CN114551331A - Bearing device and semiconductor process equipment - Google Patents

Bearing device and semiconductor process equipment Download PDF

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Publication number
CN114551331A
CN114551331A CN202210121039.3A CN202210121039A CN114551331A CN 114551331 A CN114551331 A CN 114551331A CN 202210121039 A CN202210121039 A CN 202210121039A CN 114551331 A CN114551331 A CN 114551331A
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China
Prior art keywords
magnetic
driving
shaft
frame
temperature measuring
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Pending
Application number
CN202210121039.3A
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Chinese (zh)
Inventor
崔宇
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Beijing Naura Microelectronics Equipment Co Ltd
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Beijing Naura Microelectronics Equipment Co Ltd
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Application filed by Beijing Naura Microelectronics Equipment Co Ltd filed Critical Beijing Naura Microelectronics Equipment Co Ltd
Priority to CN202210121039.3A priority Critical patent/CN114551331A/en
Publication of CN114551331A publication Critical patent/CN114551331A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B23/00Single-crystal growth by condensing evaporated or sublimed materials
    • C30B23/02Epitaxial-layer growth
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/08Reaction chambers; Selection of materials therefor
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/12Substrate holders or susceptors
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02Constructional details
    • G01J5/0205Mechanical elements; Supports for optical elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67248Temperature monitoring
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The application discloses a bearing device and semiconductor process equipment, and relates to the field of semiconductor equipment. A bearing device comprises a base, a supporting shaft, a driving mechanism and a temperature measuring mechanism; the base is provided with a temperature measuring surface; one end of the supporting shaft is connected with the base, the supporting shaft is provided with a first channel, and one end of the first channel is arranged corresponding to the temperature measuring surface; the driving mechanism comprises a driving assembly and a shell, the driving assembly comprises a driving structure and a driven driving structure, the driving structure is located outside the shell, the driven driving structure is located in the shell, the driving assembly and the driven driving structure are magnetically coupled, at least part of the supporting shaft is arranged in an inner cavity of the shell, the other end of the supporting shaft is connected with the driven driving structure, the shell is provided with a light transmission part, the light transmission part is arranged corresponding to the other end of the first channel, and the temperature measuring mechanism is arranged outside the shell and is arranged corresponding to the light transmission part. The semiconductor processing equipment comprises the bearing device. The temperature measuring device can solve the problems that the temperature measuring precision is low, and the supporting shaft moves to cause the air pressure in the cavity to change and the like.

Description

Bearing device and semiconductor process equipment
Technical Field
The application belongs to the technical field of semiconductor equipment, and particularly relates to a bearing device and semiconductor process equipment.
Background
The technology of infrared temperature measurement is widely used in the temperature measurement and the monitoring process of epitaxial equipment at present, and in the course of working of wafer, because the wafer has formed the inhomogeneous surface of characteristic pattern on the surface of carrying out epitaxial processing, carry out infrared temperature measurement to the wafer surface and can't obtain accurate temperature, from this, the industry adopts the more even base back that is used for bearing the wafer of test surface to carry out temperature monitoring basically. In the epitaxial process, in order to guarantee the uniformity of growth, the base adopts rotatable design, and along with the rotation of base, the bearing structure of bottom can disturb the temperature measurement of infrared pyrometer to influence the temperature measurement precision.
Currently, some base support components include base axle and base plate lifting unit spare, and wherein, the base axle includes the support column and outwards extends a plurality of extension arms from the support column, and like this, at the rotatory in-process of base support component, the extension arm can be periodically through the space between the base back and the infrared pyrometer to infrared emission to the base back causes the interference, influences the temperature measurement accuracy. In addition, in the process of lifting the supporting shaft, the volume in the cavity can be changed, the air pressure in the cavity is influenced, and therefore additional load can be brought to the substrate lifting component.
Disclosure of Invention
The embodiment of the application aims to provide a bearing device and semiconductor process equipment, and the problems that an extension arm periodically blocks infrared emission to influence temperature measurement precision, extra load is brought in the lifting process of a support shaft and the like can be solved at least.
In order to solve the technical problem, the present application is implemented as follows:
the embodiment of the application provides a bearing device, which is applied to a process chamber of semiconductor process equipment, and comprises: the device comprises a base, a support shaft, a driving mechanism and a temperature measuring mechanism;
the base is provided with a bearing surface and a temperature measuring surface which are arranged in a reverse manner, and the bearing surface is used for bearing a wafer;
one end of the support shaft is connected with the base, the support shaft is provided with a first channel extending along the axis direction of the support shaft, and one end of the first channel is arranged corresponding to the temperature measuring surface;
the driving mechanism comprises a driving assembly and a shell which is used for being in sealed connection with the process chamber, the driving assembly comprises a driving structure arranged outside the shell and a driven driving structure arranged in an inner cavity of the shell, the supporting shaft is at least partially arranged in the inner cavity of the shell, the other end of the supporting shaft is connected with the driven driving structure, and the driving structure drives the driven driving structure through magnetic coupling so as to drive the supporting shaft to move along the direction of the axis of the driving structure and rotate around the axis of the driving structure;
the shell is provided with a light-transmitting part along the extending direction of the first channel, and the other end of the first channel is arranged corresponding to the light-transmitting part;
the temperature measuring mechanism is arranged outside the shell and corresponds to the light transmission part.
The embodiment of the application also provides semiconductor process equipment which comprises the bearing device.
In the embodiment of the application, the support shaft is provided with the first channel extending along the axis direction, one end of the first channel is arranged corresponding to the temperature measuring surface on the back surface of the base, in order to ensure the sealing performance of the process chamber, the housing is connected to the bottom of the process chamber, at least part of the support shaft is arranged in the inner cavity of the housing, the housing is provided with the light transmission part along the extending direction of the first channel, the other end of the first channel is arranged corresponding to the light transmission part, the temperature measuring mechanism is arranged outside the housing and arranged corresponding to the light transmission part, the light transmission part has better light transmission performance to the infrared wave band, so that the infrared ray on the back surface of the base is transmitted through the first channel and is emitted out of the light transmission part, at the moment, the infrared ray transmitted through the light transmission part can be received through the temperature measuring mechanism, and the temperature measurement on the temperature measuring surface of the base is realized.
And, drive assembly includes the initiative drive structure and the driven drive structure of magnetic coupling, and wherein, the initiative drive structure sets up outside the casing, and the driven drive structure sets up in the inner chamber of casing, and the other end and the driven drive structure of back shaft are connected, so, the initiative drive structure can be through the driven drive structure drive back shaft along self axis direction removal and around self axis rotation.
Based on the arrangement, the first channel of the supporting shaft is used as the channel for infrared transmission, so that an infrared temperature measuring light path is formed along the axis direction of the supporting shaft, infrared rays emitted by the temperature measuring surface are transmitted to the temperature measuring mechanism along the first channel, and the transmission of the infrared rays is not interfered even if the supporting shaft rotates, so that the temperature measuring mechanism can effectively measure the temperature of the temperature measuring surface on the back surface of the base through the first channel, and the accuracy of temperature measurement is guaranteed; meanwhile, the driving structure and the driven driving structure are magnetically coupled and are respectively located outside and inside the shell, so that when the driving structure drives the supporting shaft to move along the axis of the driving structure through the driven driving structure, the air pressure inside the shell and even inside the process chamber cannot be changed, and the moving resistance of the supporting shaft cannot be additionally increased.
Drawings
FIG. 1 is a schematic view of a susceptor support member and a pyrometer according to the related art;
FIG. 2 is a cross-sectional view of a carrier disclosed in an embodiment of the present application;
fig. 3 is a sectional view of a drive mechanism disclosed in an embodiment of the present application.
Description of reference numerals:
a-a base axis; b-a substrate lifting member; c-a base; d-a bellows; e-a first arm; f-an infrared pyrometer;
10-a base; 11-a bearing surface; 12-temperature measuring surface;
20-supporting the shaft; 21-a first shaft body; 211 — a first channel; 22-a first support arm; 23-a support column;
30-a lift shaft; 31-a second shaft; 311-a second channel; 32-a second arm; 33-lifting the rod;
40-a drive mechanism; 41-a housing; 411-a sealed cylinder; 412-annular seal; 413-sealing plate; 414 — a first sealing element; 415-a second sealing element; 42-a drive assembly; 421-a first elevation drive means; 4211-a first linear module; 4212-a first frame; 4213-a second frame; 4214-a third frame; 422-a rotary drive member; 4221-rotary drive; 4222-a first magnetic rotation piece; 4223-a second magnetic rotation piece; 4231-a first bearing; 4232-a second bearing; 424-second elevation drive member; 4241-a second linear module; 4242-a first magnetic member; 4243-a second magnetic piece; 425-a first annular support; 426-a second loop-shaped support; 43-a fixed support; 441-a first guide rail; 442-a second guide rail;
50-a temperature measuring mechanism; 51-a temperature measuring element; 52-shield can.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and that the terms "first," "second," and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
The embodiments of the present application are described in detail below with reference to the accompanying drawings through specific embodiments and application scenarios thereof.
Referring to fig. 1, a susceptor supporting member in the related art includes a susceptor shaft a and a substrate elevating member b. The base shaft a includes a solid first support column and a plurality of first arms e extending radially from the first support column, and the substrate lifting member b includes a second support column and a plurality of second arms extending radially from the second support column. The temperature measuring path is shown as a dotted line in fig. 1, and the temperature of the back surface of the susceptor c is measured through the side light path. In the lifting process, the two shaft bodies are driven to lift through the expansion of the two corrugated pipes d at the bottom, and meanwhile, the base shaft a can also be driven to rotate by the bottom rotating mechanism.
However, in a normal use state of the susceptor supporting member, the plurality of first arms e of the susceptor shaft a interfere with the infrared emission from the back surface of the susceptor c, affecting the temperature measurement accuracy of the infrared pyrometer f located at the lower side of the susceptor supporting member; in addition, bellows d type elevating system, at the lift in-process, the whole volume of cavity can change, also can influence the temperature measurement accuracy of infrared pyrometer f, and the inside atmospheric pressure of cavity can bring extra load for elevator motor, and dirt and the dust particle of raising are also hidden easily to the bellows d of activity.
In view of the above, the present application provides a carrying device to overcome the above problems, as follows.
Referring to fig. 2 and fig. 3, an embodiment of the present application discloses a carrying device, which is applied to a process chamber of a semiconductor processing apparatus, and can carry a wafer through the carrying device, so that the wafer can perform a corresponding process flow in an inner cavity of the process chamber, so as to implement processing on the wafer.
The disclosed carrying device includes a base 10, a support shaft 20, a driving mechanism 40, and a temperature measuring mechanism 50. The base 10 is used for bearing a wafer, and the support shaft 20 is used for connecting the base 10, on one hand, the support shaft supports the base 10, and on the other hand, the support shaft can drive the base 10 to rotate, so that the uniformity of the wafer is improved, and the processing precision is improved; the driving mechanism 40 is at least used to provide a driving force for the rotation of the base 10.
The susceptor 10 has a bearing surface 11 and a temperature measuring surface 12, and the bearing surface 11 is opposite to the temperature measuring surface 12, wherein the bearing surface 11 is used for bearing a wafer, and the temperature measuring surface 12 is used for measuring temperature. When the bearing device is in an application state, the bearing surface 11 is positioned at the top of the base 10, and the temperature measuring surface 12 is positioned at the bottom of the base 10.
One end of the support shaft 20 is connected to the base 10. Alternatively, the support shaft 20 may include a first shaft body 21, a first arm 22 and a support column 23, wherein a plurality of first arms 22 are disposed on an outer wall of the first shaft body 21, and the plurality of first arms 22 respectively extend outward along a radial direction of the first shaft body 21, so that a contact area between the support shaft 20 and the base 10 may be enlarged to ensure stability and firmness of connection between the support shaft 20 and the base 10. One end of each support arm, which is away from the first shaft body 21, is provided with a support column 23, and the support column 23 is parallel to the first shaft body 21, so that the first support arm 22 is connected with the base 10 through the support column 23.
Alternatively, a plurality of mounting holes may be formed in the bottom of the base 10 along the circumferential direction, and the plurality of supporting columns 23 are fitted into the plurality of mounting holes in a one-to-one correspondence manner, so as to connect the supporting columns 23 with the base 10.
In order to form the infrared temperature measuring light path, the supporting shaft 20 is provided with a first channel 211 extending along the axis direction thereof, and one end of the first channel 211 is arranged corresponding to the temperature measuring surface 12. Specifically, the first shaft body 21 is hollowed along the axis direction, so that the first shaft body 21 is formed into a hollow shaft structure, and the hollow cavity of the first shaft body 21 and the back surface of the base 10, that is, the temperature measuring surface 12, are oppositely arranged, so that it can be ensured that the infrared rays emitted by the temperature measuring surface 12 can be transmitted along the first channel 211 to the direction away from the temperature measuring surface 12, so as to be received by the temperature measuring mechanism 50.
To ensure that the process chamber is in a sealed state during the process and the rotation of the susceptor 10 is achieved, the driving mechanism 40 in the embodiment of the present application includes a driving assembly 42 and a housing 41, wherein the housing 41 is in a sealed connection with the process chamber. Alternatively, one end of the housing 41 is opened and coupled to the bottom of the process chamber, and communicates with the process chamber through the opening, so that the support shaft 20 can penetrate into the process chamber. To ensure the sealing property, a sealing structure may be further provided between the housing 41 and the process chamber to ensure the sealing property at the connection.
When the supporting shaft 20 is arranged, one end of the supporting shaft 20 can penetrate into the inner cavity of the process chamber to support the base 10 in the inner cavity of the process chamber, and at least part of the other end of the supporting shaft 20 is arranged in the inner cavity of the shell 41, so that the supporting shaft 20 can be positioned in the inner cavity of the process chamber and the inner cavity of the shell 41 which are communicated with each other, the inner cavity of the process chamber cannot be communicated with the external environment, and the sealing performance of the process chamber is ensured.
In order to allow the infrared rays transmitted through the first passage 211 to be received by the temperature measuring mechanism 50, in the embodiment of the present application, a light-transmitting portion is provided in the direction in which the housing 41 extends along the first passage 211, and the other end of the first passage 211 is provided corresponding to the light-transmitting portion, and the temperature measuring mechanism 50 is provided outside the housing 41 and corresponding to the light-transmitting portion. Thus, the infrared rays emitted from the temperature measuring surface 12 of the base 10 can be transmitted to the light-transmitting portion along the first channel 211, and at this time, the infrared rays can be received only by aligning the temperature measuring mechanism 50 with the light-transmitting portion, thereby realizing temperature measurement of the temperature measuring surface 12 of the base 10.
In the embodiment of the present application, the infrared rays emitted from the temperature measuring surface 12 of the base 10 can be transmitted to the light-transmitting portion through the first channel 211, so that the temperature measuring mechanism 50 can receive the infrared rays at the light-transmitting portion, thereby implementing temperature measurement on the temperature measuring surface 12 of the base 10.
In order to realize the rotation and lifting of the susceptor 10, the driving assembly 42 is at least partially disposed in the inner cavity of the housing 41, and the driving assembly 42 is connected to the supporting shaft 20, so that the supporting shaft 20 can be driven by the driving assembly 42 to move along the direction of the own axis and rotate around the own axis, thereby meeting the process requirements.
In some embodiments, the drive assembly 42 includes a driving drive structure disposed outside of the housing 41 and a driven drive structure disposed within an interior cavity of the housing 41. Wherein, the other end and the driven drive structure of back shaft 20 are connected, and initiative drive structure and driven drive structure magnetic coupling to can drive the motion of driven drive structure, and move and rotate around self axis along self axis direction through driven drive structure drive back shaft.
The specific structure of the driving and driven driving structures and their connection will be described in detail below.
Based on the above setting, the first channel 211 of the support shaft 20 is used as the channel for infrared transmission in the embodiment of the application, thereby forming the infrared temperature measurement light path along the axis direction of the support shaft 20, the infrared ray emitted by the temperature measurement surface 12 is transmitted to the temperature measurement mechanism 50 along the first channel 211, because the first channel 211 extends along the axis direction of the support shaft 20, the arm connected to the support shaft 20 cannot be blocked, and therefore, even if the support shaft 20 rotates, the transmission of the infrared ray cannot be interfered, and therefore, the temperature measurement mechanism 50 can effectively measure the temperature of the temperature measurement surface 12 on the back surface of the base 10 through the first channel 211, thereby ensuring the accuracy of temperature measurement.
Meanwhile, the driving structure and the driven driving structure are magnetically coupled and are respectively located outside and inside the shell 41, so that when the driving structure drives the supporting shaft 20 to move along the axis of the driving structure, the pressure inside the shell 41 and even inside the process chamber cannot be changed, the accuracy of temperature measurement is further ensured, and the moving resistance of the supporting shaft 20 cannot be additionally increased.
To accomplish the elevation and rotation of the susceptor 10, the driving structure may include a first elevation driving part 421 and a rotation driving part 422, and the driven driving structure may include a first driven driving structure. The output end of the rotation driving component 422 is magnetically coupled to a first driven driving structure, and the first driven driving structure is connected to the supporting shaft 20 to drive the supporting shaft 20 to rotate around its axis, and the supporting shaft 20 drives the susceptor 10 to rotate synchronously, so that the wafer carried on the carrying surface 11 of the susceptor 10 can rotate along with the susceptor 10, thereby ensuring the uniformity of wafer processing.
The first elevation driving part 421 is connected to the rotation driving part 422 to drive the rotation driving part 422 and the support shaft 20 to move along the axial direction of the support shaft 20.
To drive the support shaft 20 in rotation, in some embodiments, the rotary drive component 422 may include a rotary drive member 4221 and a first magnetic rotation member 4222, while the first driven drive structure includes a second magnetic rotation member 4223. The rotation driving member 4221 is in transmission connection with the first magnetic rotation member 4222, the first magnetic rotation member 4222 is magnetically coupled with the second magnetic rotation member 4223, the first magnetic rotation member 4222 is rotatably disposed outside the housing 41, and the second magnetic rotation member 4223 is rotatably disposed in an inner cavity of the housing 41 and is connected to the support shaft 20.
It should be noted here that the polarities of the first magnetic rotating element 4222 and the second magnetic rotating element 4223 may be different, so that the two magnetic rotating elements with different polarities may be coupled together by a magnetic attraction force, thereby achieving transmission of motion and power. Of course, the polarities of the first magnetic rotation element 4222 and the second magnetic rotation element 4223 may also be the same, so that two magnetic rotation elements having the same polarity may be coupled by a magnetic repulsive force, thereby achieving transmission of motion and power.
Alternatively, the rotary drive 4221 may be a rotary electric motor, which may drive the first magnetic rotary member 4222 to rotate; the first magnetic rotation element 4222 and the second magnetic rotation element 4223 may be magnetic transmission wheels, and due to magnetic coupling between the first magnetic rotation element 4222 and the second magnetic rotation element 4223, the first magnetic rotation element 4222 may drive the second magnetic rotation element 4223 to rotate when driven by the rotation driving element 4221, so that the second magnetic rotation element 4223 may drive the support shaft 20 to rotate, and finally the support shaft 20 may drive the base 10 to rotate.
Based on the above arrangement, the first magnetic rotator 4222 located outside the housing 41 can transmit power and motion to the second magnetic rotator 4223 located inside the housing 41 through magnetic coupling between the first magnetic rotator 4222 and the second magnetic rotator 4223, so that the transmission of power and motion between the first magnetic rotator 4222 and the second magnetic rotator 4223 can be realized without providing an escape space on the housing 41, and the tightness of the housing 41 and the process chamber is ensured, and at the same time, the rotation of the base 10 can be realized.
To accomplish the lifting of the support shaft 20, in some embodiments, the first lifting driving part 421 includes a first linear module 4211 and a first frame 4212, and the first driven driving structure includes a second frame 4213. The first linear module 4211 is connected to the first frame 4212, the first frame 4212 is disposed outside the housing 41 and is movable relative to the housing 41 along the axial direction of the support shaft 20, the first magnetic rotator 4222 is rotatably connected to the first frame 4212, the second frame 4213 is disposed in the inner cavity of the housing 41 and is movable relative to the housing 41 along the axial direction of the support shaft 20, and the second magnetic rotator 4223 is rotatably connected to the second frame 4213.
To prevent magnetic interference, the first and second frames 4212 and 4213 may be made of a non-magnetic metal material.
In some embodiments, the first linear module 4211 may include a driving motor, a lead screw, and a slider, wherein a rotating shaft of the driving motor is connected to the lead screw, the slider is in threaded connection with the lead screw, and the slider is fixedly connected to the first frame 4212. In this way, the driving motor can drive the slider and the first frame 4212 connected with the slider to move through the screw rod, so that the first frame 4212 reciprocates along the axial direction of the support shaft 20, and drives the support shaft 20 to reciprocate along the axial direction of the support shaft through the first magnetic rotating piece 4222 and the second magnetic rotating piece 4223 which are magnetically coupled, and finally, the base 10 is lifted.
In other embodiments, the first linear module 4211 may also be in other forms, such as a pneumatic cylinder, a hydraulic cylinder, an electric cylinder, and the like, and the specific form of the first linear module 4211 is not limited in this embodiment.
The first frame 4212 may be a ring-shaped structure, which is sleeved outside the housing 41 and can move relative to the housing 41. To mount the first magnetic rotation member 4222, a first annular groove may be bored in the first frame 4212, the first magnetic rotation member 4222 may be disposed in the first annular groove, and the first magnetic rotation member 4222 may be rotated in the first annular groove.
In order to mount the first magnetic rotation member 4222 into the first annular groove, the first frame 4212 may be designed as a split structure, specifically, including an annular frame structure having an L-shaped cross section and an annular plate. When the first magnetic rotating piece 4222 is installed, the annular plate is separated from the annular frame structure, then the first magnetic rotating piece 4222 is placed inside the annular frame structure, and the annular plate cover is arranged on one end face of the annular frame structure, so that the annular plate and the annular frame structure jointly enclose a first annular groove, and the installation of the first magnetic rotating piece 4222 is achieved.
In order to enable the first frame 4212 to move smoothly, the first guide rail 441 may be provided on the outer wall of the housing 41 in the axial direction of the support shaft 20, and the inner side of the first frame 4212 is slidably coupled to the first guide rail 441, so that the first frame 4212 can be ensured to move smoothly outside the housing 41. Alternatively, the inner end surface of the annular frame structure may be slidably connected to the first guide rail 441, and the annular plate may be spaced apart from the first guide rail 441.
In some embodiments, the second frame 4213 may also be a ring-shaped structure disposed inside the housing 41 and movable relative to the housing 41 within the interior cavity of the housing 41. In order to mount the second magnetic rotation element 4223, a second annular groove may be formed in the second frame 4213, the second magnetic rotation element 4223 may be disposed in the second annular groove, and the second magnetic rotation element 4223 may be rotated in the second annular groove.
Alternatively, the second frame 4213 may be a unitary structure, and in this case, in order to mount the second magnetic rotation member 4223 into the second annular groove, the diameter of an opening at one end of the second frame 4213 may be made large to ensure that the second magnetic rotation member 4223 can be placed in the second annular groove. Meanwhile, it is also ensured that the support shaft 20 can be coupled to the second magnetic rotary member 4223 after passing through the second frame 4213.
Based on this, the cross section of the second frame 4213 may be designed to be a C-shaped structure, and one end of the C-shaped structure is shorter than the other end, so as to form a ring structure with one end opened large and the other end opened small, thereby facilitating the installation of the second magnetic rotation member 4223.
In order to enable the second frame 4213 to move smoothly, the second guide rail 442 may be provided on the inner wall of the housing 41 in the axial direction of the support shaft 20, and the outer side of the second frame 4213 may be slidably coupled to the second guide rail 442, so that the second frame 4213 can be guaranteed to move smoothly inside the housing 41.
In some embodiments, the first magnetic rotation element 4222 is a magnetic gear sleeve, and accordingly, the rotation driving element 4221 has an output gear, and the output gear is engaged with the magnetic gear sleeve, so that the transmission of force and motion can be performed.
In order to connect the second magnetic rotating member 4223 to the supporting shaft 20, in some embodiments, the second magnetic rotating member 4223 is a magnetic ring sleeve, and an end of the supporting shaft 20 away from the base 10 penetrates into the magnetic ring sleeve and is relatively engaged to realize connection, so that the supporting shaft 20 can be driven by the second magnetic rotating member 4223 to rotate.
In order to realize the relative rotation between the magnetic gear sleeve and the first frame 4212, two end surfaces of the magnetic gear sleeve, which are axially opposite to each other, may be connected to the first frame 4212 through bearings, respectively. Optionally, the first frame 4212 is provided with a first annular groove, the first annular groove has an upper wall surface and a lower wall surface which are oppositely arranged, when the magnetic gear sleeve is arranged in the first annular groove, a first bearing 4231 is respectively arranged between one end surface of the magnetic gear sleeve and the upper wall surface, and between the other end surface of the magnetic gear and the lower wall surface, so that the magnetic gear sleeve can be assembled in the first annular groove through the first bearing 4231, two end surfaces of the magnetic gear sleeve can be respectively supported through the first bearing 4231, and the magnetic gear sleeve can be ensured to be freely rotated.
Similarly, to realize relative rotation between the magnetic ring and the second frame 4213, the two end surfaces of the magnetic ring opposite to each other in the axial direction may be connected to the second frame 4213 by bearings, respectively. Alternatively, the second frame 4213 may be provided with a second annular groove having an upper wall surface and a lower wall surface which are opposite to each other, and when the magnetic ring sleeve is disposed in the second annular groove, the second bearings 4232 are respectively disposed between one end surface of the magnetic ring sleeve and the upper wall surface, and between the other end surface of the magnetic ring sleeve and the lower wall surface, so that the magnetic ring sleeve may be fitted in the second annular groove via the second bearings 4232, and both end surfaces of the magnetic ring sleeve may be respectively supported via the second bearings 4232, and the magnetic ring sleeve may be ensured to be freely rotatable.
In order to realize the connection between the rotation driving part 422 and the first lifting driving part 421, in some embodiments, the first lifting driving part 421 may further include a third frame 4214, the third frame 4214 is connected to the first frame 4212, and a rotation driving part 4221 in the rotation driving part 422 is disposed on the third frame 4214, so that the rotation driving part 422 and the first frame 4212 may be connected by the third frame 4214, so that when the first frame 4212 moves along the axis of the supporting shaft 20, the rotation driving part 4221 may be driven by the third frame 4214 to move synchronously, so as to ensure that the rotation driving part 4221 can be in transmission connection with a first magnetic rotation part 4222 disposed on the first frame 4212.
Since the output end (i.e., the output gear) of the rotation driving member 4221 is located in the inner cavity of the third frame 4214, and the first magnetic rotation member 4222 is disposed in the inner cavity of the first frame 4212, in order to make the rotation driving member 4221 in transmission connection with the first magnetic rotation member 4222, an avoiding hole may be disposed on the sidewall of the first frame 4212, and the inner cavity of the first frame 4212 and the inner cavity of the third frame 4214 may be communicated through the avoiding hole, so that the output gear and the first magnetic rotation member 4222 may be in transmission connection through the avoiding hole, thereby ensuring transmission of rotation power, and finally realizing rotation of the support shaft 20 and the base 10 connected with the support shaft 20.
Based on the above arrangement, the first magnetic rotating element 4222, the second magnetic rotating element 4223 and the rotary driving element 4221 are respectively and correspondingly mounted on the first frame 4212, the second frame 4213 and the third frame 4214, and under the driving action of the first linear module 4211, the first frame 4212 and the first magnetic rotating element 4222 can move along the axial direction of the support shaft 20, and under the magnetic action, the second magnetic rotating element 4223 and the second frame 4213 can move synchronously, and the third frame 4214 and the rotary driving element 4221 can also move synchronously, so that the driving force can be provided for the support shaft 20, so that the support shaft 20 can be ensured to be lifted and lowered and rotated without interference in movement, and the sealing performance of a process chamber can be ensured.
In order to place the wafer on the carrying surface 11 or separate from the carrying surface 11, the carrying device may further include a lift shaft 30 for lifting the wafer, and the wafer may be moved by the movement of the lift shaft 30, so that the wafer may be placed on the carrying surface 11 or lifted from the carrying surface 11.
In some embodiments, the lifting shaft 30 is at least partially disposed in the inner cavity of the housing 41, and meanwhile, a second channel 311 extending along the axis direction of the lifting shaft 30 is disposed on the lifting shaft 30 and sleeved outside the supporting shaft 20, so that the supporting shaft 20 can pass through the second channel 311 and at least partially pass through the second channel 311. In this way, the assembly between the support shaft 20 and the lift shaft 30 is achieved, and the support shaft 20 and the lift shaft 30 are collinear. Therefore, the support shaft 20 can be rotated and moved up and down in the second passage 311 of the lift shaft 30 without interference from the lift shaft 30, and at the same time, the lift shaft 30 can be freely moved up and down without interference from the support shaft 20.
Here, one end of the support shaft 20 located in the housing 41 is extended out of the corresponding end of the lift shaft 30, so that the support shaft 20 can be connected to the second magnetic rotator 4223.
Alternatively, the lift shaft 30 may include a second shaft body 31, a plurality of second arms 32 connected to an outer wall of the second shaft body 31 and extending in a radial direction, and lift rods 33 corresponding to the plurality of second arms 32 one to one. The second shaft 31 is a hollow shaft structure, and a second passage 311 is formed in the second shaft so as to pass through the support shaft 20; the plurality of lifting rods 33 are movably disposed on the first arm 22 and correspond to the plurality of second arms 32, and the base 10 has through holes corresponding to the plurality of lifting rods 33, so that the lifting rods 33 can pass through the through holes to contact the wafer. Thus, when a wafer needs to be lifted, the second shaft 31 can move along its axis and respectively abut against the corresponding lifting rods 33 through the second support arms 32, so that the wafer is lifted through the lifting rods 33, and the wafer is conveniently placed on the carrying surface 11 or lifted from the carrying surface 11.
In order to move the lift shaft 30, the driving structure may further include a second lifting driving member 424, and the driven driving structure includes a second driven driving structure, and an output end of the second lifting driving member 424 is magnetically coupled to the second driven driving structure, which is connected to the lift shaft 30 to drive the lift shaft 30 to reciprocate along its axis direction, so as to lift the wafer on the carrying surface 11 or separate from the carrying surface 11 through the lift shaft 30.
Based on this, actuating mechanism 40 both can drive back shaft 20 rotatory and go up and down, can drive again and lift up axle 30 lift, has realized multiple functions, compares and adopts a plurality of drive division, can reduce spare part, reduces the structural complexity of load-bearing device, and practices thrift the cost.
In some embodiments, the second elevation drive member 424 may include a second linear module 4241 and a first magnetic member 4242, and the second driven drive structure includes a second magnetic member 4243. The second linear module 4241 is connected to the first magnetic member 4242, the first magnetic member 4242 is magnetically coupled to the second magnetic member 4243, and the lift shaft 30 is connected to the second magnetic member 4243. Thus, under the driving action of the second linear module 4241, the first magnetic member 4242 can move along with the second linear module 4241, and under the magnetic force action, the second magnetic member 4243 can move along with the first magnetic member 4242, so that the second magnetic member 4243 can drive the lift shaft 30 to move relative to the support shaft 20, thereby realizing the lifting action on the wafer.
It should be noted here that the polarities of the first magnetic member 4242 and the second magnetic member 4243 are different, so that the two magnetic members can be coupled together by magnetic attraction force, thereby transferring motion and power to achieve the effect of lifting together. Of course, the polarities of the first magnetic member 4242 and the second magnetic member 4243 may also be the same, so that two magnetic members having the same polarity may be coupled by a magnetic repulsive force, thereby achieving transmission of motion and power.
In some embodiments, the second linear module 4241 may include a driving motor, a screw rod, and a slider, wherein a rotating shaft of the driving motor is connected to the screw rod, the slider is connected to the screw rod by a screw thread, and the slider is fixedly connected to the first magnetic member 4242. Therefore, the driving motor can drive the sliding block and the first magnetic part 4242 connected with the sliding block to move through the screw rod, so that the first magnetic part 4242 can move back and forth along the axis direction of the lifting shaft 30, the first magnetic part 4242 and the second magnetic part 4243 which are magnetically coupled drive the lifting shaft 30 to move back and forth along the axis direction of the lifting shaft 30, and finally the lifting shaft 30 is lifted.
In other embodiments, the second linear module 4241 may also be in other forms, such as a pneumatic cylinder, a hydraulic cylinder, an electric cylinder, and the like, and the specific form of the second linear module 4241 is not limited in this embodiment.
In some embodiments, the first magnetic member 4242 and the second magnetic member 4243 are both magnetic rings, the first magnetic member 4242 is sleeved outside the housing 41, and the second magnetic member 4243 is disposed in the inner cavity of the housing 41 and sleeved outside the lift shaft 30.
In order to allow the first magnetic member 4242 and the second magnetic member 4243 to smoothly move, the first magnetic member 4242 is slidably coupled to an outer wall of the housing 41, and the second magnetic member 4243 is slidably coupled to an inner wall of the housing 41. Optionally, a third guide rail may be disposed on an outer wall of the housing 41 along an axial direction of the lift shaft 30, and an inner side of the first magnetic member 4242 is slidably connected to the third guide rail, so that the first magnetic member 4242 can be ensured to move smoothly outside the housing 41; similarly, the fourth guide rail may be reversely disposed on the inner wall of the housing 41 along the axis of the lifting shaft 30, and the outer side of the second magnetic member 4243 may be slidably connected to the fourth guide rail, so as to ensure that the second magnetic member 4243 stably and smoothly moves inside the housing 41.
Here, the third guide rail and the first guide rail 441 may be two independent guide rails, or may be the same guide rail; similarly, the fourth guide rail and the second guide rail 442 may be two independent guide rails, or may be the same guide rail.
In order to make the connection between the rotation driving component 422 and the supporting shaft 20 more stable and firm, the driving assembly 42 further includes a first annular supporting member 425, the first annular supporting member 425 and a second magnetic rotating member 4223, and the first annular supporting member 425 is sleeved on an end of the supporting shaft 20 facing away from the base 10.
Optionally, the first annular supporting member 425 is fixed on the second magnetic rotating member 4223, and the first annular supporting member 425 and the second magnetic rotating member 4223 are coaxially arranged, when the other end of the supporting shaft 20 penetrates into the second magnetic rotating member 4223, on one hand, the outer wall of the supporting shaft 20 abuts against the inner side surface of the second magnetic rotating member 4223 to ensure the matching connection between the supporting shaft 20 and the second magnetic rotating member 4223, and on the other hand, the outer wall of the supporting shaft 20 abuts against the inner side wall of the first annular supporting member 425 to ensure the matching connection between the supporting shaft 20 and the first annular supporting member 425.
Further, an anti-slip structure, such as a rough surface, an anti-slip pad, etc., is disposed on the inner sidewall of the first annular supporting member 425, so that the frictional resistance between the first annular supporting member 425 and the supporting shaft 20 can be increased, and it can be ensured that the supporting shaft 20 does not separate from the second magnetic rotating member 4223 and does not rotate relative to the second magnetic rotating member 4223.
Based on the above arrangement, the firmness and stability of the connection of the second magnetic rotation member 4223 and the support shaft 20 can be increased by the first annular support member 425.
In order to make the connection between the second elevating driving member 424 and the lifting shaft 30 more stable and firm, the driving assembly 42 further includes a second ring-shaped supporting member 426, the second ring-shaped supporting member 426 is connected to the second magnetic member 4243, and the second ring-shaped supporting member 426 is sleeved on an end of the lifting shaft 30 away from the base 10.
Optionally, the second annular support member 426 is fixed on the second magnetic member 4243, and the second annular support member 426 and the second magnetic member 4243 are coaxially arranged, when the other end of the lifting shaft 30 penetrates into the second magnetic member 4243, on one hand, the outer wall of the lifting shaft 30 abuts against the inner side surface of the second magnetic member 4243 to ensure the matching connection between the lifting shaft 30 and the second magnetic member 4243, and on the other hand, the outer wall of the lifting shaft 30 abuts against the inner side wall of the second annular support member 426 to ensure the matching connection between the lifting shaft 30 and the second annular support member 426.
Further, an anti-slip structure, such as a rough surface, an anti-slip pad, etc., is disposed on the inner sidewall of the second loop-shaped support 426, so as to increase the frictional resistance between the second loop-shaped support 426 and the lift shaft 30, and further ensure that the lift shaft 30 does not disengage from the second magnetic member 4243 and does not rotate relative to the second magnetic member 4243.
Based on the above arrangement, the second ring-shaped support 426 can increase the connection firmness and stability of the second magnetic member 4243 and the lift shaft 30.
In order to ensure the sealing property and the light transmittance of the housing 41, the housing 41 includes a sealing cylinder 411, a sealing plate 413, and an annular sealing member 412, wherein the light transmittance portion is formed on the sealing plate 413, and the annular sealing member 412 is used for connecting the sealing plate 413 to the end of the sealing cylinder 411 away from the base 10 in a sealing manner.
Alternatively, the sealing cylinder 411 is a cylinder structure with two open ends, one end of the sealing cylinder is connected to the bottom of the process chamber, the other end is provided with an annular sealing member 412, and the sealing plate 413 can be mounted at the other end of the sealing cylinder 411 through the annular sealing member 412. In this way, the sealing property at the other end of the housing 41 can be ensured, and the light transmission performance can be realized through the light transmission part, so that the infrared rays transmitted along the first channel 211 can be emitted through the light transmission part to be received by the temperature measuring mechanism 50.
In some embodiments, the annular seal 412 is L-shaped in cross-section such that an end of the annular seal 412 forms an annular groove, and the seal plate 413 may be disposed in the annular groove, and then the annular seal 412 may be secured to the seal cartridge 411 such that the seal plate 413 is captured therebetween by the annular seal 412 and the seal cartridge 411.
In addition, the light-transmitting portion of the sealing plate 413 can be made of a material with good light-transmitting property, so that the infrared rays have excellent transmittance, and thus the infrared rays can be received by the temperature measuring mechanism 50, and the accuracy of temperature measurement can be ensured.
In order to ensure the sealing performance at the connection region between the housing 41 and the process chamber, the housing 41 further includes a first sealing element 414 and a second sealing element 415, wherein the first sealing element 414 is located in the inner cavity of the process chamber, and the second sealing element 415 is connected to one end of the sealing cylinder 411, so that when the housing 41 is connected to the process chamber, the first sealing element 414 and the second sealing element 415 can cooperate to achieve the sealing performance between the housing 41 and the process chamber, thereby ensuring the smooth process in the process chamber.
In order to prevent the temperature measuring mechanism 50 and the transparent part from being affected by external light during the temperature measuring process, the temperature measuring mechanism 50 may further include a shielding cover 52, and in addition, the temperature measuring mechanism 50 further includes a temperature measuring element 51. One end of the shield 52 is connected to the annular seal 412, and the other end of the shield 52 is connected to the temperature measuring element 51, so that a shielding passage for shielding external light is formed between the housing 41 and the temperature measuring element 51.
Based on the above arrangement, the infrared rays transmitted to the light-transmitting portion along the first channel 211 are continuously transmitted to the temperature measuring element 51 along the shielding channel, so as to be received by the temperature measuring element 51, in the process, a circle between the light-transmitting portion and the temperature measuring element 51 is surrounded by the shielding cover 52, so that external light can be prevented from entering between the light-transmitting portion and the temperature measuring element 51, and the accuracy of temperature measurement can be effectively prevented from being influenced by the external light.
Alternatively, the shielding cover 52 may be made of a material capable of shielding infrared rays from outside light to prevent the infrared rays from entering between the transparent portion and the temperature measuring element 51, thereby ensuring the accuracy of temperature measurement.
In order to fix the driving assembly 42, the supporting device may further include a fixing bracket 43, and the fixing bracket 43 is fixedly connected to the housing 41. The fixing bracket 43 may be provided with fixing mounting grooves in which the first and second elevation driving parts 421 and 424 are disposed to prevent external factors from interfering with the normal operation of the driving assembly 42 while preventing the appearance from being exposed.
Based on the bearing device, the embodiment of the application also discloses semiconductor process equipment, and the disclosed semiconductor process equipment comprises the bearing device.
To sum up, the device that bears in this application embodiment can implement more accurate infrared pyrometry to the temperature measurement face 12 of base 10 back, specifically does, the infrared ray of the temperature measurement face 12 thermal radiation of base 10 back passes first passageway 211 and to the better printing opacity portion of infrared ray trafficability characteristic, is received by temperature measurement mechanism 50, can obtain the signal of telecommunication that the temperature corresponds after temperature measurement mechanism 50 handles, temperature measurement mechanism 50 has better distance coefficient, the region of testing is less under the distance far away promptly, its temperature measurement scope can not receive the interference.
In the embodiment of the application, the lifting and the rotation of the supporting shaft 20 and the lifting of the lifting shaft 30 can be realized through the driving component 42, compared with a corrugated pipe form, the lifting and the rotation of the supporting shaft 20 can be hermetically connected with a process chamber through the shell 41, and a full-magnetic coupling rotation lifting driving mode is adopted, so that in the respective lifting processes of the supporting shaft 20 and the lifting shaft 30, the light transmission part is relatively fixed and cannot move along with the movement, the stability of a temperature measuring light path is ensured, and the temperature measuring precision can be further improved; meanwhile, compared with a corrugated pipe mode, the change of the atmospheric pressure in the process chamber can be avoided, so that extra load caused by the atmospheric pressure can be avoided in the lifting process, and the load of each lifting driving part can be greatly reduced; moreover, the fixed shape structure is also helpful to prevent the particles adsorbed and stabilized on the inner surface of the driving assembly 42 from reentering the working area in the process chamber, thereby effectively avoiding particle pollution.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (12)

1. A bearing device applied to a process chamber of semiconductor process equipment is characterized by comprising: the temperature measuring device comprises a base (10), a support shaft (20), a driving mechanism (40) and a temperature measuring mechanism (50);
the base (10) is provided with a bearing surface (11) and a temperature measuring surface (12) which are arranged in a back-to-back mode, and the bearing surface (11) is used for bearing a wafer;
one end of the support shaft (20) is connected with the base (10), the support shaft (20) is provided with a first channel (211) extending along the axis direction of the support shaft, and one end of the first channel (211) is arranged corresponding to the temperature measuring surface (12);
the driving mechanism (40) comprises a driving assembly (42) and a shell (41) which is used for being connected with the process chamber in a sealing manner, the driving assembly (42) comprises a driving structure which is arranged outside the shell (41) and a driven driving structure which is arranged in an inner cavity of the shell (41), the supporting shaft (20) is at least partially arranged in the inner cavity of the shell (41), the other end of the supporting shaft (20) is connected with the driven driving structure, and the driving structure drives the driven driving structure through magnetic coupling so as to drive the supporting shaft (20) to move along the direction of the axis of the supporting shaft and rotate around the axis of the supporting shaft;
the shell (41) is provided with a light-transmitting part along the extending direction of the first channel (211), and the other end of the first channel (211) is arranged corresponding to the light-transmitting part;
the temperature measuring mechanism (50) is arranged outside the shell (41) and corresponds to the light transmission part.
2. The carrying device according to claim 1, wherein the driving arrangement comprises a first lifting driving member (421) and a rotating driving member (422), and the driven driving arrangement comprises a first driven driving arrangement;
the output end of the rotary driving component (422) is magnetically coupled with the first driven driving structure, and the first driven driving structure is connected with the supporting shaft (20) so as to drive the supporting shaft (20) to rotate around the axis of the supporting shaft;
the first lifting driving part (421) is connected with the rotating driving part (422) so as to drive the rotating driving part (422) and the supporting shaft (20) to move along the axial direction of the supporting shaft (20).
3. The carrier device according to claim 2, wherein the rotary drive component (422) comprises a rotary drive (4221) and a first magnetic rotation (4222), the first driven drive arrangement comprising a second magnetic rotation (4223);
the rotary driving member (4221) is in transmission connection with the first magnetic rotating member (4222), the first magnetic rotating member (4222) is magnetically coupled with the second magnetic rotating member (4223), the first magnetic rotating member (4222) is rotatably arranged outside the shell (41), and the second magnetic rotating member (4223) is rotatably arranged in an inner cavity of the shell (41) and is connected with the supporting shaft (20).
4. Load carrying device according to claim 3, characterized in that said first lifting drive means (421) comprise a first rectilinear module (4211) and a first frame (4212), said first driven drive structure further comprising a second frame (4213);
the first linear module (4211) is connected with the first frame (4212), the first frame (4212) is arranged outside the housing (41) and is movable relative to the housing (41) along the axial direction of the support shaft (20), and the first magnetic rotating member (4222) is rotatably connected with the first frame (4212);
the second frame (4213) is disposed in an inner cavity of the housing (41) and is movable relative to the housing (41) in an axial direction of the support shaft (20), and the second magnetic rotation member (4223) is rotatably connected to the second frame (4213).
5. The carrying device according to claim 4, wherein the first magnetic rotation element (4222) is a magnetic gear sleeve, the rotation driving element (4221) is provided with an output gear, the output gear is in meshing connection with the magnetic gear sleeve, and two axially opposite end surfaces of the magnetic gear sleeve are respectively connected with the first frame (4212) through bearings;
and/or the second magnetic rotating piece (4223) is a magnetic ring sleeve, and two end faces of the magnetic ring sleeve, which are opposite to each other in the axial direction, are connected with the second frame (4213) through bearings respectively.
6. The load carrying device according to claim 4, wherein the first lift drive means (421) further comprises a third frame (4214), the third frame (4214) being connected to the first frame (4212);
the side wall of the first frame (4212) is provided with an avoidance hole, and the avoidance hole is communicated with the inner cavity of the first frame (4212) and the inner cavity of the third frame (4214);
the rotary driving piece (4221) is arranged on the third frame (4214), and the output end of the rotary driving piece (4221) is located in the inner cavity of the third frame (4214) and is in transmission connection with the first magnetic rotary piece (4222) through the avoiding hole.
7. The carrier as claimed in claim 2, further comprising a lift shaft (30) for lifting the wafer, the lift shaft (30) being at least partially disposed in the interior cavity of the housing (41);
the lifting shaft (30) is provided with a second channel (311) extending along the axis direction of the lifting shaft and sleeved outside the supporting shaft (20);
the initiative drive structure still includes second lift drive part (424), the driven drive structure still includes the driven drive structure of second, the output and the driven drive structure magnetic coupling of second lift drive part (424), the driven drive structure of second with lift axle (30) are connected, in order to drive lift axle (30) are followed self axis direction and are removed.
8. The carrying device according to claim 7, wherein the second lifting drive component (424) comprises a second linear module (4241) and a first magnetic member (4242), the second linear module (4241) is connected with the first magnetic member (4242), and the second driven drive structure comprises a second magnetic member (4243) magnetically coupled with the first magnetic member (4242);
the first magnetic part (4242) is connected with the outer wall of the shell (41) in a sliding mode, the second magnetic part (4243) is connected with the inner wall of the shell (41) in a sliding mode, and the lifting shaft (30) is connected with the second magnetic part (4243).
9. The carrying device according to claim 8, wherein the driving assembly (42) further comprises a first annular support member (425), the first annular support member (425) is connected with the second magnetic rotating member (4223), and the first annular support member (425) is sleeved on one end of the supporting shaft (20) facing away from the base (10);
and/or the driving assembly (42) further comprises a second ring-shaped supporting member (426), the second ring-shaped supporting member (426) is connected with the second magnetic member (4243), and the second ring-shaped supporting member (426) is sleeved at one end of the lifting shaft (30) which is far away from the base (10).
10. The carrier device according to claim 1, wherein the housing (41) comprises a sealing cylinder (411), a sealing plate (413) and an annular seal (412), the light-transmitting portion being formed on the sealing plate (413), the annular seal (412) being adapted to sealingly connect the sealing plate (413) to an end of the sealing cylinder (411) facing away from the base (10).
11. The carrying device according to claim 10, wherein the temperature measuring mechanism (50) comprises a temperature measuring element (51) and a shielding case (52), one end of the shielding case (52) is connected to the annular sealing member (412), and the other end of the shielding case (52) is connected to the temperature measuring element (51) so as to form a shielding passage for shielding external light between the housing (41) and the temperature measuring element (51).
12. A semiconductor processing apparatus comprising the carrier of any one of claims 1 to 11.
CN202210121039.3A 2022-02-09 2022-02-09 Bearing device and semiconductor process equipment Pending CN114551331A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210121039.3A CN114551331A (en) 2022-02-09 2022-02-09 Bearing device and semiconductor process equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210121039.3A CN114551331A (en) 2022-02-09 2022-02-09 Bearing device and semiconductor process equipment

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023232049A1 (en) * 2022-06-01 2023-12-07 北京北方华创微电子装备有限公司 Semiconductor process device, process chamber thereof, and tray detection method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023232049A1 (en) * 2022-06-01 2023-12-07 北京北方华创微电子装备有限公司 Semiconductor process device, process chamber thereof, and tray detection method

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