TW202350044A - Expansion frame assembly and expansion card frame - Google Patents
Expansion frame assembly and expansion card frame Download PDFInfo
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- TW202350044A TW202350044A TW111121555A TW111121555A TW202350044A TW 202350044 A TW202350044 A TW 202350044A TW 111121555 A TW111121555 A TW 111121555A TW 111121555 A TW111121555 A TW 111121555A TW 202350044 A TW202350044 A TW 202350044A
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- expansion
- mounting plate
- rack
- radiator
- frame
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- 238000009434 installation Methods 0.000 claims 8
- 238000010586 diagram Methods 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000013473 artificial intelligence Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
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- Mirrors, Picture Frames, Photograph Stands, And Related Fastening Devices (AREA)
- Credit Cards Or The Like (AREA)
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
Abstract
Description
本發明係關於一種擴充架組與擴充卡架,特別是一種具散熱器的擴充架組與擴充卡架。The invention relates to an expansion rack set and an expansion card rack, in particular to an expansion rack set and an expansion card rack with a radiator.
近年來,隨著科技與資訊的日新月異,電子產品的製造技術亦日漸進步。電子產品除了追求輕、薄、短、小的特性外,更朝著優越的性能邁進。In recent years, with the rapid development of technology and information, the manufacturing technology of electronic products has also been gradually advanced. In addition to pursuing the characteristics of being light, thin, short, and small, electronic products are also moving towards superior performance.
隨著印刷電路板上傳輸的電子訊號速度越來越快,訊號衰減的問題也變得更為嚴重。若電子訊號的傳輸速度從第四代PCIe卡之16.0GT/s)進化到第5代PCIe卡之32.0 GT/s時,則電子訊號的傳輸距離會從15英吋縮短到10英吋以內。為了能夠有效延長PCIe卡之訊號傳輸距離,一般會在PCIe卡上設置重定時器(Retimer)。As the speed of electronic signals transmitted on printed circuit boards becomes faster and faster, the problem of signal attenuation becomes more serious. If the transmission speed of electronic signals evolves from the 16.0 GT/s of the fourth-generation PCIe card to the 32.0 GT/s of the fifth-generation PCIe card, the transmission distance of the electronic signals will be shortened from 15 inches to less than 10 inches. In order to effectively extend the signal transmission distance of the PCIe card, a retimer (Retimer) is usually set on the PCIe card.
由於重定時器(Retimer)的發熱量較一般電子零件大,故在設計上需要散熱器來對重定時器(Retimer)進行散熱。由於空間有限,故若要加裝對重定時器(Retimer)散熱之散熱器,則需在PCIe卡之安裝架設置讓位開槽。然而,增設之讓位開槽卻會導致安裝架的結構強度下降,進而難以兼顧PCIe卡的散熱需求與PCIe卡之安裝架的結構強度需求。Since the retimer generates more heat than ordinary electronic components, a heat sink is required in the design to dissipate heat from the retimer. Due to limited space, if you want to install a radiator for retimer cooling, you need to provide a slot in the PCIe card mounting bracket. However, the additional slots will cause the structural strength of the mounting bracket to decrease, making it difficult to balance the heat dissipation requirements of the PCIe card with the structural strength requirements of the PCIe card mounting bracket.
本發明在於提供一種擴充架組與擴充卡架,藉以兼顧PCIe卡的散熱需求與PCIe卡之安裝架的結構強度需求。The present invention provides an expansion rack set and an expansion card rack, so as to take into account the heat dissipation requirements of the PCIe card and the structural strength requirements of the PCIe card mounting frame.
本發明之一實施例所揭露之擴充架組用以供一擴充卡設置。擴充架組包含一擴充卡架及一轉接卡。擴充卡架包含一架體及一散熱器。架體具有一讓位開口。散熱器組裝於架體,並遮蓋架體之讓位開口。轉接卡安裝並熱接觸於散熱器,並以供擴充卡設置。An expansion rack set disclosed in one embodiment of the present invention is used for installing an expansion card. The expansion rack set includes an expansion card rack and a riser card. The expansion card rack includes a body and a radiator. The frame body has a clearance opening. The radiator is assembled on the frame body and covers the opening of the frame body. The riser card is installed in thermal contact with the heat sink and provides for expansion card setup.
本發明之另一實施例所揭露之擴充卡架包含一架體及一散熱器。架體具有一讓位開口。散熱器組裝於架體,並遮蓋架體之讓位開口。An expansion card rack disclosed in another embodiment of the present invention includes a body and a radiator. The frame body has a clearance opening. The radiator is assembled on the frame body and covers the opening of the frame body.
根據上述實施例之擴充架組與擴充卡架,由於架體增設讓位開口,且散熱器裝設於架體,並遮蓋讓位開口,故可透過讓位開口在有限空間中設置對擴充卡散熱的散熱器,以及透過將散熱器與架體之組裝關係來提升或補強架體之讓位開口處的結構強度。如此一來,將可兼顧擴充架組與擴充卡架的散熱需求與擴充架組與擴充卡架的結構強度需求。According to the expansion rack set and the expansion card holder of the above embodiment, since the rack body is provided with a clearance opening, and the radiator is installed on the rack body and covers the clearance opening, an expansion card can be installed in a limited space through the clearance opening. A radiator for heat dissipation, and by assembling the radiator with the frame, the structural strength of the opening of the frame is improved or reinforced. In this way, the heat dissipation requirements of the expansion rack set and the expansion card rack and the structural strength requirements of the expansion rack set and the expansion card rack can be taken into consideration.
以上關於本發明內容的說明及以下實施方式的說明係用以示範與解釋本發明的原理,並且提供本發明的專利申請範圍更進一步的解釋。The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention, and to provide further explanation of the patent application scope of the present invention.
請參閱圖1至圖3。圖1為根據本發明第一實施例所述之擴充架組1的立體示意圖。圖2為圖1的分解示意圖。圖3為圖2之另一視角的分解示意圖。See Figure 1 to Figure 3. FIG. 1 is a schematic three-dimensional view of an expansion rack set 1 according to the first embodiment of the present invention. Figure 2 is an exploded schematic diagram of Figure 1. Figure 3 is an exploded schematic diagram of Figure 2 from another perspective.
本實施例之擴充架組1用以供一擴充卡(未繪示)設置。擴充卡例如為網路卡、顯示卡等介面卡,其介面例如為PCIE介面。擴充架組1包含一擴充卡架10及一轉接卡20。此外,擴充架組1還可以包含多個第一緊固件30。The expansion rack set 1 of this embodiment is used to accommodate an expansion card (not shown). The expansion card is, for example, a network card, a graphics card and other interface cards, and its interface is, for example, a PCIE interface. The expansion rack set 1 includes an expansion card rack 10 and an adapter card 20 . In addition, the expansion rack set 1 may also include a plurality of first fasteners 30 .
擴充卡架10包含一架體100及一散熱器200。此外,擴充卡架10還可以包含多個第二緊固件300。架體100包含一第一安裝板110、一第二安裝板120及一側蓋板130。第二安裝板120立於第一安裝板110之其中一側,且讓位開口121位於第二安裝板120,The expansion card rack 10 includes a body 100 and a heat sink 200 . In addition, the expansion card rack 10 may also include a plurality of second fasteners 300 . The frame 100 includes a first mounting plate 110 , a second mounting plate 120 and a side cover 130 . The second mounting plate 120 stands on one side of the first mounting plate 110, and the clearance opening 121 is located on the second mounting plate 120,
側蓋板130之相鄰兩側分別連接於第一安裝板110之一側與第二安裝板120之一側,第一安裝板110用以供擴充卡固定,散熱器200組裝於架體100之第二安裝板120。第二安裝板120具有一讓位開口121及二第一組裝部122。二第一組裝部122位於讓位開口121之相對兩側。Adjacent two sides of the side cover 130 are respectively connected to one side of the first mounting plate 110 and one side of the second mounting plate 120 . The first mounting plate 110 is used for fixing expansion cards. The radiator 200 is assembled on the frame 100 The second mounting plate 120. The second mounting plate 120 has a clearance opening 121 and two first assembly parts 122 . The two first assembly parts 122 are located on opposite sides of the relief opening 121 .
在本實施例中,架體100還可以包含一鎖固組件150。鎖固組件150用以鎖合於一主機板(未繪示)或機殼(未繪示),以將架體100固定於主機板(未繪示)或機殼(未繪示)。In this embodiment, the frame 100 may further include a locking component 150 . The locking component 150 is used to lock with a motherboard (not shown) or a case (not shown), so as to fix the frame 100 to the motherboard (not shown) or the case (not shown).
散熱器200的材質例如為金、銀、銅、鋁等金屬,並包含一鰭片部210及二第二組裝部220。二第二組裝部220分別連接於鰭片部210之相對兩側。二第二組裝部220分別例如透過第二緊固件300裝設於二第一組裝部122,以令散熱器200組裝於架體100之第二安裝板120,並遮蓋架體100之讓位開口121。所謂之散熱器200遮蓋架體100之讓位開口121包含散熱器200將讓位開口121之全部遮蓋與將讓位開口121之部分遮蓋。第二緊固件300例如但不限於為螺絲。The material of the heat sink 200 is, for example, gold, silver, copper, aluminum and other metals, and includes a fin part 210 and two second assembly parts 220 . The two second assembly parts 220 are respectively connected to opposite sides of the fin part 210 . The two second assembling parts 220 are respectively installed on the two first assembling parts 122 , for example, through the second fasteners 300 , so that the radiator 200 is assembled on the second mounting plate 120 of the frame 100 and covers the opening of the frame 100 . 121. The so-called radiator 200 covering the relief opening 121 of the frame 100 includes the radiator 200 covering all of the relief opening 121 and partially covering the relief opening 121 . The second fastener 300 is, for example but not limited to, a screw.
轉接卡20安裝並熱接觸於散熱器200。詳細來說,轉接卡20包含一電路板22、一轉接插槽25及二熱源26。電路板22例如透過這些第一緊固件30螺合於散熱器200之鰭片部210。第一緊固件30例如但不限於為螺絲。電路板22具有相對的一第一面22A及一第二面22B。轉接插槽25設置於電路板22之第一面22A,並以供擴充卡(未繪示)插設。二熱源26例如為重定時器,並設置於電路板22之第二面22B。散熱器200熱接觸於二熱源26,以對二熱源26進行散熱。此外,電路板22之其中一側具有一連接介面23。連接介面23例如為PCIe介面,並用以插設於一主機板(未繪示)。The riser card 20 is installed and in thermal contact with the heat sink 200 . Specifically, the riser card 20 includes a circuit board 22 , a riser slot 25 and two heat sources 26 . For example, the circuit board 22 is screwed to the fin portion 210 of the heat sink 200 through these first fasteners 30 . The first fastener 30 is, for example but not limited to, a screw. The circuit board 22 has an opposite first side 22A and a second side 22B. The transfer slot 25 is provided on the first side 22A of the circuit board 22 and is used for expansion cards (not shown) to be inserted. The second heat source 26 is, for example, a retimer, and is disposed on the second surface 22B of the circuit board 22 . The heat sink 200 is in thermal contact with the two heat sources 26 to dissipate heat from the two heat sources 26 . In addition, one side of the circuit board 22 has a connection interface 23 . The connection interface 23 is, for example, a PCIe interface and is used to be plugged into a motherboard (not shown).
在本實施例中,熱源26的數量為二個,但並不以此為限。在其他實施例中,熱源的數量也可以改為單個。此外,在本實施例中,熱源26係以重定時器為例,但並不以此為限。在其他實施例中,熱源亦可為其他電子零件。In this embodiment, the number of heat sources 26 is two, but it is not limited to this. In other embodiments, the number of heat sources can also be changed to a single one. In addition, in this embodiment, the heat source 26 is a retimer, but it is not limited to this. In other embodiments, the heat source can also be other electronic components.
在本實施例中,架體100還可以包含二定位柱140。二定位柱140設置於第二安裝板120。電路板22具有二定位槽24。架體100之二定位柱140至少部分位於電路板22之二定位槽24,以透過定位槽24搭配定位柱140之導引來相定位。In this embodiment, the frame 100 may further include two positioning posts 140 . Two positioning posts 140 are provided on the second mounting plate 120 . The circuit board 22 has two positioning grooves 24 . The two positioning posts 140 of the frame 100 are at least partially located in the two positioning grooves 24 of the circuit board 22 so as to be positioned relative to each other through the guidance of the positioning grooves 24 and the positioning posts 140 .
請參閱圖4至圖5。圖4與圖5為圖1之擴充架組1的組裝示意圖。如圖4所示,先將轉接卡20安裝於散熱器200,再將相組的轉接卡20與散熱器200沿方向A裝上架體100之第二安裝板120,直至轉接卡20之定位槽24與架體100之定位柱140相定位。接著,如圖5所示,沿方向B將這些第二緊固件300穿鎖第二安裝板120之第一組裝部122與散熱器200之第二組裝部220。如此一來,即可將散熱器200裝設於架體100,並透過金屬材質的散熱器200來補強架體100於讓位開口121處的結構強度。See Figure 4 to Figure 5. Figures 4 and 5 are schematic assembly diagrams of the expansion rack set 1 in Figure 1 . As shown in Figure 4, first install the adapter card 20 on the radiator 200, and then install the combined adapter card 20 and the radiator 200 on the second mounting plate 120 of the frame 100 along direction A until the adapter card 20 The positioning groove 24 is positioned with the positioning post 140 of the frame 100 . Next, as shown in FIG. 5 , these second fasteners 300 are threaded through the first assembly portion 122 of the second mounting plate 120 and the second assembly portion 220 of the heat sink 200 along direction B. In this way, the radiator 200 can be installed on the frame 100 , and the structural strength of the frame 100 at the relief opening 121 can be reinforced through the metal radiator 200 .
根據上述實施例之擴充架組與擴充卡架,由於架體增設讓位開口,且散熱器裝設於架體,並遮蓋讓位開口,故可透過讓位開口在有限空間中設置對擴充卡散熱的散熱器,以及透過將散熱器與架體之組裝關係來提升或補強架體之讓位開口處的結構強度。如此一來,將可兼顧擴充架組與擴充卡架的散熱需求與擴充架組與擴充卡架的結構強度需求。According to the expansion rack set and the expansion card holder of the above embodiment, since the rack body is provided with a clearance opening, and the radiator is installed on the rack body and covers the clearance opening, an expansion card can be installed in a limited space through the clearance opening. A radiator for heat dissipation, and by assembling the radiator with the frame, the structural strength of the opening of the frame is improved or reinforced. In this way, the heat dissipation requirements of the expansion rack set and the expansion card rack and the structural strength requirements of the expansion rack set and the expansion card rack can be taken into consideration.
在本發明的一實施例中,本發明之擴充架組與擴充卡架係可應用於伺服器,伺服器係可用於人工智慧(Artificial Intelligence,簡稱AI)運算、邊緣運算(Edge Computing),亦可當作5G伺服器、雲端伺服器或車聯網伺服器使用。In an embodiment of the present invention, the expansion rack set and the expansion card rack of the present invention can be applied to a server, and the server can be used for artificial intelligence (AI) computing, edge computing (Edge Computing), and also It can be used as a 5G server, cloud server or Internet of Vehicles server.
雖然本發明以前述之諸項實施例揭露如上,然其並非用以限定本發明,任何熟習相像技藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the foregoing embodiments, they are not intended to limit the present invention. Anyone skilled in the similar art can make some modifications and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention is The scope of patent protection for an invention shall be determined by the scope of the patent application attached to this specification.
1:擴充架組 10:擴充卡架 20:轉接卡 22:電路板 22A:第一面 22B:第二面 23:連接介面 24:定位槽 25:轉接插槽 26:熱源 30:第一緊固件 100:架體 110:第一安裝板 120:第二安裝板 121:讓位開口 122:第一組裝部 130:側蓋板 140:定位柱 150:鎖固組件 200:散熱器 210:鰭片部 220:第二組裝部 300:第二緊固件 A、B:方向 1: Expansion rack set 10: Expansion card rack 20: Adapter card 22:Circuit board 22A: Side 1 22B:Second side 23:Connection interface 24: Positioning slot 25:Transfer slot 26:Heat source 30:First fastener 100: Frame 110:First mounting plate 120: Second mounting plate 121: Give way and speak 122:First Assembly Department 130:Side cover 140: Positioning column 150:Lock component 200: Radiator 210: Fin Department 220:Second Assembly Department 300:Second fastener A, B: direction
圖1為根據本發明第一實施例所述之擴充架組的立體示意圖。 圖2為圖1的分解示意圖。 圖3為圖2之另一視角的分解示意圖。 圖4與圖5為圖1之擴充架組的組裝示意圖。 FIG. 1 is a schematic three-dimensional view of an expansion rack set according to the first embodiment of the present invention. Figure 2 is an exploded schematic diagram of Figure 1. Figure 3 is an exploded schematic diagram of Figure 2 from another perspective. Figures 4 and 5 are assembly diagrams of the expansion rack set in Figure 1 .
1:擴充架組 1: Expansion rack set
10:擴充卡架 10: Expansion card rack
20:轉接卡 20: Adapter card
22:電路板 22:Circuit board
22A:第一面 22A: Side 1
22B:第二面 22B:Second side
23:連接介面 23:Connection interface
24:定位槽 24: Positioning slot
26:熱源 26:Heat source
30:第一緊固件 30:First fastener
100:架體 100: Frame
110:第一安裝板 110:First mounting plate
120:第二安裝板 120: Second mounting plate
121:讓位開口 121: Give way and speak
122:第一組裝部 122:First Assembly Department
130:側蓋板 130:Side cover
140:定位柱 140: Positioning column
150:鎖固組件 150:Lock component
200:散熱器 200: Radiator
210:鰭片部 210: Fin Department
220:第二組裝部 220:Second Assembly Department
300:第二緊固件 300:Second fastener
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