TW202344583A - Film for forming protective coating, composite sheet for forming protective coating, protective coating-equipped semiconductor chip, and semiconductor device - Google Patents

Abstract

The present invention relates to: a curable film for forming a protective coating, wherein the ratio of the number of phosphorous atoms to the total number of carbon atoms, nitrogen atoms, oxygen atoms, phosphorous atoms, and silicon atoms is 0.4 at% or more as detected by analyzing through X-ray photoelectron spectrometry at least one surface of said film for forming a protective coating, and the copper-foil peel strength of a cured product of said film for forming a protective coating is 3.0 N/10 mm or more; a composite sheet for forming a protective coating using said film for forming a protective coating; a protective coating-equipped semiconductor chip; and a semiconductor device.

Description

Films for protective film formation, composite sheets for protective film formation, semiconductor wafers and semiconductor devices with protective films

The present invention relates to a film for forming a protective film, a composite sheet for forming a protective film, a semiconductor wafer with a protective film, and a semiconductor device.

In recent years, semiconductor devices are manufactured by applying a so-called face down mounting method in which a semiconductor chip is mounted on a substrate with the circuit surface facing the substrate side. In the face-down method, in order to bond electrodes such as bumps formed on the circuit surface of the semiconductor wafer to the substrate, the semiconductor wafer is sometimes placed in a state where the back surface opposite to the circuit surface is not peeled off. A protective film is formed on the back. The protective film plays a role in protecting the semiconductor chip from external impact during the manufacturing process of the semiconductor chip and after the semiconductor chip is installed. In addition, the protective film can be used for identification and decoration of laser-printed semiconductor chips. In addition, the protective film also functions as a light-shielding layer to prevent circuit malfunction.

The protective film is formed using, for example, a protective film forming film. As a film for forming a protective film, a curable film made of a resin composition having thermosetting properties or energy ray curing properties is used from the viewpoint of mechanical strength, heat resistance, etc. After a curable protective film-forming film is attached to an object to be protected such as a semiconductor wafer or a semiconductor wafer, the protective film is formed by curing the film. For example, Patent Document 1 discloses a film for wafer protection, which is characterized by having a curable protective film-forming layer having a pencil hardness of 5H or more after curing. [Prior technical literature] [Patent Document]

Patent Document 1: Japanese Patent Application Publication No. 2009-147277

[Problem to be solved by the invention]

By the way, in recent years, from the viewpoint of improving safety, the requirements for the flame retardancy of electronic parts have been increasing. As a flame retardant to improve the flame retardancy of plastic products, halogen-based flame retardants have been used in the past. However, halogen-based flame retardants are suspected of emitting toxic substances when burned, and there is a movement to avoid their use. However, according to the research of the present inventors, when the flame retardant of the protective film-forming film is made flame-retardant by using a substitute flame retardant of the halogen-based flame retardant, it was found that it is difficult to make the protective film formed of the protective film-forming film both difficult and difficult. Flammability and persistence.

The present invention was made in view of the above problems, and its object is to provide a protective film-forming film capable of forming a protective film having both flame retardancy and adhesiveness, a protective film-forming composite sheet using the protective film-forming film, and a protective film-forming composite sheet. Protective film for semiconductor wafers and semiconductor devices. [Means used to solve problems]

The present inventors paid attention to the phosphorus atom presence ratio and the copper foil peeling strength on the surface of the protective film-forming film, found that the above problems can be solved, and completed the present invention.

That is, the present invention relates to the following [1] to [13]. [1] A film for forming a protective film that has curability, At least one surface of the protective film-forming film is analyzed by X-ray photoelectron spectrometry to detect the number of phosphorus atoms relative to the total number of carbon atoms, nitrogen atoms, oxygen atoms, phosphorus atoms and silicon atoms. The ratio is 0.4 atomic % or more, The copper foil peeling strength of the cured product of the protective film forming film is 3.0 N/10mm or more. [2] The film for forming a protective film according to the above [1], wherein the ratio of the number of phosphorus atoms on the surface of which the ratio of the number of phosphorus atoms is 0.4 atomic % or more is 5.0 atomic % or less. [3] The protective film-forming film according to [1] or [2] above, wherein the ratio [X] of the number of phosphorus atoms in one surface of the protective film-forming film and the other of the protective film-forming film The ratio [X/Y] of the aforementioned ratio [Y] of the number of phosphorus atoms in a surface is 0.7~1.4. [4] The protective film-forming film according to any one of [1] to [3] above, wherein the protective film-forming film has thermosetting properties. [5] The film for forming a protective film according to any one of the above [1] to [4], which is formed using a resin composition containing (A) a thermoplastic resin and (B) a thermosetting resin. [6] The film for forming a protective film according to the above [5], wherein the thermoplastic resin (A) is an acrylic resin. [7] The film for forming a protective film according to the above [5] or [6], wherein the thermosetting resin (B) is an epoxy resin. [8] The film for forming a protective film according to any one of the above [1] to [7], with a thickness of 1 to 100 μm. [9] The film for forming a protective film according to any one of the above [1] to [8], which is attached to the back surface of a semiconductor wafer and used in the production of a semiconductor wafer with a protective film. [10] A composite sheet for protective film formation having a structure in which the film for protective film formation according to any one of the above [1] to [9] is sandwiched between two release films. [11] A composite sheet for forming a protective film, which has a base material, an adhesive layer, and a film for forming a protective film according to any one of the above [1] to [9] in this order. [12] A semiconductor wafer with a protective film having a protective film that is a cured product of the film for forming a protective film according to any one of [1] to [9] above. [13] A semiconductor device having a semiconductor wafer with a protective film as described in [12] above. [Effects of the invention]

According to the present invention, it is possible to provide a protective film-forming film capable of forming a protective film having both flame retardancy and adhesiveness, a protective film-forming composite sheet using the protective film-forming film, a semiconductor wafer with a protective film, and a semiconductor device. .

In this specification, the number average molecular weight (Mn) and the mass average molecular weight (Mw) are values converted to standard polystyrene measured by gel permeation chromatography (GPC). Specifically, they can be measured based on the method described in the Examples. value.

In this specification, the lower limit and the upper limit are described in stages regarding preferred numerical ranges (such as the range of content, etc.), which can be combined independently. For example, based on the description of "10~90 is better, 30~60 is better", "better lower limit value (10)" and "better upper limit value (60)" can also be combined to become "10~60" ”.

The so-called "energy lines" in this specification refer to electromagnetic waves or charged particle beams that contain energy quanta. Examples of energy rays include ultraviolet rays, radiation, electron beams, and the like. Ultraviolet rays can be irradiated using electrodeless lamps, high-pressure mercury lamps, metal halide lamps, xenon lamps, black lamps, LED lamps, etc. The electron beam can be irradiated using a generator such as an electron beam accelerator.

In this specification, "energy ray curability" means a property that is hardened by irradiation with energy rays, and "non-energy ray curability" means a property that is not hardened even by irradiation with energy rays, and includes thermal curability and Non-hardening. "Thermosetting property" means the property of being hardened by heating, and "non-hardening property" means the property of not being hardened by heating or energy ray irradiation.

In this specification, for example, "(meth)acrylic acid" means both "acrylic acid" and "methacrylic acid", and the same applies to other similar terms.

In this specification, the term "circuit surface" of a semiconductor wafer and a semiconductor wafer refers to the surface on which a circuit is formed, and the term "back surface" of a semiconductor wafer and a semiconductor wafer refers to the surface opposite to the circuit surface.

In this specification, the "thickness" of a certain object means the thickness of the entire object. For example, when the object is composed of a plurality of layers, it means the total thickness of all the layers constituting the object. The "object" here means a film for forming a protective film, a release film, a base material, an adhesive layer, etc. which will be described later. The thickness in this specification is a value measured based on the method described in the Example.

In this specification, "solid content" refers to components other than diluting solvents such as water and organic solvents among the components contained in the subject composition.

The mechanism of action described in this specification is speculation and does not limit the mechanism by which the effects of the present invention are exerted.

[Film for protective film formation] The protective film-forming film of this embodiment is a curable protective film-forming film. At least one surface of the protective film-forming film is analyzed by X-ray photoelectron spectrometry to detect the relative carbon content of the protective film-forming film. The ratio of the number of phosphorus atoms to the total number of atoms, nitrogen atoms, oxygen atoms, phosphorus atoms and silicon atoms is 0.4 atomic % or more, and the copper foil peeling strength of the cured product of the protective film forming film is 3.0 N/10mm or more.

The film system for forming a protective film of this embodiment has curability, preferably thermosetting property or energy ray curing property, and more preferably thermosetting property. Here, in this specification, the "film for protective film formation" refers to the former cured film, and the so-called "protective film" refers to the latter film cured.

In addition, the curing conditions of the protective film-forming film when forming the cured product of the protective film-forming film to be measured for the copper foil peeling strength should be set to allow the reaction of the curable components in the protective film-forming film to be substantially The conditions for completion may be sufficient as long as they correspond to the type of film for protective film formation, such as the conditions described in <Harding Conditions of Film for Protective Film Formation> described later or the conditions described in the Examples.

The protective film-forming film of this embodiment is attached to an object to be protected such as a semiconductor wafer and a semiconductor wafer, and then hardened to form a protective film that protects the object to be protected from external impact and the like. In particular, the film for forming a protective film according to this embodiment is useful for being attached to the back surface of a semiconductor wafer to produce a semiconductor wafer with a protective film. Since the protective film formed of the protective film-forming film of this embodiment has both flame retardancy and adhesiveness, the object to be protected provided with the protective film formed of the protective film-forming film of this embodiment has excellent safety, and the object to be protected is excellent in safety. The protective film formed is excellent in protecting the object to be protected.

The film for forming a protective film in this embodiment may be composed of only one layer, or may be composed of a plurality of two or more layers. When the film for forming a protective film according to this embodiment is composed of a plurality of layers, the respective layers constituting the plurality of layers may be the same or different from each other.

<Ratio of the number of phosphorus atoms> At least one surface of the protective film-forming film of this embodiment is analyzed by X-ray photoelectron spectroscopy, thereby detecting the number of phosphorus atoms relative to the total number of carbon atoms, nitrogen atoms, oxygen atoms, phosphorus atoms, and silicon atoms. The number ratio (hereinafter also referred to as "phosphorus atomic ratio") is 0.4 atomic % or more. When the phosphorus atomic ratio is 0.4 atomic % or more, the protective film formed of the protective film-forming film of this embodiment is excellent in flame retardancy.

The phosphorus atom ratio on at least one surface of the protective film-forming film of this embodiment only needs to be 0.4 atomic % or more. However, from the viewpoint of flame retardancy, the phosphorus atom ratio on both surfaces of the protective film-forming film is preferably 0.4 atom. %above.

In addition, the phosphorus atom ratio in this embodiment is measured under the following conditions, and more specific measurement methods are described in the Examples. [Measurement method of phosphorus atom ratio] X-ray photoelectron spectroscopy (XPS analysis) is performed on the surface of the protective film-forming film to be measured under the following conditions, and the ratio of carbon atoms, nitrogen atoms, oxygen atoms, phosphorus atoms, and The ratio of the total number of silicon atoms to the number of phosphorus atoms. (XPS analysis device) X-ray source: AlKα ( ^1486.6eV ) ) C: C1S N: C1s O: O1s Si: Si2p P: P2p

From the same viewpoint as above, the phosphorus atom ratio on the surface having a phosphorus atom ratio of 0.4 atomic % or more is preferably 0.5 atomic % or more, more preferably 0.6 atomic % or more. Furthermore, from the viewpoint of the adhesiveness of the protective film, the upper limit of the phosphorus atom ratio on the surface having a phosphorus atom ratio of 0.4 atomic % or more is preferably 5.0 atomic % or less, more preferably 3.0 atomic % or less, and still more preferably 2.0 atomic% or less.

The ratio [X/Y] of the phosphorus atom ratio [X] on one surface of the protective film-forming film of the present embodiment to the phosphorus atom ratio [Y] on the other surface is not particularly limited, but is based on the flame retardancy of the protective film. From a viewpoint, the preferred range is 0.7~1.4, the preferred range is 0.8~1.3, and the preferred range is 0.9~1.2.

＜Copper foil peeling strength＞ The copper foil peeling strength of the cured product of the protective film forming film of this embodiment is 3.0 N/10mm or more. In addition, the copper foil peeling strength of this embodiment was measured by the following measurement method, and more specific examples of the measurement method are as described in the Examples. [Measurement method of copper foil peel strength] On the surface of the protective film-forming film of this embodiment, a copper foil with a long side of 50 mm × a short side of 10 mm × a thickness of 150 μm is used as a protective film-forming film. Leave the unattached part and attach it using a laminator. Next, the protective film-forming film was cured to form a laminate in which the silicon wafer, the protective film of the cured product of the protective film-forming film, and the copper foil were laminated in the thickness direction, and this was used as the copper foil peeling strength. The measurement sample. The measurement sample was installed on a tensile testing machine, the unattached portion of the copper foil was held with a clamp, and the copper foil was peeled off in the 90° direction at a peeling speed of 50 mm/min to obtain copper foil peeling. intensity.

Based on the same viewpoint as above, the copper foil peeling strength of the protective film forming film of this embodiment is preferably 4.0N/10mm or more, more preferably 5.0N/10mm or more, still more preferably 6.0N/10mm or more, and more preferably The best is 7.0N/10mm or more. In addition, the upper limit of the copper foil peeling strength of the protective film forming film of this embodiment is preferably as high as possible. However, from the viewpoint of ease of production, it may be 20 N/10mm or less, may be 15 N/10mm or less, or may be Below 10N/10mm.

Next, materials used for forming the protective film-forming film of this embodiment will be described. The protective film forming film of this embodiment is preferably formed using a resin composition containing (A) a thermoplastic resin and (B) a thermosetting resin. In the following description, the resin composition used to form the protective film-forming film of this embodiment may be referred to as the "protective film-forming resin composition."

[Resin composition for protective film formation] The resin composition for forming a protective film is a resin composition containing (A) a thermoplastic resin and (B) a thermosetting resin. Each component contained in the resin composition for forming a protective film will be described in detail below.

＜(A) Thermoplastic resin＞ Since the resin composition for protective film formation contains (A) the thermoplastic resin, the film for protective film formation of this embodiment has flexibility before hardening and has excellent adhesion to the object to be protected. (A) Thermoplastic resin may be used individually by 1 type, and may be used in combination of 2 or more types.

Examples of (A) the thermoplastic resin include acrylic resin, urethane resin, phenoxy resin, silicone resin, saturated polyester resin, polybutylene resin, polybutadiene resin, polystyrene resin, and the like. Among these, acrylic resin is preferred.

The raw material monomer of the acrylic resin preferably contains (meth)acrylate. As the raw material monomer of the acrylic resin, one type may be used alone, or two or more types may be used in combination.

Examples of (meth)acrylate include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, and amyl (meth)acrylate. Hexyl (meth)acrylate, heptyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, octyl (meth)acrylate, nonyl (meth)acrylate, decyl (meth)acrylate Ester, undecyl (meth)acrylate, dodecyl (meth)acrylate, tridecyl (meth)acrylate, myristyl (meth)acrylate, pentadecyl (meth)acrylate Alkyl (meth)acrylate, cetyl (meth)acrylate, heptadecanyl (meth)acrylate, stearyl (meth)acrylate, etc.; cyclohexyl (meth)acrylate , (meth)acrylic acid cycloalkyl esters such as isobornyl (meth)acrylate and (meth)acrylic acid dicyclopentyl ester; (meth)acrylic acid aralkyl esters such as (meth)benzyl acrylate; (meth)acrylic acid aralkyl esters (meth)acrylic acid cycloalkenyl esters such as dicyclopentenyl acrylate; (meth)acrylic acid cycloalkenyloxyalkyl esters such as dicyclopentenyloxyethyl acrylate; acyl imine ( Meth)acrylate; (meth)acrylate containing glycidyl group such as glycidyl (meth)acrylate; (meth)acrylate hydroxymethyl ester, (meth)acrylate 2-hydroxyethyl acrylate, (meth)acrylate 2-hydroxypropyl acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, 4-hydroxy(meth)acrylate (meth)acrylates containing hydroxyl groups such as butyl ester; (meth)acrylates containing substituted amine groups such as N-methylaminoethyl (meth)acrylate; etc.

Among these, the raw material monomer of the acrylic resin preferably contains alkyl (meth)acrylate. The number of carbon atoms in the alkyl group constituting the alkyl ester of (meth)acrylic acid alkyl ester is not particularly limited, but is preferably 1 to 18, more preferably 1 to 10, and still more preferably 1 to 4. The alkyl group constituting the alkyl ester of (meth)acrylic acid alkyl ester may be in the form of n-, 2-, 3-, or iso-, depending on the position of the carbon having a free valence, and any form may be used. The content of alkyl (meth)acrylate in the raw material monomers of the acrylic resin is not particularly limited, but relative to the raw material monomers of the acrylic resin (100 mass %), it is preferably 50 to 97 mass %, and more preferably 60 to 60 mass %. 93% by mass, more preferably 70~90% by mass.

The raw material monomer of the acrylic resin preferably contains a hydroxyl-containing (meth)acrylate together with an alkyl (meth)acrylate. When the raw material monomers of acrylic resin contain hydroxyl-containing (meth)acrylate, the content of hydroxyl-containing (meth)acrylate in the raw material monomers of acrylic resin is not particularly limited, but compared to the raw material monomers of acrylic resin ( 100 mass%), preferably 2 to 50 mass%, more preferably 6 to 40 mass%, and still more preferably 10 to 30 mass%.

The raw material monomers of acrylic resin may or may not contain monomers other than (meth)acrylate. Examples of monomers other than (meth)acrylate include (meth)acrylic acid, itaconic acid, vinyl acetate, acrylonitrile, acrylomorpholine, styrene, acrylamide, and N-methylolpropylene. Amide etc.

(A) The mass average molecular weight (Mw) of the thermoplastic resin is not particularly limited, but is preferably 10,000 to 2,000,000, more preferably 100,000 to 1,500,000, still more preferably 150,000 to 1,000,000. (A) When the mass average molecular weight (Mw) of the thermoplastic resin is more than the above lower limit, the shape stability of the protective film forming film tends to be better. In addition, (A) when the mass average molecular weight (Mw) of the thermoplastic resin is less than the above upper limit, the protective film-forming film can easily follow the uneven surface of the object to be protected, and the contact between the object to be protected and the protective film-forming film can be suppressed. The tendency for gaps, etc. to occur.

(A) The glass transition temperature (Tg) of the thermoplastic resin (hereinafter also referred to as "Tg") is not particularly limited, but is preferably -60~70°C, more preferably -30~50°C, and more preferably -10~ 20℃. (A) When the Tg of the thermoplastic resin is equal to or higher than the above-mentioned lower limit, the cohesion of the film for forming a protective film tends to be better. Furthermore, when the Tg of (A) the thermoplastic resin is less than the above-mentioned upper limit, the flexibility and adhesiveness of the protective film-forming film tend to be improved.

For example, the Tg of an acrylic resin can be calculated using the Fox formula shown below. (In the formula, Tg is the glass transition temperature of acrylic resin, Tg1, Tg2,...Tgm are the glass transition temperatures of the homopolymers of each monomer that becomes the raw material of acrylic resin, W1, W2,...Wm are the The mass fraction of the monomer. However, W1+W2+...+Wm=1). For the glass transition temperature of the homopolymer of each monomer in the Fox formula above, the value recorded in the polymer data manual, adhesive manual or polymer manual can be used. For example, the Tg of methyl acrylate homopolymer is 10°C, the Tg of 2-hydroxyethyl acrylate homopolymer is -15°C, the Tg of 2-ethylhexyl acrylate is -70°C, and the Tg of 2-ethyl methacrylate is -70°C. The Tg of hydroxyhexyl ester is -10°C. In addition, Tg can be determined based on JIS K 7121 (2012).

(A) The thermoplastic resin may have functional groups. Examples of the functional group include a vinyl group, a (meth)acrylyl group, an amine group, a hydroxyl group, a carboxyl group, an isocyanate group, and the like. (A) When the thermoplastic resin has a functional group, the functional group may be bonded to other compounds via the (H) cross-linking agent described below, or may be directly bonded to other compounds without the (H) cross-linking agent. (A) Thermoplastic resins use functional groups to bond with other compounds through (H) cross-linking agents or directly, thereby tending to improve the reliability of the protective film. As the (A) thermoplastic resin having a functional group, an acrylic resin having a functional group is preferred, and an acrylic resin having a hydroxyl group as a functional group is more preferred.

The content of (A) thermoplastic resin in the protective film-forming resin composition is not particularly limited, but relative to the solid content (100 mass%) of the protective film-forming resin composition, it is preferably 5 to 80 mass%, more preferably The content is 7 to 50% by mass, and more preferably 10 to 30% by mass. (A) When the content of the thermoplastic resin is more than the above-mentioned lower limit, the flexibility of the protective film-forming film before curing and the adhesion to the object to be protected tend to be better. Furthermore, when the content of (A) the thermoplastic resin is less than the above-mentioned upper limit, the protective film tends to have better flame retardancy, mechanical strength and heat resistance.

＜(B)Thermosetting resin＞ By making the resin composition for protective film formation contain (B) thermosetting resin, the film for protective film formation of this embodiment becomes thermosetting, and a protective film excellent in mechanical strength, heat resistance, etc. can be formed. (B) Thermosetting resin may be used individually by 1 type, or may be used in combination of 2 or more types.

Examples of the (B) thermosetting resin include epoxy resin, phenol resin, melamine resin, urea resin, thermosetting polyimide resin, and the like. Among these, epoxy resin is preferred. As the epoxy resin, an epoxy resin having two or more epoxy groups per molecule is preferred. Examples of the epoxy resin include those known in the art, such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, and their hydrogenated products; phenolic novolak type epoxy resin, formaldehyde epoxy resin, etc. Phenol novolak type epoxy resin, o-cresol novolak type epoxy resin, novolac type epoxy resin, etc.; phenol aralkyl type epoxy resin, etc. aralkyl type epoxy resin; dicyclopentadiene type Epoxy resin; biphenyl-type epoxy resin; naphthalene-type epoxy resin; etc. Among these, dicyclopentadiene-type epoxy resin, bisphenol-type epoxy resin, and naphthalene-type epoxy resin are preferable from the viewpoint of film properties, heat resistance, etc. for forming a protective film.

The number average molecular weight (Mn) of the epoxy resin is not particularly limited, but from the viewpoint of the curability of the protective film forming film and the mechanical strength and heat resistance of the protective film, it is preferably 200 to 30,000, more preferably 250 to 10,000. Even better, it is 300~3,000.

The epoxy equivalent of the epoxy resin is not particularly limited, but from the viewpoint of the hardening properties of the protective film-forming film and the mechanical strength and heat resistance of the protective film, 100 to 1,500 g/eq is preferred, and 130 to 1,200 g is more preferred. /eq, preferably 160~1,000g/eq. In addition, in this specification, "epoxy equivalent" means the number of grams (g/eq) of the epoxy resin containing 1 gram equivalent of an epoxy group, and can be measured in accordance with JIS K 7236:2001.

The content of the epoxy resin in the protective film-forming resin composition is not particularly limited, but relative to the solid content (100 mass%) of the protective film-forming resin composition, it is preferably 2 to 60 mass %, and more preferably 4 to 60 mass %. 40 mass%, more preferably 7 to 20 mass%. When the epoxy resin content is more than the above lower limit, the curability of the protective film forming film and the mechanical strength and heat resistance of the protective film tend to be better. In addition, when the content of the epoxy resin is less than the above-mentioned upper limit, the flexibility of the protective film-forming film before curing tends to be better.

The content of (B) thermosetting resin in the protective film-forming resin composition is not particularly limited, but is preferably 2 to 60 mass%, more preferably 2 to 60 mass% relative to the solid content (100 mass%) of the protective film-forming resin composition. Preferably, it is 4-40 mass %, and more preferably, it is 7-20 mass %. (B) When the thermosetting resin content is more than the above-mentioned lower limit, the curability of the protective film-forming film and the mechanical strength and heat resistance of the protective film tend to be better. Moreover, when the content of (B) the thermosetting resin is less than the above-mentioned upper limit, the flexibility of the film for protective film formation before curing tends to be better.

＜(C) Inorganic filler＞ The resin composition for protective film formation preferably further contains (C) an inorganic filler. By containing the (C) inorganic filler in the protective film-forming resin composition, the protective film-forming film of the present embodiment has excellent shape maintainability, and the protective film formed from the protective film-forming film of the present embodiment becomes difficult to form. Excellent in flammability, low thermal expansion, low moisture absorption, etc. (C) Inorganic filler may be used individually by 1 type, or may be used in combination of 2 or more types.

Examples of the (C) inorganic filler include silicon oxide, talc, calcium carbonate, titanium white, iron oxide red, silicon carbide, and the like. Among these, silicon oxide and aluminum oxide are preferred, and silicon oxide is more preferred. (C) The shape of the inorganic filler is not particularly limited and may be, for example, spherical, crushed, fibrous, etc., but is preferably spherical. (C) Inorganic fillers whose surface can be modified by surface treatment agents, etc. As the surface treatment agent, the coupling agent (I) described below can be used.

(C) The average particle size (D ₅₀ ) of the inorganic filler is not particularly limited, but is preferably 0.1~10 μm, more preferably 0.2~5 μm, and still more preferably 0.3~1 μm. (C) The average particle diameter (D ₅₀ ) of the inorganic filler can be determined by measuring the particle size distribution by the Coulter counting method using a Multisizer 3 machine (manufactured by Beckman Coulter Co., Ltd.) or the like.

The content of (C) inorganic filler in the protective film-forming resin composition is not particularly limited, but it is preferably 50 mass % or more, more preferably 50 mass % or more based on the solid content (100 mass %) of the protective film-forming resin composition. 53 mass % or more, more preferably 55 mass % or more, and more preferably 90 mass % or less, more preferably 85 mass % or less, further preferably 80 mass % or less. (C) When the content of the inorganic filler is more than the above-mentioned lower limit, the shape maintainability of the protective film shape film, the flame retardancy, low thermal expansion and low hygroscopicity of the protective film tend to be better. Moreover, when the content of (C) the inorganic filler is less than the above-mentioned upper limit, the flexibility of the protective film-forming film before curing tends to be better.

＜(D)Flame retardant＞ The resin composition for protective film formation preferably further contains (D) a flame retardant. Since the resin composition for protective film formation contains the flame retardant (D), the protective film formed from the film for protective film formation of this embodiment is excellent in flame retardancy. (D) One type of flame retardant may be used alone, or two or more types may be used in combination.

Examples of the (D) flame retardant include halogen compounds, compounds containing phosphorus atoms, compounds containing nitrogen atoms, compounds containing phosphorus atoms and nitrogen atoms, and inorganic flame retardants other than these. Among these, a compound containing a phosphorus atom and a nitrogen atom is preferred from the viewpoint of flame retardancy and adhesiveness of the protective film. Hereinafter, the compound containing a phosphorus atom and a nitrogen atom will be referred to as "(D1) a compound containing a phosphorus atom and a nitrogen atom."

((D1) Compounds containing phosphorus atoms and nitrogen atoms) When the resin composition for forming a protective film contains (D1) a compound containing a phosphorus atom and a nitrogen atom, a protective film that has both flame retardancy and better adhesion tends to be formed. The reason for this is not yet certain, but one reason is that the phosphorus atoms and nitrogen atoms contained in the component (D1) contribute to the flame retardancy, and this compound interacts with (A) thermoplastic resin, (B) thermosetting resin, etc. Because of its high compatibility, it acts as a plasticizer in the protective film-forming film to improve the adhesion of the protective film-forming film to the object to be protected. (D1) The compound containing a phosphorus atom and a nitrogen atom may be used individually by 1 type, or may be used in combination of 2 or more types.

(D1) The number of phosphorus atoms in one molecule of the compound containing phosphorus atoms and nitrogen atoms is not particularly limited, but it is preferably 1 to 20, more preferably 2 to 10, still more preferably 3 to 5, especially The best number is 3 or 4. (D1) The number of nitrogen atoms in one molecule of a compound containing a phosphorus atom and a nitrogen atom is not particularly limited, but is preferably 1 to 20, more preferably 2 to 10, even more preferably 3 to 5, especially The best number is 3 or 4. (D1) If the number of phosphorus atoms and nitrogen atoms in the compound containing phosphorus atoms and nitrogen atoms is within the above range, a protective film with better both flame retardancy and adhesion tends to be formed.

(D1) The content of phosphorus atoms in the compound containing phosphorus atoms and nitrogen atoms is not particularly limited, but relative to (D1) the compound containing phosphorus atoms and nitrogen atoms (100 mass%), it is preferably 5 to 30 mass%, more preferably Preferably, it is 7-20 mass %, and more preferably, it is 10-15 mass %. (D1) The content of nitrogen atoms in the compound containing phosphorus atoms and nitrogen atoms is not particularly limited, but relative to (D1) the compound containing phosphorus atoms and nitrogen atoms (100 mass%), it is preferably 1 to 20 mass%, more preferably Preferably, it is 2-15 mass %, and more preferably, it is 4-10 mass %. (D1) If the content of the phosphorus atom and the nitrogen atom in the compound containing the phosphorus atom and the nitrogen atom is within the above range, a protective film that has both flame retardancy and better adhesion tends to be formed.

(D1) The compound containing a phosphorus atom and a nitrogen atom is preferably a compound containing a bond between a phosphorus atom and a nitrogen atom from the viewpoint of further improving the flame retardancy of the protective film.

The compound containing a bond between a phosphorus atom and a nitrogen atom is preferably an organic compound containing a bond between a phosphorus atom and a nitrogen atom, and more preferably a compound containing a bond between a phosphorus atom and a nitrogen atom, from the viewpoint of forming a protective film that is both flame retardant and has better adhesion. A compound having a structure represented by the following general formula (D-1).

(In the formula, R ¹ represents a substituted or unsubstituted aliphatic hydrocarbon group, or a substituted or unsubstituted aromatic hydrocarbon group. The plural R ^1s may be the same as each other or different, n represents an integer from 3 to 20, -* ¹ And -＊ ² represents the bond with other atoms. Bond-＊ ¹ and bond-＊ ² can be connected to each other to form a ring structure).

Examples of the substituted or unsubstituted aliphatic hydrocarbon group represented by R ¹ in the above general formula (D-1) include a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkenyl group, and a substituted or unsubstituted alkynyl group. wait. These aliphatic hydrocarbon groups may be either linear or branched. The carbon number of the substituted or unsubstituted aliphatic hydrocarbon group is not particularly limited, but is preferably 1 to 10, more preferably 2 to 8, and still more preferably 3 to 5. When the aliphatic hydrocarbon group has a substituent, the carbon number does not include the carbon number of the substituent. Examples of substituents that the aliphatic hydrocarbon group may have include a halogen atom, a hydroxyl group, a carboxyl group, an alkoxy group, a cyano group, an aromatic hydrocarbon group, and the like. Examples of the aromatic hydrocarbon group as the substituent are the same as the aromatic hydrocarbon group represented by R ¹ described below.

Examples of the substituted or unsubstituted aromatic hydrocarbon group include a substituted or unsubstituted phenyl group, a substituted or unsubstituted naphthyl group, and the like. The carbon number of the substituted or unsubstituted aromatic hydrocarbon group is not particularly limited, but is preferably 6 to 12, more preferably 6 to 8. When the aromatic hydrocarbon group has a substituent, the carbon number does not include the carbon number of the substituent. Examples of substituents that the aromatic hydrocarbon group may have include a halogen atom, a hydroxyl group, a carboxyl group, an alkoxy group, a cyano group, an aliphatic hydrocarbon group, and the like. Examples of the aliphatic hydrocarbon group as the substituent are the same as the aliphatic hydrocarbon group represented by R ¹ above.

Among the above options, R ¹ in the above general formula (D-1) is preferably a substituted or unsubstituted phenyl group, and more preferably is an unsubstituted phenyl group.

n in the above general formula (D-1) is not particularly limited, but is preferably an integer from 3 to 15, more preferably an integer from 3 to 10, and still more preferably an integer from 3 to 5.

-＊ ¹ and -＊ ² in the above general formula (D-1) represent bonds with other atoms. The bonding bond -* ¹ and the bonding bond -* ² in the above general formula (D-1) can be connected to each other to form a cyclic structure, and preferably form a cyclic structure. In this case, "the compound containing the structure represented by the general formula (D-1)" is synonymous with "the compound represented by the general formula (D-1)".

When the bonding bond -＊ ¹ and the bonding bond -＊ ² in the above general formula (D-1) are not connected to each other, -＊ ¹ is preferably -N=P(OR ¹ ) ₃ or -N=P(O )(OR ¹ ) bond, -＊ ² is preferably bonded with -P(OR ¹ ) ₃ or -P(O)(OR ¹ ). The description of R ¹ contained in these groups is the same as the description of R ¹ in the above general formula (D-1).

Examples of the compound containing a phosphorus atom and a nitrogen atom (D1) include a phosphazene compound. Here, in this specification, the "phosphazene compound" refers to a compound containing phosphorus atoms and nitrogen atoms alternately, and each phosphorus atom has two substituents. The phosphazene compound may be either an organic compound or an inorganic compound, but an organic compound is preferred.

Examples of the phosphazene compound include cyclic phosphazene compounds, chain phosphazene compounds, and the like, and cyclic phosphazene compounds are preferred. Examples of the cyclic phosphazene compound include hexaphenoxycyclotriphosphazene, octaphenoxycyclotetraphosphazene, decaphenoxycyclopentaphosphazene, dodecyloxycyclohexaphosphazene, and tetraphenoxy Cyclic phenoxyphosphazene compounds such as cycloheptaphosphazene; hexapropoxycyclotriphosphazene, octapropoxycyclotetraphosphazene, decapropoxycyclopentaphosphazene, and dodecapropoxycyclohexaphosphazene Cyclic propoxyphosphazene compounds such as phosphazene and tetradecanopropoxycycloheptaphosphazene; etc. Among these, a cyclic phenoxyphosphazene compound is preferred, and a hexaphenoxycyclotriphosphazene compound is more preferred.

(D1) The molecular weight of the compound containing a phosphorus atom and a nitrogen atom is not particularly limited, but is preferably 300 to 3,000, more preferably 400 to 1,500, more preferably 500 to 800. (D1) When the molecular weight of the compound containing phosphorus atoms and nitrogen atoms is more than the above lower limit, volatilization of the compound containing (D1) phosphorus atoms and nitrogen atoms can be suppressed during the manufacturing process and curing process of the protective film forming film. tendency. When the molecular weight of the compound (D1) containing a phosphorus atom and a nitrogen atom is less than or equal to the above upper limit, the dispersibility of the compound (D1) containing a phosphorus atom and a nitrogen atom in the protective film-forming film tends to be more favorable.

The content of (D1) the compound containing phosphorus atoms and nitrogen atoms in the protective film-forming resin composition is not particularly limited, but is preferably 1 to 20% relative to the solid content (100% by mass) of the protective film-forming resin composition. mass %, more preferably 2 to 15 mass %, more preferably 2.5 to 13 mass %, still more preferably 3 to 11 mass %, still more preferably 3 to 8 mass %, particularly preferably 3 to 5 mass % %. Furthermore, the content of the compound (D1) containing phosphorus atoms and nitrogen atoms in the protective film-forming resin composition is not particularly limited, except for the components other than inorganic fillers and colorants in the solid content of the protective film-forming resin composition. The total amount (100 mass %) is preferably 5 to 70 mass %, more preferably 7 to 60 mass %, still more preferably 8 to 50 mass %, still more preferably 9 to 40 mass %, and still more preferably The range is 14~35% by mass, and the best range is 19~30% by mass. (D1) When the content of the compound containing phosphorus atoms and nitrogen atoms is more than the above lower limit, the protective film tends to have better flame retardancy. Moreover, (D1) When the content of the compound containing a phosphorus atom and a nitrogen atom is below the upper limit, the cohesion of the protective film forming film and the adhesiveness of the protective film tend to be better.

The ratio of the content of (C) inorganic filler to the content of (D1) the compound containing phosphorus atoms and nitrogen atoms [(C) component/(D1) component] in the protective film-forming resin composition is not particularly limited, but it is The quality standard is preferably 2 to 40, more preferably 3 to 35, still more preferably 4 to 30, and particularly preferably 5 to 25. When the content ratio [component (C)/component (D1)] is within the above range, the protective film tends to have a better balance of flame retardancy, adhesiveness, low thermal expansion and low moisture absorption.

The content of (D) flame retardant in the protective film-forming resin composition is not particularly limited, but it is preferably 1 to 20 mass %, more preferably 1 to 20 mass % relative to the solid content (100 mass %) of the protective film-forming resin composition. It is 2 to 15 mass %, more preferably 2.5 to 13 mass %, still more preferably 3 to 11 mass %, still more preferably 3 to 8 mass %, and particularly preferably 3 to 5 mass %. In addition, the content of the flame retardant (D) in the protective film-forming resin composition is not particularly limited, but the content of the flame retardant (D) is not particularly limited relative to the total amount of components excluding the inorganic filler and colorant in the solid content of the protective film-forming resin composition ( 100% by mass), preferably 5~70% by mass, more preferably 7~60% by mass, still more preferably 8~50% by mass, still more preferably 9~40% by mass, and still more preferably 14~ 35% by mass, particularly preferably 19~30% by mass. (D) When the flame retardant content is more than the above lower limit, the flame retardancy of the protective film tends to be better. In addition, when the content of the flame retardant (D) is less than the above-mentioned upper limit, the adhesiveness of the protective film tends to be better.

Examples of the flame retardant (D) other than the above-mentioned component (D1) include chlorine-based flame retardants containing chlorine atoms, bromine-based flame retardants containing bromine atoms, and other halogen compounds; red phosphorus, phosphate esters, and metal phosphates. Compounds containing phosphorus atoms such as salts; compounds containing nitrogen atoms such as compounds with triazine rings and compounds with isocyanurate rings; inorganic flame retardant compounds such as aluminum hydroxide, magnesium hydroxide, antimony compounds, etc. agent; etc.

＜(E) Hardening accelerator＞ The resin composition for protective film formation may contain (E) a hardening accelerator. Since the resin composition for protective film formation contains (E) the hardening accelerator, the film for protective film formation of this embodiment tends to have better curability. (E) Hardening accelerator may be used individually by 1 type, or may be used in combination of 2 or more types.

Examples of (E) hardening accelerators include tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris(dimethylaminomethyl)phenol, etc.; 2 -Methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxy Imidazoles such as methylimidazole; organic phosphines such as tributylphosphine, diphenylphosphine, triphenylphosphine, etc.; tetraphenylphosphonium tetraphenylborate, tetraphenylphosphine tetraphenylborate, etc. Phenylborate; etc. Among these, imidazoles are preferred, and 2-phenyl-4,5-dihydroxymethylimidazole is more preferred.

When the resin composition for forming a protective film contains a curing accelerator (E), the content of the curing accelerator (E) in the resin composition for forming a protective film is not particularly limited, but relative to 100 parts by mass of the thermosetting resin (B), It is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 5 parts by mass, and still more preferably 1 to 3 parts by mass. (E) When the content of the curing accelerator is more than the above-mentioned lower limit, the curing properties of the film for forming a protective film tend to be more favorable. Moreover, when the content of (E) the hardening accelerator is less than the above-mentioned upper limit, the homogeneity of the hardened material tends to be better.

＜(F) Colorant＞ The resin composition for forming a protective film may contain (F) a coloring agent. When the resin composition for protective film formation contains the colorant (F), laser printability, light-shielding properties, design properties, etc. can be imparted to the protective film formed from the film for protective film formation of this embodiment. (F) The coloring agent may be used individually by 1 type, or may be used in combination of 2 or more types.

Examples of the coloring agent (F) include those known in the art, and include, for example, inorganic pigments, organic pigments, organic dyes, and the like. Examples of inorganic pigments include carbon black, cobalt-based pigments, iron-based pigments, chromium-based pigments, titanium-based pigments, vanadium-based pigments, zirconium-based pigments, molybdenum-based pigments, ruthenium-based pigments, platinum-based pigments, ITO (indium tin oxide) pigments, ATO (antimony tin oxide) pigments, etc. Examples of organic pigments and organic dyes include ammonium pigments, cyanine pigments, merocyanine pigments, croconium pigments, squarylium pigments, and azulene pigments. Polymethylene pigments, naphthoquinone pigments, pyridinium pigments, phthalocyanine pigments, naphthalocyanine pigments, naphtholactam pigments, azo pigments, condensed azo pigments, indigo Pigments, perylene-based pigments, perylene-based pigments, dioxazine-based pigments, quinidone-based pigments, isoindolinone-based pigments, quinolinone-based pigments, pyrrole-based pigments, thioindigo-based pigments, metal complexes Compound pigments (metal complex salt dyes), dithiol metal complex pigments, indoxyl pigments, triallylmethane pigments, anthraquinone pigments, naphthol pigments, azomethine (azomethine) pigments, benzimidazolone pigments, pyrone pigments, indanthrene pigments, etc.

When the resin composition for protective film formation contains the (F) colorant, the content of the (F) colorant in the resin composition for protective film formation is not particularly limited, but from the viewpoint of obtaining a moderate coloring effect, the content of the colorant (F) in the resin composition for protective film formation is lower than that of the resin composition for protective film formation. The solid content (100% by mass) of the composition is preferably 0.01 to 10% by mass, more preferably 0.05 to 7.5% by mass, still more preferably 0.1 to 5% by mass, and particularly preferably 1 to 3% by mass.

＜(G) Epoxy resin hardener＞ When the resin composition for protective film formation contains an epoxy resin as the (B) curable resin, it may further contain (G) an epoxy resin curing agent. Since the resin composition for protective film formation contains the (G) epoxy resin hardener, the film for protective film formation of this embodiment tends to have better curability. (G) One type of epoxy resin hardener may be used alone, or two or more types may be used in combination.

Examples of the (G) epoxy resin hardener include compounds having two or more functional groups capable of reacting with an epoxy group in one molecule. Examples of functional groups that can react with epoxy groups include phenolic hydroxyl groups, alcoholic hydroxyl groups, amine groups, carboxyl groups, acidic anhydride groups, and the like. Among these, a phenolic hydroxyl group, an amino group, and an acidic anhydride group are preferred, and a phenolic hydroxyl group and an amino group are more preferred.

Examples of the (G) epoxy resin hardener having a phenolic hydroxyl group include phenol-based hardeners such as biphenol, novolak-type phenol resin, dicyclopentadiene-type phenol resin, and aralkyl-type phenol resin. Examples of the (G) epoxy resin hardener having an amine group include amine-based hardeners such as dicyandiamide.

(G) In the epoxy resin hardener, the molecular weight of non-resin components such as bisphenol and dicyandiamide is not particularly limited, but it is preferably 60 to 500, more preferably 70 to 200, and still more preferably 80 to 120 .

When the resin composition for protective film formation contains (G) epoxy resin hardener, the content of (G) epoxy resin hardener in the resin composition for protective film formation is not particularly limited, but it is based on the curing of the film for protective film formation. From the viewpoint of better properties, relative to 100 parts by mass of epoxy resin, 0.1 to 200 parts by mass is preferred, 0.5 to 100 parts by mass is more preferred, 0.7 to 50 parts by mass is more preferred, and 1 to 10 parts by mass is particularly preferred. share.

＜(H) Cross-linking agent＞ When (A) the thermoplastic resin has a functional group, the resin composition for forming a protective film may contain (H) a cross-linking agent. By crosslinking the (A) thermoplastic resin having a functional group with the (H) crosslinking agent, the initial adhesiveness and cohesion of the protective film forming film can be adjusted. (H) Cross-linking agent may be used individually by 1 type, or may be used in combination of 2 or more types.

Examples of (H) crosslinking agents include organic polyisocyanate compounds, organic polyimine compounds, metal chelate crosslinking agents (crosslinking agents having a metal chelate structure), aziridine crosslinking agents (having a nitrogen propidyl cross-linking agent), etc.

Examples of organic polyvalent isocyanate compounds include aromatic polyvalent isocyanate compounds, aliphatic polyvalent isocyanate compounds, and alicyclic polyvalent isocyanate compounds (hereinafter, these compounds may be collectively referred to as "aromatic polyvalent isocyanate compounds, etc."); the above-mentioned aromatic polyvalent isocyanate compounds Terpolymers, isocyanurate bodies and adducts of isocyanate compounds, etc.; terminal isocyanate urethane prepolymers obtained by reacting the above aromatic polyisocyanate compounds, etc. with polyol compounds. The above-mentioned "adduct" refers to the reaction product of the above-mentioned aromatic polyisocyanate compound and low molecular weight active hydrogen-containing compounds such as ethylene glycol, propylene glycol, neopentyl glycol, trimethylolpropane, castor oil, etc. Specific examples thereof include a toluene diisocyanate adduct of trimethylolpropane described below.

Examples of organic polyisocyanate compounds include 2,4-toluene diisocyanate; 2,6-toluene diisocyanate; 1,3-xylene diisocyanate; 1,4-xylene diisocyanate; diphenylmethane-4,4 '-Diisocyanate; diphenylmethane-2,4'-diisocyanate; 3-methyldiphenylmethane diisocyanate; hexamethylene diisocyanate; isophorone diisocyanate; dicyclohexylmethane-4, 4'-diisocyanate; dicyclohexylmethane-2,4'-diisocyanate; addition of all or part of the hydroxyl groups to polyols such as trimethylolpropane is selected from toluene diisocyanate, hexamethylene diisocyanate and diisocyanate. One or more compounds in the group consisting of toluene diisocyanate; lysine diisocyanate, etc.

Examples of organic polyimine compounds include N,N'-diphenylmethane-4,4'-bis(1-aziridinylmethamide), trimethylolpropane-tris-β-aziridine propionate, tetramethylolmethane-tris-β-aziridinylpropionate, N,N'-toluene-2,4-bis(1-aziridinylformamide)triethylene Melamine etc.

Among the above options, as the (H) cross-linking agent, it is preferably an organic polyisocyanate compound, and more preferably all or part of the hydroxyl groups added to polyols such as trimethylolpropane are selected from the group consisting of toluene diisocyanate, hexamethylene It is more preferably one or more compounds from the group consisting of diisocyanate and xylene diisocyanate, and more preferably is a toluene diisocyanate adduct of trimethylolpropane.

When an organic polyvalent isocyanate compound is used as the (H) cross-linking agent, the (A) thermoplastic resin preferably has a hydroxyl group. When the (H) cross-linking agent has an isocyanate group and the (A) thermoplastic resin has a hydroxyl group, the cross-linked structure can be easily introduced into the protective film forming film through the reaction between the (H) cross-linking agent and the (A) thermoplastic resin. middle.

When the resin composition for protective film formation contains a (H) cross-linking agent, the content of the (H) cross-linking agent in the resin composition for protective film formation is not particularly limited, but it is based on the initial adhesion and cohesion of the film for protective film formation. From a more preferable viewpoint, it is preferably 0.01 to 20 parts by mass, more preferably 0.1 to 10 parts by mass, and still more preferably 0.5 to 5 parts by mass based on 100 parts by mass of the (A) thermoplastic resin having a functional group.

＜(I) Coupling agent＞ The resin composition for forming a protective film may contain (I) a coupling agent. When the resin composition for forming a protective film contains (I) the coupling agent, the dispersibility of the (C) inorganic filler can be improved, and the adhesiveness, water resistance, etc. of the protective film tend to be improved. (I) One coupling agent may be used alone, or two or more coupling agents may be used in combination.

Examples of the (I) coupling agent include silane coupling agents, titanate coupling agents, and the like. Among these, a silane coupling agent is preferred. As (I) the coupling agent, for example, those having a functional group capable of reacting with (A) thermoplastic resin, (B) thermosetting resin, etc. having a functional group are preferred. Examples of the functional group include a glycidyl group, an amino group, a mercapto group, a vinyl group, a (meth)acrylyl group, a hydroxyl group, a carboxyl group, an imidazole group, and the like. Among these, those having a glycidyl group are preferred.

Examples of the coupling agent (I) include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, and 3-glycidoxypropyltriethoxysilane. Silane, 3-glycidoxypropylmethyldiethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane silane, 3-aminopropyltrimethoxysilane, 3-(2-aminoethylamino)propyltrimethoxysilane, 3-(2-aminoethylamino)propylmethyldiethoxy Silane, 3-anilinopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-mercaptopropylmethyldimethoxysilane, bis- (3-Triethoxysilylpropyl)tetrasulfide, methyltrimethoxysilane, methyltriethoxysilane, vinyltrimethoxysilane, vinyltriacetyloxysilane, imidazolesilane, One or more of these partial hydrolysis condensates, etc. Among these, 3-glycidoxypropyltrimethoxysilane is preferred.

When the resin composition for forming a protective film contains (I) a coupling agent, the content of the (I) coupling agent in the resin composition for forming a protective film is not particularly limited, but compared to (A) thermoplastic resin and (B) thermosetting resin The total amount is 100 parts by mass, preferably 0.001~10 parts by mass, more preferably 0.005~1 part by mass, and still more preferably 0.01~0.1 parts by mass. (I) When the content of the coupling agent is more than the above lower limit, (C) the dispersibility of the inorganic filler, the adhesiveness of the protective film, the water resistance, etc. tend to be better. In addition, when the content of the coupling agent (I) is less than the above upper limit, the generation of outgassing tends to be further suppressed.

＜Solvent＞ The resin composition for forming a protective film may contain a solvent from the viewpoint of facilitating film formation. As the solvent, one type may be used alone, or two or more types may be used in combination.

Examples of solvents include hydrocarbons such as toluene and xylene; alcohols such as methanol, ethanol, 2-propanol, 2-methylpropan-1-ol, and 1-butanol; esters such as ethyl acetate; acetone, methane, etc. Ketones such as ethyl ketone; ethers such as tetrahydrofuran; amide (compounds with amide bonds) such as dimethylformamide, N-methylpyrrolidone, etc. Among these, toluene, ethyl acetate, and methyl ethyl ketone are preferred.

＜Other ingredients＞ The resin composition for forming a protective film may or may not contain other components than the above-mentioned components. Examples of other components include resin components other than the above-mentioned components, plasticizers, antistatic agents, antioxidants, gettering agents, and the like. For each of the other components, one type may be used alone, or two or more types may be used in combination. The content of other components in the resin composition for forming a protective film is not particularly limited, as long as it is appropriately selected according to the purpose.

<Production method of resin composition for protective film formation> The resin composition for forming a protective film can be produced by blending each component constituting it. The order of addition when preparing each component is not particularly limited. Two or more components can be added at the same time or one after another. When a solvent is used, any ingredients other than the solvent may also be mixed with other ingredients, diluted with the solvent or undiluted by the solvent. The method of mixing each component is not particularly limited, and may be appropriately selected from the following conventional methods: mixing by rotating a stirrer, stirring blade, etc.; mixing using a mixer; and mixing by applying ultrasonic waves method; etc. The temperature and time when adding and mixing each ingredient are not particularly limited, as long as they are appropriately adjusted according to the ingredients to be used.

[Thickness and shape of film for protective film formation] The thickness of the protective film forming film in this embodiment is not particularly limited, but is preferably 1 to 100 μm, more preferably 3 to 75 μm, and still more preferably 5 to 50 μm. When the thickness of the film for forming a protective film is more than the above-mentioned lower limit, the protective function of the protective film tends to be better. In addition, when the thickness of the film for forming a protective film is less than or equal to the above-mentioned upper limit, economical efficiency is excellent and processing such as cutting of the protective film tends to be easy.

The shape of the film for forming a protective film in this embodiment is not particularly limited, but from the viewpoint of being attached to a circular semiconductor wafer, it may be circular in plan view. When the shape of the protective film forming film is circular in plan view, its diameter is, for example, 200 mm (for 8-inch wafers), 300 mm (for 12-inch wafers), etc.

[How to use protective film forming film] The film for forming a protective film according to this embodiment can be attached to the object to be protected by being pressed against the object to be protected. While pressing, the protective film forming film can be heated as necessary.

Examples of objects to be protected to which the protective film forming film of this embodiment is attached include semiconductor wafers, semiconductor wafers, and the like. When the protective film-forming film is attached to the semiconductor wafer, for example, the protective film-forming film is attached to the back surface of the semiconductor wafer and hardened to form a semiconductor wafer with a protective film, and then the attached film is attached to the semiconductor wafer. The semiconductor wafer with protective film is diced into pieces, and a semiconductor wafer with protective film having a protective film on the back side can be obtained. Examples of semiconductor wafers include silicon wafers; wafers of gallium arsenide, silicon carbide, sapphire, lithium tantalate, lithium niobate, gallium nitride, indium phosphorus, etc.; glass wafers; etc. An example of a semiconductor wafer is one obtained by dicing the above-mentioned semiconductor wafer.

The semiconductor wafer or semiconductor wafer to which the protective film forming film of this embodiment is attached is preferably back ground. The thickness of the semiconductor wafer or semiconductor wafer after back grinding is not particularly limited, but is preferably 5~150 μm, more preferably 7~100 μm, and more preferably 10~45 μm.

<Curing conditions of the protective film-forming film> The curing conditions after the protective film-forming film is attached to the object to be protected are not particularly limited and can be appropriately determined according to the type of the protective film-forming film. For example, when the film for protective film formation has thermosetting properties, the heating temperature when thermosetting the film for protective film formation may be, for example, 100 to 200°C, 110 to 180°C, or 120 to 170°C. Moreover, the heating time when thermally hardening the film for forming a protective film can be 0.5 to 5 hours, 0.7 to 4 hours, or 1 to 3 hours. Furthermore, when the protective film-forming film having energy ray curability is irradiated with ultraviolet rays to harden it, the illuminance of the ultraviolet rays may be, for example, 30 to 500 mW/cm ² , 40 to 420 mW/cm ² , or 50 to 340 mW/cm. ² . The amount of ultraviolet light may be, for example, 100 to 2,000 mJ/cm ² , 125 to 1,000 mJ/cm ² , or 150 to 500 mJ/cm ² .

The timing of attaching the protective film-forming film of this embodiment to the object to be protected and the timing of hardening it are not particularly limited, as long as they are appropriately determined based on the process to which the protective film-forming film of this embodiment is applied. For example, in a process of manufacturing a semiconductor wafer by grinding the back surface of the semiconductor wafer and then singulating it into individual pieces, any period from after the back surface grinding of the semiconductor wafer to before the single-sided semiconductor wafer is mounted on a substrate, The film for forming a protective film is attached to a semiconductor wafer or semiconductor wafer and cured to form a protective film. However, from the viewpoint of suppressing damage when the semiconductor wafer is singulated, it is preferable to attach the protective film forming film to the back surface of the semiconductor wafer after grinding the back surface of the semiconductor wafer and before singulating it. By hardening, a semiconductor wafer with a protective film is formed. As a method of singulating semiconductor wafers with a protective film, for example, conventional singulating methods such as blade dicing, laser dicing, and stealth dicing (registered trademark) methods can be applied. By dicing the protective film-attached semiconductor wafer, the protective film-attached semiconductor wafer can be obtained.

[Production method of film for protective film formation] The film for protective film formation can be produced, for example, by forming the resin composition for protective film formation into a film shape. Specifically, for example, the protective film-forming film can be formed on a support sheet such as a release film by applying the resin composition for protective film formation to the support sheet and drying the composition as necessary.

[First aspect of composite sheet for protective film formation] The composite sheet for protective film formation according to the first aspect of this embodiment has a structure in which the film for protective film formation according to this embodiment is sandwiched between two release films. In this specification, the "peeling film" refers to a film with a peeling function that is attached to the surface of the protective film-forming film in order to protect the protective film-forming film before it is attached to the object to be protected. A preferred aspect of the protective film-forming film included in the protective film-forming composite sheet of the first aspect is as described above.

＜Construction of the first aspect of the composite sheet for forming a protective film＞ FIG. 1 is a cross-sectional view schematically showing an example of the composite sheet for forming a protective film according to the first aspect. In addition, in the drawings used in the following description, for the sake of convenience, important parts may be enlarged in some cases, and the size ratio of each component does not need to be the same as the actual size.

The protective film forming composite sheet 1 shown in FIG. 1 has a first release film 111 on one surface 10a of the protective film forming film 10 and a second release film 112 on the other surface 10b. The composite sheet for forming a protective film having such a structure is preferably stored in a roll shape, for example. The first release film 111 and the second release film 112 may be the same as each other, or they may be different. For example, the necessary peeling forces when the first release film 111 and the second release film 112 are peeled off from the protective film forming film 10 may be different from each other.

＜Peel-off film＞ Examples of the release film that can be used for the composite sheet for forming a protective film include a release agent applied to a base material for the release film. Examples of the base material for the release film include polyethylene film, polypropylene film, polybutylene film, polybutadiene film, polymethylpentene film, polyvinyl chloride film, vinyl chloride copolymer film, and polyparaphenylene. Ethylene dicarboxylate film, polyethylene naphthalate film, polybutylene terephthalate film, polyurethane film, ethylene vinyl acetate copolymer film, ionomer resin film, ethylene/ Transparent films such as (meth)acrylic copolymer film, ethylene/(meth)acrylate copolymer film, polystyrene film, polycarbonate film, polyimide film, fluororesin film, etc.; cross-linking of these films Films; colored films; opaque films; fine paper, cellophane, kraft paper, etc.; etc. These can be used as a single layer or 2 or more layers can be laminated.

Examples of release agents include rubber elastomers such as silicone resins, olefin resins, isoprene resins, butadiene resins; long-chain alkyl resins, alkyd resins, and fluorine resins; wait. One type of release agent may be used alone, or two or more types may be used in combination.

The thickness of the release film is not particularly limited, but is preferably 10 to 500 μm, more preferably 15 to 300 μm, and still more preferably 20 to 100 μm. When the thickness of the release film is more than the above-mentioned lower limit, the deformation resistance of the composite sheet for forming a protective film tends to be better. In addition, when the thickness of the release film is equal to or less than the above-mentioned upper limit, moderate flexibility is obtained and the composite sheet for forming a protective film tends to have better handling properties.

＜Method for manufacturing the composite sheet for protective film formation according to the first aspect＞ The composite sheet for protective film formation of the first aspect can be produced according to the above [Production method of film for protective film formation]. Specifically, for example, the object to be coated with the resin composition for forming a protective film is the release-processed surface of the release film, and after the protective film-forming film is formed on the release film, the protective film-forming film is attached to the exposed surface. The peeling-treated surface of the other peeling film can be used to produce a composite sheet for forming a protective film according to the first aspect.

[Second Aspect: Composite Sheet for Protective Film Formation] The composite sheet for forming a protective film according to the second aspect of this embodiment is a composite sheet for forming a protective film which has a base material, an adhesive layer, and the film for forming a protective film of this embodiment in this order. A preferred aspect of the protective film-forming film included in the protective film-forming composite sheet of the second aspect is as described above.

The protective film-forming composite sheet of the second aspect has a base material and an adhesive layer in addition to the protective film-forming film. Therefore, for example, when the protective film-forming film of the protective film-forming composite sheet of the second aspect is attached to a semiconductor wafer and hardened to form a protective film, an attached protective film supported by the base material via the adhesive layer is obtained. of semiconductor wafers. For example, the semiconductor wafer with a protective film supported by a substrate via an adhesive layer can be fixed on the side surface of the substrate and singulated. That is, the protective film-forming composite sheet of the second aspect can be used by integrating the protective film-forming film with a dicing sheet having a base material and an adhesive layer.

＜Construction of the second aspect of the protective film forming composite sheet＞ The protective film-forming composite sheet of the second aspect may be composed only of a base material, an adhesive layer, and a protective film-forming film, but may also have other components other than the base material, an adhesive layer, and a protective film-forming film. component. Examples of other structural members include a release film laminated on the surface of the protective film-forming film opposite to the adhesive layer. Preferable aspects of the release film that the composite sheet for forming a protective film of the second aspect may have are as described above.

2 and 3 are cross-sectional views schematically showing an example of the composite sheet for forming a protective film according to the second aspect. In each of the drawings, the same components as those shown in the previously described drawings are denoted by the same symbols as in the previously described drawings, and detailed descriptions thereof are omitted.

The protective film-forming composite sheet 1A shown in FIG. 2 has an adhesive layer 13 on a base material 12 and a protective film-forming film 10 on the adhesive layer 13 . The composite sheet 1A for protective film formation further has a peeling film 11 laminated on the surface 10a (upper surface) of the film 10 for protective film formation and the surface 13a (upper surface) of the adhesive layer 13. The composite sheet 1A for protective film formation is made by attaching the back surface of a semiconductor wafer (not shown) to a part of the center side of the surface 10 a of the film 10 for protective film formation in a state where the release film 11 is removed, and then The area near the peripheral edge of the protective film forming film 10 is attached to a jig such as a ring frame and used.

The composite sheet 1B for protective film formation shown in FIG. 3 is laminated with the adhesive layer 14 for a jig on a part of the surface 13a of the adhesive layer 13, that is, the area near the peripheral edge, and the surface 10a ( The upper surface) is the same as the composite sheet 1A for protective film formation shown in FIG. 2 except that the release film 11 is laminated on the surface 14a (upper surface) of the adhesive layer 14 for the jig. The adhesive layer 14 for a jig may have a single-layer structure containing an adhesive component, for example, or may have a multiple-layer structure having layers containing an adhesive component laminated on both surfaces of the sheet serving as the core material. The composite sheet 1B for protective film formation is attached to the surface 10a of the film 10 for protective film formation by attaching the back surface of the semiconductor wafer (not shown) with the release film 11 removed, and then applying the adhesive for the jig. The upper surface of the surface 14a of the layer 14 is attached to a jig such as a ring frame and used.

The composite sheet for forming a protective film according to the second aspect of this embodiment is not limited to what is shown in Figures 2 and 3, and may be what is shown in Figures 2 and 3 within the scope that does not impair the effects of this embodiment. Some of the components have been changed or deleted, and other components described so far have been added.

＜Substrate＞ Examples of the constituent material of the base material include various resins. Examples of resins constituting the base material include polyethylene such as low-density polyethylene (LDPE), linear low-density polyethylene (LLDPE), and high-density polyethylene (HDPE); polypropylene, polybutylene, and polybutadiene. , polyolefins other than polyethylene such as polymethylpentene and norbornene resin; ethylene-vinyl acetate copolymer, ethylene-(meth)acrylic acid copolymer, ethylene-(meth)acrylate copolymer, ethylene -Ethylene copolymers such as norbornene copolymers (copolymers obtained by using ethylene as a monomer); vinyl chloride resins such as polyvinyl chloride and vinyl chloride copolymers (resins obtained by using vinyl chloride as a monomer); Polystyrene; polycyclic olefin; polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, polyethylene isophthalate, poly2,6-naphthalene dicarboxylate Polyethylene carboxylate, polyesters in which all constituent units are fully aromatic polyesters with aromatic cyclic groups; copolymers of two or more polyesters; poly(meth)acrylate; polyurethane ester; polyurethane acrylate; polyimide; polyamide; polycarbonate; fluororesin; polyacetal; modified polyphenylene ether; polyphenylene sulfide; polypropylene; polyetherketone; the Cross-linked resins that are cross-linked with one or more of these resins; modified resins using ionomers of one or more of these resins, etc. The resin constituting the base material may be used alone, or two or more types may be used in combination. Among these, from the viewpoint of heat resistance, polypropylene and polybutylene terephthalate are preferred.

In addition to the above-mentioned resins, the base material may also contain various conventional additives such as fillers, colorants, antistatic agents, antioxidants, organic lubricants, catalysts, softeners (plasticizers), and the like.

The substrate can also be surface treated to improve adhesion with other layers such as the adhesive layer. Examples of surface treatment methods include roughening treatment using sand blasting, solvent treatment, etc.; corona discharge treatment, electron beam irradiation treatment, plasma treatment, ozone/ultraviolet irradiation treatment, flame treatment, chromic acid treatment, hot air treatment, etc. Oxidation treatment; primer treatment; etc. Among them, the composite sheet for forming a protective film is preferably subjected to electron beam irradiation treatment from the viewpoint of suppressing the occurrence of base material fragmentation due to blade friction when the composite sheet is applied to cutting with a blade.

The base material may be composed of only one layer, or may be composed of two or more layers. When the base material is composed of a plurality of layers, the layers constituting the plurality of layers may be the same as each other or may be different. In addition, the base material may also have, for example, an antistatic coating layer, a layer for preventing the base material from adhering to other sheets when the protective film-forming composite sheets are stacked and stored, or a layer that prevents the base material from adhering to an adsorption tape.

The thickness of the substrate is not particularly limited, but is preferably 40 to 300 μm, more preferably 50 to 200 μm, and more preferably 60 to 150 μm. When the base material thickness is within the above range, the flexibility and adhesion of the protective film forming composite sheet tend to be better.

＜Adhesive layer＞ The adhesive layer is an adhesive layer provided between the base material and the protective film forming film. The adhesive layer may be composed of only one layer, or may be composed of two or more layers. When the adhesive layer is composed of a plurality of layers, the layers constituting the plurality of layers may be the same as each other or may be different from each other.

Examples of the adhesive resin constituting the adhesive layer include acrylic resin, urethane resin, rubber resin, silicone resin, epoxy resin, polyvinyl ether resin, polycarbonate resin, ester resin, etc. Sex resin. When the adhesive resin is a copolymer having two or more structural units, the form of the copolymer is not particularly limited and may be any of a block copolymer, a random copolymer, and a graft copolymer. Among these, acrylic resin is preferred from the viewpoint of exhibiting excellent adhesive force.

In addition, in this embodiment, the so-called "adhesive resin" is a concept that includes both adhesive resin and adhesive resin. For example, not only the resin itself has adhesiveness, but also includes the resin and the additive through the resin. Resins that exhibit adhesiveness when used in combination with other ingredients; resins that exhibit adhesion through the presence of trigger points such as heat and water; etc.

The thickness of the adhesive layer is not particularly limited, but is preferably 3~30 μm, more preferably 4~20 μm, and more preferably 5~17 μm. When the thickness of the adhesive layer is more than the above-mentioned lower limit, the tackiness and adhesion tend to be better. Furthermore, when the thickness of the adhesive layer is less than the above-mentioned upper limit, the blade cutting suitability and pick-up suitability tend to be better when the protective film forming composite sheet is used for blade cutting.

The adhesive layer may be formed using an energy ray curable adhesive or a non-energy ray curable adhesive. Non-energy ray curing adhesives include thermosetting adhesives and non-curing adhesives.

＜Method for manufacturing composite sheet for forming protective film according to second aspect＞ The protective film-forming composite sheet of the second aspect can be produced by sequentially stacking the respective layers constituting the protective film-forming composite sheet so as to have a corresponding positional relationship. Each layer can be formed according to the above [Production method of film for protective film formation]. Specifically, for example, the protective film-forming resin composition may be coated on the surface of the adhesive layer laminated on the base material, and the protective film-forming film may be formed on the adhesive layer, or the release-treated surface of the release film may be preliminarily formed. A protective film-forming film is formed, the exposed surface of the protective film-forming film is bonded to the surface of the adhesive layer laminated on the base material, and the protective film-forming film is laminated on the adhesive layer. In the same manner as when an adhesive layer is laminated on a base material, the composition for forming the adhesive layer can be coated on the surface of the base material, or the adhesive layer formed on the peeling surface of the release film can be applied. After the exposed surface is bonded to the surface of the base material, remove the release film. When the composite sheet for forming a protective film of the second aspect has any layer such as an intermediate layer, the arbitrary layer may be provided at a necessary position according to the above method.

[Semiconductor Wafer with Protective Film] The semiconductor wafer with protective film of this embodiment is a semiconductor wafer with protective film having a protective film of a cured product of the film for forming a protective film of this embodiment. Preferable aspects of the protective film-forming film used for forming the protective film of the protective film-attached semiconductor wafer according to the present embodiment, the protective film formed from the protective film-forming film, and the semiconductor wafer are as described above. The size of the semiconductor wafer when viewed from above is not particularly limited, but it is preferably less than 600mm ² , more preferably less than 400mm ² , and more preferably less than 300mm ² . In addition, the so-called plan view refers to the observation in the thickness direction. The semiconductor wafer may have a square shape when viewed from above, or may have an elongated shape such as a rectangle. The semiconductor wafer with a protective film of this embodiment can be produced by the method described in the method of using the film for forming a protective film of this embodiment.

[Semiconductor device] The semiconductor device of this embodiment is a semiconductor device having the semiconductor wafer with a protective film of this embodiment. An example of the semiconductor device of this embodiment is a semiconductor package in which the semiconductor chip with a protective film of this embodiment is flip-chip connected to a substrate having a circuit. [Example]

The present invention will be described in more detail by the following examples, but the present invention is not limited to the following examples.

[Mass average molecular weight (Mw)] It is a value measured using a gel permeation chromatography device (manufactured by Tosoh Co., Ltd., product name "HLC-8320GPC") under the following conditions and converted to standard polystyrene. (Measurement conditions) ・Column: "TSK protective column SuperH-H", "TSK gel SuperHM-H", "TSK gel SuperHM-H", "TSK gel SuperH2000" (all manufactured by Tosoh Co., Ltd.) ・Pipe string temperature: 40℃ ・Developing solvent: Tetrahydrofuran ・Flow rate: 1.0mL/min

[Thickness of each layer] Using a constant pressure thickness measuring device manufactured by TECLOCK Co., Ltd. (Model: "PG-02J", based on standard specifications: JISK6783, Z1702, Z1709), measure the thickness at any 5 places at 23°C, and calculate the average of the measured values.

[Measurement method of phosphorus atom ratio] X-ray photoelectron spectroscopy (XPS) was performed on the exposed surface of the double-sided peelable film-forming sheet for forming a protective film with a peelable film obtained in each example to determine the relative density of carbon atoms, nitrogen atoms, oxygen atoms, and phosphorus atoms. And the ratio of the number of phosphorus atoms to the total number of silicon atoms. The XPS analysis device was manufactured by ULVAC Phi Co., Ltd., model name "PHI Quantera SXM", and the X-ray source, X-ray beam diameter, analysis conditions, and analysis element peaks were as described above. It is also measured on both the surface of the protective film forming sheet where the light peeling film is attached (hereinafter also referred to as the "light peeling surface") and the surface where the heavy peeling film is attached (hereinafter also referred to as the "heavy peeling surface") Surface, each implemented in any 5 places. The phosphorus atom ratio of each measurement was calculated, and the average of three values excluding the maximum value and the minimum value on the surface was used as the phosphorus atom ratio of the surface.

[Measurement method of copper foil peel strength] The protective film-forming film with a release film on both sides obtained in each example was peeled off and the exposed surface of the protective film-forming film was attached to a silicon wafer using a roller laminator heated to 70°C. The polishing surface of a 350μm thick silicon wafer with No. 2,000 polishing surface. Next, peel off the heavy release film from the surface of the attached protective film forming film opposite to the silicon wafer, and use a roll laminator heated to 70°C on the exposed surface of the surface protective film forming film. Attach a copper foil with a long side of 50mm×short side of 10mm×thickness of 150μm. At this time, 10 mm of one long side end portion of the copper foil was not attached to the protective film forming film and was left as an unattached portion. Next, the protective film-forming film is thermally cured by heating at 140° C. for 2 hours to form a laminate in which a silicon wafer, a protective film of a cured product of the protective film-forming film, and a copper foil are laminated in the thickness direction thereof. As a sample for measuring the peel strength of copper foil. The measurement sample obtained above was mounted on a universal tensile testing machine (manufactured by Shimadzu Corporation, trade name "AG-XPlus"), the unattached portion of the copper foil was held with a clamp, and the peeling speed was 50 mm/min. Under the conditions, the copper foil is peeled off in the 90° direction to obtain the copper foil peeling strength.

[Evaluation method of flame retardancy] The protective film-forming film with a release film on both sides obtained in each example was heated at 140° C. for 2 hours to thermally cure the protective film-forming film to form a protective film of the cured product of the protective film-forming film, and then cut into long sides. The size of the protective film is 200mm x 50mm on the short side, and the peeling films on both sides of the protective film are peeled off. After the obtained protective film was stored for 48 hours in an environment with a temperature of 23°C and a relative humidity of 50%, the short side was wound on a cylindrical rod with a diameter of 12.7 mm, and a marking line was set at a position 125 mm from one end of the long side. , fix the part between the other end and the above-mentioned marking line (the 75mm part) with tape, make a cylindrical protective film, and then pull out the rod. Next, take the cylindrical protective film, with the end fixed by the tape as the upper side, and flatten the end so that air does not leak from the upper end, making it vertical in the closed state. Installed on the fixture, the contact flame test is performed in accordance with the UL94VTM test (vertical combustion test of sheet materials) specified by Underwriters Laboratories (UL) (Flamability Test of Plastic Materials for Machine Parts). Specifically, the burner barrel is placed 10 mm away from the lower end of the cylindrical protective film, and the first contact flame test of a 20 mm blue flame in 3 seconds is performed at the center of the lower end of the cylindrical protective film. The second contact flame test under the same conditions immediately after extinguishing is evaluated based on the following criteria. A: In the first and second contact flame tests, the flame did not reach the marking line (125mm). F: In the first or second contact flame test, the flame reaches the marking line (125mm).

[Manufacture of film for protective film formation] Examples 1 to 6, Comparative Examples 1 to 3 (Production of resin composition for protective film formation) Dissolve or disperse each component shown in Table 1 in a mixed solvent of methyl ethyl ketone, toluene and ethyl acetate according to the preparation composition described in Table 1, and obtain a solid content concentration of 62% by mass by stirring at 23°C. A resin composition for forming a protective film.

(Preparation of film for protective film formation) The resin composition for forming a protective film obtained above was coated on a heavy release film (manufactured by Lintec Co., Ltd., trade name "SP-PET502150") using a doctor blade coater, and polyterephthalate with a thickness of 50 μm was coated with silicone resin. ((One side of the ethylene glycol film is peeled off)) The peeling surface is dried at 100°C for 2 minutes to form a protective film forming film with a thickness of 25 μm on the heavy peeling film. Subsequently, a light peeling film (manufactured by Lintec Co., Ltd., trade name "SP-PET381130", one side of a polyethylene terephthalate film with a thickness of 38 μm is peeled with silicone resin) was peeled off. The protective film-forming film is bonded to the protective film-forming film on both sides to produce a protective film-forming film having a structure in which the protective film-forming film is sandwiched between two pieces of release film and having release films on both sides. The film for protective film formation obtained in each example was evaluated by the method shown above. The results are shown in Table 1.

In addition, the details of each component shown in Table 1 are as follows. ＜(A) Thermoplastic resin＞ Acrylic resin (mass average molecular weight (Mw): 370,000, glass transition temperature: 6°C) obtained by copolymerizing 85 parts by mass of methyl acrylate and 15 parts by mass of 2-hydroxyethyl acrylate.

＜(B)Thermosetting resin＞ (B)-1: Dicyclopentadiene-type epoxy resin (manufactured by DIC Co., Ltd., trade name "Epiclone HP-7200HH", epoxy equivalent 255~260 g/eq) (B)-2: Bisphenol A type epoxy resin (manufactured by Mitsubishi Chemical Co., Ltd., trade name "jER1055", epoxy equivalent 800~900g/eq) (B)-3: Bisphenol A type epoxy resin (manufactured by Mitsubishi Chemical Co., Ltd., trade name "jER828", epoxy equivalent 184~194g/eq)

<(C) Inorganic filler> Spherical silicon oxide (manufactured by Admatex Co., Ltd., trade name "SC2050MA", average particle diameter (D ₅₀ ) 0.5 μm)

＜(D)Flame retardant＞ Hexaphenoxycyclotriphosphazene (compound represented by the following formula (D-2), equivalent to component (D1))

＜(E) Hardening accelerator＞ 2-Phenyl-4,5-dihydroxymethylimidazole

＜(F) Colorant＞ carbon black

＜(G) Epoxy resin hardener＞ Dicyandiamide type latent hardener (manufactured by ADEKA Co., Ltd., trade name "ADEKA Hardner EH-3636AS", active hydrogen equivalent 21g/eq)

＜(H) Cross-linking agent＞ Toluene diisocyanate adduct of trimethylolpropane

＜(I) Coupling agent＞ 3-glycidoxypropyltrimethoxysilane

As can be seen from Table 1, the protective films formed from the protective film-forming films of Examples 1 to 6 have both flame retardancy and adhesiveness. On the other hand, the protective films formed from the protective film-forming films of Comparative Examples 1 to 3 were inferior in both flame retardancy and adhesiveness.

1,1A,1B: Composite sheet for protective film formation 10: Film for protective film formation 10a, 10b: Surface of the peeling film side of the protective film forming film 11: Peel off film 111: 1st peeling film 112: 2nd peeling film 12:Substrate 13:Adhesive layer 13a: Surface of the protective film forming side of the adhesive layer 14: Adhesive layer for fixtures 14a: Surface of the peeling film side of the jig adhesive layer

[Fig. 1] is a schematic cross-sectional view showing an example of the structure of the composite sheet for forming a protective film according to the first aspect of the present invention. [Fig. 2] is a schematic cross-sectional view showing an example of the structure of the composite sheet for forming a protective film according to the second aspect of the present invention. [Fig. 3] is a schematic cross-sectional view showing another example of the structure of the composite sheet for forming a protective film according to the second aspect of the present invention.

1: Composite sheet for protective film formation

10: Film for protective film formation

10a, 10b: Surface of the peeling film side of the protective film forming film

111: 1st peeling film

112: 2nd peeling film

Claims (13)

A film for forming a protective film, which has curability, At least one surface of the protective film-forming film is analyzed by X-ray photoelectron spectroscopy, thereby examining the ratio of the number of phosphorus atoms to the total number of carbon atoms, nitrogen atoms, oxygen atoms, phosphorus atoms and silicon atoms. is 0.4 atomic % or more, The copper foil peeling strength of the cured product of the protective film forming film is 3.0 N/10mm or more. The film for forming a protective film according to claim 1, wherein the ratio of the number of phosphorus atoms on the surface is 0.4 atomic % or more and the phosphorus atomic number ratio on the surface is 5.0 atomic % or less. The film for protective film formation as claimed in claim 1 or 2, wherein the ratio [X] of the number of the aforementioned phosphorus atoms in one surface of the aforementioned protective film formation film is proportional to the ratio [X] of the aforementioned number of phosphorus atoms in the other surface of the aforementioned protective film formation film. The ratio of the number of atoms [Y] to the ratio [X/Y] is 0.7~1.4. The protective film forming film according to claim 1 or 2, wherein the protective film forming film has thermosetting properties. The film for forming a protective film according to claim 1 or 2 is formed using a resin composition containing (A) a thermoplastic resin and (B) a thermosetting resin. The film for forming a protective film according to claim 5, wherein the thermoplastic resin (A) is an acrylic resin. The film for forming a protective film according to claim 5, wherein the thermosetting resin (B) is an epoxy resin. For example, the film for forming a protective film according to claim 1 or 2 has a thickness of 1 to 100 μm. For example, the film for forming a protective film according to claim 1 or 2 is attached to the back surface of a semiconductor wafer and used in the manufacture of a semiconductor wafer with a protective film. A protective film-forming composite sheet having a structure in which the protective film-forming film according to claim 1 or 2 is sandwiched between two release films. A composite sheet for forming a protective film, which has a base material, an adhesive layer, and the film for forming a protective film according to claim 1 or 2 in this order. A semiconductor wafer with a protective film having a protective film that is a cured product of the film for forming a protective film according to claim 1 or 2. A semiconductor device having a semiconductor wafer with a protective film according to claim 12.

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