreign matter such as fine particles and dust will adhere to the components. Foreign matter attached to components can cause short circuits between wiring and circuit failures. Therefore, in order to improve the reliability of components, it is necessary to clean the wafer on which the components are formed to remove foreign matter on the wafer.

The back side (non-component side) of the wafer will also be attached with foreign objects such as the above-mentioned particles and dust. When such foreign objects are attached to the back side of the wafer, the wafer will be tilted to the stage reference plane because the wafer leaves the stage reference plane of the exposure device, resulting in pattern formation deviation and focus distance deviation. In order to prevent such problems, it is necessary to remove foreign objects attached to the back side of the wafer.

Therefore, as shown in FIG21, a polishing device for polishing the back side of a wafer with a polishing tape is used. FIG21 is a top view of a conventional polishing device, and FIG22 is a side view of the conventional polishing device shown in FIG21. The polishing device holds the periphery of the wafer W by a plurality of rollers 500, and the rollers 500 themselves rotate to rotate the wafer W. The polishing tape 502 is disposed on the back side of the wafer W. The polishing tape 502 moves in the direction indicated by the arrow Z.

A plurality of polishing heads 505 are arranged in the radial direction of the wafer W. The back side of the wafer W is polished by pressing a polishing tape 502 against the back side of the wafer W using the polishing heads 505. The polishing tape 502 pressed against the back side of the wafer W can remove foreign matter from the back side of the wafer W.

Figure 23 is a perspective view of the grinding head 505. As shown in FIG. 23 , the polishing head 505 has a pressing ring 512 that presses the polishing tape 502 to the back surface of the wafer W. The pressing ring 512 is made of elastic material such as silicone rubber. The pressing ring 512 is inserted into the pressing ring holder 513 in a state where tension is applied. The pressing ring 512 pushes the polishing belt 502 toward the wafer W. The polishing belt 502 receives the pressing force from the pressing ring 512 to polish the wafer W. [Prior technical literature] [Patent Document]

[Patent Document 1] Japanese Patent Application Publication No. 2021-122895

(Invent the problem you want to solve)

However, the pressing ring 512 has elasticity, so when the pressing ring 512 is stretched and hung on the pressing ring holder 513, it will be slightly deformed as shown by the dotted line in FIG. 24 . Because the pressing ring 512 is deformed, the actual effective grinding range PR2 will be smaller than the target effective grinding range PR1. As a result, the polishing tape 502 cannot polish the target area of the wafer W uniformly.

Therefore, the present invention provides a polishing head that can use a pressing member to uniformly press a polishing tape against a substrate such as a wafer. In addition, the present invention provides a grinding device provided with such a grinding head. (a means of solving problems)

One aspect provides a polishing head for polishing a substrate, and includes: a pressing member that presses a polishing tape against the substrate; a pressing member holder that holds the pressing member; and an actuator that is connected to The pressing member holder applies a pressing force to the pressing member; the pressing member has a rod shape with both ends, and the pressing member fits into a groove formed on the pressing surface of the pressing member holder.

One pattern is that the two side walls of the aforementioned groove are parallel to each other. In one aspect, the groove has: a first part having a first width smaller than the width of the pressing member; and a second part having a second width larger than the first width; the pressing member is The first part is sandwiched. In one aspect, the first part includes a spacer arranged on at least one side of the pressing member. In one aspect, the spacer is a plate that is detachable from the pressing member holder. In one aspect, the pressing member holder has a protruding portion protruding toward the inside of the groove, and the spacer is composed of the protruding portion. In one aspect, the polishing head further includes a pressing member stopper, which is arranged at both ends of the pressing member.

One aspect provides a polishing device comprising: a substrate holding portion for holding a substrate; and the polishing head. (Effect of the invention)

When the present invention is used, since the pressing member is in the shape of a rod with two ends, when the pressing member is mounted on the pressing member holder, no tension will occur in the length direction of the pressing member. Therefore, the pressing member will not be substantially deformed, and the polishing can be performed within the effective polishing range of the target, and the polishing tape can be uniformly pressed onto the substrate.

In addition, since the pressing member is sandwiched by the first part of the groove, the part of the pressing member held in the first part with a narrow width is better than the part of the pressing member held in the second part with a wide width, and the polishing tape is pressed to the substrate. Not easily deformed. As a result, the substrate can be polished with a high polishing rate by accepting the pressing force from the portion of the pressing member held on the first part. Furthermore, the distribution of the grinding rate can be adjusted through the position and length of the first part, resulting in a uniform grinding profile.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing an embodiment of a polishing head 10 for grinding a wafer W by pressing a polishing tape 2 as an example of a polishing tool onto the surface of a wafer W as an example of a substrate. FIG. 2 is a perspective view of FIG. 1 A cross-sectional view of the grinding head 10 is shown. The polishing head 10 of this embodiment is arranged below the wafer W and the polishing tape 2, and is arranged in such a manner that the polishing tape 2 is pressed against the back surface of the wafer W from its back side.

The polishing head 10 includes: a pressing member 12 as a pressing member for pressing the polishing tape 2 against the wafer W; an actuator 15 for applying a pressing force to the pressing member 12 by moving the pressing member 12 in a specified pressing direction indicated by an arrow CL; and a housing 18 in which the actuator 15 is disposed. The actuator 15 includes: a movable shaft 16 connected to the pressing member 12; and a partition wall film 25 (diaphragm) forming a pressure chamber 20 between the end of the movable shaft 16 and the housing 18. The movable shaft 16 and the partition wall film 25 are disposed in the housing 18.

The polishing head 10 further includes a pressing member holder 30 that holds the pressing member 12 . The pressing member holder 30 is connected to the movable shaft 16 and can move integrally with the movable shaft 16 . The pressing member holder 30 has a groove 50 on its pressing surface 30a, and the pressing member 12 is embedded in the groove 50. The pressing member holder 30 has inclined surfaces 30b and 30c that are inclined downward from both sides of the pressing surface 30a toward the outside.

As shown in FIG. 2 , the movable shaft 16 is movable in the axial direction of the housing 18 , and the movable shaft 16 can make the pressing member 12 rise in the pressing direction indicated by arrow CL. The pressing member 12 faces the back side of the polishing belt 2 . When the movable shaft 16 causes the pressing member 12 to rise in the pressing direction indicated by the arrow CL, the pressing member 12 contacts the back side of the polishing belt 2 . The pressing member 12 presses the polishing surface of the polishing belt 2 to the back surface of the wafer W, and uses the polishing belt 2 to polish the back surface of the wafer W. During polishing of the wafer W, the back side of the polishing belt 2 is supported by the pressing member 12 . The back side of the polishing belt 2 is the surface opposite to the polishing surface having the abrasive grains. During polishing of wafer W, the polishing belt 2 is conveyed in the length direction at a specified speed.

The movable shaft 16 of this embodiment is composed of a ball spline shaft. A ball spline nut 32 is disposed in the housing 18 , and the movable shaft 16 is supported movably in the axial direction of the movable shaft 16 by the ball spline nut 32 . In one embodiment, the movable shaft 16 is movably supported on the inner surface of the housing 18 .

The housing 18 includes a housing body 18A having a space for accommodating the movable shaft 16 formed therein, and a cover 18B for blocking the space. The cover 18B is detachably fixed to the housing body 18A by screws (not shown). The actuator 15 for generating a pressing force for pressing the polishing tape 2 against the wafer W includes: the movable shaft 16 and a partition wall film 25. The partition wall film 25 contacts the end (lower end) of the movable shaft 16, and the edge of the partition wall film 25 is sandwiched between the housing body 18A and the cover 18B. The partition wall film 25 only contacts the movable shaft 16, but is not fixed to the movable shaft 16.

The partition film 25 is formed of a soft material. Examples of materials constituting the partition membrane 25 include chloroprene rubber, fluororubber, and silicone rubber. The pressure chamber 20 is connected to a compressed gas supply line (not shown), and compressed gas (for example, compressed air) can be supplied from the compressed gas supply line into the pressure chamber 20 .

When polishing the wafer W, compressed gas such as compressed air is supplied to the pressure chamber 20. The pressure of the compressed gas in the pressure chamber 20 acts on the end (lower end) of the movable shaft 16 through the partition wall film 25, so that the movable shaft 16, the pressing member holder 30, and the pressing member 12 are raised. The polishing head 10 may further include a distance detector for measuring the relative movement distance of the movable shaft 16 to the housing 18. When polishing of the wafer W is completed, the pressure chamber 20 is opened to the atmosphere, and as a result, the movable shaft 16 and the pressing member 12 are lowered by the weight of the movable shaft 16 itself and the tension of the polishing tape 2.

A skirt 38 is fixed to the pressing member holder 30 . The skirt 38 extends downward from the pressing member holder 30 and surrounds the upper part of the housing 18 . The skirt 38 in this embodiment is cylindrical, but it can also be in other shapes as long as it can surround the upper part of the housing 18 . The skirt 38 prevents liquids such as pure water used for polishing the wafer W from intruding into the housing 18 .

As shown in FIG. 1 , the pressing member 12 has a rod shape having both ends 12 a, and the pressing member 12 is detachably held by the pressing member holder 30 . The pressing member 12 of this embodiment is inclined to the traveling direction Z of the polishing belt 2 and extends linearly.

The pressing member 12 is formed of an elastic material. Examples of materials constituting the pressing member 12 include rubbers such as fluororubber, silicone rubber, and ethylene propylene diene rubber. The cross-section of the pressing member 12 has a circular shape. However, the pressing member 12 is not limited to this embodiment, and may have other shapes, or may be made of other materials. For example, a plurality of pressing members 12 may be provided to press the polishing tape 2 onto the wafer W. The pressing member 12 in other examples may also be in a curved shape instead of a straight-line extension.

The polishing head 10 of this embodiment has two pressing member stoppers 45 disposed at both ends of the pressing member 12. These pressing member stoppers 45 are detachably fixed to the pressing member holder 30 by screws 46. The pressing member stoppers 45 are made of a hard material such as resin or metal. The pressing member stoppers 45 have the function of positioning the pressing member 12 in the longitudinal direction of the pressing member 12.

As shown in FIG. 1 , during polishing of wafer W, the polishing belt 2 is transported in the length direction of the polishing belt 2 at a specified speed as indicated by arrow Z. The pressing member 12 of this embodiment extends obliquely to the longitudinal direction (traveling direction Z) of the polishing belt 2 . When polishing the wafer W, the pressing member 12 presses the polishing tape 2 against the wafer W from the back side thereof.

FIG. 3 is a view showing a state in which the pressing member 12 and the pressing member stopper 45 are removed from the pressing member holder 30 . The pressing surface (upper surface in this embodiment) 30 a of the pressing member holder 30 has a groove 50 into which the pressing member 12 fits. The groove 50 has the same length as the pressing member 12 or is longer than the pressing member 12 . In this embodiment, the length of the groove 50 is the same as the length of the pressing member 12 . The term "same" in this specification means not only exactly the same, but also includes what is substantially the same within the scope of technical common sense.

The pressing member 12 is mounted on the pressing member holder 30 by fitting into the groove 50 . The pressing member 12 is not fixed to the pressing member holder 30 without adhesive, but is detachable from the pressing member holder 30 as shown in FIG. 3 .

In this embodiment, since the pressing member 12 is in the shape of a rod with two ends 12a, when the pressing member 12 is mounted on the pressing member holder 30, no tension will be generated in the length direction of the pressing member 12. Therefore, the pressing member 12 will not be substantially deformed, and the polishing tape 2 can be uniformly pressed against the wafer W.

FIG. 4 is a top view showing an embodiment of the groove 50, FIG. 5 is a cross-sectional view along line AA in FIG. 4, and FIG. 6 is a cross-sectional view along line B-B in FIG. 4. The groove 50 is formed on the pressing surface 30 a of the pressing member holder 30 and extends from one side of the pressing member holder 30 to the other side. As shown in FIGS. 5 and 6 , the groove 50 is composed of two side walls 51 formed on the pressing surface 30 a of the pressing member holder 30 and a bottom surface 52 located between these side walls 51 . The two side walls 51 are flat and mutually exclusive. parallel. The groove 50 in this embodiment has a rectangular cross section. When the two side walls 51 of the groove 50 are parallel to each other, the bottom surface 52 of the groove 50 may also be uneven.

The groove 50 has a first portion 50A having a first width D1 smaller than the width of the pressing member 12, and a second portion 50B having a second width D2 larger than the first width D1. The first portion 50A is located at the center of the pressing member 12, and the second portion 50B is located at both ends of the pressing member 12. The first portion 50A is located between the two second portions 50B.

As shown in FIG. 5 , the first portion 50A includes spacers 55 disposed on both sides of the pressing member 12. The two side walls 51 constituting the first portion 50A are constituted by the spacers 55. The spacers 55 of this embodiment are constituted by a plate (e.g., a shim) that is detachably mounted on the pressing member holder 30. These spacers 55 constitute the first portion 50A of the groove 50 and contact both sides of the pressing member 12. The position, thickness, and length of the spacers 55 can be changed. Therefore, the position, width, and length of the first portion 50A of the groove 50 can also be changed. The spacers 55 are made of resin or metal, etc.

As shown in Fig. 6, the two side walls 51 constituting the second portion 50B are formed by the surface of the pressing member holder 30. The width D2 of the second portion 50B of the groove 50 is larger than the width D1 of the first portion 50A of the groove 50 shown in Fig. 5.

FIG. 7 is a top view showing an embodiment of the pressing member 12 embedded in the groove 50, FIG. 8 is a cross-sectional view taken along line C-C of FIG. 7, and FIG. 9 is a cross-sectional view taken along line D-D of FIG. 7. The width D1 of the first portion 50A of the groove 50 is smaller than the width of the pressing member 12 before being embedded in the groove 50. Therefore, the pressing member 12 made of an elastic material is clamped by the first portion 50A of the groove 50 and is held by the first portion 50A. In addition, the width D2 of the second portion 50B of the groove 50 is slightly larger than the width of the pressing member 12 before being embedded in the groove 50. Therefore, the pressing member 12 is not held by the second portion 50B. However, when the width D2 of the second portion 50B is greater than the width D1 of the first portion 50A, the width D2 of the second portion 50B may be the same as the width of the pressing member 12 or smaller than the width of the pressing member 12 .

Since the pressing member 12 is clamped by the first portion 50A of the groove 50, the portion of the pressing member 12 held in the narrow first portion 50A is less likely to be deformed when the polishing tape 2 is pressed against the wafer W than the portion of the pressing member 12 held in the wide second portion 50B. As a result, the polishing tape 2 can receive the pressing force from the portion of the pressing member 12 held in the first portion 50A, and polish the wafer W at a high polishing rate. Furthermore, the distribution of the polishing rate can be adjusted by the position and length of the first portion 50A, and as a result, a uniform polishing profile can be achieved.

FIG. 10A is a diagram showing an example of a grinding profile when a grinding head 10 having a first portion 50A without a groove 50 is used, and FIG. 10B is a diagram showing an example of a grinding profile when a grinding head 10 of FIG. 7 having a first portion 50A with a groove 50 is used. As shown in FIG. 10A , the grinding rate of the area corresponding to the center of the pressing member 12 is lower than the grinding rate of the areas corresponding to the two ends of the pressing member 12. In contrast, the grinding profile shown in FIG. 10B includes a substantially uniform grinding rate over the entire length of the pressing member 12. Therefore, by arranging the spacer 55 constituting the first portion 50A having a narrow width in the area with a low grinding rate, a uniform grinding rate can be achieved.

The embodiment described with reference to FIGS. 4 to 9 disposes the spacers 55 on both sides of the pressing member 12 . However, in one embodiment, as shown in FIG. 11 , the spacers 55 may also be disposed on only one side of the pressing member 12 . . Even at this time, the width of the first portion 50A of the groove 50 is smaller than the width of the pressing member 12 and smaller than the width of the second portion 50B of the groove 50 . Since the pressing member 12 is sandwiched by the first portion 50A of the groove 50, the portion of the pressing member 12 held in the first portion 50A, which has a narrow width, is smaller than the portion of the pressing member 12 held in the second portion 50B, which has a wide width. The polishing tape 2 is not easily deformed when it is pressed onto the wafer W.

FIG. 12 and FIG. 13 are diagrams showing other implementation forms of the first portion 50A and the second portion 50B of the groove 50. In the implementation form shown in FIG. 12, the second portion 50B of the groove 50 is located at the center of the pressing member 12, and the two first portions 50A of the groove 50 are located at both ends of the pressing member 12. The spacer 55 constituting the first portion 50A contacts both ends of the pressing member 12. In the implementation form shown in FIG. 13, the first portion 50A and the second portion 50B of the groove 50 are located at both ends of the pressing member 12. That is, the spacer 55 constituting the first portion 50A of the groove 50 contacts one end of the pressing member 12, and the second portion 50B of the groove 50 is located at the other end of the pressing member 12.

As shown in FIG14 , the polishing head 10 may also include: two grooves 50 and two pressing members 12 respectively embedded in the grooves 50. Since the structures of each groove 50 and each pressing member 12 are the same as those of the embodiment described with reference to FIG4 to FIG9 , the repeated description thereof is omitted. The variation described with reference to FIG11 to FIG13 may also be applied to the present embodiment shown in FIG14 .

FIG. 15 is a top view showing another embodiment of the groove 50, FIG. 16 is a cross-sectional view taken along line E-E of FIG. 15, and FIG. 17 is a cross-sectional view taken along line F-F of FIG. 15. Since the structure of this embodiment not specifically described is the same as that of the embodiment described with reference to FIGS. 4 to 9, the repeated description thereof is omitted. In this embodiment, the spacer 55 constituting the first portion 50A of the groove 50 is constituted by a protruding portion of the pressing member holder 30 protruding toward the inner side of the groove 50. Since the relationship between the width D1 of the first portion 50A, the width of the pressing member 12, and the width D2 of the second portion 50B is the same as that of the embodiment described with reference to FIGS. 4 to 9, the repeated description thereof is omitted. The variations described with reference to FIGS. 11 to 13 are also applicable to the present embodiment shown in FIGS. 15 to 17 .

FIG. 18 is a side view showing an embodiment of the grinding device, and FIG. 19 is a top view of the grinding device shown in FIG. 18 . The polishing apparatus shown in FIGS. 18 and 19 includes: a substrate holding part 70 that holds and rotates the wafer W; and the polishing tapes 2A and 2B are brought into contact with the first surface 5 a of the wafer W held by the substrate holding part 70 A plurality of polishing heads 10A to 10D for polishing the first surface 5a of the wafer W; a polishing tape supply mechanism 72A that supplies the polishing tape 2A to the polishing heads 10A and 10B and recovers the polishing tape 2 from the polishing heads 10A and 10B; and The polishing tape supply mechanism 72B supplies the polishing tape 2B to the polishing heads 10C and 10D and collects the polishing tape 2B from the polishing heads 10C and 10D.

The polishing heads 10A and 10C have the same structure as the polishing head 10 described with reference to FIG. 14 , and the polishing heads 10B and 10D have the same structure as the polishing head 10 described with reference to FIG. 7 . Polishing belts 2A and 2B have the same structure.

The first surface 5a of the wafer W of this embodiment is the back side of the wafer W where no component is formed or where no component is expected to be formed, i.e., the non-component surface. The second surface 5b of the wafer W on the opposite side of the first surface 5a is the surface where components are formed or where components are expected to be formed, i.e., the component surface. The wafer W of this embodiment is horizontally held on the substrate holding portion 70 with its first surface 5a facing downward.

The substrate holding portion 70 includes: a plurality of rollers 75A, 75B, 75C, 75D that can contact the periphery of the wafer W; and a roller rotating device (not shown) for rotating the rollers 75A to 75D at the same speed. In this embodiment, four rollers 75A to 75D are provided, but five or more rollers may be provided.

The polishing heads 10A and 10B are supported by the supporting member 78A, and the polishing heads 10C and 10D are supported by the supporting member 78B. The plurality of polishing heads 10A to 10D are arranged on the lower side of the wafer W held by the substrate holding portion 70. These polishing heads 10A to 10D are arranged in the diameter direction of the wafer W. This embodiment is provided with four polishing heads 10A to 10D, but the number of polishing heads is not limited to this embodiment. A single polishing head may also be provided in one embodiment.

Since the polishing tape supply mechanisms 72A and 72B have the same structure, the polishing tape supply mechanism 72A will be described below. The polishing tape supply mechanism 72A includes a tape take-up reel 81 connected to one end of the polishing tape 2A; a tape take-up reel 82 connected to the other end of the polishing tape 2A; and a plurality of guide rollers 83 that guide the traveling direction of the polishing tape 2A. The tape take-up reel 81 and the tape take-up reel 82 are connected to reel motors 86 and 87 respectively.

By rotating the belt reel 82 in the direction indicated by the arrow, the polishing tape 2A is conveyed from the belt unwinding shaft 81 to the belt reel reel 82 via the polishing heads 10A and 10B. The polishing tape 2A is supplied to the top of the polishing heads 10A and 10B in a manner that the polishing surface 3a of the polishing tape 2A faces the first surface 5a of the wafer W. The reel motor 86 can apply tension to the polishing tape 2A by imparting a specified torque to the belt unwinding shaft 81. The reel motor 87 is controlled in a manner that the polishing tape 2A is conveyed at a constant speed. The speed at which the polishing tape 2A is conveyed can be changed by changing the rotation speed of the belt reel reel 82.

In one embodiment, the polishing device may include a belt conveying device for conveying the polishing belt 2A in its longitudinal direction in addition to the belt unwinding shaft 81, the belt rewinding shaft 82, and the reel motors 86 and 87. In another embodiment, the positions of the belt unwinding shaft 81 and the belt rewinding shaft 82 may be oppositely arranged.

Wafer W is ground as follows. The wafer W is rotated by rotating the rollers 75A to 75D while holding the peripheral portion of the wafer W with a plurality of rollers 75A to 75D. The polishing tapes 2A and 2B are transported to the polishing heads 10A to 10D by the polishing tape supply mechanisms 72A and 72B. At the same time, the pressing members 12 of the polishing heads 10A to 10D press the polishing tapes 2A and 2B to the first surface 5a of the wafer W. The first surface 5a of the wafer W is polished.

The above-mentioned pressing member 12 and the groove 50 are applicable to a polishing head for polishing the back side of a wafer, but the above-mentioned pressing member 12 and the groove 50 can also be applied to a polishing head for polishing the edge of a wafer. For example, as shown in FIG. 20 , the pressing member 12 and the groove 50 can also be bent along the edge of the wafer W. The pressing member 12 presses the polishing tape 2 to the edge of the wafer W, and at the same time, the polishing head 10 moves outward in the radial direction of the wafer W as shown by the arrow X. The movement of the polishing head 10 in the direction X is achieved by a polishing head moving mechanism not shown in the figure.

The above-mentioned embodiments are described so that a person having ordinary knowledge in the technical field to which the present invention belongs can implement the present invention. Of course, those with ordinary knowledge in this technical field can form various variations of the above-described embodiments, and the technical ideas of the present invention can also be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, but should be interpreted in the broadest scope based on the technical ideas defined by the patent claims. [Industrial availability]

The present invention can be used in a polishing head for pressing a polishing tape onto a substrate such as a wafer. In addition, the present invention can be used in a polishing device for polishing a substrate using such a polishing head.

2,2A,2B: Grinding belt 3a: Grinding surface 5a: First surface 5b: Second surface 10,10A~10D: Grinding head 12: Pressing member 12a: Both ends 15: Actuator 16: Active shaft 18: Housing 18A: Housing body 18B: Cover 20: Pressure chamber 25: Partition membrane 30: Pressing member holder 30a: Pressing surface 30b,30c: Inclined surface 32: Ball spline nut 38: Skirt 45: Pressing member stopper 46: Screw 50: Groove 50A: First part 50B: Second part 51: Side wall 52: Bottom surface 55: Spacer 70: Substrate holding part 72A, 72B: Polishing tape supply mechanism 75A~75D: Roller 78A, 78B: Support member 81: Tape unwinding reel 82: Tape rewinding reel 83: Guide roller 86, 87: Reel motor 500: Roller 502: Polishing tape 505: Polishing head 512: Pressing ring 513: Pressing ring holder CL: Arrow D1: First width D2: Second width PR1, PR2: Effective polishing range W: Wafer X: Arrow, direction Z: Arrow, direction of travel

FIG. 1 is a perspective view showing an embodiment of a polishing head for polishing a wafer by pressing a polishing tape as an example of a polishing tool onto a surface of a wafer as an example of a substrate. FIG. 2 is a cross-sectional view of the polishing head shown in FIG. 1. FIG. 3 is a state diagram showing a pressing member and a pressing member stopper removed from a pressing member holder. FIG. 4 is a top view showing an embodiment of a groove. FIG. 5 is a cross-sectional view taken along line A-A of FIG. 4. FIG. 6 is a cross-sectional view taken along line B-B of FIG. 4. FIG. 7 is a top view showing an embodiment of a pressing member embedded in a groove. FIG. 8 is a cross-sectional view taken along line C-C of FIG. 7. FIG. 9 is a cross-sectional view taken along line D-D of FIG. 7. FIG. 10A is a diagram showing an example of a polishing profile when a polishing head having a first portion without a groove is used. FIG. 10B is a diagram showing an example of a grinding profile when the grinding head of FIG. 7 having a first portion with a groove is used. FIG. 11 is a top view showing an embodiment of a grinding head in which a spacer is arranged only on one side of a pressing member. FIG. 12 is a diagram showing another embodiment of the first and second portions of the groove. FIG. 13 is a diagram showing another embodiment of the first and second portions of the groove. FIG. 14 is a top view showing an embodiment of a grinding head having two grooves and two pressing members. FIG. 15 is a top view showing another embodiment of the groove. FIG. 16 is a cross-sectional view taken along line E-E of FIG. 15. FIG. 17 is a cross-sectional view taken along line F-F of FIG. 15. FIG. 18 is a side view showing an embodiment of a grinding device. FIG. 19 is a top view of the polishing device shown in FIG. 18 . FIG. 20 is a top view showing an embodiment of a polishing head having a curved groove and a pressing member. FIG. 21 is a top view of a conventional polishing device. FIG. 22 is a side view of the conventional polishing device shown in FIG. 21 . FIG. 23 is a three-dimensional view of a conventional polishing head. FIG. 24 is an explanatory diagram of the deformation of the pressing ring.

2: Grinding belt

10: Grinding head

12: Press components

18: Shell

30: Pressing member holder

30a: Press the surface

30b,30c: Inclined surface

38: Skirt

45: Press component stopper

46: Screws

50: ditch

Z: Arrow, direction of travel

Claims (8)

A grinding head is used for grinding substrates and has: a pressing member, which presses the abrasive tape against the substrate; A pressing member holder, which holds the aforementioned pressing member; and an actuator connected to the aforementioned pressing member holder and imparting a pressing force to the aforementioned pressing member; The aforementioned pressing member is in the shape of a rod with both ends. The pressing member is fitted into a groove formed on a pressing surface of the pressing member holder. A polishing head as claimed in claim 1, wherein the two side walls of the aforementioned groove are parallel to each other. A polishing head as claimed in claim 1 or 2, wherein the groove comprises: a first portion having a first width smaller than the width of the pressing member; and a second portion having a second width larger than the first width; the pressing member is clamped by the first portion. The grinding head according to claim 3, wherein the first part includes a spacer, which is arranged on at least one side of the pressing member. The grinding head of claim 4, wherein the spacer is a plate that can be attached to and detached from the pressing member holder. As in claim 4, the pressing member holder has a protrusion that protrudes toward the inner side of the groove, and the spacer is formed by the protrusion. A grinding head as in any one of claims 1 to 6, further comprising a pressing member stopper, which is disposed at both ends of the pressing member. A grinding device having: a substrate holding portion that holds the substrate; and The polishing head according to any one of claims 1 to 7, which is used for polishing the aforementioned substrate.

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