TW202349730A - Sensor package structure - Google Patents

Abstract

The present invention provides a sensor package structure, which includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, a light-permeable layer, a supporting layer having a ring-shape and sandwiched between the sensor chip and the light-permeable layer, and an encapsulation that is formed on the substrate. The supporting layer has an inner roughened surface being ring-shaped and having an irregular pattern. The light-permeable layer, the inner roughened surface of the supporting layer, and the sensor chip jointly surround to define an enclosed space. The sensor chip, the supporting layer, and the light-permeable layer are embedded in the encapsulation, and at least part of outer surface of the light-permeable layer is exposed from the encapsulation. The inner roughened surface is configured to reflect light, which travels onto the inner roughened surface by passing through the light-permeable layer, so as to enable the light to be scattered.

Description

Sensor packaging structure

The present invention relates to a packaging structure, and in particular to a sensor packaging structure.

The existing sensor packaging structure includes a light-transmitting sheet, a sensing chip, and an adhesive layer adhered between the glass sheet and the sensing chip. However, since the light passing through the light-transmitting sheet may be reflected, it is easy to affect the sensing area of the sensing chip (such as glare).

Therefore, the inventor believed that the above-mentioned defects could be improved, so he devoted himself to research and applied scientific principles, and finally proposed an invention that is reasonably designed and effectively improves the above-mentioned defects.

Embodiments of the present invention provide a sensor packaging structure that can effectively improve defects that may occur in existing sensor packaging structures.

An embodiment of the present invention discloses a sensor packaging structure, which includes: a substrate; a sensing chip, which is disposed on the substrate, and the sensing chip is electrically coupled to the substrate; wherein, the sensing chip A top surface of the sensing chip contains a sensing area and a load-bearing area surrounding the sensing area; a support layer is annular and is disposed on the load-bearing area of the sensing chip; wherein, the support layer The layer has an annular inner rough surface with an irregular pattern; a light-transmitting layer has an outer surface and an inner surface located on opposite sides, and the light-transmitting layer is disposed on the support layer, so that the light-transmitting layer, the inner rough surface of the support layer, and the sensing chip together form a closed space; and a package is formed on the substrate, and the The sensing chip, the support layer, and the light-transmitting layer are embedded in the package, and at least part of the outer surface of the light-transmitting layer is exposed outside the package; wherein, the inner The rough surface can be used to reflect and scatter the light that passes through the light-transmitting layer and irradiates thereon.

In summary, the sensor packaging structure disclosed in the embodiment of the present invention forms the inner rough surface with an irregular pattern on the support layer, thereby enabling the light irradiated on the inner rough surface to The light is reflected and scattered, thereby effectively reducing the glare phenomenon caused by the sensor packaging structure.

In order to further understand the characteristics and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, these descriptions and drawings are only used to illustrate the present invention and do not make any reference to the protection scope of the present invention. limit.

The following is a specific embodiment to illustrate the implementation of the "sensor packaging structure" disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depictions based on actual dimensions, as is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of the present invention.

It should be understood that although terms such as “first”, “second” and “third” may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another component or one signal from another signal. In addition, the term "or" used in this article shall include any one or combination of more of the associated listed items depending on the actual situation.

[Example 1]

Please refer to Figures 1 to 5, which are Embodiment 1 of the present invention. As shown in Figures 1 and 2, this embodiment discloses a sensor packaging structure 100; that is to say, any structure that does not encapsulate a sensor internally has a structural design basis that is different from the sensing structure 100 referred to in this embodiment. device packaging structure 100, so comparison between the two is not suitable.

As shown in FIGS. 2 to 4 , the sensor package structure 100 includes a substrate 1 , a sensing chip 2 disposed on the substrate 1 , and the sensing chip 2 is electrically coupled to the substrate. A plurality of metal lines 3 of 1, a support layer 4 in an annular shape and provided on the sensing chip 2, a light-transmitting layer 5 provided on the support layer 4, and a layer formed on the substrate 1 One package 6.

Although the sensor packaging structure 100 is described as including the above components in this embodiment, the sensor packaging structure 100 can also be adjusted and changed according to design requirements. For example, in other embodiments not shown in the present invention, the sensor packaging structure 100 can omit a plurality of the metal lines 3, and the sensing chip 2 is fixed by a flip-chip or chip-bonding method. electrically coupled to the substrate 1 . The structure and connection relationship of each component of the sensor packaging structure 100 in this embodiment will be described below.

The substrate 1 is square or rectangular in this embodiment, but the invention is not limited thereto. The substrate 1 is provided with a chip fixing area 111 at approximately the center of its upper surface 11 , and the substrate 1 is formed with a plurality of bonding pads 112 located outside the chip fixing area 111 on the upper surface 11 . The plurality of bonding pads 112 are generally arranged in a ring shape in this embodiment, but the invention is not limited thereto. For example, in other embodiments not shown in the present invention, the plurality of bonding pads 112 may also be arranged in two rows on opposite sides of the chip fixing area 111 .

In addition, the substrate 1 can also be provided with a plurality of solder balls 7 on its lower surface 12, and the sensor package structure 100 can be soldered and fixed to an electronic component (not shown in the figure) through a plurality of the solder balls 7. (shown), thereby enabling the sensor packaging structure 100 to be electrically connected to the electronic component through a plurality of solder balls 7 .

The sensing chip 2 is in a square shape (eg, rectangular or square) in this embodiment and is illustrated as an image sensing chip, but is not limited to this. Wherein, the sensing chip 2 (bottom surface 22 ) is fixed (along a preset direction D and through die-bonding adhesive) to the chip fixing area 111 of the substrate 1 ; that is to say, the sensing chip 2 The wafer 2 is located inside a plurality of the bonding pads 112 . Furthermore, a top surface 21 of the sensing chip 2 includes a sensing area 211 and a carrying area 212 surrounding the sensing area 211 (and in an annular shape), and two of each metal line 3 The terminals are respectively connected to the carrying area 212 of the substrate 1 and the sensing chip 2, so that the substrate 1 and the sensing chip 2 are electrically coupled to each other.

In more detail, the sensing chip 2 includes a plurality of connection pads 213 located in the carrying area 212 (that is, the plurality of connection pads 213 are located outside the sensing area 211). In this embodiment, the number and position of the connection pads 213 of the sensing chip 2 respectively correspond to the number and position of the bonding pads 112 of the substrate 1; that is to say, The plurality of connection pads 213 are also generally arranged in a ring shape in this embodiment. Furthermore, the two ends of each metal line 3 are respectively connected to one of the bonding pads 112 and the corresponding connection pads 213 .

The support layer 4 is disposed on the carrying area 212 of the sensing chip 2 and surrounds the outside of the sensing area 211 . Furthermore, the support layer 4 in this embodiment can be further limited to a UV curable layer (or photocurable layer), which means a structure cured by UV irradiation, but the invention is not limited thereto. this.

Furthermore, in Figures 3 and 4 of this embodiment, part of each metal line 3 is embedded in the support layer 4, while the remaining parts of each metal line 3 are It is embedded in the package 6, but the present invention is not limited thereto. For example, as shown in FIG. 5 , the support layer 4 may be located inside a plurality of the metal lines 3 and not in contact with any of the metal lines 3 (that is, each of the metal lines 3 Located outside the support layer 4 and embedded within the package 6 ).

Furthermore, as shown in Figures 2 to 4, the support layer 4 has an annular inner rough surface 41, and the outer surface of the support layer 4 is not a rough surface, but the invention is not limited to this. . In this embodiment, the inner rough surface 41 is curved and has a haze of between 10% and 90%, and the inner rough surface 41 is preferably formed on the support layer 4 The haze of the entire inner surface is preferably between 30% and 90%, but is not limited to this.

It should be noted that the inner rough surface 41 of the support layer 4 is defined to have an irregular pattern, so as to effectively scatter the light irradiated thereon uniformly. That is to say, the inner rough surface 41 in this embodiment excludes any regular pattern (such as sawtooth shape).

In addition, as shown in FIG. 3 , the bottom edge of the outer side of the support layer 4 may be an edge adjacent to the top surface 21 of the sensing chip 2 , so as to make good use of the sensing chip 2 of the top surface 21 space, but is not limited to this.

As shown in FIGS. 2 to 4 , the light-transmitting layer 5 is illustrated as a flat glass in this embodiment, but the invention is not limited thereto. Wherein, the light-transmitting layer 5 has an outer surface 53 and an inner surface 54 located on opposite sides, and the light-transmitting layer 5 (with the inner surface 54) is disposed on the support layer 4, so that the The light-transmitting layer 5 , the inner rough surface 41 of the supporting layer 4 , and the sensing chip 2 together form a closed space E.

Furthermore, the sensing area 211 of the sensing chip 2 is located within the closed space E, and the center of curvature of the inner rough surface 41 is also located within the closed space E. Furthermore, the inner rough surface 41 can be used to reflect the light that passes through the light-transmitting layer 5 and is irradiated on it and scatters (in the closed space E), thereby effectively Thus, the glare phenomenon caused by the sensor packaging structure 100 is reduced.

In this embodiment, the package 6 is opaque to block visible light from passing through. The encapsulation body 6 is illustrated as a liquid encapsulation, and the encapsulation body 6 is formed on the upper surface 11 of the substrate 1 and its edge is flush with the edge of the substrate 1 . Wherein, at least part of each metal line 3, the sensing chip 2, the support layer 4, and the light-transmitting layer 5 are all embedded in the package 6, and the light-transmitting layer At least part of the outer surface 53 of 5 is exposed outside the package body 6, but the invention is not limited thereto.

As mentioned above, the sensor packaging structure 100 disclosed in the embodiment of the present invention does not need to provide any light-shielding layer on the inner surface 54 of the light-transmitting layer 5 so that the support layer 4 can be more transparent. It is conducive to complete curing and avoids the tilt of the light-transmitting layer 5, which can further avoid mutual peeling or delamination defects between the support layer 4 and the light-transmitting layer 5, thereby effectively improving the Yield of sensor package structure 100 .

[Example 2]

Please refer to Figures 6 and 7, which are Embodiment 2 of the present invention. Since this embodiment is similar to the above-mentioned Embodiment 1, the similarities between the two embodiments will not be described in detail. The differences between this embodiment and the above-mentioned Embodiment 1 are roughly described as follows:

In this embodiment, the support layer 4 further has an annular outer rough surface 42, and the package body 6 is joined to the outer rough surface 42 without any gap, so that the package body 6 can be effectively lifted. The contact area and bonding force between 6 and the support layer 4. In this embodiment, the outer rough surface 42 is curved and its center of curvature is located inside the package 6, and the outer rough surface 42 is preferably formed on the entire outer side of the support layer 4. However, the present invention is not limited to this.

It should be additionally noted that the outer rough surface 42 has a haze between 10% and 90% (the haze is preferably between 30% and 90%), and the outer surface of the support layer 4 has a haze between 10% and 90%. The rough surface 42 preferably has an irregular pattern, so that it can effectively scatter the light irradiating on it evenly inside the support layer 4, thereby facilitating the complete solidification of the support layer 4. However, the present invention Not limited to this.

[Embodiment 3]

Please refer to Figures 8 to 10, which are Embodiment 3 of the present invention. Since this embodiment is similar to the above-mentioned Embodiments 1 and 2, the similarities between the two embodiments will not be described in detail. The differences between this embodiment and the above-mentioned Embodiments 1 and 2 are roughly described as follows:

In this embodiment, the light-transmitting layer 5 has a transparent block 51 and an annular block 52 surrounding the transparent block 51, and the light-transmitting layer 5 is disposed with the annular block 52. on the support layer 4. The shape and size of the transparent block 51 in this embodiment generally corresponds to the sensing area 211; that is to say, the transparent block 51 is orthogonally projected along the preset direction D to the sensing area 211. A projection area formed by the top surface 21 of the sensing chip 2 substantially completely overlaps the sensing area 211 , but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the size of the transparent block 51 may be slightly larger than the sensing area 211 .

The annular block 52 forms an annular roughened area 521 on the outer surface 53 , and the annular roughened area 521 is projected along the preset direction D toward the top surface 21 of the sensing chip 2 . A projection space is located outside the sensing area 211 and covers the entire inner rough surface 41 of the support layer 4 . That is to say, the light irradiating the inner rough surface 41 can first be scattered by the annular rough area 521 , thereby further reducing the glare phenomenon generated in the sensor packaging structure 100 .

It should be additionally noted that the annular rough area 521 has a haze between 10% and 90% (the haze is preferably between 30% and 90%), and the haze of the light-transmitting layer 5 The annular rough area 521 preferably has an irregular pattern, which can effectively cause the light to scatter toward the support layer 4 evenly after passing through the annular rough area 521, thereby facilitating the support layer 4. Completely cured, but the invention is not limited thereto.

[Technical effects of the embodiments of the present invention]

In summary, the sensor packaging structure disclosed in the embodiment of the present invention forms the inner rough surface with an irregular pattern on the support layer, thereby enabling the light irradiated on the inner rough surface to The light is reflected and scattered, thereby effectively reducing the glare phenomenon caused by the sensor packaging structure.

Furthermore, the sensor packaging structure disclosed in the embodiment of the present invention does not need to provide any light-shielding layer on the inner surface of the light-transmitting layer, so that the support layer can be more conducive to complete curing and avoid The light-transmitting layer is tilted, thereby further preventing mutual peeling or delamination defects between the support layer and the light-transmitting layer, thereby effectively improving the yield of the sensor packaging structure.

Furthermore, in the sensor packaging structure disclosed in the embodiment of the present invention, the outer rough surface can be formed on the outer side of the support layer and/or the outer rough surface can be formed on the outer surface of the annular block of the light-transmitting layer. The annular rough area is formed on the surface, so that the support layer can be evenly scattered, thereby facilitating the complete solidification of the support layer.

The contents disclosed above are only preferred and feasible embodiments of the present invention, and do not limit the patent scope of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the patent scope of the present invention. within.

100: Sensor packaging structure 1:Substrate 11: Upper surface 111: Chip fixing area 112:Joining pad 12: Lower surface 2: Sensing chip 21:Top surface 211: Sensing area 212: Bearing area 213:Connection pad 22: Bottom surface 3:Metal wire 4: Support layer 41:Inner rough surface 42:Outer rough surface 5: Translucent layer 51:Transparent block 52:Ring block 521: Annular rough area 53:Outer surface 54:Inner surface 6:Package 7: Solder ball D: Default direction E: Enclosed space

FIG. 1 is a schematic three-dimensional view of a sensor packaging structure according to Embodiment 1 of the present invention.

Figure 2 is a schematic top view of Figure 1.

FIG. 3 is a schematic cross-sectional view along section line III-III in FIG. 1 .

FIG. 4 is an enlarged schematic diagram of area IV in FIG. 3 .

FIG. 5 is another enlarged schematic diagram of region IV in FIG. 3 .

FIG. 6 is a schematic cross-sectional view of a sensor packaging structure according to Embodiment 2 of the present invention.

FIG. 7 is an enlarged schematic diagram of area VII in FIG. 6 .

FIG. 8 is a schematic three-dimensional view of a sensor packaging structure according to Embodiment 3 of the present invention.

Figure 9 is a schematic cross-sectional view along section line IX-IX of Figure 8.

FIG. 10 is a schematic cross-sectional view of another aspect of FIG. 9 .

100: Sensor packaging structure

1:Substrate

11: Upper surface

111: Chip fixing area

112:Joining pad

12: Lower surface

2: Sensing chip

21:Top surface

211: Sensing area

212: Bearing area

213:Connection pad

22: Bottom surface

3:Metal wire

4: Support layer

41:Inner rough surface

5: Translucent layer

53:Outer surface

54:Inner surface

6:Package

7: Solder ball

D: Default direction

E: Enclosed space

Claims (10)

A sensor packaging structure, which includes: a substrate; A sensing chip is disposed on the substrate, and the sensing chip is electrically coupled to the substrate; wherein a top surface of the sensing chip contains a sensing area and surrounds the sensing area. A load-bearing area of a region; A support layer is annular and is disposed on the load-bearing area of the sensing chip; wherein the support layer has an annular inner rough surface with an irregular pattern; A light-transmitting layer has an outer surface and an inner surface located on opposite sides, and the light-transmitting layer is disposed on the support layer, so that the light-transmitting layer and the inner rough surface of the support layer , and the sensing chip together form a closed space; and A package formed on the substrate, and the sensing chip, the support layer, and the light-transmitting layer are embedded in the package, and at least part of the outer surface of the light-transmitting layer Exposed outside the package; Wherein, the inner rough surface can be used to reflect and scatter light that passes through the light-transmitting layer and irradiates thereon. The sensor packaging structure of claim 1, wherein the inner rough surface has a haze between 10% and 90%. The sensor packaging structure of claim 1, wherein the inner rough surface is curved and its center of curvature is located within the closed space. The sensor packaging structure of claim 1, wherein the support layer is further defined as a UV curing layer. The sensor packaging structure of claim 1, wherein the sensor packaging structure further includes a plurality of metal lines, and two ends of each metal line are respectively connected to the substrate and the sensing The carrying area of the chip is so that the substrate and the sensing chip are electrically coupled to each other; each of the metal lines is located outside the support layer and is embedded in the package. The sensor packaging structure of claim 1, wherein the sensor packaging structure further includes a plurality of metal lines, and two ends of each metal line are respectively connected to the substrate and the sensing The load-bearing area of the chip, so that the substrate and the sensing chip are electrically coupled to each other; part of each of the metal lines is buried in the support layer, and the remaining parts of each of the metal lines embedded within the package. The sensor packaging structure of claim 1, wherein the support layer has an annular outer rough surface, and the package body is joined to the outer rough surface without gaps, and the outer rough surface has Haze between 10% and 90%. The sensor package structure of claim 7, wherein the outer rough surface is curved and its center of curvature is located within the package body. The sensor packaging structure of claim 1, wherein the light-transmitting layer has a transparent block and an annular block surrounding the transparent block, and the annular block is disposed on the support layer on the outer surface, and the annular block forms an annular rough area on the outer surface. The sensor packaging structure of claim 9, wherein the annular rough area is located outside the sensing area toward a projection space along which the top surface of the sensing chip is orthogonally projected. And cover the entire inner rough surface of the support layer.

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