TW202348116A - Electronic device with heat dissipation system - Google Patents

Abstract

An electronic device with a heat dissipation system is used to solve the problem that the heat dissipation effect of the conventional electronic device heat dissipation method is poor. The electronic device with the heat dissipation system includes: an electrical unit having a liquid cooling radiator thermally connected to a heat source, a heat exchange unit coupled to the liquid cooling radiator, a pipe assembly connected to the liquid cooling radiator and the heat exchange unit, and a heat removal equipment is coupled to the heat exchange unit. The liquid cooling radiator has a working liquid inside. The working liquid circulates between the liquid cooling radiator and the heat exchange unit along the pipe assembly. The heat removal equipment has an air collecting hood and an air guiding member, the air collecting hood is connected to the heat exchange unit, and the air guiding member is rotatably located in the air collecting hood. The air guide member sucks the heat energy of the heat exchange unit and discharges it through an air outlet of the heat removal equipment.

Description

Electronic devices with heat dissipation systems

The present invention relates to an electronic device with a heat dissipation system, in particular to an electronic device with a heat dissipation system in which air flows do not interfere with each other.

With the advancement of technology, the Internet has become one of the most important information exchange media in modern people's lives. In order to provide diversified network services, a variety of electronic devices (such as servers) are indispensable equipment. Computer hosts can access data in the servers through the network to achieve rapid information transmission. When a large amount of data needs to be accessed, some computer systems will be equipped with a server cabinet so that the server cabinet can accommodate several servers.

A large amount of heat energy will be generated during the operation of the servers. A common heat dissipation method is to configure each of the servers with a fan. The fan can be combined with one side of the server, and the fan is connected to the heat source of the server. There can be an air duct between them. The fan can introduce airflow from the outside and flow to the inside of the server through the fan. After the airflow passes through the heat source of the server for heat exchange, it absorbs the heat energy generated by the heat source and then passes through the server. The air duct is discharged to the outside of the server.

However, in the above-mentioned conventional server cooling method, since the incoming airflow and the exhausting airflow pass through the air duct, the incoming airflow and the exhausting airflow are easy to interfere with each other, which makes it difficult to effectively cool down the heat source of the server. Resulting in poor heat dissipation.

In view of this, there is still a need to improve the conventional heat dissipation methods of electronic devices.

In order to solve the above problems, the object of the present invention is to provide an electronic device with a heat dissipation system that can provide good heat dissipation performance.

A secondary object of the present invention is to provide an electronic device with a heat dissipation system that can make the air flow flow more smoothly.

Another object of the present invention is to provide an electronic device with a heat dissipation system that can reduce manufacturing costs.

Another object of the present invention is to provide an electronic device with a heat dissipation system that is convenient for the assembler.

Directionality or similar terms are used throughout the present invention, such as "front", "back", "left", "right", "upper (top)", "lower (bottom)", "inner", "outer" , "side", etc. mainly refer to the directions of the attached drawings. Each directionality or its approximate terms are only used to assist in explaining and understanding the various embodiments of the present invention, and are not intended to limit the present invention.

The use of the quantifier "a" or "an" in the elements and components described throughout the present invention is only for convenience of use and to provide a common sense of the scope of the present invention; in the present invention, it should be interpreted as including one or at least one, and single The concept of also includes the plural unless it is obvious that something else is meant.

Approximate terms such as "combination", "combination" or "assembly" used throughout the present invention mainly include forms that can be separated without damaging the components after being connected, or components that are inseparable after being connected, and are based on common knowledge in this field. You can choose according to the material of the components to be connected or the assembly requirements.

The electronic device with a heat dissipation system of the present invention includes: an electrical unit with a liquid cooling radiator thermally connected to a heat source, the liquid cooling radiator has a working liquid; a heat exchange unit combined with the liquid cooling heat dissipation device; a pipe set that connects the liquid cooling radiator and the heat exchange unit in series, and the working liquid circulates along the pipe set between the liquid cooling radiator and the heat exchange unit; and a heat dissipation device combined with The heat exchange unit and the heat dissipation equipment have an air collecting hood and an air guide part. The air collecting hood is connected to the heat exchange unit. The air guide part is rotatably located in the air collecting hood. The air guide part suctions The heat energy of the heat exchange unit is discharged from an air outlet of the heat dissipation device.

The electronic device with a heat dissipation system of the present invention includes: an electrical unit with a liquid cooling radiator thermally connected to a heat source, the liquid cooling radiator has a working liquid; a heat exchange unit combined with the liquid cooling heat dissipation The heat exchange unit has a combined machine body and a fan assembly. The fan assembly has an air inlet and an air outlet. The air inlet is connected to the machine body; and a pipe assembly is connected in series to the liquid cooling radiator. And the heat exchange unit, the working fluid circulates along the pipe assembly between the liquid cooling radiator and the heat exchange unit.

Accordingly, in the electronic device with a heat dissipation system of the present invention, the working liquid in the liquid cooling radiator can absorb the thermal energy of the heat source, and the higher temperature working liquid can flow to the heat exchange unit through the pipe assembly, and the external Cold air can enter the heat exchange unit for heat exchange, and the hot air in the heat exchange unit can be blown or sucked through the fan assembly or the heat dissipation device so that the hot air can be discharged, and the air collecting hood can also reduce the return of hot air. , which can ensure that the flow of cold air and the flow of hot air will not interfere with each other, and the cooled working liquid can flow into the liquid cooling radiator through the pipe assembly, so that the heat source can be effectively cooled, and the system can provide good heat dissipation performance effect.

Wherein, the heat exchange unit may have a combined machine body and a fan assembly, and the heat dissipation device is combined with the fan assembly. In this way, the hot air can first flow into the interior of the fan assembly, and then pass through the air guide duct and be discharged from the air outlet, which achieves better heat dissipation performance.

The fan assembly may have an air inlet and an air outlet. The air inlet is connected to the machine body, and the air outlet is connected to the air collecting hood. In this way, the structure is simple and easy to manufacture, and has the effect of reducing manufacturing costs.

Wherein, the heat exchange unit may have an accommodating space, and the two ends of the accommodating space in a ventilation direction may each have an opening. The machine body may have a flow channel, and a space between the flow channel and the air inlet may be defined. There is an exhaust direction, and the exhaust direction can be orthogonal to the ventilation direction. In this way, it is ensured that the inlet air flow and the exhaust air flow do not interfere with each other, which has the effect of making the air flow smoother.

Wherein, the heat exchange unit may have a machine body, and the heat dissipation device is combined with the machine body. In this way, the system has a simple structure and is easy to assemble.

The heat exchange unit may have a machine body. The machine body may have a shell and a cover. The cover is combined above the shell. A flow channel may be formed between the cover and the shell. In this way, the structure is simple and easy to manufacture, and has the effect of reducing manufacturing costs.

Wherein, the heat exchange unit may have a shell, the shell surround forms an accommodating space, and the heat exchange unit may have a heat dissipation pipe located in the accommodating space. In this way, the structure is simple and easy to manufacture, and has the effect of reducing manufacturing costs.

Wherein, the heat exchange unit may have a heat dissipation fin group, the heat dissipation fin group is located in the accommodation space, and the heat dissipation pipe body may be combined with the heat dissipation fin group. In this way, the heat dissipation fin group can take away the heat energy transferred from the working liquid to the heat dissipation pipe body, so that the temperature of the working liquid can be reduced, which has the effect of increasing the heat dissipation efficiency.

Wherein, the heat dissipation pipe body can be formed into a curved shape. In this way, the heat dissipation pipe body can have a larger contact area with the surrounding cold air, which has a better heat dissipation effect.

Wherein, the heat exchange unit may have a heat dissipation pipe body, and the pipe assembly may have a first pipe member and a second pipe member, and the first pipe member may connect a liquid inlet hole of the liquid cooling radiator and the heat exchange unit. A liquid outlet port, the second pipe fitting can connect a liquid outlet hole of the liquid cooling radiator and a liquid inlet port of the heat exchange unit, and the liquid inlet port and the liquid outlet port are respectively connected to both sides of the heat dissipation pipe body. end. In this way, the system has a simple structure and is easy to assemble.

The pipe assembly may have a pump, and the pump may be connected in series to the first pipe or the second pipe. In this way, the pump can drive the working liquid to easily enter the pipe assembly and increase the circulation speed, and also relatively increase the speed of taking away heat energy, which has the effect of improving heat dissipation efficiency.

Wherein, there may be an air guide duct in the air collecting hood, and the air guide duct is connected with the heat exchange unit. In this way, the air guide can have enough space for the airflow inside the heat exchange unit to enter, which has the effect of making the airflow flow smoother.

Wherein, the heat dissipation device may have an air inlet, the air inlet is connected to the air guide duct, and the heat exchange unit is combined with the air inlet. In this way, the structure is simple and easy to manufacture, and has the effect of reducing manufacturing costs.

Wherein, the heat dissipation device may have a partition, and the partition may be located inside the air collecting hood. A chamber may be formed between the partition and the top wall of the air collecting hood, and the air guide member is located in the chamber. In this way, the system has a simple structure and is easy to assemble.

The heat dissipation device may have an air outlet connected to the chamber, and the air outlet may be located between the partition and the top wall of the air collecting hood. In this way, the system has a simple structure and is easy to assemble.

Wherein, the air collecting hood may have an air guide duct, and the partition may have a through hole, and the through hole may communicate with the heat exchange unit through the air guide duct. In this way, the structure is simple and easy to manufacture, and has the effect of reducing manufacturing costs.

Wherein, the number of the electrical unit, the heat exchange unit and the pipe assembly may be several respectively, and the air collecting hood may be combined with the several heat exchange units. In this way, the heat dissipation device can simultaneously extract hot air from the several heat exchange units, and the air collecting hood can reduce the return flow of hot air, which has the effect of saving usage costs and providing better heat dissipation performance.

Wherein, the heat exchange unit may have an accommodating space, and the two ends of the accommodating space in a ventilation direction may each have an opening. The machine body may have a flow channel, and a space between the flow channel and the air inlet may be defined. There is an exhaust direction, and the exhaust direction can be orthogonal to the ventilation direction. In this way, it is ensured that the inlet air flow and the exhaust air flow do not interfere with each other, which has the effect of making the air flow smoother.

In order to make the above and other objects, features and advantages of the present invention more obvious and understandable, preferred embodiments of the present invention are illustrated below and described in detail with reference to the accompanying drawings; in addition, the same symbols are used in different drawings. are considered to be the same and their description will be omitted.

Please refer to Figure 1, which is a first embodiment of an electronic device with a heat dissipation system of the present invention. It includes an electrical unit 1, a heat exchange unit 2 and a pipe assembly 3. The heat exchange unit 2 is combined with the Electrical unit 1, the pipe assembly 3 connects the electrical unit 1 and the heat exchange unit 2.

The electrical unit 1 has a heat source H. The electrical unit 1 can be installed in a cabinet E. The electrical unit 1 can be, for example, a server unit, a network communication host or a network communication relay station. The invention is not limited thereto. The electrical unit 1 may have a box body 11. The present invention does not limit the shape of the box body 11. For example, the box body 11 in this embodiment may be roughly rectangular, and the top of the box body 11 may be shaped like a drawer. In an open form, the electrical unit 1 may have an electronic module 12. The electronic module 12 may be provided in the box 11. The heat source H is located in the electronic module 12. The electronic module 12 may be a power supply, for example. Suppliers, hard drives, heat dissipation equipment, motherboards, central processing units, memory and graphics cards, etc., among which electronic modules 12 that will generate high temperatures during operation, such as motherboards, central processing units, memory and graphics cards wait.

The electrical unit 1 can have a liquid cooling radiator 13 filled with a working liquid L. The liquid cooling radiator 13 can be thermally connected to the heat source H so that the heat energy of the heat source H can be transferred to The working liquid L in the liquid cooling radiator 13 is. The liquid-cooling radiator 13 may have a liquid inlet 131 and a liquid outlet 132. The liquid inlet 131 can be used for the working liquid L to flow into the liquid-cooled radiator 13. The liquid outlet The hole 132 can be used for the working liquid L to flow out in a direction away from the liquid cooling radiator 13 .

Please refer to Figures 2 and 4. The heat exchange unit 2 may have a machine body 2a and a fan assembly 2b. The fan assembly 2b may be laterally coupled to the machine body 2a. Specifically, the main body 2a of the machine may have a shell 21 and a heat dissipation pipe body 22. The present invention does not limit the type of the shell 21. For example, the shell 21 of this embodiment can surround and form a container. The accommodation space S has an opening S1 at both ends in a ventilation direction D1. The heat dissipation pipe body 22 is located in the accommodation space S. The body 2a of the heat exchange unit 22 may have a liquid inlet. Port Q1 and a liquid outlet port Q2. The liquid inlet port Q1 and the liquid outlet port Q2 are respectively connected to both ends of the heat dissipation pipe body 22. The liquid inlet port Q1 can be connected to the liquid outlet hole 132 of the liquid cooling radiator 13. , the liquid outlet port Q2 can be connected to the liquid inlet hole 131 of the liquid cooling radiator 13 . The heat dissipation pipe body 22 can be formed into a straight shape or a curved shape. In this embodiment, the heat dissipation pipe body 22 is illustrated as a curved shape. The heat dissipation pipe body 22 can be formed into several U-shaped shapes. In this way, the system This allows the heat dissipation pipe body 22 to have a larger contact area with the surrounding cold air, thereby achieving a better heat dissipation effect.

In addition, the body 2a of the heat exchange unit 2 may have a heat dissipation fin set 23, which is located in the accommodation space S. The heat dissipation fin set 23 may be a single piece of fin by bending. The present invention is not limited by the heat dissipation fin set 23 can be made of a metal material with a high thermal conductivity to improve the heat conduction efficiency. The heat dissipation pipe body 22 can be Combined with the heat dissipation fin group 23, the heat dissipation pipe body 22 can contact the heat dissipation fin group 23. In this embodiment, the heat dissipation pipe body 22 is illustrated as penetrating the heat dissipation fin group 23; in this way, it can The heat dissipation fin group 23 takes away the heat energy transferred from the working liquid L to the heat dissipation tube body 22, so that the temperature of the working liquid L can be reduced. Preferably, the body 2a of the heat exchange unit 2 can have a cover 24, which can be combined above the shell 21, and a channel F can be formed between the cover 24 and the shell 21. , the cover 24 may have an opening 241, the flow channel F is located between the accommodating space S and the opening 241, the flow channel F may connect the accommodating space S and the opening 241, and in other cases In the embodiment, the heat exchange unit 2 may not have the cover 24, which is not limited by the present invention.

Please refer to Figures 1 and 4, in which the body 2a of the heat exchange unit 2 can have at least one spacer 25, and the at least one spacer 25 can be connected to the cover 24 or the shell 21. In this embodiment, , the at least one positioning bracket 25 is connected to the cover 24, and the at least one positioning bracket 25 can be connected to the box 11 of the electrical unit 1, so that the heat exchange unit 2 is stably installed on one side of the electrical unit 1 , in this embodiment, the number of the positioning brackets 25 is two for illustration. In addition, the thickness B1 of the heat exchange unit 2 can preferably be less than or equal to the thickness B2 of the box 11 of the electrical unit 1. In this way, when the electrical unit 1 is installed in the cabinet E, it can be removed by pinching the box 11 of the electrical unit 1. The heat exchange unit 2 makes it easy to extract the electrical unit 1 from the cabinet E.

In addition, the fan assembly 2b can be used to blow or suck the hot air in the machine body 2a. The fan assembly 2b can be a centrifugal fan, a cross-flow fan or an axial flow fan. In this embodiment, a cross-flow fan is used. Examples are used to illustrate, but are not limited to this. The fan assembly 2b may have an air inlet 26 and an air outlet 27. The air inlet 26 may be connected to the opening 241 of the cover 24. The air flow of the air inlet 26 and the air flow of the air outlet 27 may be orthogonal. In this embodiment, the air inlet 26 is illustrated as an opening 241 laterally connected to the cover 24, so that the airflow of the fan assembly 2b can form a side-in and side-out configuration as shown in Figure 4. The air inlet 26 can be connected to the inside of the body 2a of the heat exchange unit 2 through the flow channel F. An exhaust direction D2 can be defined between the flow channel F and the air inlet 26. The exhaust direction D2 can be normal. In the ventilation direction D1, when the fan assembly 2b is operating, the fan assembly 2b can blow or suck the airflow in the machine body 2a, so that the airflow can flow into the interior of the fan assembly 2b through the air inlet 26, and then from the air inlet 26. The air outlet 27 flows out. In other embodiments, the fan assembly 2b can also be a centrifugal fan, and the air inlet 26 can be positioned at the center of the fan assembly 2b, so that the air inlet 26 can be axially aligned with the opening 241 of the cover 24 , so that the airflow of the fan assembly 2b can form an axis-in-side-out shape as shown in Figure 5.

Please refer to Figures 1 and 3. The pipe assembly 3 can have a first pipe 31 and a second pipe 32. The first pipe 31 can communicate with the liquid inlet 131 of the liquid cooling radiator 13 and the heat exchanger. The liquid outlet port Q2 of the unit 2, the second pipe fitting 32 can connect the liquid outlet hole 132 of the liquid cooling radiator 13 and the liquid inlet port Q1 of the heat exchange unit 2, the pipe assembly 3 contains the working liquid L, the The working fluid L circulates along the pipe assembly 3 between the liquid cooling radiator 13 and the heat exchange unit 2 . The pipe assembly 3 can also have a pump 33, which can be connected in series to the first pipe 31 or the second pipe 32. In this embodiment, the pump 33 is connected in series to the second pipe 32. The pump 33 can drive the working liquid L to easily enter the pipe assembly 3 and increase the circulation speed, which also increases the speed of taking away heat energy, thereby improving the heat dissipation efficiency.

Please refer to Figures 1 and 4. When the electronic device with a heat dissipation system of the present invention is operating, the working liquid L in the liquid cooling radiator 13 can quickly absorb the heat energy of the heat source H, and the working liquid L can be absorbed from the heat source H. The lower temperature forms a higher temperature working liquid L, which can dissipate heat from the heat source H connected to the liquid cooling radiator 13. The higher temperature working liquid L flows into the heat dissipation tube body 22 through the second pipe fitting 32; At this time, external cold air can enter the accommodation space S along the ventilation direction D1, and the cold air can flow through the heat dissipation tube body 22 and the heat dissipation fin group 23 to form hot air.

Then, the fan assembly 2b can blow or suck the hot air in the machine body 2a, so that the hot air can flow into the interior of the fan assembly 2b from the air inlet 26 along the exhaust direction D2, and then flow out from the air outlet 27, and then Lowering the temperature of the working liquid L in the heat dissipation tube body 22 can ensure that the flow of cold air and the flow of hot air do not interfere with each other, and the working liquid L in the heat dissipation tube body 22 can return to a lower temperature working liquid. L, so that the cooled working liquid L can flow into the liquid-cooling radiator 13 through the first pipe 31; such continuous circulation can effectively cool down the heat source H received by the liquid-cooling radiator 13, and then Maintaining the electronic module 12 at an appropriate operating temperature can provide good heat dissipation performance.

Please refer to Figures 6 and 7, which are a second embodiment of an electronic device with a heat dissipation system of the present invention. The second embodiment is substantially the same as the first embodiment. In the second embodiment, the electrical device The number of the unit 1, the heat exchange unit 2 and the pipe assembly 3 is several respectively. The heat exchange unit 2 may not have the fan assembly 2b, and the electronic device with the heat dissipation system of the present invention may further include a heat dissipation device 4, The heat dissipation device 4 can be laterally coupled to the machine body 2a of each heat exchange unit 2, and the heat dissipation device 4 dissipates the heat energy transferred to each heat exchange unit 3.

Specifically, the heat dissipation device 4 may have an air collecting hood 41 and an air guide 42. The air guiding member 42 may be, for example, a fan wheel. The air collecting hood 41 in this embodiment may be roughly rectangular. The air hood 41 is connected to the inside of the machine body 2a. The air collecting hood 41 may have an air guide P, and the air guide P may be parallel to the ventilation direction D1. The heat dissipation device 4 may have several air inlets 43. and an air outlet 44. The air inlets 43 and the air outlet 44 can penetrate the wall of the air collecting hood 41. The air inlets 43 and the air outlets 44 are connected to the air guide duct P. The main body 2a of the exchange unit 2 can be coupled to the air inlets 43 respectively, so that the air guide P can communicate with the inside of the main body 2a.

In addition, the heat dissipation device 4 has a partition 45 located inside the air collecting hood 41 . A chamber R is formed between the partition 45 and the top wall of the air collecting hood 41 . The air guide 42 It can be located in the chamber R. The partition 45 can have a through hole 451. The through hole 451 can preferably be aligned with the center of the air guide 42. The through hole 451 is connected to the machine body through the air guide duct P. 2a, the air outlet 44 is located between the partition 45 and the top wall of the air collecting hood 41. The air outlet 44 can be connected to the chamber R, and the air flow of the air guide P can flow into the chamber through the through hole 451. Chamber R then flows out from the air outlet 44.

In this way, the working liquid L in the liquid cooling radiators 13 can quickly absorb the heat energy of the heat source H. The working liquid L can be formed from a lower temperature to a higher temperature working liquid L. The higher temperature working liquid L can It flows into the heat dissipation tubes 22 respectively through the second pipes 32; at this time, the external cold air can enter the accommodation spaces S along the ventilation direction D1, and the cold air can flow through the heat dissipation tubes 22. The tube body 22 and the plurality of heat dissipation fin groups 23 form hot air.

Then, when the air guide 42 rotates, the hot air in the machine bodies 2a can flow into the air guide P along the exhaust direction D2, and into the chamber R through the through hole 451, and then from the outlet. The air outlet 44 flows out, thereby lowering the temperature of the working liquid L in the heat dissipation tubes 22, and the air collecting cover 41 can also reduce the return flow of hot air, ensuring that the flow of cold air and the flow of hot air do not interfere with each other, and The working liquid L in the heat dissipation tubes 22 can be restored to a lower temperature working liquid L, so that the cooled working liquid L can flow into the liquid cooling radiators through the first pipes 31 respectively. 13; Such continuous circulation can effectively reduce the temperature of the heat source H received by the liquid cooling radiators 13, thereby maintaining the electronic modules 12 at an appropriate operating temperature, thereby providing good heat dissipation. The role of effectiveness.

Please refer to Figure 8, which is a third embodiment of an electronic device with a heat dissipation system of the present invention. The third embodiment is substantially the same as the second embodiment. In the third embodiment, the electrical unit 1 The number of the heat exchange unit 2 and the pipe assembly 3 is several respectively. Each heat exchange unit 2 can have the fan assembly 2b. The heat dissipation device 4 can be laterally combined with each heat exchange unit 2. In this case, In the embodiment, the heat dissipation device 4 is combined with the fan assembly 2b of each heat exchange unit 2, and the fan assemblies 2b can be respectively combined with the air inlets 43 of the heat dissipation device 4, so that the several fan assemblies 2b The fan assembly 2b can be connected with the air guide channel P.

In this way, the working liquid L in the liquid cooling radiators 13 can quickly absorb the heat energy of the heat source H. The working liquid L can be formed from a lower temperature to a higher temperature working liquid L. The higher temperature working liquid L can It flows into the heat dissipation tubes 22 respectively through the second pipes 32; at this time, the external cold air can enter the accommodation spaces S along the ventilation direction D1, and the cold air can flow through the heat dissipation tubes 22. The tube body 22 and the heat dissipation fin groups 23 form hot air, and the fan assemblies 2b can blow or suck the hot air in the machine body 2a, so that the hot air can flow from the air inlets 26 along the exhaust direction. D2 flows into the inside of the fan assembly 2b.

Then, the hot air can flow into the air guide duct P through the air outlets 27 , and by the rotation of the air guide 42 , the hot air in the air guide duct P can flow into the chamber R through the through hole 451 , and then from the air guide 42 . The air outlet 44 flows out, thereby lowering the temperature of the working liquid L in the heat dissipation tubes 22, and the air collecting cover 41 can also reduce the return flow of hot air, ensuring that the flow of cold air and the flow of hot air do not interfere with each other. And the working liquid L in the heat dissipation tubes 22 can be restored to a lower temperature working liquid L, so that the cooled working liquid L can flow into the liquid cooling heat dissipation devices through the first pipe fittings 31 respectively. 13; such continuous circulation can effectively reduce the temperature of the heat source H received by the liquid cooling radiators 13, so that the electronic modules 12 can be maintained at an appropriate operating temperature, and the system can provide good The role of heat dissipation efficiency.

To sum up, in the electronic device with a heat dissipation system of the present invention, the working liquid in the liquid cooling radiator can absorb the thermal energy of the heat source, and the higher temperature working liquid formed can flow to the heat exchange unit through the pipe assembly. External cold air can enter the heat exchange unit for heat exchange, and the hot air in the heat exchange unit can be blown or sucked through the fan assembly or the heat dissipation device so that the hot air can be discharged, and the air collecting hood can also reduce the The hot air reflux can ensure that the flow of cold air and the flow of hot air do not interfere with each other, and the cooled working liquid can flow into the liquid cooling radiator through the pipe assembly, so that the heat source can be effectively cooled, and the system can provide good The effect of cooling efficiency.

Although the present invention has been disclosed using the above-mentioned preferred embodiments, they are not intended to limit the invention. Anyone skilled in the art can make various changes and modifications to the above-described embodiments without departing from the spirit and scope of the invention. The technical scope protected by the invention, therefore, the protection scope of the invention shall include all changes within the literal and equivalent scope described in the appended patent application scope. Furthermore, when several of the above-mentioned embodiments can be combined, the present invention includes any combination of implementations.

﹝This invention﹞ 1: Electrical unit 11:Box body 12: Electronic module 13:Liquid cooling radiator 131: Liquid inlet hole 132: Liquid outlet 2: Heat exchange unit 2a:Machine body 2b:Fan assembly 21:Shell cover 22:Heat dissipation pipe body 23: Cooling fin set 24: Cover body 241:Opening 25: Positioning frame 26:Air inlet 27:Air outlet 3: Pipe fittings group 31:First pipe fitting 32:Second pipe fitting 33:Pump 4:Heat exhaust equipment 41:Wind collecting hood 42:Air guide 43:Air inlet 44:Air outlet 45:Partition 451:Through hole B1: Thickness of heat exchange unit B2:Thickness of box body D1: Ventilation direction D2: Exhaust direction E:cabinet F:Flow channel H: Heat source L: Working liquid P: Air guide Q1: Liquid inlet port Q2: Liquid outlet port R:Room S: Accommodation space S1:Open your mouth

[Figure 1] An exploded perspective view of the first embodiment of the present invention installed in a cabinet. [Figure 2] An exploded perspective view of the heat exchange unit and heat exhaust equipment according to the first embodiment of the present invention. [Figure 3] An assembled plan view of the first embodiment of the present invention. [Figure 4] Cross-sectional view along line A-A in Figure 3. [Figure 5] A cross-sectional view of the airflow of the fan assembly according to the first embodiment of the present invention. [Figure 6] An exploded perspective view of the second embodiment of the present invention. [Picture 7] A partial cross-sectional view of the combination shown in Figure 6. [Figure 8] A combined partial cross-sectional view of the third embodiment of the present invention.

1: Electrical unit

11:Box body

12: Electronic module

13:Liquid cooling radiator

131: Liquid inlet hole

132: Liquid outlet

2: Heat exchange unit

2a:Machine body

2b:Fan assembly

21:Shell cover

24: Cover body

241:Opening

25: Positioning frame

26:Air inlet

27:Air outlet

3: Pipe fittings group

31:First pipe fitting

32:Second pipe fitting

33:Pump

E:cabinet

H: Heat source

L: Working liquid

Q1: Liquid inlet port

Q2: Liquid outlet port

Claims (19)

An electronic device with a heat dissipation system, including: An electrical unit has a liquid-cooled radiator thermally connected to a heat source, and the liquid-cooled radiator contains a working liquid; A heat exchange unit combined with the liquid cooling radiator; A pipe set is connected in series to the liquid cooling radiator and the heat exchange unit, and the working liquid circulates along the pipe set between the liquid cooling radiator and the heat exchange unit; and A heat dissipation device is combined with the heat exchange unit. The heat dissipation device has an air collecting hood and an air guide. The air collecting hood is connected to the heat exchange unit. The air guide is rotatably located in the air collecting hood. , the air guide absorbs the heat energy of the heat exchange unit and discharges it from an air outlet of the heat dissipation device. The electronic device with a heat dissipation system of claim 1, wherein the heat exchange unit has a combined machine body and a fan assembly, and the heat dissipation device is combined with the fan assembly. The electronic device with a heat dissipation system of claim 2, wherein the fan assembly has an air inlet and an air outlet, the air inlet is connected to the machine body, and the air outlet is connected to the air collecting hood. The electronic device with a heat dissipation system as claimed in claim 3, wherein the heat exchange unit has an accommodating space, the accommodating space has an opening at both ends in a ventilation direction, the machine body has a channel, and the flow An exhaust direction is defined between the duct and the air inlet, and the exhaust direction is orthogonal to the ventilation direction. The electronic device with a heat dissipation system of claim 1, wherein the heat exchange unit has a machine body, and the heat dissipation device is combined with the machine body. The electronic device with a heat dissipation system of claim 1, wherein the heat exchange unit has a machine body, the machine body has a shell and a cover body, the cover body is combined above the shell sleeve, and the cover body is A flow channel is formed between the shell sleeves. As claimed in claim 1, the electronic device with a heat dissipation system, wherein the heat exchange unit has a shell, the shell surround forms an accommodating space, and the heat exchange unit has a heat dissipation pipe located in the accommodating space. As claimed in claim 7, the electronic device with a heat dissipation system, wherein the heat exchange unit has a heat dissipation fin set, the heat dissipation fin set is located in the accommodation space, and the heat dissipation pipe body is combined with the heat dissipation fin set. The electronic device with a heat dissipation system as claimed in claim 7, wherein the heat dissipation tube body is formed into a curved shape. The electronic device with a heat dissipation system of claim 1, wherein the heat exchange unit has a heat dissipation pipe body, the pipe set has a first pipe and a second pipe, and the first pipe is connected to a first pipe of the liquid cooling radiator. The liquid inlet hole and a liquid outlet port of the heat exchange unit, the second pipe connects a liquid outlet hole of the liquid cooling radiator and a liquid inlet port of the heat exchange unit, and the liquid inlet port and the liquid outlet port Connect the two ends of the heat dissipation pipe body respectively. As claimed in claim 10, the electronic device with a heat dissipation system, wherein the pipe assembly has a pump, and the pump is connected in series to the first pipe or the second pipe. The electronic device with a heat dissipation system of claim 1, wherein the air collecting hood is provided with an air guide duct, and the air guide duct is connected with the heat exchange unit. As claimed in claim 12, the electronic device with a heat dissipation system, wherein the heat dissipation device has an air inlet, the air inlet is connected to the air guide duct, and the heat exchange unit is combined with the air inlet. The electronic device with a heat dissipation system of claim 1, wherein the heat dissipation device has a partition, the partition is located inside the air collecting hood, and a chamber is formed between the partition and the top wall of the air collecting hood, The air guide is located in the chamber. As claimed in claim 14, the electronic device with a heat dissipation system, wherein the heat dissipation device has an air outlet connected to the chamber, and the air outlet is located between the partition and the top wall of the air collecting hood. The electronic device with a heat dissipation system of claim 14, wherein the air collecting hood is provided with an air guide duct, the partition has a through hole, and the through hole is connected to the heat exchange unit through the air guide duct. The electronic device with a heat dissipation system of claim 1, wherein the number of the electrical unit, the heat exchange unit and the pipe assembly is several respectively, and the air collecting hood is combined with the plurality of heat exchange units. An electronic device with a heat dissipation system, including: An electrical unit has a liquid-cooled radiator thermally connected to a heat source, and the liquid-cooled radiator contains a working liquid; A heat exchange unit, combined with the liquid cooling radiator, the heat exchange unit has a combined machine body and a fan assembly, the fan assembly has an air inlet and an air outlet, the air inlet is connected to the machine body; and A pipe set is connected in series to the liquid cooling radiator and the heat exchange unit, and the working liquid circulates along the pipe set between the liquid cooling radiator and the heat exchange unit. As claimed in claim 18, the electronic device with a heat dissipation system, wherein the heat exchange unit has an accommodating space, the accommodating space has an opening at both ends in a ventilation direction, the machine body has a channel, and the flow An exhaust direction is defined between the duct and the air inlet, and the exhaust direction is orthogonal to the ventilation direction.

Images