TW202344552A - 樹脂組成物、接著劑或密封材、硬化物、半導體裝置及電子元件 - Google Patents

樹脂組成物、接著劑或密封材、硬化物、半導體裝置及電子元件 Download PDF

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Publication number
TW202344552A
TW202344552A TW112107642A TW112107642A TW202344552A TW 202344552 A TW202344552 A TW 202344552A TW 112107642 A TW112107642 A TW 112107642A TW 112107642 A TW112107642 A TW 112107642A TW 202344552 A TW202344552 A TW 202344552A
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TW
Taiwan
Prior art keywords
resin composition
compound
epoxy
group
compounds
Prior art date
Application number
TW112107642A
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English (en)
Chinese (zh)
Inventor
深澤恵莉
岩谷一希
阿部信幸
Original Assignee
日商納美仕有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商納美仕有限公司 filed Critical 日商納美仕有限公司
Publication of TW202344552A publication Critical patent/TW202344552A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/66—Mercaptans
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW112107642A 2022-03-23 2023-03-02 樹脂組成物、接著劑或密封材、硬化物、半導體裝置及電子元件 TW202344552A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022046977 2022-03-23
JP2022-046977 2022-03-23

Publications (1)

Publication Number Publication Date
TW202344552A true TW202344552A (zh) 2023-11-16

Family

ID=88100692

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112107642A TW202344552A (zh) 2022-03-23 2023-03-02 樹脂組成物、接著劑或密封材、硬化物、半導體裝置及電子元件

Country Status (3)

Country Link
JP (1) JPWO2023181831A1 (https=)
TW (1) TW202344552A (https=)
WO (1) WO2023181831A1 (https=)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170253693A1 (en) * 2014-09-11 2017-09-07 Teijin Limited Thermosetting resin composition
CN104774584A (zh) * 2014-12-29 2015-07-15 北京海斯迪克新材料有限公司 一种用于led背光模组lens粘接的单组份环氧胶粘剂
JP6766360B2 (ja) * 2016-01-15 2020-10-14 住友ベークライト株式会社 樹脂組成物
WO2019138919A1 (ja) * 2018-01-15 2019-07-18 日立化成株式会社 液状封止樹脂組成物、電子部品装置及び電子部品装置の製造方法
JP7014998B2 (ja) * 2018-01-18 2022-02-02 味の素株式会社 樹脂組成物
CN109536098A (zh) * 2018-11-09 2019-03-29 苏州昇攀新材料技术有限公司 一种用于led背光模组的环氧胶黏剂及其制备方法
JP2020132646A (ja) * 2019-02-12 2020-08-31 住友ベークライト株式会社 樹脂組成物、それを用いたキャリア付樹脂膜、プリプレグ、積層板、プリント配線基板および半導体装置
JP7437695B2 (ja) * 2020-07-30 2024-02-26 パナソニックＩｐマネジメント株式会社 熱硬化性組成物、硬化物、機器、及び機器の製造方法
JPWO2023276773A1 (https=) * 2021-06-28 2023-01-05
JP7649038B2 (ja) * 2021-08-24 2025-03-19 ナミックス株式会社 樹脂組成物及び接着剤

Also Published As

Publication number Publication date
WO2023181831A1 (ja) 2023-09-28
JPWO2023181831A1 (https=) 2023-09-28

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