TW202403488A - 溫度調節模組 - Google Patents

溫度調節模組 Download PDF

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Publication number
TW202403488A
TW202403488A TW112110899A TW112110899A TW202403488A TW 202403488 A TW202403488 A TW 202403488A TW 112110899 A TW112110899 A TW 112110899A TW 112110899 A TW112110899 A TW 112110899A TW 202403488 A TW202403488 A TW 202403488A
Authority
TW
Taiwan
Prior art keywords
composite material
resin
inorganic particles
layer
particles
Prior art date
Application number
TW112110899A
Other languages
English (en)
Chinese (zh)
Inventor
小谷泰暢
加藤智也
大塚哲弥
Original Assignee
日商日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW202403488A publication Critical patent/TW202403488A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/26—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof by elimination of a solid phase from a macromolecular composition or article, e.g. leaching out
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW112110899A 2022-03-29 2023-03-23 溫度調節模組 TW202403488A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022054690 2022-03-29
JP2022-054690 2022-03-29

Publications (1)

Publication Number Publication Date
TW202403488A true TW202403488A (zh) 2024-01-16

Family

ID=88200983

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112110899A TW202403488A (zh) 2022-03-29 2023-03-23 溫度調節模組

Country Status (3)

Country Link
JP (1) JPWO2023189776A1 (https=)
TW (1) TW202403488A (https=)
WO (1) WO2023189776A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104086929A (zh) * 2008-10-21 2014-10-08 日立化成工业株式会社 导热片材、其制造方法以及使用了该导热片材的散热装置
JP6178389B2 (ja) * 2014-12-25 2017-08-09 デクセリアルズ株式会社 熱伝導シートの製造方法、熱伝導シート、及び半導体装置
JP7271592B2 (ja) * 2020-03-31 2023-05-11 日東電工株式会社 複合材料

Also Published As

Publication number Publication date
JPWO2023189776A1 (https=) 2023-10-05
WO2023189776A1 (ja) 2023-10-05

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