TW202401635A - Semiconductor process equipment, a process chamber thereof and a detection method of a tray - Google Patents

Abstract

Semiconductor process equipment, a process chamber thereof and a detection method of a tray. The process chamber comprises a process cavity, a tray, a first heating body, a rotating shaft component, and an infrared thermometer, wherein the first heating body comprises a first heating plate; the tray is rotatbly arranged on the top surface of the first heating plate; the rotating shaft component includes a rotating shaft and a temperature marking element. The rotating shaft passes through the first heating plate and rotates in conjunction with the first heating plate. The first end of the rotating shaft is connected to the tray, enabling the rotating shaft to rotate with the tray. The second end of the rotating shaft extends and protrudes from the bottom surface of the first heating plate. The temperature marking element is set at the second end of the rotating shaft and can rotate with the rotating shaft. The infrared thermometer is used to detect the temperature of the temperature marker rotating to the preset temperature detection position, in order to periodically obtain the temperature of the temperature marker.

Description

Semiconductor process equipment and inspection methods for process chambers and trays

The present application relates to the field of semiconductor manufacturing technology, and in particular to a semiconductor processing equipment and a method for detecting process chambers and trays.

In the semiconductor wafer manufacturing process, the epitaxial growth process is an extremely important link. The epitaxial growth process refers to growing a single crystal layer with certain requirements and the same crystal orientation as the wafer on the wafer surface to extend the crystal on the wafer surface.

In related technologies, epitaxial growth equipment includes a tray, an upper heating body and a lower heating body. The tray is located between the upper and lower heating bodies, and the upper and lower heating bodies jointly heat the tray, and the tray has a rotation function to rotate. This allows the wafers placed on the tray to be heated evenly. Since the upper heating body and the lower heating body are wrapped with insulation felt, the infrared pyrometer cannot be installed directly above the tray to detect the temperature of the tray. Since the temperature and rotation speed of the tray are closely related to the uniformity of the wafer epitaxial film, the epitaxial growth equipment is also equipped with a temperature measurement device for detecting the temperature of the tray, and a speed measurement device for detecting the rotation speed of the tray. However, the temperature measurement device and the speed measurement device will The structure of the epitaxial growth equipment is too complex.

This application discloses a method for detecting semiconductor processing equipment, a process chamber, and a tray, which can simultaneously detect the temperature and rotation speed of the tray and simplify the structural layout of the equipment.

In order to solve the above problems, this application adopts the following technical solutions:

In a first aspect, the present application provides a process chamber for semiconductor processing equipment, including a process chamber, a tray disposed in the process chamber, a first heating body, a rotating shaft assembly, and an infrared temperature measurement disposed outside the process chamber. device, wherein: the first heating body includes a first heating plate; the tray is rotatably disposed on the top surface of the first heating plate; the rotating shaft assembly includes a rotating shaft and a temperature marker, and the rotating shaft passes through the first heating plate. The heating plate is rotatably matched with the first heating plate. The first end of the rotating shaft is connected to the tray so that the rotating shaft can rotate with the tray. The second end of the rotating shaft extends and protrudes from the first heating plate. The bottom surface; the temperature marker is provided at the second end of the rotating shaft and can rotate with the rotating shaft; the infrared thermometer is used to detect the temperature of the temperature marker rotated to a preset temperature detection position to periodically obtain The temperature marks the temperature of the piece.

In a second aspect, the present application provides a semiconductor processing equipment, including the process chamber described in the first aspect of the present application.

In a third aspect, this application provides a pallet detection method using the process chamber described in the first aspect of this application. The detection method includes: activating the infrared thermometer, and periodically receiving the infrared thermometer's When the temperature marker rotates to the preset temperature detection position, the temperature of the temperature marker is detected as the temperature of the tray; the temperature of all the temperature markers obtained during the detection time is compared, and the temperature of the temperature marker is calculated based on all the temperatures of the temperature marker. The temperature of the temperature marker is used to determine the stability of the temperature of the tray; based on the number of acquisition times of the temperature of the tray in unit time, the rotation speed of the tray is calculated based on the number of acquisition times.

The technical solution adopted in this application can achieve the following beneficial effects:

In the semiconductor processing equipment and its processing chamber disclosed in this application, the first end of the rotating shaft is connected to the tray, and the second end of the rotating shaft extends and protrudes from the bottom surface of the first heating plate. This ensures that the tray rotates and fits through the rotating shaft. on the first heating plate. Since the temperature marker is disposed at the second end of the rotating shaft, it can rotate circumferentially with the rotating shaft.

When detecting the temperature of the tray, as the temperature marker rotates, the infrared thermometer can periodically detect the temperature of the temperature marker at the preset temperature detection position to periodically obtain the temperature of the tray, and then through the The temperature of all temperature markers obtained during the detection time is used to determine the temperature stability of the tray, thereby accurately measuring the temperature of the tray and detecting the heating environment at the same time.

At the same time, when detecting the rotation speed of the tray, the rotation speed of the tray can be calculated based on the number of times the temperature of the tray is obtained per unit time.

Compared with related technologies, the infrared thermometer of the present application can not only be used to detect the temperature of the tray, but can also be used as a detection device for the rotation speed of the tray. This eliminates the need to set up an additional speed measuring device, thus effectively simplifying the structural layout of the equipment.

The following disclosure provides many different embodiments or examples of different means for implementing the disclosure. Specific examples of components and configurations are described below to simplify the present disclosure. Of course, these are examples only and are not intended to be limiting. For example, the following description in which a first member is formed over or on a second member may include embodiments in which the first member and the second member are formed in direct contact, and may also include embodiments in which additional members Embodiments may be formed between the first member and the second member such that the first member and the second member may not be in direct contact. Additionally, the present disclosure may repeat reference numbers and/or letters in various instances. This repetition is for simplicity and clarity and does not inherently indicate a relationship between the various embodiments and/or configurations discussed.

In addition, for ease of description, spatially relative terms such as “below,” “below,” “lower,” “above,” “upper,” and the like may be used herein to describe one element or component in relation to another(s). The relationship between components or components, as illustrated in the figure. Spatially relative terms are intended to cover different orientations of the device in use or operation other than the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the disclosure are approximations, the values stated in the specific examples are reported as precisely as possible. Any numerical value, however, inherently contains certain errors necessarily resulting from the standard deviation found in their respective testing measurements. Furthermore, as used herein, the term "about" generally means within 10%, 5%, 1% or 0.5% of a given value or range. Alternatively, the term "approximately" means within one acceptable standard error of the mean when considered by one of ordinary skill in the art. Except in operating/working examples, or unless otherwise expressly specified, all numerical ranges such as quantities, durations of time, temperatures, operating conditions, ratios of quantities, and the like for materials disclosed herein, Quantities, values and percentages should be understood to be modified in all instances by the term "approximately". Accordingly, unless indicated to the contrary, the numerical parameters set forth in the patent claims of this disclosure and accompanying invention claims are approximations that may vary as necessary. At a minimum, each numerical parameter should be interpreted in light of the number of reported significant digits and by applying ordinary rounding techniques. Ranges may be expressed herein as from one endpoint to the other endpoint or between two endpoints. All ranges disclosed herein include endpoints unless otherwise specified.

The technical solutions disclosed in various embodiments of the present application will be described in detail below with reference to the accompanying drawings.

In order to solve the technical problem of structural complexity caused by separately configuring a temperature measuring device and a speed measuring device in epitaxial growth equipment in the related art, embodiments of the present application provide a process chamber of a semiconductor processing equipment.

Referring to Figures 1 to 11, the process chamber disclosed in the embodiment of the present application includes a process chamber 100, a tray 200, a first heating body, a rotating shaft assembly 400 and an infrared thermometer 500, wherein:

The process chamber 100 is the basic component of the process chamber and can provide an installation foundation. Specifically, the tray 200 , the first heating body and the rotating shaft assembly 400 are disposed in the process chamber 100 . A process space S is formed in the process chamber 100, and the process space S provides a process processing environment for the wafers to be processed. At the same time, in order to maintain the high-temperature process environment inside the process chamber 100, the process chamber may also include a thermal insulation felt outside the process chamber 100. An induction coil is arranged around the insulation felt, and the induction coil inductively heats the first heating body. , and then the first heating body provides a high-temperature process environment for the inside of the tray 200 and the process chamber 100 .

The tray 200 is used to place wafers to be processed, that is, the tray 200 carries the wafers during the process. During process processing, the wafer needs to be in a high-temperature state. For example, in the silicon epitaxial growth process, the temperature of the process environment can reach 1500~1800°C. In order to ensure a stable high-temperature process environment, the process space S is heated by a heating body.

In the embodiment of the present application, the tray 200 is rotatably disposed on the top surface of the first heating plate 300, that is, the two can realize relative rotation.

The rotating shaft assembly 400 includes a rotating shaft 410 and a temperature marker 420. The rotating shaft 410 is passed through the first heating plate 300 and rotates with the first heating plate 300. The first end of the rotating shaft 410 is connected to the tray 200, so that the rotating shaft 410 can follow the tray. 200 rotates, the second end of the rotating shaft 410 extends and protrudes from the bottom surface of the first heating plate 300 .

Specifically, the first heating plate 300 can provide a bearing function for the tray 200 , and the tray 200 and the rotating shaft 410 can achieve synchronous movement. The tray 200 can achieve relative rotation with the first heating plate 300 through the rotating shaft 410 . Since the rotating shaft 410 penetrates the first heating plate 300, the rotating shaft 410 and the first heating plate 300 have a mutual limiting relationship, thereby optimizing the installation reliability between the tray 200 and the first heating plate 300. Furthermore, the top surface of the first heating plate 300 may be provided with an accommodating groove 370. The accommodating groove 370 is used to place the tray 200, which can further optimize the installation reliability of the tray 200; the accommodating groove 370 is preferably a circular groove. .

At the same time, since the second end of the rotating shaft 410 extends and protrudes from the bottom surface of the first heating plate 300, "protruding" here means that the second end of the rotating shaft 410 extends beyond the bottom surface of the first heating plate 300, and The bottom surface of the first heating plate 300 is away from the process space S. That is to say, the second end of the rotating shaft 410 extends outside the process space S, but is still located within the process chamber 100. See Figures 1 to 3 for details.

In the embodiment of the present application, the temperature marker 420 is disposed at the second end of the rotating shaft 410 and can rotate with the rotating shaft 410; the infrared thermometer 500 is used to detect the temperature of the temperature marker 420, and the temperature marker 420 is used to rotate to The preset temperature detection position is detected by the infrared thermometer 500 to periodically obtain the temperature of the temperature marker 420 .

It should be understood that the infrared thermometer 500 is disposed outside the process chamber, which can prevent it from being damaged due to high temperature when it is disposed inside the chamber. For example, the infrared thermometer 500 can detect the temperature of the temperature marker 420 rotated to a preset temperature detection position through a detection window provided on the process chamber 100 . When measuring the temperature of the tray 200, due to the thermal conduction relationship between the rotating shaft 410 and the tray 200, the infrared energy radiated by the second end of the rotating shaft 410 can be directly detected through the infrared thermometer 500, and the temperature of the tray 200 can be indirectly detected. Compared with In the related art, the solution of indirectly obtaining the temperature of the tray by detecting the temperature of the heating body has obviously effectively improved the detection accuracy of the temperature of the tray 200 . In the embodiment of the present application, since the temperature marker 420 is provided at the second end of the rotating shaft 410, the infrared thermometer 500 can detect the temperature of the pallet 200 in the process space S by detecting the temperature of the temperature marker 420 outside the process space S. temperature detection, and at the same time, the ambient temperature of the first heating body can also be detected.

The temperature marker 420 realizes circumferential rotation as the rotating shaft 410 and the tray 200 rotate. In this way, the temperature marker 420 can periodically rotate to a position corresponding to the infrared thermometer 500, that is, a preset temperature detection position, so that The infrared thermometer 500 can periodically detect the temperature of the temperature markers 420 to periodically obtain the temperature of the tray, and then determine the temperature stability of the tray 200 by comparing the temperatures of all temperature markers 420 obtained within the detection time. , thereby accurately measuring the temperature of the tray 200.

At the same time, when detecting the rotation speed of the tray 200, the rotation speed of the tray 200 can be calculated based on the number of acquisition times of the temperature of the tray 200 in unit time.

Specifically, when the tray 200 rotates, the temperature marker 420 passes through the preset temperature detection position during the rotation, and the acquisition times can be recorded once. It should be noted that the number of times the infrared thermometer 500 obtains the temperature of the temperature marker 420 can be characterized by the temperature data it detects. Specifically, as shown in FIG. 6 , the temperature and time detected by the infrared thermometer 500 In the relationship diagram, the sudden change in the temperature detected by the infrared thermometer 500 can be a sudden change from the peak temperature to the trough temperature, or a sudden change from the trough temperature to the peak temperature, where the peak temperature within the detection time is recorded. The number of times is the number of acquisitions mentioned above.

In this structural layout, the circumferential area of the second end of the rotating shaft 410 is evenly divided by the temperature marker 420. When the temperature marker 420 is a single structure, the circumferential area of the second end of the rotating shaft 410 is 360°. the overall area. In this way, as long as the number of acquisition times of the temperature of the temperature marker 420 within a unit time can be detected, it can be obtained how many equally divided areas it has rotated, and the sum of these equally divided areas can represent the rotational speed of the rotating shaft 410, thus Indicates the rotation speed of the tray 200.

The process chamber also includes a control system. The control system includes a reading unit. The reading unit can read the number of times the temperature detected by the infrared thermometer 500 is obtained in a unit time, that is, the number of times the temperature of the tray 200 is detected in the unit time. The number of times is obtained, and then the control system calculates the rotation speed of the tray 200 based on the number of times of acquisition. In order to facilitate calculation, the control system can use the complete peak temperature interval and trough temperature interval as a calculation unit.

Specifically, by multiplying the ratio of the acquisition times to the number of marking structures (such as blades) included in the temperature marker 420 by 2π, the rotation angle of the tray 200 in unit time can be obtained, and thus the rotation speed of the tray 200 can be obtained. The above calculation process may refer to the formula ω=2nπ⁄mT, where ω is the angular velocity of the tray 200, n is the number of acquisitions, and m is the number of marking structures included in the temperature marking piece 420.

Compared with related technologies, the infrared thermometer 500 in the embodiment of the present application is not only used to detect the temperature of the tray 200, but can also be used as a detection device for the rotation speed of the tray 200. This eliminates the need to set up an additional speed measuring device, thereby effectively simplifying the equipment. structural layout. In the embodiment of the present application, the specific type of the temperature marker 420 is not limited. For example, the temperature marker 420 may include a bump provided on the circumferential side wall of the second end of the rotating shaft 410 , etc.

In other embodiments, as shown in FIGS. 1 to 5 , the temperature marker 420 may include a plurality of blades 421 , and the plurality of blades 421 are evenly arranged along the circumferential direction of the rotating shaft 200 .

In this structural layout, the detection path of the infrared thermometer 500 is misaligned with the rotating shaft 410. At the preset temperature detection position, that is, on the detection path of the infrared thermometer 500, the blades 421 will rotate to this position in sequence. And the temperature is detected by the infrared thermometer 500, which is the peak temperature at this time, see Figure 5 for details; when the detection paths of the blade 421 and the infrared thermometer 500 are staggered, the infrared thermometer 500 detects the trough temperature, See Figure 4 for details.

As shown in Figures 2 and 11, the temperature marker 420 includes an impeller 422 located at the second end of the rotating shaft 410. The impeller 422 is sleeved on the rotating shaft 410. The blades 421 are connected to the impeller 422 and distributed along the circumferential direction. The second end of the rotating shaft 410 A fastener 401 may be provided at the end to limit the position of the impeller 422 through the fastener 401.

In an optional solution, as shown in Figures 8 to 10, the first heating plate 300 is provided with a gas flow channel. The gas flow channel includes an air outlet channel 350. The air outlet channel 350 is used to transport driving gas. The first heating plate 300 It includes an air outlet 302 provided on its top surface. The air outlet 302 is connected with the air outlet channel 350 and is arranged corresponding to the tray 200. The tray 200 includes a driving part 210 provided on its bottom surface. The driving gas output through the air outlet 302 can pass through The driving part 210 is pushed to drive the tray 200 to rotate.

Under this structural layout, the driving gas in the input gas flow channel can be output from the air outlet flow channel 350 and the air outlet 302, and the driving gas can exert a driving effect on the bottom surface of the tray 200; based on the existence of the driving part 210, the driving gas can be driven by The portion 210 drives the tray 200 to rotate. It can be seen that the tray 200 in the embodiment of the present application adopts a gas-driven solution, which can avoid the shortcoming of the conventional solution of motor-driven tray 200 being difficult to withstand high temperatures. In addition, in the structural layout between the tray 200 and the first heating plate 300, the driving effect of the driving gas on the tray 200 has a vertical component. This vertical component can drive the tray 200 to float up a certain distance, so that the tray 200 is connected to the first heating plate 300. The plates 300 are separated, thereby facilitating the rotation of the tray 200 . The driving effect of the driving gas on the tray 200 has a horizontal component, and this horizontal component can drive the tray 200 to rotate.

The embodiment of the present application does not limit the specific configuration of the driving part 210, which may be a groove or a protrusion. When the driving part 210 is a groove, the driving gas exerts a driving effect by pushing the groove wall; when the driving part 210 is a protrusion, the driving gas exerts a driving effect by pushing the side walls of the protrusion.

In an optional solution, as shown in Figure 10, the driving part 210 is a strip groove, and the strip groove has a longer extension length, which can increase the area of action of the driving gas on the groove wall of the strip groove, thereby improving the Drive efficiency. In order to further optimize the driving effect of the driving gas on the strip grooves, multiple driving parts 210 can be configured, thereby further increasing the action area of the driving gas; the strip grooves can be configured to be inclined around the rotation axis 410, so that The driving effect exerted by the driving gas along the circumferential direction of the tray 200 can be increased; the inclination directions of the plurality of strip grooves can be further configured to be in the same direction. This can avoid interference due to reverse arrangement of the strip grooves, and is more conducive to simultaneous application of the driving gas. directional driving effect.

Furthermore, the plurality of strip grooves are centrally symmetrically arranged around the center of the tray 200 .

When the driving part 210 is a groove, the driving part 210 may also be a spiral groove. When the driving part 210 is a protrusion, the driving part 210 may also be a protrusion, a spiral protrusion, or the like.

In an optional solution, as shown in FIG. 8 , the first heating plate 300 includes at least three air outlets 302 , and the at least three air outlets 302 are evenly distributed along the circumferential direction of the central axis of the tray 200 . Under such a layout, based on the principle of three points forming a plane, the driving gas output from at least three air outlets 302 can form at least three action areas on the bottom surface of the tray 200. Compared with the one and two action area solutions, it is obviously more effective. The driving stability and reliability of the tray 200 are improved.

The number of air outlets 302 is not specifically limited in the embodiment of the present application. In addition to the three shown in FIG. 8 , it can also be one, two, four, five, etc.

In the optional solution, as shown in Figures 7 to 9, the gas flow channel also includes an inlet flow channel. One end of the inlet flow channel is used to communicate with the external air source, and the other end of the inlet flow channel is connected to the outlet air flow. The air flow channels are connected to transport the driving gas into the air outlet flow channel, the inlet air flow channel is arranged on the horizontal plane, and the air outlet flow channel 350 is arranged inclined relative to the vertical direction. In this structural layout, the air outlet flow channel 350 is tilted relative to the vertical direction, so that the driving gas transported in the horizontal plane and in the air inlet flow channel can be transported upward and output from the air outlet 302, and the air outlet direction is consistent with that of the air outlet 302. The tray 200 is set at a preset angle, thereby driving the tray 200 to rotate. Of course, the embodiment of the present application does not limit the specific cooperation relationship between the air outlet flow channel 350 and the air inlet flow channel. The air outlet flow channel 350 can also be an arc-shaped flow channel, which can also output the driving gas transported in the horizontal plane upward through the air outlet 302 , and the air outlet direction is set at a preset angle with the tray 200 .

In this structural layout, since the air outlet channel 350 is a linear channel, the axis of the air outlet channel 350 is collinear with the axis of the air outlet 302; the linear channel is easy to be directly processed and formed, thereby facilitating the installation of the air outlet channel. The inclination angle of the axis relative to the central axis of the tray 200 is used to cooperate with the driving part 210 on the bottom surface of the tray 200 to optimize the driving effect of the driving gas.

The angle between the axis of the air outlet channel 350 and the central axis of the tray 200 is a. The angle is an obtuse angle, and the angle directly affects the inclination of the air outlet channel 350 . Specifically, the included angle may be 120°, 130°, 140°, etc.

Further, the air inlet flow passage includes an input sub-flow passage, a distribution sub-flow passage and a plurality of transport sub-flow passages. The first end of the input sub-flow passage is used to communicate with the external air source, and the second end of the input sub-flow passage is connected to the external air source. The air inlet ends of the distribution sub-flow channels are connected, and the distribution sub-flow channels have multiple air outlet ends; the air inlet ends of the multiple transport sub-flow channels are connected to the multiple air inlet ends of the distribution sub-flow channels in one-to-one correspondence; the first heating At least three air outlets 302 are provided on the top surface of the plate, and the air outlet channels 350 include at least three air outlet sub-channels. Each air outlet sub-channel is connected to each air outlet 302 in a one-to-one correspondence; each transport sub-channel has The air outlet end is connected with one of the air outlet sub-flow channels. In this structural layout, the external air source can deliver driving gas into the input sub-flow channel, and the driving gas can be evenly distributed through the distribution sub-flow channel. Then, the driving gas can be separately transported to multiple delivery sub-flow channels, and then through each sub-flow channel. Each transport sub-flow channel is transported to the gas outlet sub-channel connected thereto, and finally output through the gas outlet 302 connected to the gas outlet sub-channel. This structural layout can avoid outputting different components of driving gas from different air outlets 302 to optimize the uniformity of the driving effect exerted by the driving gas on the tray 200 .

In a preferred embodiment, as shown in Figures 7 to 9, the air inlet flow channel includes an input sub-flow channel 310, a distribution sub-flow channel 320, a first transportation sub-flow channel 330 and a second transportation sub-flow channel 340. The input sub-flow channel 310 extends along a first horizontal direction (ie, the vertical direction of FIG. 7 ), and the extension direction of the distribution sub-flow channel 320 is perpendicular to the first horizontal direction (ie, perpendicular to the vertical direction of FIG. 7 ), the first end of the input sub-flow channel 310 is connected to the external air source through the air inlet 301, and the second end of the input sub-flow channel 310 is connected to the distribution sub-flow channel 320, for example, the second end of the input sub-flow channel 310 It is connected with the air inlet end located in the middle of the distribution sub-flow channel 320, so that the driving gas entering the distribution sub-flow channel 320 reaches the two outlet ends of the distribution sub-flow channel 320 at the same distance after being divided. There are two conveying sub-flow channels, namely the first conveying sub-flow channel 330 and the second conveying sub-flow channel 340, which are respectively connected with the two outlet ends of the distribution sub-flow channel 320, and the first conveying sub-flow channel 330 and the second conveying sub-flow channel 340 are arranged symmetrically with respect to the input sub-flow channel 310; one end of the distribution sub-flow channel 320, the first conveying sub-flow channel 330 and the second conveying sub-flow channel 340 is outside the first heating plate 300 There are through-holes 303 on the surface, and seals 304 are provided on the through-holes 303; there are three air outlets 302, and they are evenly distributed along the circumferential direction of the central axis of the tray 200. There are three gas outlet sub-channels, namely the first gas outlet sub-channel 305, the second gas outlet sub-channel 306 and the third gas outlet sub-channel 307. The first gas outlet sub-channel 305 is connected with the input sub-channel 310. The second gas outlet sub-flow channel 306 is connected with the first transport sub-channel 330, the third gas outlet sub-channel 307 is connected with the second transport sub-channel 340, and the first gas outlet sub-channel 305, the second gas outlet sub-channel 306 and The third air outlet sub-flow channel 307 is connected to the three air outlets 302 in one-to-one correspondence.

Under this structural layout, the external air source can deliver driving gas into the input sub-flow channel 310 , the driving gas can be evenly distributed through the distribution sub-flow channel 320 , and then the driving gas can be separately delivered to the first transport sub-flow channel 330 and the second conveying sub-flow channel 340. In the input sub-flow channel 310, the driving gas can be output from the first gas outlet sub-channel 305 and the corresponding gas outlet 302. In the first transport sub-channel 330, the driving gas can be output from the second gas outlet sub-channel 306 and the corresponding gas outlet 302. To output the driving gas, in the second transport sub-flow channel 350, the driving gas can be output from the third gas outlet sub-channel 307 and the corresponding gas outlet 302. This structural layout can avoid outputting different components of driving gas from different air outlets 302 to optimize the uniformity of the driving effect exerted by the driving gas on the tray 200 .

Based on the through opening 303, the distribution sub-flow channel 320, the first conveying sub-flow channel 330 and the second conveying sub-flow channel 340 can be easily processed, and the seal 304 can ensure that the distribution sub-flow channel 320, the first conveying sub-flow channel 340 330 and the air tightness of the second conveying sub-flow channel 340. Among them, the sealing member 304 may be airway plugging, sealing rubber, etc.

Of course, the embodiment of the present application does not limit the specific shaping scheme of the air inlet flow channel in the first heating plate 300. In other embodiments, the first heating plate 300 may include a first sub-heating plate and a second sub-heating plate. The lower surface of the first sub-heating plate and the upper surface of the second sub-heating plate are both provided with relatively arranged air inlet grooves. The first sub-heating plate and the second sub-heating plate are aligned to form oppositely arranged air inlet grooves. The input sub-channel 310, the distribution sub-channel 320, the first transport sub-channel 330 and the second transport sub-channel 340 are complete, and in this structural layout, there is no need to provide the aforementioned through-port 303.

In an optional solution, the axes of at least three air outlets 302 are all inclined around the rotation axis 410, and the inclination directions are the same. Under such an arrangement, when the driving gas output from the air outlet 302 is incident on the bottom surface of the tray 200, there will be an included angle with the bottom surface of the tray 200, thereby ensuring that the driving effect of the driving gas on the tray 200 has a vertical component and a horizontal component. The vertical component can drive the tray 200 to float up, and the horizontal component can act on the driving part 210 and drive the tray 200 to rotate.

At the same time, the inclination direction of the axes of the air outlets 302 is the same, which ensures that the axes of the air outlets 302 have the same inclination feature, so that the horizontal components of the driving gas output by different air outlets 302 can drive the tray 200 in the same direction. In order to optimize the driving effect.

In an optional solution, as shown in Figures 2 and 11, the process chamber also includes a sleeve 600. The first heating plate 300 has a through hole 360 penetrating its top surface and bottom surface. The sleeve 600 is sleeved on the rotating shaft 410. outside, and is located between the rotating shaft 410 and the hole wall of the through hole 360 . With this arrangement, the sleeve 600 can support the rotating shaft 410 and the hole wall of the through hole 360 to prevent the rotating shaft 410 from deflecting; the rotating shaft 410 is usually made of wear-resistant material, thereby reducing the wear of the rotating shaft 410 .

Further, as shown in FIG. 11 , a first annular stepped groove 361 is provided in the through hole 360 , and the sleeve 600 is provided in the first annular stepped groove 361 . Under this structural layout, the first annular step groove 361 provides an accommodation space for the sleeve 600, which can improve the compactness of the structure. Moreover, the step surface of the first annular step groove 361 can support and limit the shaft sleeve 600 .

Further, as shown in FIGS. 8 , 10 and 11 , a second annular step groove 362 is also provided in the through hole 360 . The first annular step groove 361 and the second annular step groove 362 extend along the through hole 360 from top to bottom. The pallet 200 includes an annular fitting portion 220 on its bottom surface. The annular fitting portion 220 is sleeved on the outside of the sleeve 600 and is arranged in the second annular step groove 362 .

In this structural layout, the through hole 360 is a multi-step stepped hole, the second annular stepped groove 362 provides a receiving space for the annular fitting part 220, and the annular fitting part 220 is limited radially inward by the sleeve 600. It is also limited radially outward by the groove side walls of the second annular stepped groove 362, thereby optimizing the positioning effect of the tray 200.

In an optional solution, the process chamber further includes a second heating body 700, a first end cover, and a second end cover; the first heating body further includes a first arc-shaped heating element connected to the first heating plate 300. The second heating body 700 includes a second heating plate and a second arc-shaped heating element. The first heating body and the second heating body are arranged oppositely; the first end cap is provided on the first end of the first heating body and the second heating body 700 The first end of the first heating body, the second end cap is provided on the second end of the first heating body and the second end of the second heating body 700, the first heating plate and the second heating plate are arranged oppositely, and a process is formed between them. Space S.

Specifically, the first heating plate 300 and the first arc-shaped heating element are connected to form a semicircular first heating body penetrating in the axial direction. A first heating element is formed between the first heating plate 300 and the first arc-shaped heating element. Cavity; the second heating plate and the second arc-shaped heating element are connected to form a semicircular second heating body 700 that runs through in the axial direction, and a second heating cavity is formed between the second heating plate and the second arc-shaped heating element. . The temperature marker 420 is disposed in the first heating chamber. The infrared thermometer 500 can detect the infrared radiation energy generated by the temperature marker 420 in the first heating chamber to detect the temperature of the temperature marker 420, which not only achieves The temperature of the tray 200 may also be detected by detecting the ambient temperature in the first heating chamber of the first heating body.

In the embodiment of the present application, the process chamber can be configured with a first heating plate 300 and a second heating plate arranged opposite each other, and the tray 200 is located in the process space S between the first heating plate 300 and the second heating plate. The heating body and the second heating body 700 are surrounded by induction coils. The induction coils inductively heat the first heating body and the second heating body 700, thereby improving the temperature uniformity of the environment where the tray 200 is located, which is beneficial to improving the wafer quality. The epitaxial growth quality of W.

Embodiments of the present application also provide a semiconductor processing equipment, which includes the process chamber mentioned in any of the foregoing solutions, so that the semiconductor processing equipment has the beneficial effects of any of the foregoing solutions, which will not be described again here. Optionally, the semiconductor processing equipment in the embodiment of the present application is an epitaxial growth equipment. Of course, it can also be a semiconductor heat treatment equipment that needs to detect the temperature and rotation speed of the tray.

Embodiments of the present application also provide a detection method for the tray 200 , which is applied to the process chamber mentioned in any of the foregoing solutions and is used to detect the temperature and rotation speed of the tray 200 . Detection methods include:

Step S100, start the infrared thermometer 500, and periodically receive the temperature of the temperature marker 420 detected by the infrared thermometer 500 when the temperature marker 420 rotates to a preset temperature detection position as the temperature of the tray 200 ;

Step S200: Compare the temperatures of all temperature markers 420 obtained within the detection time, and determine the temperature stability of the tray 200 based on the comparison results;

Step S300: Calculate the rotation speed of the tray 200 based on the number of acquisition times of the temperature of the tray 200 within the unit time.

In the embodiment of the present application, since the temperature marker 420 is disposed at the second end of the rotating shaft 410 , during the rotation of the rotating shaft 410 with the tray 200 , the temperature marking 420 realizes circumferential rotation along with the rotation of the rotating shaft 410 and the tray 200 . , at the preset temperature detection position, the infrared thermometer 500 can periodically detect the temperature of the temperature markers 420, thereby periodically obtaining the temperature of the tray 200, and then by measuring all the temperature markers 420 obtained within the detection time. temperature to determine the stability of the temperature of the tray 200, thereby accurately measuring the temperature of the tray 200.

At the same time, when detecting the rotation speed of the tray 200, the rotation speed of the tray 200 can be calculated based on the number of acquisition times of the temperature of the tray 200 in unit time.

Specifically, when the tray 200 rotates, the temperature marker 420 passes through the preset temperature detection position during the rotation, and the acquisition times can be recorded once. It should be noted that the number of times the infrared thermometer 500 obtains the temperature of the temperature marker 420 can be characterized by the temperature data it detects. Specifically, as shown in FIG. 6 , the temperature and time detected by the infrared thermometer 500 In the relationship diagram, the sudden change in the temperature detected by the infrared thermometer 500 can be a sudden change from the peak temperature to the trough temperature, or a sudden change from the trough temperature to the peak temperature, where the peak temperature within the detection time is recorded. The number of times is the number of acquisitions mentioned above.

By multiplying the ratio of the acquisition times to the number of marking structures (such as blades) included in the temperature marker 420 by 2π, the rotation angle of the tray 200 in unit time can be obtained, and thus the rotation speed of the tray 200 can be obtained. The above calculation process may refer to the formula ω=2nπ⁄mT, where ω is the angular velocity of the tray 200, n is the number of acquisitions, and m is the number of marking structures (eg, blades) included in the temperature marking piece 420.

Compared with related technologies, the infrared thermometer 500 in the embodiment of the present application is not only used to detect the temperature of the tray 200, but can also be used as a detection device for the rotation speed of the tray 200. This eliminates the need to set up an additional speed measuring device, thereby effectively simplifying the equipment. structural layout.

The foregoing content summarizes the features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also understand that such equivalent constructions do not depart from the spirit and scope of the disclosure, and that they can be variously changed, replaced, and altered herein without departing from the spirit and scope of the disclosure.

100: Process chamber 200:pallet 210:Drive Department 220: Ring fitting part 300: First heating plate 301:Air inlet 302: Air outlet 303: Through port 304:Seals 305: The first outlet channel 306: The second outlet channel 307: The third outlet channel 310:Input sub-channel 320: Allocate sub-runners 330: First conveying sub-flow channel 340: Second conveying sub-flow channel 350: Air outlet runner 360:Through hole 361: First annular step groove 362: Second annular step groove 370: Accommodation tank 400:Rotating shaft assembly 401: Fasteners 410:Shaft 420: Temperature marking piece 421:Blade 422: Impeller 500: Infrared thermometer 600: Bushing 700: Second heating body S: process space

The present disclosure is best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that in accordance with standard practice in the industry, the various components are not drawn to scale. In fact, the dimensions of the various components may be arbitrarily increased or reduced for clarity of discussion. Figure 1 is a cross-sectional view of a process chamber disclosed in an embodiment of the present application; Figure 2 is a diagram of the cooperation relationship between the tray and the rotating shaft disclosed in the embodiment of the present application; Figure 3 is a schematic structural diagram of the first heating plate disclosed in the embodiment of the present application; Figures 4 and 5 are respectively diagrams of the working principles of the process chamber disclosed in the embodiments of the present application in different working states; Figure 6 is a diagram showing the relationship between temperature and time detected by the infrared thermometer disclosed in the embodiment of the present application; Figure 7 is a cross-sectional view of the first heating plate disclosed in the embodiment of the present application; Figure 8 is a top view of the first heating plate disclosed in the embodiment of the present application; Figure 9 is a cross-sectional view along the A-A direction of Figure 8; Figure 10 is a schematic structural diagram of the tray disclosed in the embodiment of the present application; Figure 11 is a partial enlarged view of Figure 1.

100: Process chamber

200:pallet

300: First heating plate

310:Input sub-channel

320: Allocate sub-runners

400:Rotating shaft assembly

700: Second heating body

S: process space

Claims (12)

A process chamber of semiconductor processing equipment, including a process chamber, a tray arranged in the process chamber, a first heating body, a rotating shaft assembly and an infrared thermometer arranged outside the process chamber, in: The first heating body includes a first heating plate; The tray is rotatably located on the top surface of the first heating plate; The rotating shaft assembly includes a rotating shaft and a temperature marker. The rotating shaft passes through the first heating plate and rotates with the first heating plate. The first end of the rotating shaft is connected to the tray, so that the rotating shaft can follow the The tray rotates, and the second end of the rotating shaft extends and protrudes from the bottom surface of the first heating plate; The temperature marker is disposed at the second end of the rotating shaft and can rotate with the rotating shaft; the infrared thermometer is used to detect the temperature of the temperature marker rotated to a preset temperature detection position to periodically obtain the temperature Mark the temperature of the piece. As in the process chamber of claim 1, the temperature marker includes a plurality of blades, and the plurality of blades are evenly arranged along the circumferential direction of the rotating shaft. As in the process chamber of claim 1, a gas flow channel is provided in the first heating plate. The gas flow channel includes an air outlet channel. The air outlet channel is used to transport a driving gas. The first heating plate has a gas flow channel. An air outlet is provided on the top surface, and the air outlet is connected with the air outlet flow channel and is arranged corresponding to the tray; the tray includes a driving part provided on the bottom surface of the tray, and the driving gas output through the air outlet can push the The driving part drives the tray to rotate. In the process chamber of claim 3, at least three air outlets are provided on the top surface of the first heating plate, and the at least three air outlets are evenly distributed along the circumferential direction of the central axis of the tray. As in the process chamber of claim 3 or 4, the gas flow channel further includes an inlet flow channel, one end of the inlet flow channel is used to communicate with an external gas source, and the other end of the inlet flow channel is connected to The air outlet flow channel is connected to deliver the driving gas into the air outlet channel. The air inlet channel is arranged on the horizontal plane, and the air outlet channel is arranged inclined relative to the vertical direction. As for the process chamber of claim 5, the inlet flow channel includes an input sub-channel, a distribution sub-channel and a plurality of transport sub-channels, and the first end of the input sub-channel is used to communicate with the external The air source is connected, and the second end of the input sub-flow channel is connected with the air inlet end of the distribution sub-flow channel. The distribution sub-flow channel has multiple air outlet ends; the air inlet ends of the multiple transport sub-flow channels correspond one to one. The ground is connected to the plurality of air inlet ends of the distribution sub-flow channel; At least three air outlets are provided on the top surface of the first heating plate. The air outlet channel includes at least three air outlet sub-channels, and each air outlet sub-channel communicates with each air outlet in a one-to-one correspondence; each air outlet channel includes at least three air outlet sub-channels. The air outlet end of the conveying sub-flow channel is connected with one of the air outlet sub-channels. As in the process chamber of claim 6, the input sub-flow channel extends along a first horizontal direction, the extension direction of the distribution sub-flow channel is perpendicular to the first horizontal direction, and the second end of the input sub-flow channel Connected to the air inlet end of the distribution sub-flow channel; There are two conveying sub-flow channels, namely a first conveying sub-flow channel and a second conveying sub-flow channel. The first conveying sub-flow channel and the second conveying sub-flow channel are respectively connected with the distribution sub-flow channel. The two air outlets are connected, and the first conveying sub-flow channel and the second conveying sub-flow channel are symmetrically arranged relative to the input sub-flow channel; the distribution sub-flow channel, the first conveying sub-flow channel and the second conveying sub-flow channel One end of the sub-flow channel is provided with a through opening on the outer surface of the first heating plate, and a sealing member is provided at the through opening; There are three air outlets, evenly distributed along the circumferential direction of the central axis of the tray; there are three air outlet sub-channels, which are a first air outlet sub-channel, a second air outlet sub-channel and a third air outlet sub-channel. The first gas outlet sub-flow channel is connected with the input sub-channel, the second gas outlet sub-channel is connected with the first transport sub-channel, the third gas outlet sub-channel is connected with the second transport sub-channel The flow passages are connected, and the first air outlet sub-flow passage, the second air outlet sub-flow passage and the third air outlet sub-flow passage are respectively connected with the three air outlets in a one-to-one correspondence. As claimed in claim 1, the process chamber further includes a sleeve, the first heating plate has a through hole penetrating its top surface and bottom surface, and a first annular step groove is provided in the through hole, and the first heating plate has a through hole. The shaft sleeve is sleeved outside the rotating shaft and located in the first annular step groove. According to the process chamber of claim 8, a second annular step groove is further provided in the through hole, and the first annular step groove and the second annular step groove are arranged in sequence from bottom to top along the through hole; the tray It includes an annular fitting portion provided on the bottom surface of the tray, the annular fitting portion is sleeved outside the shaft sleeve and is arranged in the second annular step groove. The process chamber according to claim 1, the process chamber further includes a second heating body, a first end cover and a second end cover; the first heating body further includes a heating element connected to the first heating plate. A first arc-shaped heating element, a first heating cavity is formed between the first heating plate and the first arc-shaped heating element; the second heating body includes a second heating plate and a second arc-shaped heating element, A second heating cavity is formed between the second heating plate and the second arc-shaped heating element; the first heating body and the second heating body are arranged oppositely; The first end cap is disposed on the first end of the first heating body and the first end of the second heating body, and the second end cap is disposed on the second end of the first heating body and the second heating body. At the second end of the body, the first heating plate and the second heating plate are arranged oppositely, and a process space is formed between them. A semiconductor processing equipment, including the processing chamber described in any one of claims 1 to 10. A pallet detection method, applied to the process chamber described in any one of claims 1 to 10, the detection method includes: Start the infrared thermometer, and periodically receive the temperature of the temperature marker detected by the infrared thermometer when the temperature marker rotates to the preset temperature detection position as the temperature of the tray; Compare the temperatures of all temperature markers obtained within the detection time, and determine the temperature stability of the tray based on the comparison results; According to the number of acquisition times of the temperature of the pallet in unit time, the rotation speed of the pallet is calculated based on the number of acquisition times.