WO2023167001A1 - Polishing head and polishing device - Google Patents

Polishing head and polishing device Download PDF

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Publication number
WO2023167001A1
WO2023167001A1 PCT/JP2023/005452 JP2023005452W WO2023167001A1 WO 2023167001 A1 WO2023167001 A1 WO 2023167001A1 JP 2023005452 W JP2023005452 W JP 2023005452W WO 2023167001 A1 WO2023167001 A1 WO 2023167001A1
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WO
WIPO (PCT)
Prior art keywords
pressing member
polishing
pressing
wafer
groove
Prior art date
Application number
PCT/JP2023/005452
Other languages
French (fr)
Japanese (ja)
Inventor
誠 柏木
真於 藤澤
Original Assignee
株式会社荏原製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社荏原製作所 filed Critical 株式会社荏原製作所
Publication of WO2023167001A1 publication Critical patent/WO2023167001A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B24B21/06—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving members with limited contact area pressing the belt against the work, e.g. shoes sweeping across the whole area to be ground
    • B24B21/08—Pressure shoes; Pressure members, e.g. backing belts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Definitions

  • the present invention relates to a polishing head for pressing a polishing tape against a substrate such as a wafer.
  • the present invention also relates to a polishing apparatus for polishing a substrate with such a polishing head.
  • Foreign matter such as fine particles and dust as described above may also adhere to the back surface (non-device surface) of the wafer. If such foreign matter adheres to the back surface of the wafer, the wafer moves away from the stage reference plane of the exposure apparatus, causing the wafer front surface to tilt with respect to the stage reference plane, resulting in deviations in patterning and focal length. becomes. In order to prevent such problems, it is necessary to remove the foreign matter adhering to the back surface of the wafer.
  • FIG. 21 is a top view of a conventional polishing apparatus
  • FIG. 22 is a side view of the conventional polishing apparatus shown in FIG.
  • the polishing apparatus rotates the wafer W by rotating the rollers 500 themselves while holding the peripheral portion of the wafer W with a plurality of rollers 500 .
  • the polishing tape 502 is arranged on the back side of the wafer W. As shown in FIG. The polishing tape 502 advances in the direction indicated by the arrow Z.
  • a plurality of polishing heads 505 are arranged in the diameter direction of the wafer W, and the rear surface of the wafer W is polished by pressing the polishing tape 502 against the rear surface of the wafer W with these polishing heads 505 .
  • the polishing tape 502 pressed against the back surface of the wafer W can remove foreign matter from the back surface of the wafer W.
  • FIG. 23 is a perspective view of the polishing head 505.
  • the polishing head 505 has a pressing ring 512 that presses the polishing tape 502 against the back surface of the wafer W.
  • the pressing ring 512 is made of an elastic material such as silicone rubber.
  • the pressure ring 512 is fitted into the pressure ring holder 513 under tension. The pressing ring 512 pushes the polishing tape 502 toward the wafer W, and the polishing tape 502 can polish the wafer W by receiving the pressing force from the pressing ring 512 .
  • the pressing ring 512 has elasticity, when the pressing ring 512 is stretched and hung on the pressing ring holder 513, it is slightly deformed as indicated by the dotted line in FIG. Due to this deformation of the pressing ring 512, the actual effective polishing range PR2 becomes smaller than the target effective polishing range PR1. As a result, the polishing tape 502 may not polish the target area of the wafer W uniformly.
  • the present invention provides a polishing head capable of uniformly pressing a polishing tape against a substrate such as a wafer with a pressing member.
  • the present invention also provides a polishing apparatus equipped with such a polishing head.
  • a polishing head for polishing a substrate comprises: a pressing member for pressing a polishing tape against the substrate; a pressing member holder for holding the pressing member;
  • the pressing member has a rod shape having both ends, and the pressing member is fitted into a groove formed in the pressing surface of the pressing member holder. is provided.
  • the sidewalls of the groove are parallel to each other.
  • the groove has a first portion having a first width smaller than the width of the pressing member and a second portion having a second width larger than the first width, and the pressing member sandwiched between the first parts.
  • the first portion includes a spacer arranged on at least one side of the pressing member.
  • the spacer is a plate material that can be attached to and detached from the pressing member holder.
  • the pressing member holder has a protruding portion protruding toward the inside of the groove, and the spacer comprises the protruding portion.
  • the polishing head further includes pressing member stoppers arranged at both ends of the pressing member.
  • a polishing apparatus that includes a substrate holding part that holds a substrate, and the above polishing head.
  • the pressing member is rod-shaped with both ends, no tension is generated in the pressing member in its longitudinal direction when the pressing member is attached to the pressing member holder. Therefore, the pressing member is not substantially deformed, it is possible to polish the target effective polishing area, and the polishing tape can be uniformly pressed against the substrate.
  • the portion of the pressing member held by the narrow first portion is larger than the portion of the pressing member held by the wide second portion. , not easy to deform when the polishing tape is pressed against the substrate.
  • the polishing tape can polish the substrate at a high polishing rate by receiving a pressing force from the portion of the pressing member held by the first portion.
  • the position and length of the first portion allows for adjustment of the polishing rate distribution, resulting in a uniform polishing profile.
  • FIG. 1 is a perspective view showing an embodiment of a polishing head for polishing a wafer by pressing a polishing tape, which is an example of a polishing tool, against the surface of a wafer, which is an example of a substrate;
  • FIG. 2 is a cross-sectional view of the polishing head shown in FIG. 1;
  • FIG. FIG. 5 is a diagram showing a state in which the pressing member and the pressing member stopper are removed from the pressing member holder;
  • FIG. 10 is a top view of one embodiment of a groove;
  • FIG. 5 is a cross-sectional view taken along line AA of FIG. 4;
  • FIG. 5 is a cross-sectional view taken along line BB of FIG. 4;
  • FIG. 11 is a top view showing one embodiment of a pressing member fitted in a groove;
  • FIG. 8 is a cross-sectional view taken along line CC of FIG. 7;
  • FIG. 8 is a cross-sectional view taken along line DD of FIG. 7;
  • FIG. 10A is a diagram showing an example of a polishing profile when using a polishing head without a groove first portion.
  • FIG. 10B shows an example of a polishing profile using the polishing head of FIG. 7 with the first portion of the groove.
  • FIG. 4 is a top view of an embodiment of a polishing head with spacers located on only one side of the pressing member;
  • Fig. 10 shows another embodiment of the first and second parts of the groove;
  • FIG. 11 illustrates yet another embodiment of the first and second portions of the groove;
  • FIG. 10A is a diagram showing an example of a polishing profile when using a polishing head without a groove first portion.
  • FIG. 10B shows an example of a polishing profile using
  • FIG. 10 is a top view of an embodiment of a polishing head with two grooves and two pressing members;
  • FIG. 11 is a top view showing another embodiment of grooves;
  • FIG. 16 is a cross-sectional view taken along line EE of FIG. 15;
  • FIG. 16 is a cross-sectional view taken along line FF of FIG. 15;
  • FIG. 19 is a top view of the polishing apparatus shown in FIG. 18;
  • FIG. 10 is a top view of one embodiment of a polishing head with curved grooves and pressing members; It is a top view of a conventional polishing apparatus.
  • FIG. 1 is a perspective view showing an embodiment of a polishing head 10 for polishing a wafer W by pressing a polishing tape 2, which is an example of a polishing tool, against the surface of a wafer W, which is an example of a substrate
  • FIG. 2 is a cross-sectional view of the polishing head 10 shown in FIG. 1;
  • the polishing head 10 of this embodiment is arranged below the wafer W and the polishing tape 2, and is arranged so as to press the polishing tape 2 against the back surface of the wafer W from its back side.
  • the polishing head 10 includes a pressing member 12 as a pressing member for pressing the polishing tape 2 against the wafer W, and the pressing member 12 is moved in a predetermined pressing direction indicated by an arrow CL to apply a pressing force to the pressing member 12. and a housing 18 in which the actuator 15 is arranged.
  • the actuator 15 includes a movable shaft 16 connected to the pressing member 12 and a diaphragm 25 forming a pressure chamber 20 between the end of the movable shaft 16 and the housing 18 .
  • the movable shaft 16 and the partition membrane 25 are arranged inside the housing 18 .
  • the polishing head 10 further includes a pressing member holder 30 that holds the pressing member 12 .
  • the pressing member holder 30 is connected to the movable shaft 16 and is movable together with the movable shaft 16 .
  • the pressing member holder 30 has a groove 50 on its pressing surface 30 a , and the pressing member 12 is fitted in the groove 50 .
  • the pressing member holder 30 has inclined surfaces 30b and 30c that slope outward from both sides of the pressing surface 30a.
  • the movable shaft 16 is movable in its axial direction within the housing 18, and the movable shaft 16 can raise the pressing member 12 in the pressing direction indicated by the arrow CL.
  • the pressing member 12 faces the back side of the polishing tape 2 .
  • the pressing member 12 contacts the back side of the polishing tape 2 .
  • the pressing member 12 presses the polishing surface of the polishing tape 2 against the rear surface of the wafer W to polish the rear surface of the wafer W with the polishing tape 2 .
  • the back side of the polishing tape 2 is supported by the pressing member 12 .
  • the back side of the polishing tape 2 is the surface opposite to the polishing surface having abrasive grains.
  • the polishing tape 2 is fed in its longitudinal direction at a predetermined speed.
  • the movable shaft 16 is composed of a ball spline shaft.
  • a ball spline nut 32 is arranged in the housing 18 , and the movable shaft 16 is supported by the ball spline nut 32 so as to be movable in the axial direction of the movable shaft 16 .
  • movable shaft 16 may be movably supported on the inner surface of housing 18 .
  • the housing 18 includes a housing main body 18A having a space inside which the movable shaft 16 is accommodated, and a lid 18B closing the space.
  • the lid 18B is detachably fixed to the housing body 18A with screws (not shown).
  • the actuator 15 that generates a pressing force for pressing the polishing tape 2 against the wafer W includes the movable shaft 16 and the partition membrane 25 .
  • the partition membrane 25 is in contact with the end (lower end) of the movable shaft 16, and the edge of the partition membrane 25 is sandwiched between the housing main body 18A and the lid 18B.
  • the partition membrane 25 is only in contact with the movable shaft 16 and is not fixed to the movable shaft 16 .
  • the partition membrane 25 is made of a flexible material. Examples of materials forming the partition membrane 25 include chloroprene rubber, fluororubber, and silicone rubber.
  • the pressure chamber 20 communicates with a compressed gas supply line (not shown), and compressed gas (for example, compressed air) is supplied into the pressure chamber 20 from the compressed gas supply line.
  • the polishing head 10 may further include a distance sensor that measures the relative movement distance of the movable shaft 16 with respect to the housing 18 .
  • the pressure chamber 20 is opened to the atmosphere.
  • a skirt 38 is fixed to the pressing member holder 30 .
  • the skirt 38 extends downwardly from the pressure member holder 30 and surrounds the upper portion of the housing 18 .
  • the skirt 38 is cylindrical in this embodiment, it may have other shapes as long as it can surround the upper portion of the housing 18 .
  • the skirt 38 can prevent liquid such as pure water used for polishing the wafer W from entering the housing 18 .
  • the pressing member 12 has a bar shape with both ends 12a, and the pressing member 12 is detachably held by a pressing member holder 30. As shown in FIG. In this embodiment, the pressing member 12 extends obliquely and linearly with respect to the traveling direction Z of the polishing tape 2 .
  • the pressing member 12 is made of an elastic material. Examples of materials forming the pressing member 12 include rubber such as fluororubber, silicone rubber, and ethylene propylene diene rubber.
  • the cross section of the pressing member 12 has a circular shape.
  • the pressing member 12 is not limited to this embodiment, and may have other shapes or be made of other materials.
  • a plurality of pressing members 12 for pressing the polishing tape 2 against the wafer W may be provided.
  • the pressing member 12 may have a curved shape instead of a straight shape.
  • the polishing head 10 of this embodiment includes two pressing member stoppers 45 arranged at both ends of the pressing member 12 . These pressing member stoppers 45 are detachably fixed to the pressing member holder 30 by screws 46 .
  • the pressing member stopper 45 is made of a hard material such as resin or metal.
  • the pressing member stopper 45 has a function of positioning the pressing member 12 in the longitudinal direction of the pressing member 12 .
  • the polishing tape 2 is fed at a predetermined speed in the longitudinal direction of the polishing tape 2 as indicated by the arrow Z.
  • the pressing member 12 of the present embodiment extends obliquely with respect to the longitudinal direction (advancing direction Z) of the polishing tape 2 .
  • the pressing member 12 presses the polishing tape 2 against the wafer W from its rear side.
  • FIG. 3 is a diagram showing a state in which the pressing member 12 and the pressing member stopper 45 are removed from the pressing member holder 30.
  • FIG. A pressing surface (an upper surface in this embodiment) 30a of the pressing member holder 30 has a groove 50 in which the pressing member 12 is fitted.
  • the groove 50 may be the same length as the pressing member 12 or longer than the pressing member 12 .
  • the length of the groove 50 is the same as the length of the pressing member 12 .
  • the term “same” includes not only completely the same but also substantially the same within the scope of common general technical knowledge.
  • the pressing member 12 is attached to the pressing member holder 30 by being fitted into the groove 50 .
  • the pressing member 12 is not fixed to the pressing member holder 30 with an adhesive or the like, and can be removed from the pressing member holder 30 as shown in FIG.
  • the pressing member 12 since the pressing member 12 has a rod shape having both ends 12a, tension is generated in the pressing member 12 in its longitudinal direction when the pressing member 12 is attached to the pressing member holder 30. do not. Therefore, the pressing member 12 is not substantially deformed, and the polishing tape 2 can be pressed against the wafer W uniformly.
  • FIG. 4 is a top view showing one embodiment of the groove 50
  • FIG. 5 is a cross-sectional view along line AA in FIG. 4
  • FIG. 6 is a cross-sectional view along line BB in FIG.
  • the groove 50 is formed in the pressing surface 30a of the pressing member holder 30 and extends from one side surface of the pressing member holder 30 to the other side surface.
  • the groove 50 is composed of two side walls 51 formed on the pressing surface 30a of the pressing member holder 30 and a bottom surface 52 positioned between the side walls 51. 51 are flat and parallel to each other.
  • the cross section of the groove 50 of this embodiment is rectangular. If the side walls 51 of the groove 50 are parallel to each other, the bottom surface 52 of the groove 50 need not be flat.
  • the groove 50 has a first portion 50A having a first width D1 smaller than the width of the pressing member 12 and a second portion 50B having a second width D2 larger than the first width D1.
  • the first portion 50A is located in the center of the pressing member 12, and the second portions 50B are located at both ends of the pressing member 12. As shown in FIG. The first portion 50A is located between the two second portions 50B.
  • the first portion 50A includes spacers 55 arranged on both sides of the pressing member 12. As shown in FIG. Both side walls 51 forming the first portion 50A are formed of spacers 55. As shown in FIG.
  • the spacer 55 of this embodiment is composed of a plate material (for example, a shim) detachably attached to the pressing member holder 30 . These spacers 55 constitute the first portion 50A of the groove 50 and are in contact with both sides of the pressing member 12 . The position, thickness and length of spacer 55 can be changed. Therefore, the position, width and length of the first portion 50A of the groove 50 can also be changed.
  • the spacer 55 is made of resin, metal, or the like.
  • both side walls 51 forming the second portion 50B are formed from the surface of the pressing member holder 30.
  • the width D2 of the second portion 50B of the groove 50 is larger than the width D1 of the first portion 50A of the groove 50 shown in FIG.
  • FIG. 7 is a top view showing one embodiment of the pressing member 12 fitted in the groove 50
  • FIG. 8 is a cross-sectional view taken along line CC of FIG. 7
  • FIG. 9 is a cross-sectional view taken along line DD of FIG. is.
  • a width D1 of the first portion 50A of the groove 50 is smaller than the width of the pressing member 12 before being fitted into the groove 50 . Therefore, the pressing member 12 made of an elastic material is sandwiched between the first portions 50A of the grooves 50 and held by the first portions 50A.
  • the width D2 of the second portion 50B of the groove 50 is slightly larger than the width of the pressing member 12 before being fitted into the groove 50 . Therefore, the pressing member 12 is not held by the second portion 50B.
  • the width D2 of the second portion 50B may be the same as or smaller than the width of the pressing member 12. good.
  • the portion of the pressing member 12 held by the narrow first portion 50A is not the same as the portion of the pressing member 12 held by the wide second portion 50B.
  • the polishing tape 2 can polish the wafer W at a high polishing rate by receiving a pressing force from the portion of the pressing member 12 held by the first portion 50A.
  • the position and length of the first portion 50A makes it possible to adjust the polishing rate distribution, and as a result, a uniform polishing profile can be achieved.
  • FIG. 10A shows an example of a polishing profile when using the polishing head 10 without the first portion 50A of the groove 50
  • FIG. 10B shows the polishing head 10 of FIG. 7 with the first portion 50A of the groove 50
  • the polishing rate of the region corresponding to the center of the pressing member 12 is lower than the polishing rate of the regions corresponding to both ends of the pressing member 12 .
  • the polishing rate is substantially uniform over the entire length of the pressing member 12 .
  • the spacers 55 are located on both sides of the pressing member 12, but in one embodiment, the spacers 55 are positioned on the pressing member 12 as shown in FIG. It may be arranged only on one side. Even in this case, the width of the first portion 50A of the groove 50 is smaller than the width of the pressing member 12 and smaller than the width of the second portion 50B of the groove 50 . Since the pressing member 12 is sandwiched by the first portion 50A of the groove 50, the portion of the pressing member 12 held by the narrow first portion 50A is the portion of the pressing member 12 held by the wide second portion 50B. When the polishing tape 2 is pressed against the wafer W, it is difficult to deform compared to .
  • FIG. 12 and 13 are diagrams showing other embodiments of the first portion 50A and the second portion 50B of the groove 50.
  • FIG. 12 the second portion 50B of the groove 50 is located in the center of the pressing member 12 and the two first portions 50A of the groove 50 are located at opposite ends of the pressing member 12 .
  • the spacers 55 forming the first portion 50A are in contact with both ends of the pressing member 12 .
  • the first portion 50A and the second portion 50B of the groove 50 are located at opposite ends of the pressing member 12.
  • the spacer 55 forming the first portion 50A of the groove 50 is in contact with one end of the pressing member 12, and the second portion 50B of the groove 50 is positioned at the other end of the pressing member 12. As shown in FIG.
  • the polishing head 10 may include two grooves 50 and two pressing members 12 fitted in the grooves 50, respectively. Since the configuration of each groove 50 and each pressing member 12 is the same as the embodiment described with reference to FIGS. 4 to 9, redundant description thereof will be omitted. The modifications described with reference to FIGS. 11 to 13 are also applicable to this embodiment shown in FIG.
  • FIG. 15 is a top view showing another embodiment of the groove 50
  • FIG. 16 is a cross-sectional view taken along line EE in FIG.
  • FIG. 17 is a cross-sectional view along line FF in FIG.
  • the spacer 55 forming the first portion 50A of the groove 50 is made up of a protruding portion of the pressing member holder 30 that protrudes toward the inside of the groove 50 .
  • the relationship between the width D1 of the first portion 50A, the width of the pressing member 12, and the width D2 of the second portion 50B is the same as in the embodiment described with reference to FIGS. Description is omitted.
  • the modifications described with reference to FIGS. 11 to 13 are also applicable to the present embodiment shown in FIGS. 15 to 17.
  • FIG. 11 to 13 are also applicable to the present embodiment shown in FIGS. 15 to 17.
  • FIG. 11 to 13 are also applicable to the present embodiment shown in FIGS. 15 to 17.
  • FIG. 11 to 13 are also applicable to the present embodiment shown in FIGS. 15 to 17.
  • FIG. 18 is a side view showing one embodiment of a polishing apparatus
  • FIG. 19 is a top view of the polishing apparatus shown in FIG.
  • the polishing apparatus shown in FIGS. 18 and 19 includes a substrate holding portion 70 that holds and rotates a wafer W, and polishing tapes 2A and 2B that are brought into contact with the first surface 5a of the wafer W held by the substrate holding portion 70.
  • a mechanism 72A and a polishing tape supply mechanism 72B for supplying the polishing tape 2B to the polishing heads 10C and 10D and recovering the polishing tape 2B from the polishing heads 10C and 10D are provided.
  • Polishing heads 10A and 10C have the same configuration as polishing head 10 described with reference to FIG. 14, and polishing heads 10B and 10D have the same configuration as polishing head 10 described with reference to FIG. there is Polishing tapes 2A and 2B have the same configuration.
  • the first surface 5a of the wafer W is the back surface of the wafer W on which no devices are formed or devices are not planned to be formed, that is, the non-device surface.
  • a second side 5b of the wafer W, opposite the first side 5a, is the side on which the devices are or are to be formed, ie the device side.
  • the wafer W is horizontally supported by the substrate holder 70 with the first surface 5a facing downward.
  • the substrate holding unit 70 includes a plurality of rollers 75A, 75B, 75C, and 75D that can contact the peripheral edge of the wafer W, and a roller rotating device (not shown) for rotating the rollers 75A to 75D at the same speed.
  • a roller rotating device not shown for rotating the rollers 75A to 75D at the same speed.
  • rollers 75A-75D are provided, but five or more rollers may be provided.
  • the polishing heads 10A and 10B are supported by a supporting member 78A, and the polishing heads 10C and 10D are supported by a supporting member 78B.
  • a plurality of polishing heads 10A to 10D are arranged below the wafer W held by the substrate holding part . These polishing heads 10A to 10D are arranged in the diameter direction of the wafer W. As shown in FIG. Although four polishing heads 10A to 10D are provided in this embodiment, the number of polishing heads is not limited to this embodiment. In one embodiment, a single polishing head may be provided.
  • the polishing tape supply mechanism 72A includes a tape unwinding reel 81 to which one end of the polishing tape 2A is connected, a tape take-up reel 82 to which the other end of the polishing tape 2A is connected, and a plurality of reels for guiding the advancing direction of the polishing tape 2A. of guide rollers 83 are provided. Tape take-up reel 81 and tape take-up reel 82 are coupled to reel motors 86 and 87, respectively.
  • the polishing tape 2A is fed from the tape take-up reel 81 to the tape take-up reel 82 via the polishing heads 10A and 10B.
  • the polishing tape 2A is supplied above the polishing heads 10A and 10B so that the polishing surface 3a of the polishing tape 2A faces the first surface 5a of the wafer W.
  • the reel motor 86 can apply tension to the polishing tape 2A by applying a predetermined torque to the tape supply reel 81 .
  • the reel motor 87 is controlled to feed the polishing tape 2A at a constant speed.
  • the feeding speed of the polishing tape 2A can be changed by changing the rotation speed of the tape take-up reel 82.
  • the polishing apparatus may include a tape feeding device that feeds the polishing tape 2A in its longitudinal direction, separately from the tape supply reel 81, the tape take-up reel 82, and the reel motors 86, 87.
  • the positions of tape take-up reel 81 and tape take-up reel 82 may be reversed.
  • the wafer W is polished as follows.
  • the wafer W is rotated by rotating these rollers 75A to 75D while holding the peripheral portion of the wafer W with a plurality of rollers 75A to 75D.
  • the polishing tapes 2A and 2B are fed to the polishing heads 10A to 10D by the polishing tape supply mechanisms 72A and 72B, the pressing members 12 of the polishing heads 10A to 10D press the polishing tapes 2A and 2B against the first surface 5a of the wafer W.
  • the first surface 5a of the wafer W is polished by using the
  • the pressing member 12 and the groove 50 described above are applied to a polishing head for polishing the back surface of the wafer. It can also be applied to the head.
  • the pressing member 12 and groove 50 may be curved along the edge of the wafer W, as shown in FIG. While pressing the polishing tape 2 against the edge of the wafer W by the pressing member 12 , the polishing head 10 moves outward in the radial direction of the wafer W as indicated by the arrow X. As shown in FIG. Movement of the polishing head 10 in the direction X is achieved by a polishing head moving mechanism (not shown).
  • the present invention can be used for a polishing head for pressing a polishing tape against a substrate such as a wafer. Also, the present invention can be used in a polishing apparatus for polishing a substrate with such a polishing head.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The present invention pertains to a polishing head for pressing a polishing tape against a substrate such as a wafer. The present invention also pertains to a polishing device for polishing a substrate using such a polishing head. The polishing head (10) for polishing the substrate (W) comprises: a pressing member (12) for pressing the polishing tape (2) against the substrate (W); a pressing member holder (30) for holding the pressing member (12); and an actuator (15) connected to the pressing member holder (30) and imparting a pressing force to the pressing member (12). The pressing member (12) is formed in a rod-shape having both ends (12a), and the pressing member (12) is fitted to a groove (50) formed in a pressing surface (30a) of the pressing member holder (30).

Description

研磨ヘッドおよび研磨装置Polishing head and polishing equipment
　本発明は、ウェーハなどの基板に研磨テープを押し付けるための研磨ヘッドに関する。また、本発明はそのような研磨ヘッドで基板を研磨するための研磨装置に関する。 The present invention relates to a polishing head for pressing a polishing tape against a substrate such as a wafer. The present invention also relates to a polishing apparatus for polishing a substrate with such a polishing head.
　近年、メモリー回路、ロジック回路、イメージセンサ（例えばＣＭＯＳセンサー）などのデバイスは、より高集積化されつつある。これらのデバイスを形成する工程においては、微粒子や塵埃などの異物がデバイスに付着することがある。デバイスに付着した異物は、配線間の短絡や回路の不具合を引き起こしてしまう。したがって、デバイスの信頼性を向上させるために、デバイスが形成されたウェーハを洗浄して、ウェーハ上の異物を除去することが必要とされる。 In recent years, devices such as memory circuits, logic circuits, and image sensors (for example, CMOS sensors) are becoming more highly integrated. In the process of forming these devices, foreign matter such as fine particles and dust may adhere to the devices. Foreign matter adhering to the device causes a short circuit between wirings and a malfunction of the circuit. Therefore, in order to improve the reliability of devices, it is necessary to clean the wafer on which the devices are formed to remove foreign substances on the wafer.
　ウェーハの裏面（非デバイス面）にも、上述したような微粒子や粉塵などの異物が付着することがある。このような異物がウェーハの裏面に付着すると、ウェーハが露光装置のステージ基準面から離間することでウェーハ表面がステージ基準面に対して傾き、結果として、パターニングのずれや焦点距離のずれが生じることとなる。このような問題を防止するために、ウェーハの裏面に付着した異物を除去することが必要とされる。 Foreign matter such as fine particles and dust as described above may also adhere to the back surface (non-device surface) of the wafer. If such foreign matter adheres to the back surface of the wafer, the wafer moves away from the stage reference plane of the exposure apparatus, causing the wafer front surface to tilt with respect to the stage reference plane, resulting in deviations in patterning and focal length. becomes. In order to prevent such problems, it is necessary to remove the foreign matter adhering to the back surface of the wafer.
　そこで、図２１に示すように、ウェーハの裏面を研磨テープで研磨する研磨装置が使用されている。図２１は、従来の研磨装置の上面図であり、図２２は図２１に示す従来の研磨装置の側面図である。研磨装置は、複数のローラー５００によりウェーハＷの周縁部を保持しながら、これらローラー５００自身が回転することで、ウェーハＷを回転させる。研磨テープ５０２は、ウェーハＷの裏面側に配置されている。研磨テープ５０２は、矢印Ｚで示す方向に進行する。 Therefore, as shown in FIG. 21, a polishing apparatus is used that polishes the back surface of the wafer with a polishing tape. 21 is a top view of a conventional polishing apparatus, and FIG. 22 is a side view of the conventional polishing apparatus shown in FIG. The polishing apparatus rotates the wafer W by rotating the rollers 500 themselves while holding the peripheral portion of the wafer W with a plurality of rollers 500 . The polishing tape 502 is arranged on the back side of the wafer W. As shown in FIG. The polishing tape 502 advances in the direction indicated by the arrow Z. FIG.
　複数の研磨ヘッド５０５はウェーハＷの直径方向に配列されており、これらの研磨ヘッド５０５で研磨テープ５０２をウェーハＷの裏面に対して押し付けることにより、ウェーハＷの裏面を研磨する。ウェーハＷの裏面に押し付けられた研磨テープ５０２は、ウェーハＷの裏面から異物を除去することができる。 A plurality of polishing heads 505 are arranged in the diameter direction of the wafer W, and the rear surface of the wafer W is polished by pressing the polishing tape 502 against the rear surface of the wafer W with these polishing heads 505 . The polishing tape 502 pressed against the back surface of the wafer W can remove foreign matter from the back surface of the wafer W. FIG.
　図２３は、研磨ヘッド５０５の斜視図である。図２３に示すように、研磨ヘッド５０５は、研磨テープ５０２をウェーハＷの裏面に押し付ける押圧リング５１２を有している。押圧リング５１２は、シリコーンゴムなどの弾性材料から構成されている。押圧リング５１２は、テンションが加えられた状態で押圧リングホルダ５１３に嵌め込まれている。押圧リング５１２は、研磨テープ５０２をウェーハＷに向かって押し上げ、研磨テープ５０２は、押圧リング５１２からの押圧力を受けてウェーハＷを研磨することができる。 23 is a perspective view of the polishing head 505. FIG. As shown in FIG. 23, the polishing head 505 has a pressing ring 512 that presses the polishing tape 502 against the back surface of the wafer W. As shown in FIG. The pressing ring 512 is made of an elastic material such as silicone rubber. The pressure ring 512 is fitted into the pressure ring holder 513 under tension. The pressing ring 512 pushes the polishing tape 502 toward the wafer W, and the polishing tape 502 can polish the wafer W by receiving the pressing force from the pressing ring 512 .
特開２０２１－１２２８９５号公報JP 2021-122895 A
　しかしながら、押圧リング５１２は、弾性を有しているために、押圧リング５１２を引き伸ばして押圧リングホルダ５１３に掛けるとき、図２４の点線で示すように、やや変形する。この押圧リング５１２の変形のため、目標の有効研磨範囲ＰＲ１に比べて、実際の有効研磨範囲ＰＲ２が小さくなってしまう。結果として、研磨テープ５０２はウェーハＷの目標領域を均一に研磨できないことがあった。 However, since the pressing ring 512 has elasticity, when the pressing ring 512 is stretched and hung on the pressing ring holder 513, it is slightly deformed as indicated by the dotted line in FIG. Due to this deformation of the pressing ring 512, the actual effective polishing range PR2 becomes smaller than the target effective polishing range PR1. As a result, the polishing tape 502 may not polish the target area of the wafer W uniformly.
　そこで、本発明は、押圧部材で研磨テープをウェーハなどの基板に対して均一に押し付けることができる研磨ヘッドを提供する。また、本発明は、そのような研磨ヘッドを備えた研磨装置を提供する。 Accordingly, the present invention provides a polishing head capable of uniformly pressing a polishing tape against a substrate such as a wafer with a pressing member. The present invention also provides a polishing apparatus equipped with such a polishing head.
　一態様では、基板を研磨するための研磨ヘッドであって、研磨テープを基板に対して押し付ける押圧部材と、前記押圧部材を保持する押圧部材ホルダと、前記押圧部材ホルダに連結され、前記押圧部材に押圧力を付与するアクチュエータを備え、前記押圧部材は、両端を有する棒形状であり、前記押圧部材は、前記押圧部材ホルダの押圧面に形成されている溝に嵌合している、研磨ヘッドが提供される。 In one aspect, a polishing head for polishing a substrate comprises: a pressing member for pressing a polishing tape against the substrate; a pressing member holder for holding the pressing member; The pressing member has a rod shape having both ends, and the pressing member is fitted into a groove formed in the pressing surface of the pressing member holder. is provided.
　一態様では、前記溝の両側壁は、互いに平行である。
　一態様では、前記溝は、前記押圧部材の幅よりも小さい第１幅を有する第１部分と、前記第１幅よりも大きい第２幅を有する第２部分を有し、前記押圧部材は前記第１部分に挟まれている。
　一態様では、前記第１部分は、前記押圧部材の少なくとも一方側に配置されたスペーサを含む。
　一態様では、前記スペーサは、前記押圧部材ホルダに着脱可能な板材である。
　一態様では、前記押圧部材ホルダは、前記溝の内側に向かって突出する突出部を有しており、前記スペーサは前記突出部から構成されている。
　一態様では、前記研磨ヘッドは、前記押圧部材の両端に配置された押圧部材ストッパをさらに備えている。 In one aspect, the sidewalls of the groove are parallel to each other.
In one aspect, the groove has a first portion having a first width smaller than the width of the pressing member and a second portion having a second width larger than the first width, and the pressing member sandwiched between the first parts.
In one aspect, the first portion includes a spacer arranged on at least one side of the pressing member.
In one aspect, the spacer is a plate material that can be attached to and detached from the pressing member holder.
In one aspect, the pressing member holder has a protruding portion protruding toward the inside of the groove, and the spacer comprises the protruding portion.
In one aspect, the polishing head further includes pressing member stoppers arranged at both ends of the pressing member.
　一態様では、基板を保持する基板保持部と、上記研磨ヘッドを備えている、研磨装置が提供される。 In one aspect, there is provided a polishing apparatus that includes a substrate holding part that holds a substrate, and the above polishing head.
　本発明によれば、押圧部材は両端を有する棒形状であるので、押圧部材を押圧部材ホルダに取り付けるときに、押圧部材にはその長手方向にテンションが発生しない。したがって、押圧部材は実質的に変形せず、目標の有効研磨範囲を研磨することを可能とし、研磨テープを基板に対して均一に押し付けることができる。 According to the present invention, since the pressing member is rod-shaped with both ends, no tension is generated in the pressing member in its longitudinal direction when the pressing member is attached to the pressing member holder. Therefore, the pressing member is not substantially deformed, it is possible to polish the target effective polishing area, and the polishing tape can be uniformly pressed against the substrate.
　また、押圧部材は溝の第１部分に挟まれているので、幅の狭い第１部分に保持された押圧部材の部位は、幅の広い第２部分に保持された押圧部材の部位に比べて、研磨テープを基板に押し付けたときに変形しにくい。結果として、研磨テープは、第１部分に保持された押圧部材の部位からの押付力を受けて、高い研磨レートで基板を研磨することができる。さらに、第１部分の位置および長さにより、研磨レートの分布を調整することが可能となり、結果として、均一な研磨プロファイルを達成することができる。 Further, since the pressing member is sandwiched between the first portions of the groove, the portion of the pressing member held by the narrow first portion is larger than the portion of the pressing member held by the wide second portion. , not easy to deform when the polishing tape is pressed against the substrate. As a result, the polishing tape can polish the substrate at a high polishing rate by receiving a pressing force from the portion of the pressing member held by the first portion. Furthermore, the position and length of the first portion allows for adjustment of the polishing rate distribution, resulting in a uniform polishing profile.
研磨具の一例である研磨テープを基板の一例であるウェーハの表面に押し付けてウェーハを研磨するための研磨ヘッドの一実施形態を示す斜視図である。1 is a perspective view showing an embodiment of a polishing head for polishing a wafer by pressing a polishing tape, which is an example of a polishing tool, against the surface of a wafer, which is an example of a substrate; FIG. 図１に示す研磨ヘッドの断面図である。2 is a cross-sectional view of the polishing head shown in FIG. 1; FIG. 押圧部材および押圧部材ストッパを押圧部材ホルダから取り外した状態を示す図である。FIG. 5 is a diagram showing a state in which the pressing member and the pressing member stopper are removed from the pressing member holder; 溝の一実施形態を示す上面図である。FIG. 10 is a top view of one embodiment of a groove; 図４のＡ－Ａ線断面図である。FIG. 5 is a cross-sectional view taken along line AA of FIG. 4; 図４のＢ－Ｂ線断面図である。FIG. 5 is a cross-sectional view taken along line BB of FIG. 4; 溝に嵌め込まれた押圧部材の一実施形態を示す上面図である。FIG. 11 is a top view showing one embodiment of a pressing member fitted in a groove; 図７のＣ－Ｃ線断面図である。FIG. 8 is a cross-sectional view taken along line CC of FIG. 7; 図７のＤ－Ｄ線断面図である。FIG. 8 is a cross-sectional view taken along line DD of FIG. 7; 図１０Ａは、溝の第１部分がない研磨ヘッドを用いた場合の研磨プロファイルの一例を示す図である。FIG. 10A is a diagram showing an example of a polishing profile when using a polishing head without a groove first portion. 図１０Ｂは、溝の第１部分がある図７の研磨ヘッドを用いた場合の研磨プロファイルの一例を示す図である。FIG. 10B shows an example of a polishing profile using the polishing head of FIG. 7 with the first portion of the groove. スペーサが押圧部材の一方側にのみ配置された研磨ヘッドの一実施形態を示す上面図である。FIG. 4 is a top view of an embodiment of a polishing head with spacers located on only one side of the pressing member; 溝の第１部分と第２部分の他の実施形態を示す図である。Fig. 10 shows another embodiment of the first and second parts of the groove; 溝の第１部分と第２部分のさらに他の実施形態を示す図である。FIG. 11 illustrates yet another embodiment of the first and second portions of the groove; ２つの溝および２つの押圧部材を備えた研磨ヘッドの一実施形態を示す上面図である。FIG. 10 is a top view of an embodiment of a polishing head with two grooves and two pressing members; 溝の他の実施形態を示す上面図である。FIG. 11 is a top view showing another embodiment of grooves; 図１５のＥ－Ｅ線断面図である。FIG. 16 is a cross-sectional view taken along line EE of FIG. 15; 図１５のＦ－Ｆ線断面図である。FIG. 16 is a cross-sectional view taken along line FF of FIG. 15; 研磨装置の一実施形態を示す側面図である。It is a side view which shows one Embodiment of a polishing apparatus. 図１８に示す研磨装置の上面図である。FIG. 19 is a top view of the polishing apparatus shown in FIG. 18; 湾曲した溝および押圧部材を備えた研磨ヘッドの一実施形態を示す上面図である。FIG. 10 is a top view of one embodiment of a polishing head with curved grooves and pressing members; 従来の研磨装置の上面図である。It is a top view of a conventional polishing apparatus. 図２１に示す従来の研磨装置の側面図である。FIG. 22 is a side view of the conventional polishing apparatus shown in FIG. 21; 従来の研磨ヘッドの斜視図である。1 is a perspective view of a conventional polishing head; FIG. 押圧リングが変形する様子を説明する図である。It is a figure explaining a mode that a press ring deform|transforms.
　以下、本発明の実施形態について図面を参照して説明する。図１は、研磨具の一例である研磨テープ２を基板の一例であるウェーハＷの表面に押し付けてウェーハＷを研磨するための研磨ヘッド１０の一実施形態を示す斜視図であり、図２は、図１に示す研磨ヘッド１０の断面図である。本実施形態の研磨ヘッド１０は、ウェーハＷおよび研磨テープ２の下方に配置されており、研磨テープ２をその裏側からウェーハＷの裏面に対して押圧するように配置されている。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing an embodiment of a polishing head 10 for polishing a wafer W by pressing a polishing tape 2, which is an example of a polishing tool, against the surface of a wafer W, which is an example of a substrate, and FIG. 2 is a cross-sectional view of the polishing head 10 shown in FIG. 1; FIG. The polishing head 10 of this embodiment is arranged below the wafer W and the polishing tape 2, and is arranged so as to press the polishing tape 2 against the back surface of the wafer W from its back side.
　研磨ヘッド１０は、研磨テープ２をウェーハＷに対して押し付けるための押圧部材としての押圧部材１２と、押圧部材１２を矢印ＣＬで示す所定の押圧方向に移動させ、押圧部材１２に押圧力を付与するアクチュエータ１５と、アクチュエータ１５が内部に配置されたハウジング１８を備えている。アクチュエータ１５は、押圧部材１２に連結された可動軸１６と、可動軸１６の端部とハウジング１８との間に圧力室２０を形成する隔壁膜（ダイヤフラム）２５とを備えている。可動軸１６および隔壁膜２５は、ハウジング１８内に配置されている。 The polishing head 10 includes a pressing member 12 as a pressing member for pressing the polishing tape 2 against the wafer W, and the pressing member 12 is moved in a predetermined pressing direction indicated by an arrow CL to apply a pressing force to the pressing member 12. and a housing 18 in which the actuator 15 is arranged. The actuator 15 includes a movable shaft 16 connected to the pressing member 12 and a diaphragm 25 forming a pressure chamber 20 between the end of the movable shaft 16 and the housing 18 . The movable shaft 16 and the partition membrane 25 are arranged inside the housing 18 .
　研磨ヘッド１０は、押圧部材１２を保持する押圧部材ホルダ３０をさらに備えている。押圧部材ホルダ３０は、可動軸１６に連結されており、可動軸１６と一体に移動可能である。押圧部材ホルダ３０は、その押圧面３０ａに溝５０を有しており、押圧部材１２は溝５０に嵌め込まれている。押圧部材ホルダ３０は、押圧面３０ａの両側から外側に向かって下方に傾斜する傾斜面３０ｂ，３０ｃを有する。 The polishing head 10 further includes a pressing member holder 30 that holds the pressing member 12 . The pressing member holder 30 is connected to the movable shaft 16 and is movable together with the movable shaft 16 . The pressing member holder 30 has a groove 50 on its pressing surface 30 a , and the pressing member 12 is fitted in the groove 50 . The pressing member holder 30 has inclined surfaces 30b and 30c that slope outward from both sides of the pressing surface 30a.
　図２に示すように、可動軸１６は、その軸方向にハウジング１８内で移動可能となっており、可動軸１６は、押圧部材１２を矢印ＣＬに示す押圧方向に上昇させることができる。押圧部材１２は研磨テープ２の裏側に対向している。可動軸１６が押圧部材１２を矢印ＣＬに示す押圧方向に上昇させると、押圧部材１２は、研磨テープ２の裏側に接触する。押圧部材１２は研磨テープ２の研磨面をウェーハＷの裏面に押し付けてウェーハＷの裏面を研磨テープ２で研磨する。ウェーハＷの研磨中、研磨テープ２の裏側は、押圧部材１２によって支持される。研磨テープ２の裏側は、砥粒を有する研磨面とは反対側の面である。ウェーハＷの研磨中、研磨テープ２はその長手方向に所定の速度で送られる。 As shown in FIG. 2, the movable shaft 16 is movable in its axial direction within the housing 18, and the movable shaft 16 can raise the pressing member 12 in the pressing direction indicated by the arrow CL. The pressing member 12 faces the back side of the polishing tape 2 . When the movable shaft 16 raises the pressing member 12 in the pressing direction indicated by the arrow CL, the pressing member 12 contacts the back side of the polishing tape 2 . The pressing member 12 presses the polishing surface of the polishing tape 2 against the rear surface of the wafer W to polish the rear surface of the wafer W with the polishing tape 2 . During polishing of the wafer W, the back side of the polishing tape 2 is supported by the pressing member 12 . The back side of the polishing tape 2 is the surface opposite to the polishing surface having abrasive grains. During polishing of the wafer W, the polishing tape 2 is fed in its longitudinal direction at a predetermined speed.
　本実施形態では、可動軸１６はボールスプライン軸から構成されている。ハウジング１８内にはボールスプラインナット３２が配置されており、可動軸１６はボールスプラインナット３２により可動軸１６の軸方向に移動可能に支持されている。一実施形態では、可動軸１６は、ハウジング１８の内面に移動可能に支持されてもよい。 　In this embodiment, the movable shaft 16 is composed of a ball spline shaft. A ball spline nut 32 is arranged in the housing 18 , and the movable shaft 16 is supported by the ball spline nut 32 so as to be movable in the axial direction of the movable shaft 16 . In one embodiment, movable shaft 16 may be movably supported on the inner surface of housing 18 .
　ハウジング１８は、可動軸１６が収容される空間が内部に形成されたハウジング本体１８Ａと、上記空間を塞ぐ蓋１８Ｂとを備えている。蓋１８Ｂはねじ（図示せず）によりハウジング本体１８Ａに着脱可能に固定されている。研磨テープ２をウェーハＷに対して押圧するための押圧力を発生するアクチュエータ１５は、可動軸１６および隔壁膜２５を含む。隔壁膜２５は、可動軸１６の端部（下端）に接触しており、隔壁膜２５の縁は、ハウジング本体１８Ａと蓋１８Ｂとの間に挟まれている。隔壁膜２５は可動軸１６に接触しているのみであり、可動軸１６に固定されていない。 The housing 18 includes a housing main body 18A having a space inside which the movable shaft 16 is accommodated, and a lid 18B closing the space. The lid 18B is detachably fixed to the housing body 18A with screws (not shown). The actuator 15 that generates a pressing force for pressing the polishing tape 2 against the wafer W includes the movable shaft 16 and the partition membrane 25 . The partition membrane 25 is in contact with the end (lower end) of the movable shaft 16, and the edge of the partition membrane 25 is sandwiched between the housing main body 18A and the lid 18B. The partition membrane 25 is only in contact with the movable shaft 16 and is not fixed to the movable shaft 16 .
　隔壁膜２５は、柔軟な材料から形成されている。隔壁膜２５を構成する材料の例としては、クロロプレンゴム、フッ素ゴム、シリコーンゴムが挙げられる。圧力室２０は、圧縮気体供給ライン（図示せず）に連通しており、圧縮気体供給ラインから圧縮気体（例えば圧縮空気）が圧力室２０内に供給されるようになっている。 The partition membrane 25 is made of a flexible material. Examples of materials forming the partition membrane 25 include chloroprene rubber, fluororubber, and silicone rubber. The pressure chamber 20 communicates with a compressed gas supply line (not shown), and compressed gas (for example, compressed air) is supplied into the pressure chamber 20 from the compressed gas supply line.
　ウェーハＷを研磨するときは、圧縮空気などの圧縮気体は圧力室２０内に供給される。圧力室２０内の圧縮気体の圧力は、隔壁膜２５を介して可動軸１６の端部（下端）に作用し、可動軸１６、押圧部材ホルダ３０、および押圧部材１２を上昇させる。研磨ヘッド１０は、可動軸１６のハウジング１８に対する相対的な移動距離を測定する距離センサをさらに備えてもよい。ウェーハＷの研磨を終了させるときは、圧力室２０は大気開放され、その結果、可動軸１６の自重および研磨テープ２の張力により可動軸１６および押圧部材１２が下降する。 When polishing the wafer W, compressed gas such as compressed air is supplied into the pressure chamber 20 . The pressure of the compressed gas in the pressure chamber 20 acts on the end portion (lower end) of the movable shaft 16 via the partition film 25 to raise the movable shaft 16, the pressing member holder 30, and the pressing member 12. FIG. The polishing head 10 may further include a distance sensor that measures the relative movement distance of the movable shaft 16 with respect to the housing 18 . When the polishing of the wafer W is finished, the pressure chamber 20 is opened to the atmosphere.
　押圧部材ホルダ３０にはスカート３８が固定されている。このスカート３８は押圧部材ホルダ３０から下方に延び、ハウジング１８の上部を囲んでいる。本実施形態ではスカート３８は円筒状であるが、ハウジング１８の上部を囲むことができるのであれば、他の形状であってもよい。スカート３８は、ウェーハＷの研磨に使用される純水などの液体がハウジング１８内に侵入することを防ぐことができる。 A skirt 38 is fixed to the pressing member holder 30 . The skirt 38 extends downwardly from the pressure member holder 30 and surrounds the upper portion of the housing 18 . Although the skirt 38 is cylindrical in this embodiment, it may have other shapes as long as it can surround the upper portion of the housing 18 . The skirt 38 can prevent liquid such as pure water used for polishing the wafer W from entering the housing 18 .
　図１に示すように、押圧部材１２は、両端１２ａを有する棒形状を有しており、押圧部材１２は取り外し可能に押圧部材ホルダ３０に保持されている。本実施形態では、押圧部材１２は、研磨テープ２の進行方向Ｚに対して斜めにかつ直線状に延びている。 As shown in FIG. 1, the pressing member 12 has a bar shape with both ends 12a, and the pressing member 12 is detachably held by a pressing member holder 30. As shown in FIG. In this embodiment, the pressing member 12 extends obliquely and linearly with respect to the traveling direction Z of the polishing tape 2 .
　押圧部材１２は、弾性材料から形成されている。押圧部材１２を構成する材料の例としては、フッ素ゴム、シリコーンゴム、エチレンプロピレンジエンゴムなどのゴムが挙げられる。押圧部材１２の断面は、円形の形状を有している。ただし、押圧部材１２は、本実施形態に限られず、他の形状を有してもよく、あるいは他の材料から構成されてもよい。例えば、研磨テープ２をウェーハＷに押し付けるための複数の押圧部材１２が設けられてもよい。他の例では、押圧部材１２は、直線状に延びる形状に代えて、湾曲した形状であってもよい。 The pressing member 12 is made of an elastic material. Examples of materials forming the pressing member 12 include rubber such as fluororubber, silicone rubber, and ethylene propylene diene rubber. The cross section of the pressing member 12 has a circular shape. However, the pressing member 12 is not limited to this embodiment, and may have other shapes or be made of other materials. For example, a plurality of pressing members 12 for pressing the polishing tape 2 against the wafer W may be provided. In another example, the pressing member 12 may have a curved shape instead of a straight shape.
　本実施形態の研磨ヘッド１０は、押圧部材１２の両端に配置された２つの押圧部材ストッパ４５を備えている。これら押圧部材ストッパ４５は、押圧部材ホルダ３０にねじ４６により取り外し可能に固定されている。押圧部材ストッパ４５は、樹脂または金属などの硬質の材料から構成されている。押圧部材ストッパ４５は、押圧部材１２の長手方向における押圧部材１２の位置決めをする機能を有する。 The polishing head 10 of this embodiment includes two pressing member stoppers 45 arranged at both ends of the pressing member 12 . These pressing member stoppers 45 are detachably fixed to the pressing member holder 30 by screws 46 . The pressing member stopper 45 is made of a hard material such as resin or metal. The pressing member stopper 45 has a function of positioning the pressing member 12 in the longitudinal direction of the pressing member 12 .
　図１に示すように、ウェーハＷの研磨中は、研磨テープ２は矢印Ｚで示すように、研磨テープ２の長手方向に所定の速度で送られる。本実施形態の押圧部材１２は、研磨テープ２の長手方向（進行方向Ｚ）に対して斜めに延びている。ウェーハＷを研磨するときは、押圧部材１２は研磨テープ２をその裏側からウェーハＷに対して押し付ける。 As shown in FIG. 1, during polishing of the wafer W, the polishing tape 2 is fed at a predetermined speed in the longitudinal direction of the polishing tape 2 as indicated by the arrow Z. The pressing member 12 of the present embodiment extends obliquely with respect to the longitudinal direction (advancing direction Z) of the polishing tape 2 . When polishing the wafer W, the pressing member 12 presses the polishing tape 2 against the wafer W from its rear side.
　図３は、押圧部材１２および押圧部材ストッパ４５を押圧部材ホルダ３０から取り外した状態を示す図である。押圧部材ホルダ３０の押圧面（本実施形態では上面）３０ａは、押圧部材１２が嵌合する溝５０を有している。溝５０は、押圧部材１２と同じ長さか、あるいは押圧部材１２よりも長い。本実施形態では、溝５０の長さは、押圧部材１２の長さと同じである。本明細書において、「同じ」とは完全に同じであることのみならず、技術常識の範囲内で実質的に同じであることを含む。 FIG. 3 is a diagram showing a state in which the pressing member 12 and the pressing member stopper 45 are removed from the pressing member holder 30. FIG. A pressing surface (an upper surface in this embodiment) 30a of the pressing member holder 30 has a groove 50 in which the pressing member 12 is fitted. The groove 50 may be the same length as the pressing member 12 or longer than the pressing member 12 . In this embodiment, the length of the groove 50 is the same as the length of the pressing member 12 . As used herein, the term "same" includes not only completely the same but also substantially the same within the scope of common general technical knowledge.
　押圧部材１２は、溝５０に嵌合されることで押圧部材ホルダ３０に取り付けられる。押圧部材１２は、接着剤などで押圧部材ホルダ３０に固定されていなく、図３に示すように、押圧部材ホルダ３０から取り外し可能である。 The pressing member 12 is attached to the pressing member holder 30 by being fitted into the groove 50 . The pressing member 12 is not fixed to the pressing member holder 30 with an adhesive or the like, and can be removed from the pressing member holder 30 as shown in FIG.
　本実施形態によれば、押圧部材１２はその両端１２ａを有する棒形状を有しているので、押圧部材１２を押圧部材ホルダ３０に取り付けるときに、押圧部材１２にはその長手方向にテンションが発生しない。したがって、押圧部材１２は実質的に変形せず、研磨テープ２をウェーハＷに対して均一に押し付けることができる。 According to this embodiment, since the pressing member 12 has a rod shape having both ends 12a, tension is generated in the pressing member 12 in its longitudinal direction when the pressing member 12 is attached to the pressing member holder 30. do not. Therefore, the pressing member 12 is not substantially deformed, and the polishing tape 2 can be pressed against the wafer W uniformly.
　図４は溝５０の一実施形態を示す上面図であり、図５は図４のＡ－Ａ線断面図であり、図６は図４のＢ－Ｂ線断面図である。溝５０は、押圧部材ホルダ３０の押圧面３０ａに形成されており、押圧部材ホルダ３０の一側面から他側面まで延びている。図５および図６に示すように、溝５０は、押圧部材ホルダ３０の押圧面３０ａに形成された２つの側壁５１と、これら側壁５１の間に位置する底面５２から構成されており、両側壁５１は平坦であり、互いに平行である。本実施形態の溝５０の断面は、矩形状である。溝５０の両側壁５１が互いに平行であれば、溝５０の底面５２は平坦でなくてもよい。 4 is a top view showing one embodiment of the groove 50, FIG. 5 is a cross-sectional view along line AA in FIG. 4, and FIG. 6 is a cross-sectional view along line BB in FIG. The groove 50 is formed in the pressing surface 30a of the pressing member holder 30 and extends from one side surface of the pressing member holder 30 to the other side surface. As shown in FIGS. 5 and 6, the groove 50 is composed of two side walls 51 formed on the pressing surface 30a of the pressing member holder 30 and a bottom surface 52 positioned between the side walls 51. 51 are flat and parallel to each other. The cross section of the groove 50 of this embodiment is rectangular. If the side walls 51 of the groove 50 are parallel to each other, the bottom surface 52 of the groove 50 need not be flat.
　溝５０は、押圧部材１２の幅よりも小さい第１幅Ｄ１を有する第１部分５０Ａと、第１幅Ｄ１よりも大きい第２幅Ｄ２を有する第２部分５０Ｂを有する。第１部分５０Ａは、押圧部材１２の中央に位置し、第２部分５０Ｂは押圧部材１２の両端に位置している。第１部分５０Ａは、２つの第２部分５０Ｂの間に位置している。 The groove 50 has a first portion 50A having a first width D1 smaller than the width of the pressing member 12 and a second portion 50B having a second width D2 larger than the first width D1. The first portion 50A is located in the center of the pressing member 12, and the second portions 50B are located at both ends of the pressing member 12. As shown in FIG. The first portion 50A is located between the two second portions 50B.
　図５に示すように、第１部分５０Ａは、押圧部材１２の両側に配置されたスペーサ５５を含む。第１部分５０Ａを構成する両側壁５１は、スペーサ５５から構成されている。本実施形態のスペーサ５５は、押圧部材ホルダ３０に着脱可能に取り付けられた板材（例えばシム）から構成されている。これらスペーサ５５は、溝５０の第１部分５０Ａを構成し、押圧部材１２の両側に接触している。スペーサ５５の位置、厚さ、長さは変更可能である。したがって、溝５０の第１部分５０Ａの位置、幅、長さも変更可能である。スペーサ５５は、樹脂または金属などから構成されている。 As shown in FIG. 5, the first portion 50A includes spacers 55 arranged on both sides of the pressing member 12. As shown in FIG. Both side walls 51 forming the first portion 50A are formed of spacers 55. As shown in FIG. The spacer 55 of this embodiment is composed of a plate material (for example, a shim) detachably attached to the pressing member holder 30 . These spacers 55 constitute the first portion 50A of the groove 50 and are in contact with both sides of the pressing member 12 . The position, thickness and length of spacer 55 can be changed. Therefore, the position, width and length of the first portion 50A of the groove 50 can also be changed. The spacer 55 is made of resin, metal, or the like.
　図６に示すように、第２部分５０Ｂを構成する両側壁５１は、押圧部材ホルダ３０の表面から構成されている。溝５０の第２部分５０Ｂの幅Ｄ２は、図５に示す溝５０の第１部分５０Ａの幅Ｄ１よりも大きい。 As shown in FIG. 6, both side walls 51 forming the second portion 50B are formed from the surface of the pressing member holder 30. As shown in FIG. The width D2 of the second portion 50B of the groove 50 is larger than the width D1 of the first portion 50A of the groove 50 shown in FIG.
　図７は溝５０に嵌め込まれた押圧部材１２の一実施形態を示す上面図であり、図８は図７のＣ－Ｃ線断面図であり、図９は図７のＤ－Ｄ線断面図である。溝５０の第１部分５０Ａの幅Ｄ１は、溝５０に嵌め込まれる前の押圧部材１２の幅よりも小さい。したがって、弾性材料から構成される押圧部材１２は、溝５０の第１部分５０Ａに挟まれ、第１部分５０Ａによって保持される。一方、溝５０の第２部分５０Ｂの幅Ｄ２は、溝５０に嵌め込まれる前の押圧部材１２の幅よりわずかに大きい。したがって、押圧部材１２は第２部分５０Ｂには保持されない。ただし、第２部分５０Ｂの幅Ｄ２が第１部分５０Ａの幅Ｄ１よりも大きければ、第２部分５０Ｂの幅Ｄ２は押圧部材１２の幅と同じか、または押圧部材１２の幅よりも小さくてもよい。 7 is a top view showing one embodiment of the pressing member 12 fitted in the groove 50, FIG. 8 is a cross-sectional view taken along line CC of FIG. 7, and FIG. 9 is a cross-sectional view taken along line DD of FIG. is. A width D1 of the first portion 50A of the groove 50 is smaller than the width of the pressing member 12 before being fitted into the groove 50 . Therefore, the pressing member 12 made of an elastic material is sandwiched between the first portions 50A of the grooves 50 and held by the first portions 50A. On the other hand, the width D2 of the second portion 50B of the groove 50 is slightly larger than the width of the pressing member 12 before being fitted into the groove 50 . Therefore, the pressing member 12 is not held by the second portion 50B. However, if the width D2 of the second portion 50B is larger than the width D1 of the first portion 50A, the width D2 of the second portion 50B may be the same as or smaller than the width of the pressing member 12. good.
　押圧部材１２は溝５０の第１部分５０Ａに挟まれているので、幅の狭い第１部分５０Ａに保持された押圧部材１２の部位は、幅の広い第２部分５０Ｂに保持された押圧部材１２の部位に比べて、研磨テープ２をウェーハＷに押し付けたときに変形しにくい。結果として、研磨テープ２は、第１部分５０Ａに保持された押圧部材１２の部位からの押付力を受けて、高い研磨レートでウェーハＷを研磨することができる。さらに、第１部分５０Ａの位置および長さにより、研磨レートの分布を調整することが可能となり、結果として、均一な研磨プロファイルを達成することができる。 Since the pressing member 12 is sandwiched between the first portions 50A of the grooves 50, the portion of the pressing member 12 held by the narrow first portion 50A is not the same as the portion of the pressing member 12 held by the wide second portion 50B. When the polishing tape 2 is pressed against the wafer W, it is less likely to be deformed than the portion of . As a result, the polishing tape 2 can polish the wafer W at a high polishing rate by receiving a pressing force from the portion of the pressing member 12 held by the first portion 50A. Furthermore, the position and length of the first portion 50A makes it possible to adjust the polishing rate distribution, and as a result, a uniform polishing profile can be achieved.
　図１０Ａは、溝５０の第１部分５０Ａがない研磨ヘッド１０を用いた場合の研磨プロファイルの一例を示す図であり、図１０Ｂは、溝５０の第１部分５０Ａがある図７の研磨ヘッド１０を用いた場合の研磨プロファイルの一例を示す図である。図１０Ａに示すように、押圧部材１２の中央に対応する領域の研磨レートは、押圧部材１２の両端に対応する領域の研磨レートよりも低い。これに対し、図１０Ｂに示す研磨プロファイルでは、押圧部材１２の全長に亘って研磨レートはほぼ均一である。このように、幅の狭い第１部分５０Ａを構成するスペーサ５５を研磨レートが低い領域に配置することで、均一な研磨レートを達成することができる。 10A shows an example of a polishing profile when using the polishing head 10 without the first portion 50A of the groove 50, and FIG. 10B shows the polishing head 10 of FIG. 7 with the first portion 50A of the groove 50. is a diagram showing an example of a polishing profile when using . As shown in FIG. 10A , the polishing rate of the region corresponding to the center of the pressing member 12 is lower than the polishing rate of the regions corresponding to both ends of the pressing member 12 . In contrast, with the polishing profile shown in FIG. 10B, the polishing rate is substantially uniform over the entire length of the pressing member 12 . By arranging the spacers 55 forming the narrow first portion 50A in the region where the polishing rate is low, a uniform polishing rate can be achieved.
　図４乃至図９を参照して説明した実施形態では、スペーサ５５は押圧部材１２の両側に配置されているが、一実施形態では、図１１に示すように、スペーサ５５は、押圧部材１２の一方側にのみ配置されてもよい。この場合でも、溝５０の第１部分５０Ａの幅は、押圧部材１２の幅よりも小さく、かつ溝５０の第２部分５０Ｂの幅よりも小さい。押圧部材１２は溝５０の第１部分５０Ａに挟まれるので、幅の狭い第１部分５０Ａに保持された押圧部材１２の部位は、幅の広い第２部分５０Ｂに保持された押圧部材１２の部位に比べて、研磨テープ２をウェーハＷに押し付けたときに変形しにくい。 4-9, the spacers 55 are located on both sides of the pressing member 12, but in one embodiment, the spacers 55 are positioned on the pressing member 12 as shown in FIG. It may be arranged only on one side. Even in this case, the width of the first portion 50A of the groove 50 is smaller than the width of the pressing member 12 and smaller than the width of the second portion 50B of the groove 50 . Since the pressing member 12 is sandwiched by the first portion 50A of the groove 50, the portion of the pressing member 12 held by the narrow first portion 50A is the portion of the pressing member 12 held by the wide second portion 50B. When the polishing tape 2 is pressed against the wafer W, it is difficult to deform compared to .
　図１２および図１３は、溝５０の第１部分５０Ａと第２部分５０Ｂの他の実施形態を示す図である。図１２に示す実施形態では、溝５０の第２部分５０Ｂは押圧部材１２の中央に位置し、溝５０の２つの第１部分５０Ａは押圧部材１２の両端に位置している。第１部分５０Ａを構成するスペーサ５５は押圧部材１２の両端に接触している。図１３に示す実施形態では、溝５０の第１部分５０Ａおよび第２部分５０Ｂは、押圧部材１２の両端に位置している。すなわち、溝５０の第１部分５０Ａを構成するスペーサ５５は、押圧部材１２の一端に接触し、溝５０の第２部分５０Ｂは押圧部材１２の他端に位置している。 12 and 13 are diagrams showing other embodiments of the first portion 50A and the second portion 50B of the groove 50. FIG. In the embodiment shown in FIG. 12, the second portion 50B of the groove 50 is located in the center of the pressing member 12 and the two first portions 50A of the groove 50 are located at opposite ends of the pressing member 12 . The spacers 55 forming the first portion 50A are in contact with both ends of the pressing member 12 . In the embodiment shown in FIG. 13, the first portion 50A and the second portion 50B of the groove 50 are located at opposite ends of the pressing member 12. In the embodiment shown in FIG. That is, the spacer 55 forming the first portion 50A of the groove 50 is in contact with one end of the pressing member 12, and the second portion 50B of the groove 50 is positioned at the other end of the pressing member 12. As shown in FIG.
　図１４に示すように、研磨ヘッド１０は、２つの溝５０、およびこれら溝５０にそれぞれ嵌め込まれた２つの押圧部材１２を備えてもよい。各溝５０および各押圧部材１２の構成は、図４乃至図９を参照して説明した実施形態と同じであるので、その重複する説明を省略する。図１１乃至図１３を参照して説明した変形例は、図１４に示す本実施形態にも適用可能である。 As shown in FIG. 14, the polishing head 10 may include two grooves 50 and two pressing members 12 fitted in the grooves 50, respectively. Since the configuration of each groove 50 and each pressing member 12 is the same as the embodiment described with reference to FIGS. 4 to 9, redundant description thereof will be omitted. The modifications described with reference to FIGS. 11 to 13 are also applicable to this embodiment shown in FIG.
　図１５は溝５０の他の実施形態を示す上面図であり、図１６は図１５のＥ－Ｅ線断面図であり、図１７は図１５のＦ－Ｆ線断面図である。特に説明しない本実施形態の構成は、図４乃至図９を参照して説明した実施形態と同じであるので、その重複する説明を省略する。この実施形態では、溝５０の第１部分５０Ａを構成するスペーサ５５は、溝５０の内側に向かって突出する、押圧部材ホルダ３０の突出部から構成されている。第１部分５０Ａの幅Ｄ１と、押圧部材１２の幅と、第２部分５０Ｂの幅Ｄ２との関係は、図４乃至図９を参照して説明した実施形態と同じであるので、その重複する説明を省略する。図１１乃至図１３を参照して説明した変形例は、図１５乃至図１７に示す本実施形態にも適用可能である。 15 is a top view showing another embodiment of the groove 50, FIG. 16 is a cross-sectional view taken along line EE in FIG. 15, and FIG. 17 is a cross-sectional view along line FF in FIG. The configuration of this embodiment, which is not particularly described, is the same as that of the embodiment described with reference to FIGS. 4 to 9, so redundant description thereof will be omitted. In this embodiment, the spacer 55 forming the first portion 50A of the groove 50 is made up of a protruding portion of the pressing member holder 30 that protrudes toward the inside of the groove 50 . The relationship between the width D1 of the first portion 50A, the width of the pressing member 12, and the width D2 of the second portion 50B is the same as in the embodiment described with reference to FIGS. Description is omitted. The modifications described with reference to FIGS. 11 to 13 are also applicable to the present embodiment shown in FIGS. 15 to 17. FIG.
　図１８は、研磨装置の一実施形態を示す側面図であり、図１９は、図１８に示す研磨装置の上面図である。図１８および図１９に示す研磨装置は、ウェーハＷを保持し、回転させる基板保持部７０と、研磨テープ２Ａ，２Ｂを、基板保持部７０に保持されたウェーハＷの第１の面５ａに接触させてウェーハＷの第１の面５ａを研磨する複数の研磨ヘッド１０Ａ～１０Ｄと、研磨テープ２Ａを研磨ヘッド１０Ａ，１０Ｂに供給し、研磨ヘッド１０Ａ，１０Ｂから研磨テープ２を回収する研磨テープ供給機構７２Ａと、研磨テープ２Ｂを研磨ヘッド１０Ｃ，１０Ｄに供給し、研磨ヘッド１０Ｃ，１０Ｄから研磨テープ２Ｂを回収する研磨テープ供給機構７２Ｂを備えている。 FIG. 18 is a side view showing one embodiment of a polishing apparatus, and FIG. 19 is a top view of the polishing apparatus shown in FIG. The polishing apparatus shown in FIGS. 18 and 19 includes a substrate holding portion 70 that holds and rotates a wafer W, and polishing tapes 2A and 2B that are brought into contact with the first surface 5a of the wafer W held by the substrate holding portion 70. a plurality of polishing heads 10A to 10D for polishing the first surface 5a of the wafer W, and a polishing tape supply for supplying the polishing tape 2A to the polishing heads 10A and 10B and recovering the polishing tape 2 from the polishing heads 10A and 10B. A mechanism 72A and a polishing tape supply mechanism 72B for supplying the polishing tape 2B to the polishing heads 10C and 10D and recovering the polishing tape 2B from the polishing heads 10C and 10D are provided.
　研磨ヘッド１０Ａ，１０Ｃは、図１４を参照して説明した研磨ヘッド１０と同じ構成を有し、研磨ヘッド１０Ｂ，１０Ｄは、図７を参照して説明した研磨ヘッド１０と同じ構成を有している。研磨テープ２Ａ，２Ｂは、同じ構成を有している。 Polishing heads 10A and 10C have the same configuration as polishing head 10 described with reference to FIG. 14, and polishing heads 10B and 10D have the same configuration as polishing head 10 described with reference to FIG. there is Polishing tapes 2A and 2B have the same configuration.
　本実施形態では、ウェーハＷの第１の面５ａは、デバイスが形成されていない、またはデバイスが形成される予定がないウェーハＷの裏面、すなわち非デバイス面である。第１の面５ａとは反対側のウェーハＷの第２の面５ｂは、デバイスが形成されている、またはデバイスが形成される予定である面、すなわちデバイス面である。本実施形態では、ウェーハＷは、その第１の面５ａが下向きの状態で、基板保持部７０に水平に支持される。 In this embodiment, the first surface 5a of the wafer W is the back surface of the wafer W on which no devices are formed or devices are not planned to be formed, that is, the non-device surface. A second side 5b of the wafer W, opposite the first side 5a, is the side on which the devices are or are to be formed, ie the device side. In this embodiment, the wafer W is horizontally supported by the substrate holder 70 with the first surface 5a facing downward.
　基板保持部７０は、ウェーハＷの周縁部に接触可能な複数のローラー７５Ａ，７５Ｂ，７５Ｃ，７５Ｄと、ローラー７５Ａ～７５Ｄを同じ速度で回転させるためのローラー回転装置（図示せず）を備えている。本実施形態では、４つのローラー７５Ａ～７５Ｄが設けられているが、５つまたはそれよりも多いローラーが設けられてもよい。 The substrate holding unit 70 includes a plurality of rollers 75A, 75B, 75C, and 75D that can contact the peripheral edge of the wafer W, and a roller rotating device (not shown) for rotating the rollers 75A to 75D at the same speed. there is In this embodiment, four rollers 75A-75D are provided, but five or more rollers may be provided.
　研磨ヘッド１０Ａ，１０Ｂは、支持部材７８Ａに支持され、研磨ヘッド１０Ｃ，１０Ｄは、支持部材７８Ｂに支持されている。複数の研磨ヘッド１０Ａ～１０Ｄは、基板保持部７０に保持されているウェーハＷの下側に配置されている。これら研磨ヘッド１０Ａ～１０Ｄは、ウェーハＷの直径方向に配列されている。本実施形態では、４つの研磨ヘッド１０Ａ～１０Ｄが設けられているが、研磨ヘッドの数は本実施形態に限られない。一実施形態では、単一の研磨ヘッドが設けられてもよい。 The polishing heads 10A and 10B are supported by a supporting member 78A, and the polishing heads 10C and 10D are supported by a supporting member 78B. A plurality of polishing heads 10A to 10D are arranged below the wafer W held by the substrate holding part . These polishing heads 10A to 10D are arranged in the diameter direction of the wafer W. As shown in FIG. Although four polishing heads 10A to 10D are provided in this embodiment, the number of polishing heads is not limited to this embodiment. In one embodiment, a single polishing head may be provided.
　研磨テープ供給機構７２Ａ，７２Ｂは、同じ構成を有しているので、以下研磨テープ供給機構７２Ａについて説明する。研磨テープ供給機構７２Ａは、研磨テープ２Ａの一端が接続されたテープ巻き出しリール８１と、研磨テープ２Ａの他端が接続されたテープ巻き取りリール８２と、研磨テープ２Ａの進行方向を案内する複数のガイドローラー８３を備えている。テープ巻き出しリール８１およびテープ巻き取りリール８２は、リールモータ８６，８７にそれぞれ連結されている。 Since the polishing tape supply mechanisms 72A and 72B have the same configuration, the polishing tape supply mechanism 72A will be described below. The polishing tape supply mechanism 72A includes a tape unwinding reel 81 to which one end of the polishing tape 2A is connected, a tape take-up reel 82 to which the other end of the polishing tape 2A is connected, and a plurality of reels for guiding the advancing direction of the polishing tape 2A. of guide rollers 83 are provided. Tape take-up reel 81 and tape take-up reel 82 are coupled to reel motors 86 and 87, respectively.
　テープ巻き取りリール８２を矢印で示す方向に回転させることにより、研磨テープ２Ａはテープ巻き出しリール８１から研磨ヘッド１０Ａ,１０Ｂを経由してテープ巻き取りリール８２に送られる。研磨テープ２Ａは、研磨テープ２Ａの研磨面３ａがウェーハＷの第１の面５ａを向くように研磨ヘッド１０Ａ,１０Ｂの上方に供給される。リールモータ８６は、所定のトルクをテープ巻き出しリール８１に与えることにより、研磨テープ２Ａにテンションをかけることができる。リールモータ８７は、研磨テープ２Ａを一定速度で送るように制御される。研磨テープ２Ａを送る速度は、テープ巻き取りリール８２の回転速度を変化させることによって変更できる。 By rotating the tape take-up reel 82 in the direction indicated by the arrow, the polishing tape 2A is fed from the tape take-up reel 81 to the tape take-up reel 82 via the polishing heads 10A and 10B. The polishing tape 2A is supplied above the polishing heads 10A and 10B so that the polishing surface 3a of the polishing tape 2A faces the first surface 5a of the wafer W. As shown in FIG. The reel motor 86 can apply tension to the polishing tape 2A by applying a predetermined torque to the tape supply reel 81 . The reel motor 87 is controlled to feed the polishing tape 2A at a constant speed. The feeding speed of the polishing tape 2A can be changed by changing the rotation speed of the tape take-up reel 82. FIG.
　一実施形態では、研磨装置は、テープ巻き出しリール８１、テープ巻き取りリール８２、およびリールモータ８６，８７とは別に、研磨テープ２Ａをその長手方向に送るテープ送り装置を備えてもよい。さらに他の実施形態では、テープ巻き出しリール８１とテープ巻き取りリール８２の位置は、逆に配置されてもよい。 In one embodiment, the polishing apparatus may include a tape feeding device that feeds the polishing tape 2A in its longitudinal direction, separately from the tape supply reel 81, the tape take-up reel 82, and the reel motors 86, 87. In still other embodiments, the positions of tape take-up reel 81 and tape take-up reel 82 may be reversed.
　ウェーハＷは次のようにして研磨される。複数のローラー７５Ａ～７５ＤでウェーハＷの周縁部を保持しながら、これらローラー７５Ａ～７５Ｄを回転させることで、ウェーハＷを回転させる。研磨テープ供給機構７２Ａ，７２Ｂにより研磨テープ２Ａ，２Ｂを研磨ヘッド１０Ａ～１０Ｄに送りながら、研磨ヘッド１０Ａ～１０Ｄの押圧部材１２は、研磨テープ２Ａ，２ＢをウェーハＷの第１の面５ａに押し付けてウェーハＷの第１の面５ａを研磨する。 The wafer W is polished as follows. The wafer W is rotated by rotating these rollers 75A to 75D while holding the peripheral portion of the wafer W with a plurality of rollers 75A to 75D. While the polishing tapes 2A and 2B are fed to the polishing heads 10A to 10D by the polishing tape supply mechanisms 72A and 72B, the pressing members 12 of the polishing heads 10A to 10D press the polishing tapes 2A and 2B against the first surface 5a of the wafer W. The first surface 5a of the wafer W is polished by using the
　上述した押圧部材１２および溝５０の実施形態は、ウェーハの裏面を研磨する研磨ヘッドに適用されているが、上述した押圧部材１２および溝５０の実施形態はウェーハのエッジ部を研磨するための研磨ヘッドにも適用可能である。例えば、図２０に示すように、押圧部材１２および溝５０は、ウェーハＷのエッジ部に沿って湾曲してもよい。押圧部材１２により研磨テープ２をウェーハＷのエッジ部に押し付けながら、研磨ヘッド１０は、矢印Ｘで示すように、ウェーハＷの半径方向外側に向かって移動する。研磨ヘッド１０の方向Ｘへの移動は、図示しない研磨ヘッド移動機構によって達成される。 The pressing member 12 and the groove 50 described above are applied to a polishing head for polishing the back surface of the wafer. It can also be applied to the head. For example, the pressing member 12 and groove 50 may be curved along the edge of the wafer W, as shown in FIG. While pressing the polishing tape 2 against the edge of the wafer W by the pressing member 12 , the polishing head 10 moves outward in the radial direction of the wafer W as indicated by the arrow X. As shown in FIG. Movement of the polishing head 10 in the direction X is achieved by a polishing head moving mechanism (not shown).
　上述した実施形態は、本発明が属する技術分野における通常の知識を有する者が本発明を実施できることを目的として記載されたものである。上記実施形態の種々の変形例は、当業者であれば当然になしうることであり、本発明の技術的思想は他の実施形態にも適用しうる。したがって、本発明は、記載された実施形態に限定されることはなく、特許請求の範囲によって定義される技術的思想に従った最も広い範囲に解釈されるものである。 The above-described embodiments are described for the purpose of enabling those who have ordinary knowledge in the technical field to which the present invention belongs to implement the present invention. Various modifications of the above embodiments can be made by those skilled in the art, and the technical idea of the present invention can be applied to other embodiments. Accordingly, the present invention is not limited to the described embodiments, but is to be construed in its broadest scope in accordance with the technical spirit defined by the claims.
　本発明は、ウェーハなどの基板に研磨テープを押し付けるための研磨ヘッドに利用可能である。また、本発明はそのような研磨ヘッドで基板を研磨するための研磨装置に利用可能である。 The present invention can be used for a polishing head for pressing a polishing tape against a substrate such as a wafer. Also, the present invention can be used in a polishing apparatus for polishing a substrate with such a polishing head.
　Ｗ　　　ウェーハ
　２，２Ａ，２Ｂ　　　研磨テープ
　５ａ　　　第１の面
　５ｂ　　　第２の面
１０，１０Ａ～１０Ｄ　　　研磨ヘッド
１２　　　押圧部材
１５　　　アクチュエータ
１６　　　可動軸
１８　　　ハウジング
１８Ａ　　ハウジング本体
１８Ｂ　　蓋
２０　　　圧力室
２５　　　隔壁膜
３０　　　押圧部材ホルダ
３０ａ　　押圧面
３０ｂ，３０ｃ　　傾斜面
３２　　　ボールスプラインナット
３８　　　スカート
４５　　　押圧部材ストッパ
４６　　　ねじ
５０　　　溝
５０Ａ　　第１部分
５０Ｂ　　第２部分
５１　　　側壁
５２　　　底面
５５　　　スペーサ
７０　　　基板保持部
７２Ａ，７２Ｂ　　　研磨テープ供給機構
７８Ａ，７８Ｂ　　　支持部材
８１　　　テープ巻き出しリール
８２　　　テープ巻き取りリール
８３　　　ガイドローラー
８６，８７　　　リールモータ
Ｄ１　　　第１幅
Ｄ２　　　第２幅 W Wafer 2, 2A, 2B Polishing tape 5a First surface 5b Second surface 10, 10A-10D Polishing head 12 Pressing member 15 Actuator 16 Movable shaft 18 Housing 18A Housing body 18B Lid 20 Pressure chamber 25 Partition membrane 30 Pressing member Holder 30a Pressing surfaces 30b, 30c Inclined surface 32 Ball spline nut 38 Skirt 45 Pressing member stopper 46 Screw 50 Groove 50A First portion 50B Second portion 51 Side wall 52 Bottom surface 55 Spacer 70 Substrate holding portions 72A, 72B Polishing tape supply mechanism 78A, 78B support member 81 tape supply reel 82 tape take-up reel 83 guide rollers 86, 87 reel motor D1 first width D2 second width

Claims (8)

  1. 　基板を研磨するための研磨ヘッドであって、
    　研磨テープを基板に対して押し付ける押圧部材と、
    　前記押圧部材を保持する押圧部材ホルダと、
    　前記押圧部材ホルダに連結され、前記押圧部材に押圧力を付与するアクチュエータを備え、
    　前記押圧部材は、両端を有する棒形状であり、
    　前記押圧部材は、前記押圧部材ホルダの押圧面に形成されている溝に嵌合している、研磨ヘッド。     A polishing head for polishing a substrate, comprising:
    a pressing member that presses the polishing tape against the substrate;
    a pressing member holder that holds the pressing member;
    an actuator connected to the pressing member holder and applying a pressing force to the pressing member;
    The pressing member has a rod shape having both ends,
    The polishing head, wherein the pressing member is fitted into a groove formed in the pressing surface of the pressing member holder.
  2. 　前記溝の両側壁は、互いに平行である、請求項１に記載の研磨ヘッド。 The polishing head according to claim 1, wherein both side walls of said groove are parallel to each other.
  3. 　前記溝は、前記押圧部材の幅よりも小さい第１幅を有する第１部分と、前記第１幅よりも大きい第２幅を有する第２部分を有し、前記押圧部材は前記第１部分に挟まれている、請求項１または２に記載の研磨ヘッド。 The groove has a first portion having a first width smaller than the width of the pressing member and a second portion having a second width larger than the first width, the pressing member extending from the first portion. 3. A polishing head according to claim 1 or 2 which is sandwiched.
  4. 　前記第１部分は、前記押圧部材の少なくとも一方側に配置されたスペーサを含む、請求項３に記載の研磨ヘッド。 The polishing head according to claim 3, wherein the first portion includes a spacer arranged on at least one side of the pressing member.
  5. 　前記スペーサは、前記押圧部材ホルダに着脱可能な板材である、請求項４に記載の研磨ヘッド。 The polishing head according to claim 4, wherein the spacer is a plate material that can be attached to and detached from the pressing member holder.
  6. 　前記押圧部材ホルダは、前記溝の内側に向かって突出する突出部を有しており、前記スペーサは前記突出部から構成されている、請求項４に記載の研磨ヘッド。 The polishing head according to claim 4, wherein the pressing member holder has a protrusion that protrudes toward the inside of the groove, and the spacer comprises the protrusion.
  7. 　前記押圧部材の両端に配置された押圧部材ストッパをさらに備えている、請求項１乃至６のいずれか一項に記載の研磨ヘッド。 The polishing head according to any one of claims 1 to 6, further comprising pressing member stoppers arranged at both ends of said pressing member.
  8. 　基板を保持する基板保持部と、
    　前記基板を研磨するための、請求項１乃至７のいずれか一項に記載の研磨ヘッドを備えている、研磨装置。     a substrate holder that holds the substrate;
    A polishing apparatus comprising the polishing head according to any one of claims 1 to 7 for polishing the substrate.
PCT/JP2023/005452 2022-03-01 2023-02-16 Polishing head and polishing device WO2023167001A1 (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5021197U (en) * 1973-06-19 1975-03-10
JP2018195853A (en) * 2018-08-31 2018-12-06 株式会社荏原製作所 Polishing method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5021197U (en) * 1973-06-19 1975-03-10
JP2018195853A (en) * 2018-08-31 2018-12-06 株式会社荏原製作所 Polishing method

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