TW202405042A - 阻劑下層膜形成組成物 - Google Patents

阻劑下層膜形成組成物 Download PDF

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Publication number
TW202405042A
TW202405042A TW112110162A TW112110162A TW202405042A TW 202405042 A TW202405042 A TW 202405042A TW 112110162 A TW112110162 A TW 112110162A TW 112110162 A TW112110162 A TW 112110162A TW 202405042 A TW202405042 A TW 202405042A
Authority
TW
Taiwan
Prior art keywords
ring
aromatic
group
underlayer film
resist underlayer
Prior art date
Application number
TW112110162A
Other languages
English (en)
Chinese (zh)
Inventor
德永光
中島誠
西卷裕和
Original Assignee
日商日產化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日產化學股份有限公司 filed Critical 日商日產化學股份有限公司
Publication of TW202405042A publication Critical patent/TW202405042A/zh

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Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G12/00Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C08G12/02Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes
    • C08G12/04Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds
    • C08G12/06Amines
    • C08G12/08Amines aromatic
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/30Imagewise removal using liquid means
    • G03F7/32Liquid compositions therefor, e.g. developers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Materials For Photolithography (AREA)
TW112110162A 2022-03-28 2023-03-20 阻劑下層膜形成組成物 TW202405042A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022051965 2022-03-28
JP2022-051965 2022-03-28

Publications (1)

Publication Number Publication Date
TW202405042A true TW202405042A (zh) 2024-02-01

Family

ID=88201076

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112110162A TW202405042A (zh) 2022-03-28 2023-03-20 阻劑下層膜形成組成物

Country Status (5)

Country Link
JP (1) JPWO2023189803A1 (https=)
KR (1) KR20240167851A (https=)
CN (1) CN118974659A (https=)
TW (1) TW202405042A (https=)
WO (1) WO2023189803A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025192444A1 (ja) * 2024-03-15 2025-09-18 日産化学株式会社 レジスト下層膜形成用組成物、レジスト下層膜、レジストパターンの形成方法、及び半導体装置の製造方法
WO2025192457A1 (ja) * 2024-03-15 2025-09-18 日産化学株式会社 レジスト下層膜形成用組成物、レジスト下層膜、レジストパターンの形成方法、及び半導体装置の製造方法
WO2025205630A1 (ja) * 2024-03-27 2025-10-02 日産化学株式会社 レジスト下層膜形成用組成物、レジスト下層膜、レジストパターンの形成方法、及び半導体装置の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4945091B1 (https=) 1970-08-20 1974-12-02
JPS6256719U (https=) 1985-09-26 1987-04-08
JPH0515035Y2 (https=) 1986-08-26 1993-04-21
US9244353B2 (en) 2012-08-10 2016-01-26 Nissan Chemical Industries, Ltd. Resist underlayer film forming composition
US9395628B2 (en) * 2013-02-25 2016-07-19 Nissan Chemical Industries, Ltd. Resist underlayer film-forming composition containing aryl sulfonate salt having hydroxyl group
US10429737B2 (en) 2017-09-21 2019-10-01 Rohm And Haas Electronic Materials Korea Ltd. Antireflective compositions with thermal acid generators
CN117015746A (zh) * 2021-03-15 2023-11-07 日产化学株式会社 包含酸催化剂负载型聚合物的抗蚀剂下层膜形成用组合物

Also Published As

Publication number Publication date
WO2023189803A1 (ja) 2023-10-05
KR20240167851A (ko) 2024-11-28
CN118974659A (zh) 2024-11-15
JPWO2023189803A1 (https=) 2023-10-05

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