TW202340381A - Resin composition, light-blocking film, method for producing light-blocking film, substrate having partitioning wall attached thereto, and display device - Google Patents

Abstract

The purpose of the present invention is to provide a resin composition that enables the formation of a gray partitioning wall having both of high reflectivity of entire visible light and high light-blocking properties even under a low-temperature heating condition of about 100 to 120 DEG C, at relatively low cost. Provided is a resin composition comprising a resin, a photosensitizing agent, a white pigment, a yellow precursor compound and a light-blocking pigment, the resin composition being characterized in that the light-blocking pigment comprises a blue pigment and a violet pigment.

Description

Resin composition, light-shielding film, method for manufacturing light-shielding film, substrate with partition walls, and display device

The present invention relates to a resin composition, a light-shielding film formed of the resin composition, a method for manufacturing the light-shielding film, a substrate with partition walls having patterned partition walls, and a display device.

In recent years, a color display device including a wavelength converting section including a wavelength converting phosphor, a polarization separation mechanism, and a polarization conversion mechanism has been proposed as a color display device with improved light utilization efficiency (for example, see Patent Document 1). For example, a color display device has been proposed that includes a blue light source, a liquid crystal element, and a wavelength converter including a phosphor that is excited by blue light and emits red phosphor, and a phosphor that is excited by blue light and emits green phosphor. A fluorescent phosphor and a light scattering layer that scatters blue light (for example, see Patent Document 2). However, a color filter containing a color-converting phosphor as described in Patent Document 1 and Patent Document 2 generates fluorescence in all directions, so the light extraction efficiency is low and the brightness is insufficient. In particular, in high-definition display devices called 4K and 8K, the pixel size becomes smaller, so the issue of brightness is significant, and therefore higher brightness is required. [Prior art documents] [Patent Document]

Patent Document 1: Japanese Patent Application Laid-Open No. 2000-131683 Patent Document 2: Japanese Patent Application Publication No. 2009-244383 Patent Document 3: Japanese Patent Application Laid-Open No. 2000-347394 Patent Document 4: Japanese Patent Application Publication No. 2006-259421 Patent Document 5: International Publication No. 2020/008969 Patent Document 6: International Publication No. 2021/200357

[Problem to be solved by the invention] Generally speaking, in order to increase the brightness of such a display device, it is effective to increase the reflectivity of the partition wall that separates the color-converting phosphors. In addition, in order to prevent color mixing of light between adjacent pixels, it is necessary to improve the light-shielding properties of the partition walls. Based on the above, partition materials that have both high reflectivity and light-shielding properties are required.

In order to form a partition wall that has both high reflectivity and high light-shielding properties, the inventors first studied a method of using a material that is added to a white partition material using a titanium oxide white pigment that exhibits high reflectivity. Made of black pigment. However, in this method, the entire exposure light is absorbed by the white pigment and the black pigment, so the exposure light cannot reach the bottom of the film, and the problem of poor pattern processability becomes clear.

Therefore, the inventors devised a design in which exposure light is transmitted during the step of pattern exposure after film formation, and the exposed film is heated at a temperature of 120° C. or more and 250° C. or less to increase the light-shielding property. In addition, by using the following resin composition, which contains: a resin; an organic metal compound containing at least one metal selected from the group consisting of silver, gold, platinum and palladium; a photopolymerization initiator or a quinone dihydride Nitrogen compound; and solvent, thereby achieving this design (see Patent Document 5). In particular, it was found that when an organic palladium compound is used, the film becomes black efficiently due to the formation of palladium oxide particles after heating, and the visible light shielding property is improved. In addition, it was found that if an organic silver compound is used, the film will turn yellow due to the formation of silver nanoparticles after heating, and the light-shielding property of blue light will increase.

Furthermore, the inventors found that by using a resin composition containing a resin, a photopolymerization initiator or a quinonediazide compound, a white pigment and/or a shading pigment, an organic silver compound and a reducing agent, the reducing agent promotes the formation of silver nanoparticles. The particles are generated even under low-temperature heating conditions of about 100°C to 120°C, making it possible to form partition walls that have excellent weather resistance and have both high light-shielding properties for blue light and high reflectivity for the entire visible light (see Patent Document 6).

However, this technology has the following problem: the light-shielding property of blue light is improved by the formation of yellow silver nanoparticles, but the light-shielding property of green light to red light (wavelength range 500 nm to 630 nm) is not improved. In addition, the previously described technology using an organic palladium compound has problems in that the organic palladium compound is expensive and that palladium oxide particles cannot be generated under low-temperature heating conditions of about 100° C. to 120° C., so the light-shielding properties are not improved.

Therefore, an object of the present invention is to relatively inexpensively provide a resin composition capable of forming a gray partition wall having both high reflectivity for the entire visible light and high light-shielding properties even under low-temperature heating conditions of about 100°C to 120°C. [Means to solve the problem]

The inventors of the present application conducted diligent research and found that a gray partition wall that has both high reflectivity and high light-shielding properties for the entire visible light can be formed, leading to the achievement of the present invention.

That is, the invention of this application is as follows. (1) A resin composition containing a resin, a photosensitizer, a white pigment, a yellow precursor compound, and a light-shielding pigment. In the resin composition, the light-shielding pigment contains a blue pigment and a purple pigment. (2) The resin composition according to (1), wherein the white pigment is treated with at least one selected from the group consisting of SiO ₂ and Al ₂ O ₃ and ZrO ₂ . (3) The resin composition according to (1), wherein the white pigment is treated with ZrO ₂ , Al ₂ O ₃ and SiO ₂ . (4) The resin composition according to (1), wherein the weight ratio of the blue pigment to the purple pigment is 20/80 to 80/20. (5) A resin composition containing a photosensitizer, a white pigment, and a yellow precursor compound. The resin composition is characterized in that the white pigment is selected from the group consisting of SiO ₂ and Al ₂ O ₃ At least one of ZrO 2 and ZrO ₂ are processed. (6) The resin composition according to (5), wherein the white pigment is treated with ZrO ₂ , Al ₂ O ₃ and SiO ₂ . (7) The resin composition as described in (5), further containing a light-shielding pigment. (8) The resin composition according to (1) or (5), wherein the yellow precursor compound is an organic silver compound. (9) The resin composition according to (1) or (5), containing a reducing agent. (10) The resin composition according to (1) or (5), containing phosphoric acid polyester. (11) A light-shielding film obtained by hardening the resin composition described in (1) or (5). (12) A method for manufacturing a light-shielding film, including: a film-making step, coating the resin composition as described in (1) or (5) on a base substrate and drying to obtain a dry film; and an exposure step, drying the obtained The film is subjected to pattern exposure; the development step is to dissolve and remove the portion of the exposed dry film that is soluble in the developer; and the heating step is to harden the developed dry film by heating it, and the manufacturing method of the light-shielding film In the heating step, by heating the developed dry film at a temperature between 100°C and 250°C, the film thickness per 10 μm measured by the specular reflection (Specular Component Included, SCI) method is The b* value rises by more than 10. (13) A substrate with partition walls having (A-1) patterned partition walls on a base substrate using the resin composition as described in (1) or (5), wherein the substrate with partition walls has: The reflectance per 10 μm thickness in the wavelength range of 430 nm to 630 nm is within the range of 20% to 50%, and the optical density (optical density, OD) per 10 μm thickness in the wavelength range of 430 nm to 630 nm ) value is in the range of 1.5 to 3.0. (14) A substrate with partition walls having (A-1) patterned partition walls on a base substrate using the resin composition as described in (1) or (5), wherein the substrate with partition walls has: The L* value per 10 μm film thickness measured by the SCI method is 50 to 70, the a* value is -5.0 to 5.0, and the b* value is -5.0 to 5.0. (15) A substrate with partition walls having (A-1) patterned partition walls on a base substrate. In the substrate with partition walls, the patterned partition walls contain a resin, a white pigment, a blue pigment, and Purple pigment, silver oxide and/or silver particles. (16) The substrate with partition walls as described in (13), which has (A-1) patterned partition walls on the base substrate, and in the substrate with partition walls, the patterned partition walls contain resin, white Pigments, blue and violet pigments, silver oxide and/or silver particles. (17) The substrate with partition walls as described in (14), which has (A-1) patterned partition walls on the base substrate, and in the substrate with partition walls, the patterned partition walls contain resin, white Pigments, blue and violet pigments, silver oxide and/or silver particles. (18) The substrate with partition walls as described in (13), further comprising (B) a pixel layer containing a color-converting luminescent material arranged and separated by the patterned partition walls of (A-1). (19) The substrate with partition walls as described in (18), further comprising a color filter with a thickness of 1 μm to 5 μm between the base substrate and (B) the pixel layer containing the color-converting luminescent material. (20) A display device, including: the substrate with partition walls as described in (13); and a light-emitting light source selected from the group consisting of a liquid crystal unit, an organic electroluminescence unit, a mini-light-emitting diode unit and a micro-light-emitting diode unit. . [Effects of the invention]

The resin composition of the present invention contains a resin, a photosensitizer, a white pigment, a yellow precursor compound, a blue pigment and a purple pigment, and allows the exposure light to pass through during the step of pattern exposure after film formation. If the exposed film is Heating at a temperature of 100°C or more and 250°C or less produces yellow particles in the film, and a fine thick-film gray barrier pattern that has both high reflectivity and high light-shielding properties for the entire visible light can be formed.

Hereinafter, preferred embodiments of the resin composition, the light-shielding film formed from the resin composition, the light-shielding film manufacturing method, and the substrate with partition walls of the present invention will be specifically described. However, the present invention is not limited to the following embodiments and can be modified according to the purpose. Or use various changes to implement.

The resin composition of the present invention can be suitably used as a material for forming partition walls that separate color-changing phosphors or light-emitting sources selected from organic EL units, mini-LED units, micro-LED units, and the like. The resin composition of the present invention contains a resin, a photosensitizer, a white pigment, a yellow precursor compound, and a light-shielding pigment, and the light-shielding pigment contains a blue pigment and a purple pigment.

In addition, the resin composition of the present invention is a resin composition containing a photosensitizer, a white pigment, and a yellow precursor compound, and the white pigment is made by at least one selected from the group consisting of SiO ₂ and Al ₂ O ₃ A resin composition treated with _ZrO2 . The resin composition preferably further contains a light-shielding pigment.

Resin Resin has the function of improving the crack resistance and light resistance of partition walls. From the viewpoint of improving the crack resistance of the partition walls during heat treatment, the content of the resin in the solid content of the resin composition is preferably 10% by weight or more, more preferably 20% by weight or more. On the other hand, from the viewpoint of improving light resistance, the content of the resin in the solid content of the resin composition is preferably 60% by weight or less, more preferably 50% by weight or less. Here, the solid content refers to all the components contained in the resin composition excluding volatile components such as solvents. The amount of solid content can be determined by measuring the remaining components after heating the resin composition to evaporate the volatile components. Examples of the resin include polysiloxane, polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, (meth)acrylic acid polymer, and the like. Here, the (meth)acrylic polymer refers to a polymer of methacrylate and/or acrylate. Two or more of these compounds may be contained. Among these, polysiloxane is preferred in terms of excellent heat resistance and light resistance.

Polysiloxane is the hydrolysis and dehydration condensation product of organosilane. When the resin composition of the present invention has negative photosensitivity, the polysiloxane preferably contains at least a repeating unit represented by the following general formula (1). It may also contain other repeating units. By containing a repeating unit derived from a bifunctional alkoxysilane compound represented by the general formula (1), excessive thermal polymerization (condensation) of polysiloxane caused by heating can be suppressed, and the crack resistance of the partition wall can be improved. . Among all the repeating units in the polysiloxane, it is preferable to contain 10 to 80 mol% of the repeating units represented by the general formula (1). By containing 10 mol% or more of the repeating unit represented by the general formula (1), the crack resistance can be further improved. The content of the repeating unit represented by the general formula (1) is more preferably 12.5 mol% or more, and further preferably 15 mol% or more. On the other hand, by containing 80 mol% or less of the repeating unit represented by the general formula (1), the molecular weight of the polysiloxane can be sufficiently increased during polymerization, thereby improving the coatability. The content of the repeating unit represented by general formula (1) is more preferably 70 mol% or less.

[Chemical 1]

In the general formula (1), R ¹ and R ² may be the same or different, respectively, and represent a monovalent organic group having 1 to 20 carbon atoms. From the viewpoint of making it easy to adjust the molecular weight of polysiloxane during polymerization, R ¹ and R ² are preferably groups selected from alkyl groups having 1 to 6 carbon atoms and aryl groups having 6 to 12 carbon atoms. Among them, at least part of the hydrogens of the alkyl group and the aryl group may be substituted with a radically polymerizable group. In this case, in the cured material of the negative photosensitive resin composition, radical polymerizable groups can undergo radical polymerization.

The polysiloxane preferably further contains a repeating unit represented by the following general formula (2). By containing repeating units derived from the trifunctional alkoxysilane compound represented by the general formula (2), the cross-linking density of the polysiloxane after film formation is increased, thereby improving the hardness and chemical resistance of the film. Among all the repeating units in the polysiloxane, it is preferable to contain 10 to 80 mol% of the repeating units represented by the general formula (2). The content of the repeating unit represented by the general formula (2) is more preferably 15 mol% or more, and further preferably 20 mol% or more. On the other hand, by containing 80 mol% or less of the repeating unit represented by the general formula (2), excessive thermal polymerization (condensation) of polysiloxane caused by heating can be suppressed, thereby improving the crack resistance of the partition wall. The content of the repeating unit represented by the general formula (2) is more preferably 70 mol% or less.

[Chemicalization 2]

In the general formula (2), R ³ represents a monovalent organic group having 1 to 20 carbon atoms. Polysiloxane may contain two or more repeating units represented by general formula (2) with different ^R3 . From the viewpoint of making it easy to adjust the molecular weight of polysiloxane during polymerization, R ³ preferably contains a group selected from an alkyl group having 1 to 6 carbon atoms and an aryl group having 6 to 12 carbon atoms. Among them, at least part of the hydrogens of the alkyl group and the aryl group may be substituted with a radically polymerizable group. In this case, in the cured material of the negative photosensitive resin composition, radical polymerizable groups can undergo radical polymerization.

The repeating units represented by the general formula (1) and the general formula (2) are respectively derived from the alkoxysilane compounds represented by the following general formula (3) and the general formula (4). That is, the polysiloxane containing the repeating unit represented by the general formula (1) and the general formula (2) can be obtained by adding an alkoxy group represented by the following general formula (3) and the general formula (4). An alkoxysilane compound of a silane compound is obtained by hydrolysis and polycondensation. Other alkoxysilane compounds may also be used. Furthermore, in general formula (3) and general formula (4), the expressions "-(OR ⁴ ) ₂ " and "-(OR ⁴ ) ₃ " mean that there are two and three "-(OR 4 ) 3 " bonded to the Si atom respectively. -(OR ⁴ )".

[Chemical 3]

In the general formula (3), R ¹ to R ² represent the same groups as R ¹ to R ² in the general formula (1). In the general formula (4), R ³ represents the same group as R ³ in the general formula (2). In the general formula (3) and the general formula (4), R ⁴ may be the same or different, and represents a monovalent organic group or hydrogen having 1 to 20 carbon atoms, preferably an alkyl group having 1 to 6 carbon atoms.

Examples of the alkoxysilane compound represented by the general formula (3) include dimethyldimethoxysilane, dimethyldiethoxysilane, diphenyldimethoxysilane, diphenyldimethoxysilane, and diphenyldimethoxysilane. Ethoxysilane, diphenylsilanediol, styrylmethyldimethoxysilane, styrylmethyldiethoxysilane, γ-methacrylylpropylmethyldimethoxysilane , γ-methacrylylpropylmethyldiethoxysilane, γ-acrylylpropylmethyldimethoxysilane, γ-acrylylpropylmethyldiethoxysilane, 3- Glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 2-(3,4-epoxycyclohexyl)ethylmethyldimethoxy silane, 2-(3,4-epoxycyclohexyl)ethylethyldimethoxysilane, methylphenyldimethoxysilane, methylphenyldiethoxysilane, 3-dimethylsilane methylmethoxysilylpropylsuccinic anhydride, 3-dimethylethoxysilylpropylsuccinic anhydride, 3-dimethylmethoxysilylpropionic acid, 3-dimethylethoxysilane propionic acid, 3-dimethylmethoxysilylpropylcyclohexyldicarboxylic anhydride, etc. Two or more of these compounds may also be used.

Examples of the alkoxysilane compound represented by the general formula (4) include methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, propylene Trimethoxysilane, propyltriethoxysilane, isobutyltrimethoxysilane, isobutyltriethoxysilane, cyclohexyltrimethoxysilane, cyclohexyltriethoxysilane, 3-ureido group Propyltrimethoxysilane, 3-ureidopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 2-(3 ,4-epoxycyclohexyl)ethyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltriethoxysilane, 3-ethyl-3-{[3-(trimethyl Oxysilyl)propoxy]methyl}oxetane, 3-ethyl-3-{[3-(triethoxysilyl)propoxy]methyl}oxetane, Phenyltrimethoxysilane, phenyltriethoxysilane, 1-naphthyltrimethoxysilane, 2-naphthyltrimethoxysilane, 2-naphthyltrimethoxysilane, 2-naphthyltrimethoxysilane , tolyltrimethoxysilane, tolyltriethoxysilane, styryltrimethoxysilane, styryltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, allyl Trimethoxysilane, allyltriethoxysilane, γ-acrylylpropyltrimethoxysilane, γ-acrylylpropyltriethoxysilane, γ-methacrylpropyltrimethyl Oxysilane, γ-methacrylylpropyltriethoxysilane, 3-trimethoxysilylpropionic acid, 3-triethoxysilylpropionic acid, 4-trimethoxysilylbutyric acid, 4-triethoxysilylbutyric acid, 5-trimethoxysilylvaleric acid, 5-triethoxysilylvaleric acid, 3-trimethoxysilylpropylsuccinic anhydride, 3-triethoxy Silylpropylsuccinic anhydride, 3-trimethoxysilylpropylcyclohexyldicarboxylic anhydride, 3-triethoxysilylpropylcyclohexyldicarboxylic anhydride, 3-trimethoxysilylpropylcyclohexyldicarboxylic anhydride Phthalic anhydride, 3-triethoxysilylpropylphthalic anhydride, trifluoropropyltrimethoxysilane, trifluoropropyltriethoxysilane, etc. Two or more of these compounds may also be used.

When the resin composition of the present invention has negative photosensitivity, the alkoxysilane compound represented by general formula (3) and/or general formula (4) preferably contains at least one radical-containing polymerizable compound. alkoxysilane compound. By containing an alkoxysilane compound containing a radically polymerizable group, the curing degree of the exposed portion can be increased by utilizing free radicals generated in the exposed portion to perform a crosslinking reaction. In addition, when the resin composition of the present invention has negative photosensitivity, the alkoxysilane compound represented by general formula (3) and/or general formula (4) preferably contains at least one carboxyl group-containing compound. Alkoxysilane compounds. By containing a carboxyl group-containing alkoxysilane compound, the solubility of the unexposed portion is improved, and the resolution can be improved during pattern processing.

Furthermore, as a raw material of polysiloxane, other alkoxysilane compounds may be included. Examples of other alkoxysilane compounds include tetrafunctional alkoxysilane compounds such as tetramethoxysilane, tetraethoxysilane, and silicate 51 (tetramethoxysilane oligomer). Two or more of these compounds may also be used.

From the viewpoint of making the content of the repeating unit represented by the general formula (1) in all the repeating units of the polysiloxane fall within the above range, the alkoxysilane compound that is the raw material of the polysiloxane has the general formula The content of the alkoxysilane compound represented by (3) is preferably 10 mol% or more, more preferably 12.5 mol% or more, and still more preferably 15 mol% or more. On the other hand, from the same viewpoint, the content of the alkoxysilane compound represented by the general formula (4) is preferably 80 mol% or less, more preferably 70 mol% or less.

The polysiloxane in the resin composition of the present invention preferably has a styrene group. By having a styrene group, hardening can be fully accelerated even under low-temperature hardening conditions of 85°C to 120°C.

From the viewpoint of coatability, the weight average molecular weight (Mw) of polysiloxane is preferably 1,000 or more, more preferably 2,000 or more. On the other hand, from the viewpoint of developability, the Mw of polysiloxane is preferably 500,000 or less, more preferably 300,000 or less. Here, the Mw of polysiloxane in the present invention refers to the polystyrene-converted value measured by gel permeation chromatography (Gel Permeation Chromatography, GPC). The measurement method is as described in the Examples described later.

Polysiloxane can be obtained by hydrolyzing the organosilane compound and subjecting the hydrolyzate to a dehydration condensation reaction in the presence of a solvent or in the absence of a solvent.

Sensitizer When the resin composition of the present invention is used for pattern formation of partition walls (A-1) described below, it is preferred that the resin composition has negative or positive photosensitivity. In order to impart photosensitivity, the resin composition of the present invention preferably contains a photosensitizer. When imparting negative photosensitivity, it is preferable to contain a photopolymerization initiator as a photosensitizer so that a high-definition pattern-shaped partition wall can be formed. The negative photosensitive resin composition preferably further contains a photopolymerizable compound. On the other hand, when imparting positive photosensitivity, it is preferable to contain a quinonediazide compound as a photosensitizer.

The photopolymerization initiator may be any photopolymerization initiator as long as it decomposes and/or reacts by irradiation with light (including ultraviolet rays and electron beams) to generate free radicals. Examples include: 2-methyl-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-dimethylamino-2-(4-methylbenzyl) -1-(4-morpholin-4-yl-phenyl)-butan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan α-aminophenylalkyl ketone compounds such as ketone-1; 2,4,6-trimethylbenzylphenylphosphine oxide, bis(2,4,6-trimethylbenzylphenyl)-benzene 1-Phenyl-1, 2-propanedione-2-(O-ethoxycarbonyl)oxime, 1,2-octanedione-1-[4-(phenylthio)-2-(O-benzoyloxime)], 1-phenyl-1,2-butanone-2-(O-methoxycarbonyl)oxime, 1,3-diphenylpropanetrione-2-(O-ethoxycarbonyl)oxime, ethanone- 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-1-(O-acetyl oxime) and other oxime ester compounds; 2-hydroxy- 2-Methyl-1-phenylpropan-1-one, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropan-1-one, 4-(2-hydroxyethoxy ) phenyl-(2-hydroxy-2-propyl) ketone, 1-hydroxycyclohexyl-phenyl ketone and other α-hydroxy ketone compounds; 2,2-diethoxyacetophenone, 2,3-diethyl ketone Oxyacetophenone, 4-tert-butyldichloroacetophenone, benzylideneacetophenone, 4-azidobenzylideneacetophenone and other acetophenone compounds. Two or more of these compounds may be contained.

From the viewpoint of effectively performing radical curing, the content of the photopolymerization initiator in the resin composition of the present invention is preferably 0.01% by weight or more, more preferably 1% by weight or more in the solid content. On the other hand, from the viewpoint of suppressing elution of the remaining photopolymerization initiator, etc., the content of the photopolymerization initiator in the solid content is preferably 20% by weight or less, more preferably 10% by weight or less.

The photopolymerizable compound in the present invention refers to a compound having two or more ethylenically unsaturated double bonds in the molecule. In consideration of ease of radical polymerization, the photopolymerizable compound preferably has a (meth)acrylic acid group.

Examples of the photopolymerizable compound include pentaerythritol triacrylate, pentaerythritol tetraacrylate, pentaerythritol trimethacrylate, pentaerythritol tetramethacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, and the like. Two or more of these compounds may be contained.

From the viewpoint of effectively performing radical curing, the content of the photopolymerizable compound in the resin composition of the present invention is preferably 1% by weight or more in the solid content. On the other hand, from the viewpoint of suppressing excess reaction of radicals and improving resolution, the content of the photopolymerizable compound is preferably 50% by weight or less in the solid content.

As the quinonediazide compound, a compound in which a sulfonic acid naphthoquinonediazide is bonded to a compound having a phenolic hydroxyl group using an ester is preferred. Examples of the compound having a phenolic hydroxyl group used here include Bis-Z, TekP-4HBPA (tetraP-DO-BPA), TrisP-HAP, TrisP-PA, BisRS-2P, and BisRS-3P (the above are Trade names, manufactured by Honshu Chemical Industry Co., Ltd.); BIR-PC, BIR-PTBP, BIR-BIPC-F (the above are trade names, manufactured by Asahi Organic Materials Industry Co., Ltd.); 4,4'-sulfonyldidioic acid Phenol, BPFL (trade name, manufactured by JFE Chemical Co., Ltd.), etc. The quinonediazide compound is preferably a compound in which 4-naphthoquinonediazide sulfonic acid or 5-naphthoquinonediazide sulfonic acid is introduced via an ester bond into a compound having a phenolic hydroxyl group. Examples thereof include THP. -17. TDF-517 (trade name, manufactured by Toyo Gosei Industry Co., Ltd.), SBF-525 (trade name, manufactured by AZ Electronic Materials Co., Ltd.), etc.

From the viewpoint of improving sensitivity, the content of the quinonediazide compound in the resin composition of the present invention is preferably 0.5% by weight or more in solid content, more preferably 1% by weight or more. On the other hand, from the viewpoint of improving resolution, the content of the quinonediazide compound in the solid content is preferably 25% by weight or less, more preferably 20% by weight or less.

white pigment The resin composition of the present invention preferably contains more white pigment. The white pigment has the function of further increasing the reflectivity of the partition wall.

Examples of white pigments include titanium dioxide, zirconium oxide, zinc oxide, barium sulfate, and composite compounds of these. Two or more of these compounds may be contained. Among these, titanium dioxide has high reflectivity and is easily industrially utilized.

The crystal structure of titanium dioxide is divided into anatase type, rutile type and brookite type. Among these, rutile titanium oxide is preferable in terms of low photocatalytic activity.

Surface treatment of white pigments is also possible. It is preferable to use a metal selected from Al, Si and Zr for surface treatment, which can improve the light resistance and heat resistance of the formed partition wall. More preferably, the white pigment is surface-treated with at least one selected from the group consisting of SiO ₂ and Al ₂ O ₃ and ZrO ₂ , and further preferably, the white pigment is surface-treated with ZrO ₂ , Al ₂ O ₃ , and SiO ₂ handle. From the viewpoint of light resistance and reflectivity, the white pigment is further preferably titanium dioxide surface-treated with ZrO ₂ , Al ₂ O ₃ and SiO ₂ .

From the viewpoint of further improving the reflectance of the partition wall, the scattered light-based particle size D50 of the white pigment is preferably 100 nm to 500 nm, more preferably 150 nm to 350 nm. Here, the particle diameter D50 of the white pigment can be measured using a particle size distribution measuring device (SZ-100; manufactured by HORIBA Co., Ltd.) or the like.

In addition, from the viewpoint of further improving the reflectance of the partition wall, the average primary particle diameter of the white pigment is preferably 100 nm to 500 nm, more preferably 150 nm to 350 nm. Here, the average primary particle diameter of the white pigment can be measured by the laser diffraction method using a particle size distribution measuring device (N4-PLUS; manufactured by Beckman-Coulter Co., Ltd.) or the like.

Examples of titanium dioxide pigments that can be preferably used as white pigments include: R960, manufactured by DuPont Co., Ltd. (rutile type, SiO ₂ /Al ₂ O ₃ treatment, average primary particle size 210 nm); R996, Lomon Manufactured by Lomon Billions (Rutile type, ZrO ₂ /Al ₂ O ₃ treatment, average primary particle size 230 nm); CR-97, manufactured by Ishihara Sangyo Co., Ltd. (Rutile type, Al ₂ O ₃ /ZrO ₂ treatment, average primary particle size 250 nm); PFC105, manufactured by Ishihara Sangyo Co., Ltd. (rutile type, SiO ₂ /Al ₂ O ₃ /ZrO ₂ treatment, average primary particle size 280 nm); JR- 301, manufactured by Tayca Co., Ltd. (rutile type, Al ₂ O ₃ treatment, average primary particle size 300 nm); JR-405, manufactured by Tayca Co., Ltd. (rutile type, Al ₂ O ₃ treatment, average primary particle size 210 nm); JR-600A, Tayca (Rutile type, Al ₂ O ₃ treatment, average primary particle size 250 nm); JR-603, Tayca (Rutile type, Al 2 O 3 treatment, average primary particle size 250 nm); JR-603, Tayca ( Tayca) (share) (rutile type, Al ₂ O ₃ /ZrO ₂ treatment, average primary particle size 280 nm), etc. Two or more of these compounds may be contained.

From the viewpoint of further improving the reflectance, the content of the white pigment in the resin composition is preferably 10% by weight or more of the solid content, more preferably 15% by weight or more. On the other hand, from the viewpoint of improving the surface smoothness of the partition walls, the content of the white pigment is preferably 60% by weight or less of the solid content, more preferably 55% by weight or less.

yellow precursor compound The resin composition of the present invention preferably further contains a yellow precursor compound. The yellow precursor compound refers to a compound that has a yellow color due to increased light absorption in the wavelength range of 380 nm to 500 nm due to reactions, decomposition, structural changes, etc. caused by heat and/or light energy. In particular, it is preferable that the absorption at a wavelength of 450 nm is increased.

By including the yellow precursor compound in the resin composition, the blue light-shielding property of the partition wall can be improved. If the resin composition contains a yellow component from the beginning, the exposure light will be greatly absorbed in the exposure step when forming the barrier rib (A-1) pattern described below, and the exposure light will not reach the bottom and will not be cured. However, by containing the yellow precursor compound, the exposure light is transmitted to the bottom in the exposure step to be cured. Therefore, a fine thick-film barrier rib pattern with high light-shielding properties against blue light can be formed. Therefore, it is more preferable that the light absorption in the wavelength range of 380 nm to 500 nm does not change during the exposure step, and that the light absorption in the wavelength range of 380 nm to 500 nm increases in the subsequent heating step.

Examples of the yellow precursor compound include phenolic compounds, organic polymer resins, organic metal compounds, and the like. From the viewpoint of the light resistance of the produced yellow component, an organic metal compound is preferred.

Phenolic compounds are oxidized by heat and/or light energy to generate quinone compounds. It is preferable to use a phenolic compound in which the produced quinone compound is yellow. Examples of the phenolic compound include 1,4-dihydroxynaphthalene, 1,4-dihydroxyanthrahydroquinone, quinizarin, 1,4-dihydroxy-2-sulfoanthraquinone, and the like. Two or more of these compounds may be contained.

The organic polymer resin is not particularly limited as long as it turns yellow due to heat and/or light energy. Examples of the organic polymer resin include polyolefins such as polyethylene and polypropylene, polyvinyl chloride, polycarbonate, and acrylonitrile-butadiene-styrene (ABS) resin. Two or more of these compounds may be contained. Polyolefins remove hydrogen from their structure by heat or light, and produce polyenes through oxidation reactions that turn yellow. Polyvinyl chloride undergoes dehydrochlorination reaction by heat or light, and turns yellow due to the increase of conjugated double bonds such as polyene. Polycarbonate turns yellow due to a photoreaction called Fries rearrangement, which generates a phenyl salicylate structure and then a dihydroxybenzophenone structure. ABS resin is known to turn yellow due to free radical species generated by oxidation by heat or light.

The organic metal compound is not particularly limited as long as it generates yellow particles with absorption at 380 nm to 500 nm by heat and/or light energy. Examples of yellow particles having absorption at 380 nm to 500 nm include: iron oxide particles, copper oxide particles, iridium oxide particles, bismuth oxide, tungsten oxide, gold oxide particles, gold nanoparticles, silver oxide and/or silver particles, silver nanoparticles, etc. Examples of the organic metal compounds include organic iron compounds, organic copper compounds, organic iridium compounds, organic bismuth compounds, organic tungsten compounds, organic gold compounds, organic silver compounds, and the like. Two or more of these compounds may be contained. Among these compounds, they are stable in the air, and can efficiently generate yellow particles (silver oxide and/or silver particles, silver nanoparticles) by decomposition and aggregation during the exposure step and/or heating step. ) and improve the light-shielding property of the film. From this point of view, the yellow precursor compound is preferably an organic silver compound.

Examples of organic iron compounds include: iron tris(2,4-pentanedioneate), ferrocene, iron cyanide, iron carbonate, iron pentacarbonyl, iron oxalate, iron nonacarbonyl, iron acetate, iron formate, hexacarbonyl Ferric cyanide, etc. Examples of the organic copper compound include copper bis(2,4-pentanedioneate), copper neodecanoate, copper acetate, copper formate, copper formate hydrate, copper oxalate, copper oxalate hydrate, and the like. Examples of the organic iridium compound include tris(2,4-pentanedioneate)iridium, tetrairidium dodecacarbonyl, bis(triphenylphosphine)iridium carbonyl chloride, iridium dicyclocene (IrCp ₂ ), and the like. Examples of organic bismuth compounds include bismuth subcarbonate, bismuth oxycarbonate, and bismuth subgallate. Examples of organic tungsten compounds include hexacarbonyltungsten, hexamethyltungsten, and the like. Examples of organic gold compounds include gold chloride (triphenylphosphine), gold resinate (Gold Resinate) MR7901-P, tetrachloroauric acid tetrahydrate, and the like.

Examples of the organic silver compound include paragraphs [0048] to [0049] of Japanese Patent Application Laid-Open No. 10-62899, and pages 18, 24, 24, and 19 of European Patent Application Publication No. 803,764A1. Line 37, European Patent Application Publication No. 962,812A1, Japanese Patent Application Publication No. 11-349591, Japanese Patent Application Publication No. 2000-7683, Japanese Patent Application Publication No. 2000-72711, Japanese Patent Application Publication No. 2002 -23301, Japanese Patent Application Publication No. 2002-23303, Japanese Patent Application Publication No. 2002-49119, European Patent Application Publication No. 1246001A1, European Patent Application Publication No. 1258775A1, Japanese Patent Application Publication No. 2003 -140290, Japanese Patent Laid-Open No. 2003-195445, Japanese Patent Laid-Open No. 2003-295378, Japanese Patent Laid-Open No. 2003-295379, Japanese Patent Laid-Open No. 2003-295380, Japanese Patent Laid-Open No. 2003 - Organic silver compounds described in Publication No. 295381, Japanese Patent Application Laid-Open No. 2003-270755, etc., or silver salts of aliphatic carboxylic acids, etc.

Among these, from the viewpoint of making the compound more yellow, a compound represented by the following general formula (5) and/or a polymer compound having a structure represented by the following general formula (6) is preferred.

[Chemical 4]

In the general formula (5), R ⁵ represents hydrogen or an organic group having 1 to 30 carbon atoms. Here, the "organic group having 1 to 30 carbon atoms" is preferably an alkyl group having 1 to 30 carbon atoms (including linear and branched alkyl groups) and/or an aromatic hydrocarbon group having 6 to 30 carbon atoms. Preferable specific examples of these include: methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, n-pentyl, isopentyl, n-hexyl, isohexyl, n-heptyl base, isoheptyl, n-octyl, isooctyl, n-nonyl, isononyl, decyl, undecyl, dodecyl, tridecyl, tetradecyl, pentadecyl, Hexadecyl, heptadecyl, octadecyl, nonadecyl, eicosyl, phenyl, benzyl, tolyl, biphenyl and naphthyl.

[Chemistry 5]

In the general formula (6), R ⁶ and R ⁷ each independently represent hydrogen or an organic group having 1 to 30 carbon atoms. Here, the "organic group having 1 to 30 carbon atoms" is preferably an alkyl group having 1 to 30 carbon atoms (including linear and branched alkyl groups) and/or an aromatic hydrocarbon group having 6 to 30 carbon atoms. Preferred specific examples of these include: methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, n-pentyl, isopentyl, n-hexyl, isohexyl, n-heptyl base, isoheptyl, n-octyl, isooctyl, n-nonyl, isononyl, decyl, undecyl, dodecyl, tridecyl, tetradecyl, pentadecyl, Hexadecyl, heptadecyl, octadecyl, nonadecyl, eicosyl, phenyl, benzyl, tolyl, biphenyl and naphthyl. In addition, a is an integer of 1 or more, preferably 1 to 10,000, more preferably 5 to 1,000.

Examples of the organic silver compound represented by the general formula (5) include silver acetate, silver propionate, silver butyrate, silver valerate, silver hexanoate, silver enanthate, silver octoate, silver nonanoate, and silver decanoate. , silver neodecanoate, silver salicylate, silver carbonate, silver p-toluenesulfonate, silver trifluoroacetate, silver 2-ethylhexanoate, silver diethyldithiocarbamate, silver benzoate, pyridine- 2-Silver carboxylate, silver behenate, silver arachidate, silver stearate, silver oleate, silver laurate, silver caproate, silver myristate, silver palmitate, etc. Two or more of these compounds may be contained. Among these, from the viewpoint of further solubility in organic solvents and yellowing, silver neodecanoate, silver octoate, silver salicylate, and silver benzoate are preferred.

The organic silver compound represented by the general formula (6) has a structure in which the carboxyl group in the (meth)acrylic polymer having a carboxyl group becomes a silver salt. The organic silver compound represented by the general formula (6) is obtained by stirring a (meth)acrylic acid polymer having a carboxyl group and silver nitrate in an organic solvent in the presence of an amine catalyst, as shown in the preparation examples described below.

The (meth)acrylic acid polymer having carboxyl groups is obtained by polymerizing unsaturated carboxylic acid. Examples of the unsaturated carboxylic acid include acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, vinyl acetic acid, acid anhydride, and the like. These may be used alone or in combination with other copolymerizable ethylenically unsaturated compounds. Specific examples of the copolymerizable ethylenically unsaturated compound include methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, n-propyl acrylate, isopropyl acrylate, and methacrylic acid. n-propyl acrylate, isopropyl methacrylate, n-butyl acrylate, n-butyl methacrylate, 2-butyl acrylate, 2-butyl methacrylate, isobutyl acrylate, isobutyl methacrylate, acrylic acid tert-butyl ester, tert-butyl methacrylate, n-amyl acrylate, n-amyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, benzyl acrylate, benzyl methacrylate and other unsaturated carboxylic acid alkyl esters; aromatic vinyl compounds such as styrene, p-methylstyrene, o-methylstyrene, m-methylstyrene, α-methylstyrene, aminoethyl acrylate, etc. Saturated carboxylic acid aminoalkyl esters; unsaturated carboxylic acid glycidyl esters such as glycidyl acrylate and glycidyl methacrylate; vinyl acetate and vinyl propionate and other carboxylic acid vinyl esters; acrylonitrile and methacrylonitrile , α-chloroacrylonitrile and other cyanide vinyl compounds; 1,3-butadiene, isoprene and other aliphatic conjugated dienes; polystyrene with an acrylyl group or a methacrylyl group at the end. , polymethyl acrylate, polymethyl methacrylate, polybutyl acrylate, polybutyl methacrylate, polysilone and other macromonomers, but are not limited to these. The (meth)acrylic polymer is not particularly limited.

Commercially available products can also be used as the (meth)acrylic polymer having a carboxyl group. Examples of commercially available carboxyl group-containing (meth)acrylic polymers include: AX3-BX-TR-101, AX3-BX-TR-102, AX3-BX-TR-106, and AX3-BX-TR-107 , AX3-BX-TR-108, AX3-BX-TR-109, AX3-BX-TR-110, AX3-RD-TR-501, AX3-RD-TR-502, AX3-RD-TR-503, AX3 -RD-TR-504, AX3-RD-TR-103, AX3-RD-TR-104 (trade name, manufactured by Nippon Shokubai Co., Ltd.); SPCR-10X, SPCR-10P, SPCR-24X, SPCR-18X , SPCR-215X (trade name, manufactured by Showa Denko Co., Ltd.); X-4007 (trade name, manufactured by NOF Co., Ltd.), etc. Among these, SPCR-10X, SPCR-10P, SPCR-24X, SPCR-18X, and SPCR-215X are preferred. Two or more of these compounds may also be used.

In addition, the weight average molecular weight (Mw) of the polymer compound represented by the general formula (6) is not particularly limited, but it is preferably 5,000 to 50,000 in terms of polystyrene measured by GPC, and more preferably 8,000 to 35,000. . If Mw is less than 5000, pattern sagging will occur during thermal hardening and the resolution will decrease. On the other hand, if Mw exceeds 50,000, it is difficult to be reduced and yellow particles are difficult to form.

The content of the yellow precursor compound in the solid content of the resin composition is preferably 0.1% by weight or more, more preferably 0.4% by weight or more. By setting the content of the yellow precursor compound to 0.4% by weight or more, the obtained partition wall can be made more yellow, and the light-shielding property of the partition wall against blue light can be improved. On the other hand, if the content of the yellow precursor compound is too high, excessive reaction occurs due to radicals partially generated by decomposition of the yellow precursor compound, making it difficult to form a pattern. Therefore, the content of the yellow precursor compound in the solid content of the resin composition is preferably 10% by weight or less, more preferably 5.0% by weight or less.

shading pigment The resin composition of the present invention preferably further contains a light-shielding pigment. The light-shielding pigment has the function of further improving the light-shielding property of the partition wall against light of a specific wavelength.

Blue and purple pigments The light-shielding pigment preferably contains a blue pigment and a purple pigment. By containing blue pigments and purple pigments, the light-shielding properties of the film in the wavelength range of 500 nm to 630 nm (green light to red light) can be improved.

The blue pigment and the purple pigment are selected from inorganic pigments, organic pigments and mixed pigments, and the ingredients are not particularly limited.

Examples of the blue pigment include: Pigment blue (hereinafter referred to as PB) 1, PB9, PB18, PB25, PB28, PB29, PB36, PB15, PB15:1, PB15:2, PB15:3, PB15 :4, PB15:6, PB17:1, PB60, PB66, PB75, PB79, etc. Two or more of these compounds may be contained. Among these, from the viewpoint of excellent light resistance, PB15, PB15:1, PB15:2, PB15:3, PB15:4, and PB15:6 which are phthalocyanine pigments are preferred, and PB15:6 is more preferred.

Examples of purple pigments include pigment violet (hereinafter referred to as PV) 1, PV3, PV3:3, PV19, PV23, PV29, PV37, PV38, PV39, PV50, and the like. Among these, from the viewpoint of excellent heat resistance, PV19, PV23, PV29, PV37, and PV38, which are condensed polycyclic pigments, are preferred, and from the viewpoint of excellent light-shielding properties in the wavelength range of 500 nm to 550 nm, More preferably, they are PV23, PV29 and PV37. The total content of the blue pigment and the purple pigment in the solid content of the resin composition is preferably 0.01% by weight or more, more preferably 0.05% by weight or more, and still more preferably 0.10% by weight or more. By setting the total content of the blue pigment and the purple pigment to 0.10% by weight or more, the light-blocking property of the obtained partition wall in the wavelength range of 500 nm to 630 nm (green light to red light) can be further improved. The total content of the blue pigment and the purple pigment in the solid content of the resin composition is preferably 3.0% by weight or less, more preferably 1.0% by weight or less, and still more preferably 0.75% by weight or less. By setting the total content of the blue pigment and the purple pigment to 0.75% by weight or less, exposure light can be sufficiently transmitted to form a fine barrier rib pattern.

The weight ratio of blue pigment and purple pigment is preferably 20/80~80/20. By setting the weight ratio of the blue pigment to the purple pigment to 20/80 to 80/20, it is possible to achieve both pigment dispersion and light-shielding properties in the wavelength range of 500 nm to 630 nm (green light to red light). The weight ratio of the blue pigment and the purple pigment is more preferably 30/70 to 70/30, and further preferably 50/50 to 65/35.

In addition, it is preferable that the weight of the yellow precursor compound in the solid content of the resin composition of the present invention is 0.2 to 20 with respect to 100 of the weight of the white pigment, and that the blue pigment and the purple pigment occupy the solid content. The total weight of the white pigment is 0.05 to 10 relative to the weight of 100 white pigments. By setting this ratio, it is possible to obtain a gray barrier pattern with excellent light-shielding properties and high reflectivity in the entire visible light range (wavelength range 430 nm to 630 nm). More preferably, the weight of the yellow precursor compound in the solid content of the resin composition of the present invention is 0.5 to 10 with respect to 100 of the weight of the white pigment, and the total weight of the blue pigment and the purple pigment in the solid content is The weight is 0.01 to 5 relative to the weight of 100 white pigments.

The resin composition of the present invention may also contain other light-shielding pigments other than blue pigments and purple pigments as light-shielding pigments. Examples of other light-shielding pigments include red pigments, black pigments, green pigments, yellow pigments, and the like.

Examples of red pigments include: Pigment red (hereinafter referred to as PR) 9, PR177, PR179, PR180, PR192, PR209, PR215, PR216, PR217, PR220, PR223, PR224, PR226, PR227, PR228, PR240, PR254, etc. Two or more of these compounds may be contained.

Examples of the black pigment include black organic pigments, black inorganic pigments, and the like.

Examples of black organic pigments include carbon black, perylene black, aniline black, and benzofuranone-based pigments. These can also be coated with resin. Examples of black inorganic pigments include: graphite; fine particles of metals such as titanium, copper, iron, manganese, cobalt, chromium, nickel, zirconium, zinc, calcium, silver, gold, platinum, and palladium; metal oxides; metal composite oxides Materials; metal sulfides; metal nitrides; metal oxynitrides; metal carbides, etc. Two or more of these compounds may be contained.

Examples of green pigments include C.I. pigment green (hereinafter referred to as PG) 7, PG36, PG58, PG37, PG59, and the like. Two or more of these compounds may be contained.

Examples of the yellow pigment include pigment yellow (hereinafter referred to as PY) PY137, PY138, PY139, PY147, PY148, PY150, PY153, PY154, PY166, PY168, PY185, and the like. Two or more of these compounds may be contained.

The resin composition of the present invention preferably further contains a reducing agent. The reducing agent generates yellow particles more efficiently by promoting the reduction of yellow precursor compounds (especially organic silver compounds), and can improve the light-shielding properties of the film even under low-temperature heating conditions of about 100°C to 120°C. This allows the present technology to be applied to applications that require low-temperature heating conditions, for example, even if there is a material such as an organic EL material that is a concern about heat resistance in the substrate. In addition, if unreacted organic silver compounds remain in the heated film, they will be decomposed by light or heat and the film color will change. Therefore, the weather resistance will be poor. However, by containing a reducing agent, the film after curing will The amount of residual organic silver compounds is reduced, and the weather resistance is improved.

The reducing agent may be any compound as long as it promotes the reduction of the organic silver compound. However, from the viewpoint of reducing the organic silver compound more efficiently, it is preferably a compound containing two or more phenolic hydroxyl groups in the molecule or Compounds containing alkenediol groups. A compound containing two or more phenolic hydroxyl groups in the molecule is preferably oxidized to form a quinone compound when the organic silver compound is reduced, but it is preferable that it does not form a colored quinone compound like the above-mentioned yellow precursor compound. structure. Examples of compounds containing two or more phenolic hydroxyl groups in the molecule include dihydric phenol compounds such as catechol compounds, hydroquinone compounds, resorcinol compounds, and anthrahydroquinone compounds; or compounds containing three The above polyphenolic compounds with phenolic hydroxyl groups. Among these, from the viewpoint of reducing properties, a hydroquinone compound represented by the following general formula (7) is more preferred.

[Chemical 6]

In the general formula (7), R ⁸ , R ⁹ , R ¹⁰ and R ¹¹ each independently represent hydrogen, a hydroxyl group, or an organic group having 1 to 30 carbon atoms. Here, the "organic group having 1 to 30 carbon atoms" is preferably an alkyl group having 1 to 30 carbon atoms (including linear and branched alkyl groups) and/or an aromatic hydrocarbon group having 6 to 30 carbon atoms. Preferable specific examples of these include: methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, n-pentyl, isopentyl, n-hexyl, isohexyl, n-heptyl base, isoheptyl, n-octyl, isooctyl, n-nonyl, isononyl, decyl, undecyl, dodecyl, tridecyl, tetradecyl, pentadecyl, Hexadecyl, heptadecyl, octadecyl, nonadecyl, eicosyl, phenyl, benzyl, tolyl, biphenyl and naphthyl.

Examples of the hydroquinone compound represented by the following general formula (7) include hydroquinone, methyl hydroquinone, ethyl hydroquinone, propyl hydroquinone, and butyl hydroquinone. Hydroquinone, tert-butylhydroquinone, 2,3-dimethylhydroquinone, 2,3-diethylhydroquinone, 2,3-dipropylhydroquinone, 2 ,3-dibutylhydroquinone, 2,3-di-tert-butylhydroquinone, 2,5-dimethylhydroquinone, 2,5-diethylhydroquinone, 2 ,5-dipropylhydroquinone, 2,5-dibutylhydroquinone, 2,5-di-tert-butylhydroquinone, hydroquinone dimethyl ether, hydroquinone dimethyl ether Diethyl ether, 1,2,4-benzenetriol, 2,5-dihydroxyacetophenone, 2,5-dihydroxybenzoic acid, phenylhydroquinone, 2,6-dimethylhydroquinone, 2,6-diethylhydroquinone, 2,6-dipropylhydroquinone, 2,6-dibutylhydroquinone, 2,6-di-tert-butylhydroquinone, 2,6-dihydroxyacetophenone, 2,6-dihydroxybenzoic acid, phenylhydroquinone, phenylhydroquinone, 2,5-tertiary amylhydroquinone, etc. Among these, from the viewpoint of reducing properties, solubility in organic solvents, and storage stability, tert-butylhydroquinone, 2,3-dimethylhydroquinone, and 2,6-dimethylhydroquinone are preferred. -Dimethylhydroquinone, 2,5-tert-pentylhydroquinone, 2,3-dipropylhydroquinone, 2,3-dibutylhydroquinone, 2,3- Di-tert-butylhydroquinone, 2,5-dipropylhydroquinone, 2,5-dibutylhydroquinone, 2,5-di-tert-butylhydroquinone.

Examples of compounds containing an enediol group include ascorbic acid, α-pyridoin, fructose, xylose, glucose, dioxyacetone, glycolaldehyde, benzoin, and monooxyacetone. , benzyl carbinol. Among these, glycolaldehyde is preferred from the viewpoint of reducing properties and solubility in organic solvents.

The content of the reducing agent in the solid content of the resin composition is preferably 0.01% by weight or more, more preferably 0.1% by weight or more. By setting the content of the reducing agent to 0.1% by weight or more, the organic silver compound can be reduced more effectively, so that the obtained partition wall becomes more yellow, and the light-shielding property of the partition wall against blue light is improved. In addition, the amount of organic silver compounds remaining in the film after curing is reduced, and the weather resistance is improved.

On the other hand, when the resin composition is a negative photosensitive resin composition, if the content of the reducing agent is too high, the reducing agent will capture free radicals generated by the decomposition of the photopolymerization initiator during exposure, thus Exposure sensitivity is reduced. Therefore, the content of the reducing agent in the solid content of the resin composition is preferably 3.0% by weight or less, more preferably 1.5% by weight or less.

The resin composition of the present invention preferably further contains phosphoric acid polyester. The phosphoric acid polyester is not particularly limited as long as it is a polymer containing a phosphate group, a polyphosphate group or a phosphoric acid group. Phosphate polyester has the function of improving the stability of white pigments and organic silver compounds. Phosphate polyester is preferably used as a dispersant when dispersing pigments.

Examples of phosphoric acid polyester include: PHOSPHANOL (registered trademark) RA-600, ML-200, ML-220, RS-610, RB-410, RD-720N (the above are Toho Chemical Industry Co., Ltd. company), SOLSPERSE (registered trademark) SOLSPERSE 26000, SOLSPERSE 36000, SOLSPERSE 41000 (the above are manufactured by ZENECA), "DESP "DISPERBYK" (registered trademark)-110, 111, 142, 145, 180, "BYK" (registered trademark)-110, 111, W969, W9010 (the above is BYK- Chemie Japan) (manufactured by Co., Ltd.), Plysurf (registered trademark) A-208B, A-208F, A-208N, A-219B, DB-01, M208F (the above are Daiichi Industrial Pharmaceutical Co., Ltd. (manufactured by Kusumoto Chemical Co., Ltd.), Disparlon (registered trademark) PW-36, DA-375 (manufactured by Kusumoto Chemical Co., Ltd.), etc. Two or more of these compounds may be contained. Among these, from the viewpoint of improving the stability of white pigments and organic silver compounds, PHOSPHANOL ML-220, DISPERBYK-110, DISPERBYK ( DISPERBYK)-111, Plysurf A-208B.

The content of the phosphate polyester in the solid content of the resin composition is preferably 0.50% by weight or more, more preferably 1.0% by weight or more. By setting the content of the phosphoric acid polyester to 0.50% by weight or more, the white pigment and the organic silver compound are further stabilized.

On the other hand, when the resin composition contains polysiloxane as the resin, if the content of the phosphoric acid polyester is too high, the condensation reaction between the polysiloxanes proceeds through the acidic groups of the phosphoric acid polyester, and the viscosity increases over time. The ground rises. Therefore, the content of the phosphate polyester in the solid content of the resin composition is preferably 15% by weight or less, more preferably 10% by weight or less.

The resin composition of the present invention preferably further contains a liquid-repellent compound. A liquid-repellent compound refers to a compound that imparts the property of repelling water or organic solvents (liquid-repellent performance) to a resin composition. It is not particularly limited as long as it is a compound having such properties. Specifically, a compound having a fluoroalkyl group can be preferably used. By containing a liquid-repellent compound, liquid-repellent performance can be imparted to the top of the partition wall (A-1) described below after the partition wall is formed. Thereby, for example, when forming (B) pixels containing a color-converting luminescent material described later, color-converting luminescent materials with different compositions can be easily applied to each pixel.

The liquid-repellent compound is preferably a liquid-repellent compound having a photoradically polymerizable group. By having a photoradically polymerizable group, a strong bond can be formed with the resin, making it easier to impart liquid-repellent properties to the top of the partition wall.

Examples of the liquid-repellent compound having a photoradically polymerizable group include "Megafac" (registered trademark) RS-72-A, RS-75-A, RS-76-E, RS-56, RS -72-K, RS-75, RS-76-E, RS-76-NS, RS-76, RS-90 (the above are trade names, manufactured by DIC Co., Ltd.), etc. Furthermore, in this case, the photopolymerizable group can be photopolymerized in the partition wall (A-1) containing the photocured material of the negative photosensitive resin composition.

From the viewpoint of improving the liquid-repellent performance of the partition wall and improving the inkjet coatability, the content of the liquid-repellent compound in the resin composition is preferably 0.01% by weight or more of the solid content, more preferably 0.1% by weight or more. On the other hand, from the viewpoint of improving compatibility with resin or white pigment, the content of the liquid-repellent compound is preferably 10% by weight or less of the solid content, more preferably 5% by weight or less.

The resin composition of the present invention may further contain an organic metal compound other than the yellow precursor compound. As the organic metal compound other than the yellow precursor compound, an organic platinum compound or an organic palladium compound is preferred. The organic platinum compound or organic palladium compound decomposes and agglomerates into black particles during the exposure step and/or the heating step. Therefore, the light-shielding property of the film can be further improved without deteriorating the pattern processability.

Examples of the organic platinum compound include bis(acetylacetone)platinum, dichlorobis(triphenylphosphine)platinum, dichlorobis(benzonitrile)platinum, and the like. Examples of the organic palladium compound include bis(acetylacetone)palladium, dichlorobis(triphenylphosphine)palladium, dichlorobis(benzonitrile)palladium, tetrakis(triphenylphosphine)palladium, and dibenzylidene Acetone palladium etc. Two or more of these compounds may be contained.

In the resin composition of the present invention, the content of organic metal compounds other than the yellow precursor compound in the solid content is preferably 0.2% by weight to 5% by weight. By setting the content to 0.2% by weight or more, the light-shielding properties of the obtained film can be further improved. More preferably, it is 0.5 weight% or more. On the other hand, by setting the content of organic metal compounds other than the yellow precursor compound to 5% by weight or less, the reflectance can be further improved. More preferably, it is 3 weight% or less.

In addition, the resin composition of the present invention may contain a polymerization inhibitor, a surfactant, an adhesion improving agent, etc. as needed.

By containing a surfactant in the resin composition of the present invention, the fluidity during coating can be improved. Examples of the surfactant include: "Megafac" (registered trademark) F142D, F172, F173, F183, F445, F470, F475, F477 (the above are trade names, manufactured by Dainippon Ink Chemical Industry Co., Ltd. ), NBX-15, FTX-218 (the above are trade names, manufactured by Neos Co., Ltd.) and other fluorine-based surfactants; "BYK" (registered trademark) -333, 301, 331 , 345, 307 (the above are trade names, manufactured by BYK-Chemie Japan (Co., Ltd.)) and other silicone-based surfactants; polyalkylene oxide-based surfactants; poly(meth)acrylate-based Surfactants, etc. Two or more of these compounds may be contained.

Since the resin composition of the present invention contains an adhesion improving agent, the adhesion to the base substrate is improved, and a highly reliable partition wall can be obtained. Examples of the adhesion improving agent include alicyclic epoxy compounds, silane coupling agents, and the like. Among these, an alicyclic epoxy compound is preferable from the viewpoint of heat resistance.

Examples of alicyclic epoxy compounds include: 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 2,2-bis(hydroxymethyl) -1,2-Epoxy-4-(2-oxanyl)cyclohexane adduct of 1-butanol, ε-caprolactone modified 3',4'-epoxycyclohexyl Methyl 3',4'-epoxycyclohexanecarboxylate, 1,2-epoxy-4-vinylcyclohexane, butanetetracarboxylic acid tetrakis(3,4-epoxycyclohexyl Methyl) modified ε-caprolactone, 3,4-epoxycyclohexyl methyl methacrylate, etc. Two or more of these compounds may be contained.

From the viewpoint of further improving the adhesiveness with the base substrate, the content of the adhesiveness improving agent in the resin composition of the present invention is preferably 0.1% by weight or more of the solid content, more preferably 1% by weight or more. On the other hand, from the viewpoint of pattern processability, the content of the adhesion improving agent is preferably 20% by weight or less of the solid content, more preferably 10% by weight or less.

The resin composition of the present invention preferably contains more solvent. The solvent has the function of adjusting the viscosity of the resin composition to a range suitable for coating and improving the uniformity of the partition walls. As a solvent, it is preferable to combine the solvent whose boiling point under atmospheric pressure exceeds 150 degreeC and 250 degreeC or less, and the solvent which is 150 degreeC or less.

Examples of the solvent include: alcohols such as isopropyl alcohol and diacetone alcohol; glycols such as ethylene glycol and propylene glycol; ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, Propylene glycol monopropyl ether, propylene glycol monobutyl ether, diethylene glycol ethyl methyl ether and other ethers; methyl ethyl ketone, acetyl acetone, methyl propyl ketone, methyl butyl ketone, methyl isobutyl ketone , diisobutyl ketone, cyclopentanone and other ketones; dimethylformamide, dimethylacetamide and other amides; ethyl acetate, propyl acetate, butyl acetate, isobutyl acetate, ethyl acetate Glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, methyl lactate, ethyl lactate, butyl lactate Acetic esters such as toluene, xylene, hexane, cyclohexane and other aromatic or aliphatic hydrocarbons, γ-butyrolactone, N-methyl-2-pyrrolidone, dimethyl sulfoxide, etc. Two or more of these compounds may be contained. Among these, from the viewpoint of coatability, it is preferable to combine diacetone alcohol or diethylene glycol ethyl methyl ether as a solvent having a boiling point under atmospheric pressure of more than 150°C and 250°C or lower, and a solvent having a boiling point of 150°C or lower. Propylene glycol monomethyl ether as solvent.

The content of the solvent can be set arbitrarily according to the coating method, etc. For example, when forming a film by spin coating, the content of the solvent in the resin composition is generally set to 50% by weight or more and 95% by weight or less.

The resin composition of the present invention can be produced, for example, by mixing the resin, a photosensitizer, a yellow precursor compound, a light-shielding pigment, and other optional components.

Next, the light-shielding film of the present invention will be described.

The light-shielding film of the present invention is obtained by curing the resin composition of the present invention. In addition to the partition wall (A-1) described below, the light-shielding film of the present invention can also be preferably used as a light-shielding film in a One Glass Solution (OGS) type touch panel such as covering a decorative pattern for a base material. pattern. The film thickness of the light-shielding film is preferably 5 μm or more, and more preferably 10 μm or more.

Next, the manufacturing method of the light-shielding film of this invention is demonstrated with an example. The manufacturing method of the light-shielding film of the present invention preferably includes in sequence: a film-making step of coating the resin composition of the present invention on a base substrate and drying to obtain a dry film; an exposure step of subjecting the obtained dry film to pattern exposure; development a step of dissolving and removing the portion of the exposed dry film that is soluble in the developer; and a heating step of hardening the developed dry film by heating it, and in the heating step, by heating the developed dry film The dried film is heated at a temperature between 100°C and 250°C to increase the b* value per 10 μm film thickness measured by the SCI method by 10 or more.

The method for manufacturing a light-shielding film of the present invention is characterized in that, in the heating step, the developed dry film is heated at a temperature of 100°C or more and 250°C or less, so that the thickness per 10 μm measured by the SCI method is reduced. The b* value of the film thickness increases by more than 10. From the viewpoint of further increasing the b* value, the heating temperature in the heating step is preferably 150°C or higher, more preferably 180°C or higher.

From the viewpoint of suppressing the occurrence of cracks in the film to be heated, the heating temperature in the heating step is preferably 250°C or lower, more preferably 240°C or lower. The heating time is preferably 15 minutes to 2 hours.

The light-shielding film formed of the resin composition of the present invention has high transmittance of exposure light (wavelength range 365 nm to 436 nm) during exposure, and after pattern formation, the b* value and the OD value in the wavelength range 400 nm to 500 nm increase. Therefore, by sufficiently photohardening to the bottom in the exposure step, it is possible to obtain partition walls with a preferable taper angle as described later. In addition, before the heating step, due to the blue pigment and purple pigment, the light-shielding property in the wavelength range of 500 nm to 630 nm (green light to red light) is high. After the heating step, the light-shielding property in the wavelength range of 400 nm to 500 nm (blue light) is further improved. It has light-shielding properties in colored light), so it is possible to obtain a gray partition that has both high light-shielding properties and reflectivity for visible light as a whole.

Examples of the coating method of the resin composition in the film forming step include slit coating, spin coating, and the like. Examples of the drying device include a hot air oven and a heating plate. The drying temperature is preferably 80°C to 120°C, and the drying time is preferably 1 minute to 60 minutes. Since the transmittance of the film of the resin composition of the present invention changes under heating conditions of 100°C or above, the drying temperature is preferably 80°C to 100°C.

The exposure step is a step in which necessary parts of the dry film are photohardened by exposure, or unnecessary parts of the dry film are photodecomposed to make any part of the dry film soluble in the developer. In the exposure step, exposure can be performed through a mask having a predetermined opening, or an arbitrary pattern can be directly drawn using a laser or the like without using a mask.

An example of the exposure device is a proximity exposure machine. Examples of active rays irradiated in the exposure step include near-infrared rays, visible rays, and ultraviolet rays, and ultraviolet rays are preferred. Examples of the light source include a low-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a halogen lamp, a germicidal lamp, and the like. However, a high-pressure mercury lamp or an ultra-high-pressure mercury lamp is preferred.

Exposure conditions can be appropriately selected according to the thickness of the dry film to be exposed. Generally speaking, it is better to use an ultra-high-pressure mercury lamp with an output of 1 mW/cm ² to 100 mW/cm ² and perform exposure at an exposure dose of 1 mJ/cm ² to 10,000 mJ/cm ² .

The development step is to dissolve and remove the portion of the exposed dry film that is soluble in the developer by using the developer to obtain a dry film patterned into an arbitrary pattern shape in which only the portion insoluble in the developer remains (hereinafter referred to as heating). Pre-pattern) steps. Examples of pattern shapes include grid-like, striped, hole-like shapes, and the like.

Examples of the development method include a dipping method, a spray method, a brushing method, and the like.

As the developer, a solvent capable of dissolving unnecessary parts of the dried film after exposure can be appropriately selected, and an aqueous solution containing water as the main component is preferred. For example, when the resin composition contains a polymer having a carboxyl group, an alkali aqueous solution is preferred as the developer. Examples of alkali aqueous solutions include inorganic alkali aqueous solutions such as sodium hydroxide, potassium hydroxide, sodium carbonate and calcium hydroxide; organic alkali aqueous solutions such as tetramethylammonium hydroxide and trimethylbenzyl ammonium hydroxide. Among these, from the viewpoint of improving resolution, a potassium hydroxide aqueous solution or a tetramethylammonium hydroxide aqueous solution is preferred. From the viewpoint of improving developability, the concentration of the alkali aqueous solution is preferably 0.01% by weight or more, more preferably 0.1% by weight or more. On the other hand, from the viewpoint of suppressing peeling or corrosion of the pattern before heating, the concentration of the alkali aqueous solution is preferably 5% by weight or less, more preferably 1% by weight or less. In addition, from the viewpoint of improving resolution, the developer may contain a surfactant. In order to facilitate step management, the development temperature is preferably 20°C to 50°C.

The heating step is a step of heating and hardening the pre-heated pattern formed in the development step. Examples of the heating device include a hot plate, an oven, and the like. The environment of the heating device is not particularly limited, and examples thereof include nitrogen and air. The preferred heating temperature and heating time are as described above.

Next, the substrate with partition walls of the present invention will be described.

The substrate with partition walls of the present invention is a substrate with partition walls having (A-1) patterned partition walls on a base substrate using the resin composition of the present invention. Preferably, the partition walls are patterned every 10 nm in the wavelength range of 430 nm to 630 nm. The reflectance of μm thickness is in the range of 20% to 50%, and the OD value per 10 μm thickness in the wavelength range of 430 nm to 630 nm is in the range of 1.5 to 3.0.

The substrate with partition walls of the present invention has (A-1) patterned partition walls on a base substrate (hereinafter, may be described as “bank walls (A-1)”). The base substrate functions as a support in the substrate with partition walls.

The substrate with barrier ribs of the present invention preferably further has (B) a pixel layer containing a color-converting luminescent material, separated by (A-1) patterned barrier ribs and arranged.

When there are pixels containing a color-converting luminescent material described below, the partition walls have the function of suppressing color mixing of light between adjacent pixels.

In the substrate with partition walls of the present invention, it is preferable that the partition wall (A-1) has a reflectance in the range of 20% to 50% per 10 μm thickness in the wavelength range of 430 nm to 630 nm, and the wavelength range of 430 nm to 630 nm is The OD value per 10 μm thickness in the nm range is in the range of 1.5 to 3.0. By setting the reflectance per 10 μm thickness in the wavelength range of 430 nm to 630 nm to 20% or more and setting the OD value to 3.0 or less, the brightness of the display device can be improved by utilizing the reflection from the side of the (A-1) partition wall. . By setting the reflectance per 10 μm thickness in the wavelength range 430 nm to 630 nm to 50% or less and setting the OD value to 1.5 or more, the light transmitted through the partition wall (A-1) can be suppressed, thereby suppressing adjacent images. Mixing colors of light between elements.

In addition, the substrate with partition walls of the present invention has partition walls (A-1) patterned on the base substrate using the resin composition of the present invention, preferably L* per 10 μm film thickness measured by the SCI method. The value is 50~70, the a* value is -5.0~5.0, and the b* value is -5.0~5.0. By keeping the L* value, a* value, and b* value within this range, wavelength dependence of the reflectance and OD value of the partition wall (A-1) can be given to the entire visible light (wavelength range 430 nm to 630 nm) There are fewer neutral gray partitions, thereby improving the color characteristics of the display.

FIG. 1 shows a cross-sectional view of one aspect of the substrate with partition walls of the present invention having patterned partition walls. The base substrate 1 has patterned partition walls 2 .

In addition, the substrate with partition walls of the present invention is a substrate with partition walls having (A-1) patterned partition walls on a base substrate. Preferably, the patterned partition walls contain a resin, a white pigment, and a blue pigment. , purple pigment, silver oxide and/or silver particles.

The resin, white pigment, blue pigment, purple pigment, silver oxide, and silver particles can be used as described above.

＜Base substrate＞ Examples of the base substrate include a glass plate, a resin plate, a resin film, a thin film transistor (TFT), a drive substrate such as a printed circuit board (PCB), and the like. As the material of the glass plate, alkali-free glass is preferred. As the material of the resin plate and the resin film, polyester, (meth)acrylic polymer, transparent polyimide, polyether styrene, etc. are preferred. The thickness of the glass plate and the resin plate is preferably 1 mm or less, more preferably 0.8 mm or less. The thickness of the resin film is preferably 100 μm or less.

Furthermore, when a driving substrate such as TFT or PCB is used as the base substrate, it is preferable to have a light source selected from an organic EL unit, a mini LED unit and a micro LED unit described below on the base substrate.

＜Next door (A-1)＞ The thickness of the partition wall (A-1) refers to the height of the partition wall (A-1) and/or the width of the partition wall (A-1). The height of the partition wall (A-1) refers to the length of the partition wall (A-1) in a direction perpendicular to the base substrate (height direction). In the case of the substrate with partition walls shown in FIG. 1 , the height of the partition walls 2 is represented by the symbol H. In addition, the width of the partition wall (A-1) refers to the length of the partition wall (A-1) in a direction horizontal to the base substrate. In the case of the substrate with partition walls shown in FIG. 1 , the width of the partition walls 2 is represented by the symbol L. Furthermore, in this specification, "height" is sometimes called "thickness".

In the present invention, it is considered that the reflectivity of the partition wall contributes to the improvement of the brightness of the display device, and the light-shielding property contributes to the suppression of color mixing. On the other hand, it is considered that the reflectance and OD value per thickness unit are the same regardless of the height direction and the width direction. Therefore, in the present invention, attention is paid to the reflectance and OD value per thickness unit of the partition wall. Furthermore, as will be described later, the thickness of the partition wall (A-1) is preferably 0.5 μm to 100 μm, and the width is preferably 1 μm to 100 μm. Therefore, in the present invention, 10 μm is selected as a representative value of the thickness of the partition wall (A-1), and attention is paid to the reflectance and OD value per 10 μm thickness.

If the reflectance per 10 μm thickness in the wavelength range of 430 nm to 630 nm is less than 20%, the reflection from the side walls of the partition walls becomes small, and the brightness of the display device becomes insufficient. The reflectance per 10 μm thickness in the wavelength range of 430 nm to 630 nm is preferably 20% or more, more preferably 25% or more, and further preferably 30% or more. The higher the reflectance per 10 μm thickness in the wavelength range of 430 nm to 630 nm, the greater the reflection of visible light from the side walls of the barrier ribs. Therefore, when (B) a pixel containing a color-converting luminescent material described below is included between the barrier ribs, , the color conversion efficiency is improved and the brightness of the display device can be improved.

If the OD value per 10 μm thickness in the wavelength range of 430 nm to 630 nm is less than 1.5, color mixing of light easily occurs because visible light leaks to adjacent pixels. The OD value per 10 μm of thickness in the wavelength range of 430 nm to 630 nm is preferably 1.5 or more, more preferably 1.7 or more, and still more preferably 2.0 or more. The higher the OD value per 10 μm thickness in the wavelength range of 430 nm to 630 nm, the greater the visible light blocking property of the side walls of the barrier ribs. Therefore, in the case where (B) a pixel containing a color-converting luminescent material described below is included between the barrier ribs, It can effectively block the light emitted from the pixel to prevent color mixing and improve the contrast of the display device.

In addition, the partition wall (A-1) is characterized by an L* value per 10 μm film thickness measured by the SCI method of 50 to 70, an a* value of -5.0 to 5.0, and a b* value of -5.0 to 5.0. If the L* value per 10 μm of film thickness measured by the SCI method is less than 50, the reflection from the side walls of the partition walls becomes small and the brightness of the display device becomes insufficient. If the a* value per 10 μm film thickness measured by the SCI method is less than -5.0, the partition walls will appear green. If the a* value exceeds 5.0, the partition walls will appear red, deteriorating the color characteristics of the display. In addition, if the b* value per 10 μm film thickness measured by the SCI method is less than -5.0, the partition walls will appear blue, and if the b* value exceeds 5.0, the partition walls will appear yellow, which may cause deterioration in the color characteristics of the display. . That is, by setting the L* value per 10 μm film thickness measured by the SCI method to 50 to 70, the a* value to -5.0 to 5.0, and the b* value to -5.0 to 5.0, in the entire visible light (wavelength In the region 430 nm to 630 nm), the color characteristics of the display can be improved by providing neutral gray partition walls with little wavelength dependence in the reflectance and OD value of the partition wall (A-1).

Regarding the reflectance per 10 μm thickness in the wavelength range of 430 nm to 630 nm of the partition wall (A-1), and the L* value, a* value, and b* value per 10 μm film thickness, it is possible to calculate The partition (A-1) is measured from the upper surface using a spectrophotometer (for example, CM-2600d manufactured by Konica Minolta (Konica Minolta) Co., Ltd.) by including the Specular Component Included (SCI) mode. Make a determination. However, when an area sufficient for measurement cannot be secured, or when a measurement sample with a thickness of 10 μm cannot be collected, when the composition of the partition wall (A-1) is known, it is also possible to produce a partition wall (A-1) similar to that of the partition wall (A-1). A-1) A whole film with a thickness of 10 μm of the same composition. Instead of the partition wall (A-1), the reflectance of the whole film is measured in the same way to determine the reflectance per 10 μm thickness. For example, the material for forming the partition wall (A-1) can also be used, and the thickness can be set to 10 μm, and a whole film can be produced under the same processing conditions as for the formation of the partition wall (A-1) except that pattern formation is not performed. The reflectance of the obtained whole film was measured similarly from the upper surface.

Regarding the OD value per 10 μm thickness in the wavelength range of 430 nm to 630 nm of the partition wall (A-1), an optical density meter/spectrophotometer ( For example, the transmittance is measured using U-4100 (manufactured by Hitachi High-Tech Science) and calculated by the following formula (1). However, when an area sufficient for measurement cannot be secured, or when a measurement sample with a thickness of 10 μm cannot be collected, when the composition of the partition wall (A-1) is known, it may be combined with the reflectance. In the same manner as the measurement, a whole film with a thickness of 10 μm having the same composition as the partition wall (A-1) was produced. Instead of the partition wall (A-1), the OD value of the whole film was measured in the same manner to determine the OD value per 10 μm thickness. . OD value=-log10（T/100）···（1） T: transmittance.

In addition, as a method for making the reflectance, OD value, L* value, a* value, and b* value fall within the above ranges, for example, setting the partition wall (A-1) to a preferred composition described below can be used. .

The taper angle of the partition wall (A-1) is preferably 45° to 110°. The taper angle of the partition wall (A-1) refers to the angle between the side and the bottom of the cross section of the partition wall. In the case of the substrate with partition walls shown in FIG. 1 , the taper angle of the partition walls 2 is represented by the symbol θ. By setting the taper angle to 45° or more, the difference in width between the upper part and the bottom of the partition wall (A-1) becomes smaller, and the width of the partition wall (A-1) can be easily formed within a preferable range described below. The cone angle is preferably more than 80°. On the other hand, by setting the taper angle to 110° or less, when forming (B) a pixel containing a color-converting luminescent material described later by inkjet coating, ink bursting can be suppressed and inkjet coating can be improved. sex. Here, ink bursting refers to a phenomenon in which ink crosses the partition wall and mixes into adjacent pixel portions. The cone angle is preferably 95° or less. The taper angle of the partition wall (A-1) can be observed by using an optical microscope (FE-SEM (for example, S-4800 manufactured by Hitachi, Ltd.)) at an accelerating voltage of 3.0 kV and a magnification of 2,500 times. -1) is obtained by measuring the angle between the side and the bottom of the cross section of the partition wall (A-1).

In addition, as a method for making the taper angle of the partition wall (A-1) fall within the above range, for example, setting the partition wall (A-1) to a preferable composition described below and using the resin composition of the present invention can be used. Formation etc.

The thickness of the partition wall (A-1) is preferably greater than the thickness of the pixel when the substrate with the partition wall has a pixel containing a color-converting luminescent material (B) described below. Specifically, the thickness of the partition wall (A-1) is preferably 0.5 μm or more, more preferably 5.0 μm or more, and further preferably 10 μm or more. On the other hand, from the viewpoint of more efficiently extracting the light emission from the bottom of the pixel, the thickness of the partition wall (A-1) is preferably 100 μm or less, and more preferably 50 μm or less. In addition, the width of the partition wall (A-1) is preferably sufficient to utilize light reflection from the side surfaces of the partition wall to further increase the brightness and further suppress color mixing of light in adjacent pixels caused by light leakage. Specifically, the width of the partition wall is preferably 1 μm or more, more preferably 5 μm or more. On the other hand, from the viewpoint of ensuring more of the light-emitting area of the pixel and further improving the brightness, the width of the partition wall (A-1) is preferably 100 μm or less, and more preferably 50 μm or less.

The partition wall (A-1) has a repeating pattern of a predetermined number of pixels corresponding to the screen size of the image display device. The number of pixels of the image display device is, for example, 4000 horizontally and 2000 vertically. The number of pixels affects the resolution (fineness) of the displayed image. Therefore, it is necessary to form a number of pixels corresponding to the required image resolution and the screen size of the image display device, and it is preferable to determine the pattern formation size of the partition walls together with these.

The partition wall (A-1) preferably contains resin, white pigment, blue pigment and purple pigment, and silver oxide and/or silver particles. Resin has the function of improving the crack resistance and light resistance of partition walls. The white pigment has the function of further increasing the reflectivity of the partition wall. The blue pigment and the purple pigment have the function of further improving the light-shielding property of the partition in the wavelength range of 500 nm to 630 nm (green light to red light). Silver oxide and/or silver particles have the function of further improving the light-shielding property of the partition wall in the wavelength range of 380 nm to 500 nm (blue light).

The resin, white pigment, blue pigment and purple pigment are as described above as materials constituting the resin composition.

From the viewpoint of improving the crack resistance of the partition wall during heat treatment, the content of the resin in the partition wall (A-1) is preferably 10% by weight or more, more preferably 20% by weight or more. On the other hand, from the viewpoint of improving light resistance, the content of the resin in the partition wall (A-1) is preferably 60% by weight or less, more preferably 50% by weight or less.

From the viewpoint of further improving the reflectance, the content of the white pigment in the partition wall (A-1) is preferably 10% by weight or more, more preferably 15% by weight or more. On the other hand, from the viewpoint of improving the surface smoothness of the partition walls, the content of the white pigment in the partition walls (A-1) is preferably 60% by weight or less, more preferably 55% by weight or less.

From the viewpoint of improving the light-shielding property of a specific wavelength, the content of the blue pigment and the purple pigment in the partition wall (A-1) is preferably 0.01% by weight or more, more preferably 0.05% by weight or more, and even more preferably 0.10% More than % by weight. On the other hand, from the viewpoint of not impairing the reflectivity of the partition wall, it is preferably 3.0% by weight or less, more preferably 1.0% by weight or less, and even more preferably 0.75% by weight or less.

The weight ratio of the blue pigment and the purple pigment in the partition (A-1) is preferably 20/80 to 80/20. By setting the weight ratio of the blue pigment to the purple pigment to 20/80 to 80/20, it is possible to achieve both pigment dispersion and light-shielding properties in the wavelength range of 500 nm to 630 nm (green light to red light). The weight ratio of the blue pigment and the purple pigment is more preferably 30/70 to 70/30, and further preferably 50/50 to 65/35.

The so-called silver oxide and/or silver particles refer to yellow particles or mixed particles of yellow particles and black particles produced by the decomposition and aggregation of the organic silver compound in the resin composition during the exposure step and/or the heating step. From the viewpoint of adjusting the reflectance and OD to the above ranges to further suppress light color mixing in adjacent pixels, the content of silver oxide and/or silver particles in the partition wall (A-1) is preferably 0.1% by weight or more. , more preferably 0.4% by weight or more. On the other hand, from the viewpoint of adjusting the reflectance and OD to the above ranges, the content of silver oxide and/or silver particles in the partition wall (A-1) is preferably 10% by weight or less, more preferably 3.0% by weight. %the following.

In addition, it is preferable that the weight of silver oxide and/or silver particles in the partition wall (A-1) is 0.2 to 20 with respect to 100 of the weight of the white pigment, and the total of the blue pigment and the purple pigment in the solid content is preferably The weight is 0.05 to 10 relative to the weight of 100 white pigments. By setting this ratio, it is possible to obtain a gray barrier pattern with excellent light-shielding properties and high reflectivity in the entire visible light range (wavelength range 430 nm to 630 nm). More preferably, the weight of the silver oxide and/or silver particles in the partition wall (A-1) is 0.5 to 10 relative to the weight of the white pigment 100, and the total weight of the blue pigment and the purple pigment in the solid content is relatively It is 0.1 to 5 based on 100 weight of white pigment.

The partition wall (A-1) preferably contains a liquid-repellent compound. By containing a liquid-repellent compound, liquid-repellent properties can be imparted to the partition wall (A-1). For example, when forming a pixel containing a color-converting luminescent material (B) described below, it is possible to easily separately apply materials with different compositions to each pixel. color changing luminescent material. The liquid-repellent compound is as described above as a material constituting the resin composition.

From the viewpoint of improving the liquid-repellent performance of the partition wall and improving the inkjet coatability, the content of the liquid-repellent compound in the partition wall (A-1) is preferably 0.01% by weight or more, more preferably 0.1% by weight or more. On the other hand, from the viewpoint of improving compatibility with resin or white pigment, the content of the liquid-repellent compound in the partition wall (A-1) is preferably 10% by weight or less, more preferably 5% by weight or less.

From the viewpoint of improving inkjet coating properties and facilitating separate coating of the color-changing luminescent material, the surface contact angle of the partition wall (A-1) with respect to propylene glycol monomethyl ether acetate is preferably 10° or more, and more preferably Preferably it is 20° or more, and further preferably it is 40° or more. On the other hand, from the viewpoint of improving the adhesion between the partition wall and the base substrate, the surface contact angle of the partition wall (A-1) is preferably 70° or less, more preferably 60° or less. Here, the surface contact angle of the partition wall (A-1) can be based on the wettability test method of the substrate glass surface specified in Japanese Industrial Standards (JIS) R3257 (date of establishment = 1999/04/20) , measure the upper part of the partition. In addition, as a method of making the surface contact angle of the partition wall (A-1) fall within the said range, the method of using the said liquid-repellent compound etc. are mentioned, for example.

As a method for patterning partition walls (A-1) on a base substrate, a photosensitive paste method is preferred in terms of ease of adjustment of the pattern shape. As a method for pattern forming partition walls using a photosensitive paste method, for example, the following method is preferred, including: a coating step of applying the resin composition on a base substrate and drying to obtain a dry film; and an exposure step of Pattern exposure is performed on the obtained dry film according to the pattern shape; a development step is to dissolve and remove the portion of the exposed dry film that is soluble in the developer solution; and a heating step is to harden the developed partition walls. The resin composition preferably has negative or positive photosensitivity. Pattern exposure may be performed through a mask having a predetermined opening, or an arbitrary pattern may be directly drawn using laser light or the like without using a mask. Furthermore, when the substrate with partition walls has a color filter and/or a light-shielding partition wall (A-2) described later, a similar pattern can be formed on the color filter and/or the light-shielding partition wall (A-2). Next door (A-1). Each step is as described above as a method for manufacturing a light-shielding film.

The substrate with partition walls of the present invention preferably further includes (B) pixels containing a color-converting luminescent material (hereinafter, sometimes described as "pixels (B)") and arranged separated by the partition walls (A-1). ”).

The pixel (B) has a function of enabling color display by converting at least part of the wavelength range of incident light and emitting outgoing light in a wavelength range different from that of the incident light.

FIG. 2 shows a cross-sectional view of one aspect of the substrate with partition walls of the present invention having patterned partition walls (A-1) and pixels (B). The base substrate 1 has patterned partition walls 2 , and pixels 3 are arranged in areas separated by the partition walls 2 .

The color conversion material preferably contains a phosphor selected from inorganic phosphors and organic phosphors.

The substrate with partition walls of the present invention can be used as a display device by combining a backlight that emits blue light with a liquid crystal and a pixel (B) formed on a TFT. In this case, the region corresponding to the red pixel preferably contains a red phosphor that is excited by blue excitation light and emits red fluorescence. Similarly, the area corresponding to the green pixel preferably contains a green phosphor that is excited by blue excitation light and emits green fluorescence. It is preferable that the area corresponding to the blue pixel does not contain phosphor.

The inorganic phosphor is preferably a phosphor that emits various colors such as green or red by blue excitation light, that is, one that is excited by excitation light with a wavelength of 400 nm to 500 nm and has an emission spectrum of 500 nm to 700 nm. A phosphor with a peak in the nm region. Examples of the inorganic phosphor include: yttrium aluminum garnet (YAG) based phosphor, terbium aluminum garnet (TAG) based phosphor, silicon aluminum oxynitride ( Sialon) based phosphors, Mn ⁴⁺ active fluoride complex phosphors, inorganic semiconductors called quantum dots, etc. Two or more of these compounds may also be used. Among these, quantum dots are preferred. Compared with other phosphors, the average particle size of quantum dots is small, so it can smooth the surface of (B) pixels and suppress light scattering on the surface, so it can further improve the light extraction efficiency and further increase the brightness.

Examples of quantum dot materials include Group II-IV, Group III-V, Group IV-VI, and Group IV semiconductors. Examples of these inorganic semiconductors include: Si, Ge, Sn, Se, Te, B, C (including diamond), P, BN, BP, BAs, AlN, AlP, AlAs, AlSb, GaN, GaP, GaAs, GaSb, InN, InP, InAs, InSb, ZnO, ZnS, ZnSe, ZnTe, CdS, CdSe, CdSeZn, CdTe, HgS, HgSe, HgTe, BeS, BeSe, BeTe, MgS, MgSe, GeS, GeSe, GeTe, SnS, SnSe, SnTe, PbO, PbS, PbSe, PbTe, Si ₃ N ₄ , Ge ₃ N ₄ , Al ₂ O ₃ , etc. Two or more of these compounds may also be used.

As the organic phosphor, a phosphor that emits various colors such as green or red by blue excitation light is preferred. Examples of phosphors that emit red fluorescence include pyrromethene derivatives having a basic skeleton represented by the following structural formula (8). Examples of phosphors that emit green fluorescence include the following compounds: Pyrromethene derivatives with a basic skeleton represented by structural formula (9), etc. In addition, perylene-based derivatives, porphyrin-based derivatives, oxazine-based derivatives, pyrazine-based derivatives, etc. that emit red or green fluorescence depending on the selection of substituents can be cited. Two or more of these compounds may be contained. Among these, the pyrrromethylene derivative is preferred in terms of high quantum yield. The pyrrromethylene derivative can be obtained, for example, by the method described in Japanese Patent Application Laid-Open No. 2011-241160.

[Chemical 7]

From the viewpoint of improving color characteristics, the thickness of the pixel (B) is preferably 0.5 μm or more, more preferably 1 μm or more. On the other hand, from the viewpoint of thinning the display device or curved surface processability, the thickness of the pixel (B) is preferably 30 μm or less, more preferably 20 μm or less.

The pixels (B) are preferably arranged separated by partition walls (A-1). By providing partition walls between pixels, the diffusion or color mixing of emitted light can be further suppressed.

An example of a method of forming the pixel (B) is a method of filling a space separated by the partition wall (A-1) with a coating liquid containing a color-converting luminescent material (hereinafter, color-converting luminescent material coating liquid). The color-changing luminescent material coating liquid may further contain resin or solvent.

Examples of filling methods for the color-converting luminescent material coating liquid include photolithography, inkjet, and the like. However, from the viewpoint of easily applying different types of color-converting luminescent materials to each pixel, inkjet is preferred. Coating method, etc.

＜Light-shielding partition (A-2)＞ The substrate with partition walls of the present invention preferably has (A-2) an OD value per 1.0 μm of thickness of 0.5 or more between the base substrate and (A-1) patterned partition walls. partition wall (hereinafter sometimes referred to as "light-shielding partition wall (A-2)"). By having a light-shielding partition (A-2), light-shielding properties can be improved, light leakage of the backlight can be suppressed, and a high-contrast and clear image can be obtained.

FIG. 3 is a cross-sectional view illustrating one aspect of the substrate with partition walls of the present invention having light-shielding partition walls. The base substrate 1 has patterned partition walls 2 and light-shielding partitions 4, and pixels 3 are arranged in areas separated by the partition walls 2 and the light-shielding partitions 4.

The OD value per 1.0 μm thickness of the light-shielding partition wall (A-2) is 0.5 or more. Here, the thickness of the light-shielding partition wall (A-2) is preferably 0.5 μm to 10 μm, as will be described later. In the present invention, 1.0 μm is selected as a representative value of the thickness of the light-shielding partition wall (A-2), and attention is paid to the OD value per 1.0 μm thickness. By setting the OD value per 1.0 μm thickness to 0.5 or more, the light-shielding property can be further improved and a higher-contrast, clear image can be obtained. On the other hand, the OD value per 1.0 μm thickness is preferably 4.0 or less, so that pattern processability can be improved. The OD value of the light-shielding partition wall (A-2) can be measured in the same manner as the OD value of the partition wall (A-1).

From the viewpoint of improving light-shielding properties, the thickness of the light-shielding partition wall (A-2) is preferably 0.5 μm or more. On the other hand, from the viewpoint of improving flatness, the thickness of the light-shielding partition wall (A-2) is preferably 10 μm or less. In addition, the width of the light-shielding partition wall (A-2) is preferably approximately the same as that of the partition wall (A-1).

The light-shielding partition (A-2) preferably contains resin and black pigment. Resin has the function of improving the crack resistance and light resistance of partition walls. Black pigment has the function of absorbing incident light and reducing emitted light.

Examples of the resin include those exemplified as the resin in the above-mentioned resin composition. Since they have excellent heat resistance and solvent resistance, (meth)acrylic polymers and polyimides are preferred.

Examples of the black pigment include the pigments exemplified as the black pigment in the resin composition, palladium oxide, platinum oxide, gold oxide, silver oxide, and the like. In terms of having high light-shielding properties, it is preferably selected from the group consisting of titanium nitride, zirconium nitride, and carbon black.

As a method of patterning the light-shielding barrier ribs (A-2) on the base substrate, for example, it is preferable to use the photosensitive material described in Japanese Patent Application Laid-Open No. 2015-1654, and use the same method as the barrier ribs (A-1). A method of pattern formation using a photosensitive paste method.

In addition, the substrate with partition walls of the present invention preferably further has a color filter layer with a thickness of 1 μm to 5 μm (hereinafter, there is recorded as "color filter"). The color filter has the function of transmitting visible light in a specific wavelength range and setting the transmitted light to a desired hue. By having a color filter, the color purity of the display device can be improved. By setting the thickness of the color filter to 1 μm or more, color purity can be further improved. On the other hand, by setting the thickness of the color filter to 5 μm or less, the brightness can be further improved.

FIG. 4 shows a cross-sectional view of one aspect of the substrate with partition walls of the present invention having a color filter. The base substrate 1 has patterned partition walls 2 and a color filter 5 , and the color filter 5 has a pixel 3 .

Examples of the color filter include color filters that are used in flat-panel displays such as liquid crystal displays and that use a pigment-dispersed material in which a pigment is dispersed in a photoresist. More specifically, examples include: a blue color filter that selectively transmits a wavelength of 400 nm to 550 nm, a green color filter that selectively transmits a wavelength of 500 nm to 600 nm, a filter that selectively transmits a wavelength of 500 nm Yellow color filters with wavelengths above nm, red color filters that selectively transmit wavelengths above 600 nm, etc.

In addition, the color filter may be laminated separately from the pixel (B) containing the color-changing luminescent material, or may be laminated integrally.

The substrate with partition walls of the present invention preferably further has a color filter with a thickness of 1 μm to 5 μm separated by a light-shielding partition between the base substrate and the pixel (B).

FIG. 5 shows a cross-sectional view of one aspect of the substrate with partition walls of the present invention having color filters separated by light-shielding partition walls. A color filter 5 separated by a patterned light-shielding partition wall 4 is provided on the base substrate 1, and has a partition wall 2 and a pixel 3 thereon.

The substrate with barrier ribs of the present invention preferably further has (C) a low refractive index layer (hereinafter, sometimes described as "low refractive index") with a refractive index of 1.20 to 1.35 at a wavelength of 550 nm above or below the pixel (B). Refractive index layer (C)"). By having the low refractive index layer (C), the light extraction efficiency can be further improved and the brightness of the display device can be further improved.

In the display device, from the viewpoint of appropriately suppressing light reflection of the backlight and efficiently allowing light to enter the pixel (B), the refractive index of the low refractive index layer (C) is preferably 1.20 or more. On the other hand, from the viewpoint of improving brightness, the refractive index of the low refractive index layer (C) is preferably 1.35 or less. Here, the refractive index of the low refractive index layer (C) can be measured by irradiating light with a wavelength of 550 nm from the direction perpendicular to the cured film surface using a oscillation coupler under atmospheric pressure and 20°C.

The substrate with partition walls of the present invention preferably further has an inorganic protective layer I with a thickness of 50 nm to 1,000 nm on the low refractive index layer (C). By having the inorganic protective layer I, it is difficult for moisture in the atmosphere to reach the low refractive index layer (C). Therefore, the refractive index variation of the low refractive index layer (C) can be suppressed and brightness degradation can be suppressed.

The substrate with partition walls of the present invention preferably has the low refractive index layer (C) between the pixel (B) and the color filter, and further, preferably on the low refractive index layer (C) It also has an inorganic protective layer (I) with a thickness of 50 nm to 1,000 nm. By having the low refractive index layer (C) between the pixel (B) and the color filter, the light extraction improvement effect of the emitted light becomes higher, and the brightness of the display is improved.

The substrate with partition walls of the present invention preferably further has an inorganic protective layer (II) with a thickness of 50 nm to 1,000 nm between the pixel (B) and the low refractive index layer (C). By having the inorganic protective layer (II), the raw material forming the pixel (B) cannot easily move from the pixel (B) to the low refractive index layer, so the refractive index change of the low refractive index layer (C) can be suppressed and brightness degradation can be suppressed. .

The substrate with partition walls of the present invention preferably further has an inorganic protective layer (III) and/or a yellow organic protective layer with a thickness of 50 nm to 1,000 nm between the color filter and the pixel (B). By having the inorganic protective layer (III), the material forming the color filter cannot easily reach the pixel (B) containing the color-converting luminescent material from the color filter, and therefore the pixel (B) containing the color-converting luminescent material can be suppressed. The brightness is degraded. In addition, by having a yellow organic protective layer, blue leakage light that has not been completely converted by the pixel (B) containing the color-converting luminescent material can be cut off, thereby improving color reproducibility. The yellow organic protective layer does not need to be formed in the pixels corresponding to the blue pixels.

The substrate with partition walls of the present invention preferably further has an inorganic protective layer (IV) and/or a yellow organic protective layer with a thickness of 50 nm to 1,000 nm on the base substrate. The inorganic protective layer (IV) and/or the yellow organic protective layer functions as a refractive index adjustment layer, which can more efficiently extract the light emitted from the pixel (B), further improving the brightness of the display device. In addition, the yellow organic protective layer blocks blue leakage light that has not been completely converted by the pixel (B) containing the color-converting luminescent material, thereby improving color reproducibility. The inorganic protective layer (IV) and/or the yellow organic protective layer is preferably disposed between the base substrate, the partition wall (A) and the pixel (B).

Examples of materials constituting the inorganic protective layers (I) to (IV) include metal oxides such as silicon oxide, indium tin oxide, and gallium zinc oxide; metal nitrides such as silicon nitride; and fluorine such as magnesium fluoride. Chemicals etc. Two or more of these compounds may be contained. Among these, silicon nitride or silicon oxide is more preferred in terms of low water vapor permeability and high permeability.

From the viewpoint of fully suppressing the transmission of substances such as water vapor, the thickness of the inorganic protective layer (I) to (IV) is preferably 50 nm or more. On the other hand, from the viewpoint of suppressing a decrease in transmittance, the thickness of the inorganic protective layer (I) to (IV) is preferably 800 nm or less.

The thickness of the inorganic protective layer (I) to the inorganic protective layer (IV) can be measured by using a polishing device such as a cross section polisher to expose the cross section perpendicular to the base substrate, and using a scanning electron microscope. Or use a transmission electron microscope to magnify the cross section.

Examples of a method for forming the inorganic protective layer (I) to the inorganic protective layer (IV) include sputtering. The inorganic protective layer is preferably colorless and transparent or yellow and transparent.

The yellow organic protective layer is obtained, for example, by subjecting a resin composition containing a yellow precursor compound and/or a yellow pigment to pattern processing. The yellow precursor compound and the yellow pigment are as described above as materials constituting the resin composition.

As a method of patterning the yellow organic protective layer, a method of patterning by a photosensitive paste method in the same manner as the partition wall (A-1) is preferred. When a yellow organic protective layer is formed on the color filter, the yellow organic protective layer may also function as an outer coating layer that flattens each pixel of the color filter.

From the viewpoint of fully blocking blue leakage light, the thickness of the yellow organic protective layer is preferably 100 nm or more. On the other hand, from the viewpoint of suppressing a decrease in light extraction efficiency, the thickness of the yellow organic protective layer is preferably 3000 nm or less.

The substrate with partition walls of the present invention can also be used in a display device using mini-LEDs or micro-LEDs in which a plurality of LEDs corresponding to pixels separated by partition walls formed on the base substrate are arranged. The ON/OFF of each pixel can be realized by the ON/OFF of mini LED or micro LED, and no liquid crystal is required. That is, the substrate with partition walls of the present invention can be used not only for partition walls that separate pixels, but also for partition walls that separate mini-LEDs or micro-LEDs in backlights and the like.

The substrate with partition walls of the present invention preferably further has a light source selected from the group consisting of organic EL units, mini LED units and micro LED units on the base substrate. By using partition walls to separate luminescent light sources selected from organic EL units, mini LED units, and micro LED units, color mixing between pixels can be prevented and the display color purity of the display can be improved.

FIG. 6 shows a cross-sectional view of one aspect of the substrate with partition walls of the present invention having a light source selected from an organic EL unit, a mini LED unit, and a micro LED unit. On the base substrate 1 and between the patterned partition walls 2, there is a light emitting source 6 selected from an organic EL unit, a mini LED unit and a micro LED unit.

The substrate with partition walls of the present invention preferably further has pixels (B) on the light source selected from the group consisting of organic EL units, mini LED units and micro LED units.

FIG. 7 shows a cross-sectional view of an aspect of the substrate with partition walls of the present invention having a light source and a pixel selected from an organic EL unit, a mini LED unit, and a micro LED unit. On the base substrate 1 and between the patterned partition walls 2, there is a light emitting light source 6 selected from an organic EL unit, a mini LED unit and a micro LED unit, and there is a pixel 3 thereon.

Next, the display device of the present invention will be described.

The display device of the present invention includes the substrate with partition walls and a light emitting source. The display device of the present invention preferably has the substrate with partition walls of the present invention, and a light source selected from the group consisting of a liquid crystal unit, an organic EL unit, a mini LED unit and a micro LED unit. As the luminescent light source, a luminescent light source selected from a liquid crystal unit, an organic EL unit, a mini LED unit and a micro LED unit is preferred. In terms of excellent light-emitting characteristics, an organic EL unit is more preferred as the light-emitting light source. The so-called mini LED unit refers to a unit in which multiple LEDs with a length of about 100 μm to 1 mm are arranged vertically and horizontally. The so-called micro LED unit refers to a unit in which multiple LEDs with a length of less than 100 μm are arranged vertically and horizontally.

The manufacturing method of the display device of the present invention will be described with reference to an example of a display device including the substrate with partition walls and the organic EL unit of the present invention. Photosensitive polyimide resin is coated on the glass substrate, and an insulating film with openings is formed using photolithography. After aluminum is sputtered thereon, the aluminum is patterned by photolithography, and a back electrode layer containing aluminum is formed in the opening without the insulating film. Next, as an electron transport layer, a film of tris(8-quinolinolate)aluminum (hereinafter referred to as Alq3) is formed by vacuum evaporation, and then as a light-emitting layer, Alq3 doped with White luminescent layer of dicyanomethylenepyran, quinacridone and 4,4'-bis(2,2-diphenylvinyl)biphenyl. Secondly, as the hole transport layer, N,N'-diphenyl-N,N'-bis(α-naphthyl)-1,1'-biphenyl-4,4'-di Amine films. Finally, as a transparent electrode, a film of indium tin oxide (ITO) is formed by sputtering to produce an organic EL unit with a white light-emitting layer. A display device can be produced by arranging the organic EL unit obtained in the above manner to face the substrate with partition walls and bonding them together with a sealant. [Example]

Hereinafter, although an Example and a comparative example are given and this invention is demonstrated more concretely, this invention is not limited to these ranges. In addition, among the compounds used, the names of the compounds whose abbreviations are used are shown below. PGMEA: propylene glycol monomethyl ether acetate EDM: diethylene glycol ethyl methyl ether DAA: diacetone alcohol BHT: Dibutylhydroxytoluene.

The solid content concentration of the polysiloxane solutions of Synthesis Examples 1 to 3 was determined by the following method. Weigh 1.5 g of the polysiloxane solution into an aluminum cup, and use a heating plate to heat at 250°C for 30 minutes to evaporate the liquid components. The weight of the solid content remaining in the aluminum cup after heating was weighed, and the solid content concentration was determined based on the ratio to the weight before heating.

The weight average molecular weight of the polysiloxane in Synthesis Examples 1 to 3 was measured in terms of polystyrene by the following method. Device: GPC measuring device with RI detector manufactured by Waters (2695) Column: PLgel MIXED-C column (manufactured by Polymer Laboratories, 300 mm) × two (connected in series) Measuring temperature: 40℃ Flow rate: 1 mL/min Solvent: tetrahydrofuran (THF) 0.5 mass% solution Standard material: polystyrene Detection mode: RI.

The content ratio of each repeating unit in the polysiloxane of Synthesis Examples 1 to 3 was determined by the following method. The polysiloxane solution was poured into a nuclear magnetic resonance (NMR) sample tube made of "Teflon" (registered trademark) with a diameter of 10 mm, and ²⁹ Si-NMR was measured. The content ratio of each repeating unit was calculated as the ratio of the integrated value of Si in the organosilane to the integrated value of the entire Si derived from the organosilane. ^{The 29} Si-NMR measurement conditions are shown below. Device: Nuclear Magnetic Resonance Device (JNM-GX270; manufactured by JEOL Ltd.) Measuring method: Gated decoupling method Measuring nuclear frequency: 53.6693 MHz ( ²⁹ Si core) Spectral width: 20000 Hz Pulse width: 12 μs (45° pulse wave) Pulse wave repetition time: 30.0 seconds Solvent: acetone-d6 Standard material: tetramethylsilane Measurement temperature: 23°C Sample rotation speed: 0.0 Hz.

Synthesis Example 1 Polysiloxane (PSL-1) solution Put 71.16 g (0.306 mol) of 3-methacryloxypropylmethyldimethoxysilane, 78.52 g (0.35 mol) of styryltrimethoxysilane, 21.56 g (0.088 mol) of 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, 113.22 g (0.83 mol) of methyltrimethoxysilane, 45.91 g (0.175 mol) of 3-trimethoxysilane Oxysilylpropylsuccinic anhydride, 1.080 g of BHT and 234.92 g of PGMEA were added over 30 minutes while stirring at 40°C. 3.304 g of phosphoric acid was dissolved in 92.14 g of water (relative to the charged monomer). 1.0% by weight) phosphoric acid aqueous solution. Thereafter, the flask was immersed in a 70°C oil bath and stirred for 60 minutes, and then the oil bath was heated to 115°C over 30 minutes. One hour after the temperature rise started, the solution temperature (internal temperature) reached 100°C, and then heating and stirring were performed for 2 hours (internal temperature was 100°C to 110°C) to obtain a polysiloxane solution. Furthermore, during temperature rise and heating stirring, a mixed gas of 95 volume % nitrogen and 5 volume % oxygen was circulated at 0.05 liter/minute. During the reaction, a total of 209 g of methanol and water were distilled off as by-products. PGMEA was added to the obtained polysiloxane solution so that the solid content concentration became 40% by weight, to obtain a polysiloxane (PSL-1) solution. Furthermore, the weight average molecular weight of the obtained polysiloxane (PSL-1) was 12,000. In addition, polysiloxane (PSL-1) is derived from 3-methacryloxypropylmethyldimethoxysilane, styryltrimethoxysilane, 3-(3,4-epoxy The molar ratios of each repeating unit of methylcyclohexyl)propyltrimethoxysilane, methyltrimethoxysilane, and 3-trimethoxysilylpropylsuccinic anhydride are 17.5 mol%, 20 mol%, and 5 mol respectively. %, 47.5 mol% and 10 mol%.

Synthesis Example 2 Polysiloxane (PSL-2) solution Put 203.13 g (0.831 mol) of diphenyldimethoxysilane, 76.06 g (0.306 mol) of 3-methacryloxypropyltrimethoxysilane, 21.56 g ( 0.088 mol) of 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, 42.08 g (0.350 mol) of dimethyldimethoxysilane, 45.91 g (0.175 mol) of 3-trimethyl Oxysilylpropylsuccinic anhydride, 1.475 g of BHT and 308.45 g of PGMEA were added over 30 minutes while stirring at 40°C. 3.887 g of phosphoric acid was dissolved in 76.39 g of water (relative to the charged monomer). 1.0% by weight) phosphoric acid aqueous solution. Thereafter, the flask was immersed in a 70°C oil bath and stirred for 60 minutes, and then the oil bath was heated to 115°C over 30 minutes. One hour after the temperature rise started, the solution temperature (internal temperature) reached 100°C, and then heating and stirring were performed for 2 hours (internal temperature was 100°C to 110°C) to obtain a polysiloxane solution. Furthermore, during temperature rise and heating stirring, a mixed gas of 95 volume % nitrogen and 5 volume % oxygen was circulated at 0.05 liter/minute. During the reaction, a total of 173.99 g of methanol and water were distilled off as by-products. PGMEA was added to the obtained polysiloxane solution so that the solid content concentration became 40% by weight, and a polysiloxane (PSL-2) solution was obtained. Furthermore, the weight average molecular weight of the obtained polysiloxane (PSL-2) was 6,000. In addition, polysiloxane (PSL-2) is derived from diphenyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-(3,4-epoxy ring The molar ratios of each repeating unit of hexyl)propyltrimethoxysilane, dimethyldimethoxysilane, and 3-trimethoxysilylpropylsuccinic anhydride are 47.5 mol%, 17.5 mol%, and 5 mol respectively. %, 20 mol% and 10 mol%.

Synthesis Example 3 Polysiloxane (PSL-5) solution Put 213.82 g (0.875 mol) of diphenyldimethoxysilane and 43.12 g (0.175 mol) of 3-(3,4-epoxycyclohexyl)propyltrimethoxy into a 1000 ml three-necked flask. Silane, 68.86 g (0.263 mol) tetraethoxysilane, 59.59 g (0.438 mol) methyltrimethoxysilane, 1.413 g BHT and 298.06 g PGMEA were added over 30 minutes while stirring at 40°C. A phosphoric acid aqueous solution in which 3.854 g of phosphoric acid (1.0% by weight relative to the charged monomer) is dissolved in 83.48 g of water. Thereafter, the flask was immersed in a 70°C oil bath and stirred for 60 minutes, and then the oil bath was heated to 115°C over 30 minutes. One hour after the temperature rise started, the solution temperature (internal temperature) reached 100°C, and then heating and stirring were performed for 2 hours (internal temperature was 100°C to 110°C) to obtain a polysiloxane solution. Furthermore, during temperature rise and heating stirring, a mixed gas of 95 volume % nitrogen and 5 volume % oxygen was circulated at 0.05 liter/minute. During the reaction, a total of 282.58 g of methanol and water were distilled off as by-products. PGMEA was added to the obtained polysiloxane solution so that the solid content concentration became 40% by weight, to obtain a polysiloxane (PSL-3) solution. Furthermore, the weight average molecular weight of the obtained polysiloxane (PSL-3) was 5,500. In addition, polysiloxane (PSL-3) is derived from diphenyldimethoxysilane, 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, tetraethoxysilane, The molar ratios of each repeating unit of methyltrimethoxysilane are 50 mol%, 10 mol%, 15 mol% and 25 mol% respectively. The compositions of Synthesis Examples 1 to 3 are summarized in Table 1.

[Table 1] [Table 1] Raw materials (mol%) Alkoxysilane constituting general formula (1) Alkoxysilane constituting general formula (2) Other alkoxysilanes Synthesis example 1 Polysiloxane (PSL-1) solution 3-Methacryloxypropylmethyldimethoxysilane (17.5) Styryltrimethoxysilane (20) 3-(3,4-Epoxycyclohexyl)propyltrimethoxysilane (5) Methyltrimethoxysilane (47.5) 3-Trimethoxysilylpropyl Succinic anhydride (10) - Synthesis example 2 Polysiloxane (PSL-2) solution Diphenyldimethoxysilane (47.5) Dimethyldimethoxysilane (20) 3-Methacryloxypropyltrimethoxysilane (17.5) 3-(3,4-Epoxycyclohexyl)propyltrimethoxysilane (5) 3-Trimethoxysilylpropylbutanedi Anhydrides (10) - Synthesis example 3 Polysiloxane (PSL-3) solution Diphenyldimethoxysilane (50) Methyltrimethoxysilane (25) 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane (10) Tetraethoxysilane (15)

Synthesis Example 4 Green organic phosphor: 3,5-dibromobenzaldehyde (3.0 g), 4-tert-butylphenylboronic acid (5.3 g), tetrakis(triphenylphosphine)palladium (0) (0.4 g) ) and potassium carbonate (2.0 g) were put into the flask and replaced with nitrogen. Degassed toluene (30 mL) and degassed water (10 mL) were added thereto, and the mixture was refluxed for 4 hours. The reaction solution was cooled to room temperature, and after liquid separation, the organic layer was washed with saturated brine. The organic layer was dried over magnesium sulfate and filtered, and then the solvent was distilled off. The obtained reaction product was purified by silica gel column chromatography to obtain 3,5-bis(4-tert-butylphenyl)benzaldehyde (3.5 g) as a white solid. Secondly, put 3,5-bis(4-tert-butylphenyl)benzaldehyde (1.5 g) and 2,4-dimethylpyrrole (0.7 g) into the flask, and add dehydrated dichloromethane (200 mL ) and trifluoroacetic acid (1 drop), stir under nitrogen atmosphere for 4 hours. A dehydrated methylene chloride solution of 2,3-dichloro-5,6-dicyano-1,4-benzoquinone (0.85 g) was added to the reaction mixture, and the mixture was further stirred for 1 hour. After the reaction was completed, boron trifluoride diethyl ether complex (7.0 mL) and diisopropylethylamine (7.0 mL) were added. After stirring for 4 hours, water (100 mL) was added and stirred, and the organic layer was Carry out liquid dispensing. The organic layer was dried over magnesium sulfate and filtered, and then the solvent was distilled off. The obtained reaction product was purified by silica gel column chromatography to obtain 0.4 g of green powder (yield 17%). The ¹ H-NMR analysis results of the obtained green powder were as follows, confirming that the green powder obtained above was [G-1] represented by the following structural formula.

¹ H-NMR (CDCl ₃ (d=ppm)): 7.95(s, 1H), 7.63-7.48(m, 10H), 6.00(s, 2H), 2.58(s, 6H), 1.50(s, 6H) , 1.37(s, 18H).

[Chemical 8]

Synthesis Example 5 Red organic phosphor was mixed with 300 mg of 4-(4-tert-butylphenyl)-2-(4-methoxyphenyl)pyrrole and 2-methoxybenzoyl chloride under nitrogen flow. A mixed solution of 201 mg and 10 ml of toluene was heated at 120°C for 6 hours. After cooling to room temperature, the solvent is evaporated. The obtained residue was washed with 20 ml of ethanol and dried under vacuum to obtain 2-(2-methoxybenzoyl)-3-(4-tert-butylphenyl)-5- (4-Methoxyphenyl)pyrrole 260 mg. Next, under nitrogen flow, 260 mg of 2-(2-methoxybenzyl)-3-(4-tert-butylphenyl)-5-(4-methoxyphenyl)pyrrole, 4 A mixed solution of -(4-tert-butylphenyl)-2-(4-methoxyphenyl)pyrrole 180 mg, methanesulfonic anhydride 206 mg and degassed toluene 10 ml was heated at 125°C for 7 hours. After the reaction mixture was cooled to room temperature, 20 ml of water was injected, and extraction was performed with 30 ml of methylene chloride. The organic layer was washed twice with 20 ml of water, evaporated, and dried under vacuum to obtain the pyrromethene form as a residue. Next, under nitrogen flow, 305 mg of diisopropylethylamine and 670 mg of boron trifluoride diethyl ether complex were added to the obtained mixed solution of pyrrole methylene and 10 ml of toluene, and the mixture was heated at room temperature. Stir for 3 hours. 20 ml of water was added to the reaction mixture, and the mixture was extracted with 30 ml of methylene chloride. The organic layer was washed twice with 20 ml of water, dried over magnesium sulfate, and then evaporated. After purification by silica column chromatography and vacuum drying, 0.27 g of purple-red powder was obtained (yield 70%). The results of ¹ H-NMR analysis of the obtained purple-red powder are as follows, confirming that the above-obtained purple-red powder is [R-1] represented by the following structural formula.

¹ H-NMR (CDCl ₃ (d=ppm)): 1.19(s, 18H), 3.42(s, 3H), 3.85(s, 6H), 5.72(d, 1H), 6.20(t, 1H), 6.42 -6.97(m, 16H), 7.89(d, 4H).

[Chemical 9]

Example 1 Resin composition for partition walls (P-1) 5.00 g of titanium dioxide pigment (CR-97; manufactured by Ishihara Sangyo Co., Ltd. (hereinafter "CR-97")) as a white pigment and 0.03 g of a blue pigment (Pigment Blue 15:6N (hereinafter " PB15: 6N")), 0.02 g of purple pigment (Pigment Violet 23 (hereinafter "PV23")), 1.00 g of phosphate polyester ("DISPERBYK" (registered trademark) as a dispersant - 111; manufactured by BYK-Chemie Japan Co., Ltd. (hereinafter "DISPERBYK-111")), 4.00 g of PGMEA was mixed as a solvent, and a grinding machine filled with zirconia beads was used Disperse using a dispersing machine to obtain a pigment dispersion (MW-1). In addition, 0.20 g of an organic silver compound (silver neodecanoate) as a yellow precursor compound was dissolved in 1.80 g of EDM to obtain a yellow precursor compound solution (YZ-1).

Next, 9.41 g of the polysiloxane (PSL-1) solution obtained in Synthesis Example 1, 6.03 g of the pigment dispersion liquid (MW-1), and 1.00 g of the yellow precursor compound solution (YZ-1) were prepared. , 0.025 g of tert-butylhydroquinone as reducing agent, ethyl ketone as photopolymerization initiator, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carb Azol-3-yl]-,1-(O-acetyl oxime) ("Irgacure" (registered trademark) OXE-02, manufactured by BASF Japan Co., Ltd. (hereinafter "OXE-2")) 0.200 g. Bis(2,4,6-trimethylbenzyl)-phenylphosphine oxide ("Irgacure" 819, manufactured by BASF Japan Co., Ltd. (hereinafter "Irgacure"- 819")) 0.200 g, dipentaerythritol hexaacrylate as a photopolymerizable compound ("KAYARAD" (registered trademark) DPHA, manufactured by Shin Nippon Pharmaceutical Co., Ltd. (hereinafter "DPHA")) 2.00 g. Photopolymerizable fluorine-containing compound as a liquid-repellent compound ("Megafac" (registered trademark) RS-72A, 20% by weight PGMEA diluted solution product, manufactured by DIC Co., Ltd. (hereinafter "RS-72A") ) 0.25 g, 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate ("Celloxide" (registered trademark) 2021P, Daicel ( Daicel) Co., Ltd. (hereinafter "Celloxide (registered trademark) 2021P")) 0.020 g, and acrylic surfactant ("BYK" (registered trademark) 352, BYK- 0.10 g of a 10% by weight dilute solution of PGMEA (equivalent to a concentration of 500 ppm) manufactured by Chemie Japan Co., Ltd. (hereinafter "BYK-352")) was dissolved in 0.76 g of the solvent PGMEA and stirred. The obtained mixture was filtered with a 5.0 μm filter to obtain a resin composition for partition walls (P-1).

Example 2 Resin composition for partition walls (P-2) Mix 5.00 g of CR-97 as a white pigment, 0.015 g of blue pigment PB15:6N as a shading pigment, 0.035 g of purple pigment PV23, and 1.00 g of phosphate polyester DISPERBYK as a dispersant. )-111. Mix 4.00 g of PGMEA as a solvent and disperse it using a grinding type disperser filled with zirconia beads to obtain a pigment dispersion (MW-2). A resin composition (P-2) for partition walls was obtained in the same manner as in Example 1, except that the pigment dispersion liquid (MW-2) was used instead of the pigment dispersion liquid (MW-1).

Example 3 Resin composition for partition walls (P-3) Mix 5.00 g of CR-97 as a white pigment, 0.035 g of blue pigment PB15:6N as a shading pigment, 0.015 g of purple pigment PV23, and 1.00 g of phosphate polyester DISPERBYK as a dispersant. )-111. Mix 4.00 g of PGMEA as a solvent and disperse it using a grinding type disperser filled with zirconia beads to obtain a pigment dispersion (MW-3). A resin composition (P-3) for partition walls was obtained in the same manner as in Example 1, except that the pigment dispersion liquid (MW-3) was used instead of the pigment dispersion liquid (MW-1).

Example 4 Resin composition for partition walls (P-4) Mix 5.00 g of CR-97 as a white pigment, 0.008 g of blue pigment PB15:6N as a shading pigment, 0.043 g of purple pigment PV23, and 1.00 g of phosphate polyester DISPERBYK as a dispersant. )-111. Mix 4.00 g of PGMEA as a solvent and disperse it using a grinding type disperser filled with zirconia beads to obtain a pigment dispersion (MW-4). A resin composition (P-4) for partition walls was obtained in the same manner as in Example 1, except that a pigment dispersion liquid (MW-4) was used instead of the pigment dispersion liquid (MW-1).

Example 5 Resin composition for partition walls (P-5) Mix 5.00 g of CR-97 as a white pigment, 0.043 g of blue pigment PB15:6N as a shading pigment, 0.008 g of purple pigment PV23, and 1.00 g of phosphate polyester DISPERBYK as a dispersant. )-111. Mix 4.00 g of PGMEA as a solvent and disperse it using a grinding type disperser filled with zirconia beads to obtain a pigment dispersion (MW-5). A resin composition (P-5) for partition walls was obtained in the same manner as in Example 1, except that a pigment dispersion liquid (MW-5) was used instead of the pigment dispersion liquid (MW-1).

Example 6 Resin composition for partition walls (P-6) Mix 5.00 g of CR-97 as a white pigment, 0.060 g of blue pigment PB15:6N as a shading pigment, 0.040 g of purple pigment PV23, and 1.00 g of phosphate polyester DISPERBYK as a dispersant. )-111. Mix 4.00 g of PGMEA as a solvent and disperse it using a grinding type disperser filled with zirconia beads to obtain a pigment dispersion (MW-6). Add 6.06 g of pigment dispersion (MW-6) instead of the pigment dispersion (MW-1), set the added amount of polysiloxane (PSL-1) solution to 9.34 g, and set the added amount of PGMEA to A resin composition (P-6) for partition walls was obtained in the same manner as in Example 1 except that the weight was 0.81 g.

Example 7 Resin composition for partition walls (P-7) Mix 5.00 g of CR-97 as a white pigment, 0.10 g of blue pigment PB15:6N as a shading pigment, 0.067 g of purple pigment PV23, and 1.00 g of phosphate polyester DISPERBYK as a dispersant. )-111. Mix 4.00 g of PGMEA as a solvent and disperse it using a grinding type disperser filled with zirconia beads to obtain a pigment dispersion (MW-7). Add 6.10 g of pigment dispersion (MW-7) instead of the pigment dispersion (MW-1), set the added amount of polysiloxane (PSL-1) solution to 9.24 g, and set the added amount of PGMEA to A resin composition (P-7) for partition walls was obtained in the same manner as in Example 1 except that the weight was 0.87 g.

Example 8 Resin composition for partition walls (P-8) Mix 5.00 g of CR-97 as a white pigment, 0.36 g of blue pigment PB15:6N as a shading pigment, 0.24 g of purple pigment PV23, and 1.00 g of phosphate polyester DISPERBYK as a dispersant. )-111. Mix 4.00 g of PGMEA as a solvent and disperse it using a grinding type disperser filled with zirconia beads to obtain a pigment dispersion (MW-8). Add 6.36 g of pigment dispersion (MW-8) instead of the pigment dispersion (MW-1), set the added amount of polysiloxane (PSL-1) solution to 8.59 g, and set the added amount of PGMEA to The resin composition for partition walls (P-8) was obtained in the same manner as in Example 1 except that the weight was 1.26 g.

Example 9 Resin composition for partition walls (P-9) Mix 5.00 g of CR-97 as a white pigment, 0.020 g of blue pigment PB15:6N as a shading pigment, 0.013 g of purple pigment PV23, and 1.00 g of phosphate polyester DISPERBYK as a dispersant. )-111. Mix 4.00 g of PGMEA as a solvent and disperse it using a grinding type disperser filled with zirconia beads to obtain a pigment dispersion (MW-9). Add 6.02 g of pigment dispersion (MW-9) instead of the pigment dispersion (MW-1), set the added amount of polysiloxane (PSL-1) solution to 9.44 g, and set the added amount of PGMEA to The resin composition for partition walls (P-9) was obtained in the same manner as in Example 1 except that the weight was 0.75 g.

Example 10 Resin composition for partition walls (P-10) Mix 5.00 g of CR-97 as a white pigment, 0.010 g of blue pigment PB15:6N as a shading pigment, 0.0067 g of purple pigment PV23, and 1.00 g of phosphate polyester DISPERBYK as a dispersant. )-111. Mix 4.00 g of PGMEA as a solvent and disperse it using a grinding type disperser filled with zirconia beads to obtain a pigment dispersion (MW-10). Add 6.01 g of pigment dispersion (MW-10) instead of the pigment dispersion (MW-1), set the added amount of polysiloxane (PSL-1) solution to 9.46 g, and set the added amount of PGMEA to The resin composition for partition walls (P-10) was obtained in the same manner as in Example 1 except that the weight was 0.73 g.

Example 11 Resin composition for partition walls (P-11) 5.00 g of CR-97 as a white pigment, 0.00050 g of blue pigment PB15:6N as a shading pigment, 0.00033 g of purple pigment PV23, and 1.00 g of phosphate polyester DISPERBYK as a dispersant )-111. Mix 4.00 g of PGMEA as a solvent and disperse it using a grinding type disperser filled with zirconia beads to obtain a pigment dispersion (MW-11). Add 6.00 g of pigment dispersion (MW-11) instead of the pigment dispersion (MW-1), set the added amount of polysiloxane (PSL-1) solution to 9.49 g, and set the added amount of PGMEA to A resin composition (P-11) for partition walls was obtained in the same manner as in Example 1 except that the weight was 0.72 g.

Example 12 Resin composition for partition walls (P-12) As the yellow precursor compound, a 10% PGMEA solution of the organic silver compound (APAG-01) obtained in Preparation Example 8 described below was used instead of the yellow precursor compound solution (YZ-1), and the amount of PGMEA added was 0.063 g. , except that 0.70 g of EDM was added, a resin composition (P-12) for partition walls was obtained in the same manner as in Example 1.

Example 13 Resin composition for partition walls (P-13) 0.20 g of an organic copper compound (copper neodecanoate) as a yellow precursor compound was dissolved in 1.80 g of EDM to obtain a yellow precursor compound solution (YZ-2). The resin composition for partition walls (P) was obtained in the same manner as in Example 1, except that the yellow precursor compound solution (YZ-2) was used instead of the yellow precursor compound solution (YZ-1) -13).

Example 14 Resin composition for partition walls (P-14) 0.20 g of a phenolic compound (1,4-dihydroxyanthrahydroquinone) as a yellow precursor compound was dissolved in 1.80 g of EDM to obtain a yellow precursor compound solution (YZ-3). Make 7.13 g of polysiloxane (PSL-1) solution, 4.82 g of MW-1, 2.40 g of the yellow precursor compound solution (YZ-3), 0.020 g of tert-butylhydroquinone, 0.160 g of OXE-02, 0.160 g of Omnirad-819, 1.60 g of DPHA, 0.20 g of RS-72A, 0.016 g of Celloxide 2021P, BYK-352 of PGMEA 10 Dissolve 0.10 g of the weight% dilute solution in 3.40 g of the solvent PGMEA and stir. The obtained mixture was filtered through a 5.0 μm filter to obtain a resin composition for partition walls (P-14).

Example 15 Resin composition for partition walls (P-15) As the yellow precursor compound, 1.60 g of the yellow precursor compound solution (YZ-1) was added instead of the yellow precursor compound solution (YZ-3), and the added amount of the polysiloxane (PSL-1) solution was set to 7.33 g, except that the added amount of PGMEA was 4.00 g, a resin composition (P-15) for partition walls was obtained in the same manner as in Example 14.

Example 16 Resin composition for partition walls (P-16) Set the addition amount of the yellow precursor compound solution (YZ-1) to 4.80 g, the addition amount of the polysiloxane (PSL-1) solution to 6.53 g, and the addition amount of PGMEA to 1.60 g. In addition, Except for this, a resin composition (P-16) for partition walls was obtained in the same manner as in Example 15.

Example 17 Resin composition for partition walls (P-17) Set the addition amount of the yellow precursor compound solution (YZ-1) to 0.50 g, the addition amount of the polysiloxane (PSL-1) solution to 9.54 g, and the addition amount of PGMEA to 1.14 g. In addition, Except for this, a resin composition (P-17) for partition walls was obtained in the same manner as in Example 1.

Example 18 Resin composition for partition walls (P-18) Set the addition amount of the yellow precursor compound solution (YZ-1) to 0.080 g, the addition amount of the polysiloxane (PSL-1) solution to 9.64 g, and the addition amount of PGMEA to 1.45 g. In addition, Except for this, a resin composition (P-18) for partition walls was obtained in the same manner as in Example 1.

Example 19 Resin composition for partition walls (P-19) Ethylene bis(oxyethylene)bis[3-(5-tert-butyl-4-hydroxy-m-tolyl)propionate] ("IRGANOX" (registered trademark)) is added as a polymerization inhibitor 1010, manufactured by BASF Japan (hereinafter "IRGANOX (registered trademark) 1010")) was used in the same manner as in Example 1 except that the reducing agent tert-butylhydroquinone was replaced. The resin composition for partition walls (P-19) is obtained in this way.

Example 20 Resin composition for partition walls (P-20) Mix 5.00 g of CR-97 as a white pigment, 0.030 g of blue pigment PB15:6N as a light-shielding pigment, 0.020 g of purple pigment PV23, and 1.00 g of an alkylolaminoamide-based dispersant as a dispersant. DISPERBYK-109 and 4.00 g of PGMEA as a solvent were mixed and dispersed using a grinding type disperser filled with zirconia beads to obtain a pigment dispersion (MW-12). A resin composition for partition walls (P-20) was obtained in the same manner as in Example 1, except that a pigment dispersion liquid (MW-12) was added instead of the pigment dispersion liquid (MW-1).

Example 21 Resin composition for partition walls (P-21) A resin composition (P-21) for partition walls was obtained in the same manner as in Example 1, except that a polysiloxane (PSL-2) solution was added as the resin instead of the polysiloxane (PSL-1) solution. .

Example 22 Resin composition for partition walls (P-22) Mix 5.00 g of CR-97 as a white pigment, 1.00 g of DISPERBYK-111 as a dispersant, and 4.00 g of PGMEA as a solvent, using a grinding type disperser filled with zirconia beads. Disperse to obtain a pigment dispersion (MW-13). Add 6.00 g of pigment dispersion (MW-13) instead of the pigment dispersion (MW-1), set the added amount of polysiloxane (PSL-1) solution to 9.49 g, and set the added amount of PGEMA to A resin composition (P-22) for partition walls was obtained in the same manner as in Example 1 except that the weight was 0.72 g.

Example 23 Resin composition for partition walls (P-23) Mix 5.00 g of CR-97 as a white pigment, 0.050 g of purple pigment PV23 as a shading pigment, 1.00 g of DISPERBYK-111 as a dispersant, and 4.00 g of PGMEA as a solvent. Disperse using a grinding type disperser filled with zirconia beads to obtain a pigment dispersion (MW-14). A resin composition for partition walls (P-23) was obtained in the same manner as in Example 1 except that a pigment dispersion liquid (MW-14) was added instead of the pigment dispersion liquid (MW-1).

Example 24 Resin composition for partition walls (P-24) Use 5.00 g of CR-97 as a white pigment, 0.050 g of blue pigment PB15:6N as a shading pigment, 1.00 g of DISPERBYK-111 as a dispersant, and 4.00 g of a solvent. PGMEA was mixed and dispersed using a grinding type disperser filled with zirconia beads to obtain a pigment dispersion (MW-15). A resin composition for partition walls (P-24) was obtained in the same manner as in Example 1 except that a pigment dispersion liquid (MW-15) was added instead of the pigment dispersion liquid (MW-1).

Example 25 Resin composition for partition walls (P-25) As a white pigment, 5.00 g of titanium dioxide pigment (PFC105; manufactured by Ishihara Sangyo Co., Ltd. (hereinafter "PFC105")), 0.030 g of blue pigment PB15:6N as a light-shielding pigment, and 0.020 g of purple pigment PV23 were dispersed. 1.00 g of DISPERBYK-111 as an agent and 4.00 g of PGMEA as a solvent were mixed and dispersed using a grinding type disperser filled with zirconia beads to obtain a pigment dispersion (MW-16). A resin composition for partition walls (P-25) was obtained in the same manner as in Example 1, except that a pigment dispersion liquid (MW-16) was added instead of the pigment dispersion liquid (MW-1).

Example 26 Resin composition for partition walls (P-26) Disperse 5.00 g of titanium dioxide pigment (R960; manufactured by Ishihara Sangyo Co., Ltd. (hereinafter "R960")) as a white pigment, 0.030 g of blue pigment PB15:6N as a light-shielding pigment, and 0.020 g of purple pigment PV23. 1.00 g of DISPERBYK-111 as an agent and 4.00 g of PGMEA as a solvent were mixed and dispersed using a grinding type disperser filled with zirconia beads to obtain a pigment dispersion (MW-17). A resin composition (P-26) for partition walls was obtained in the same manner as in Example 1, except that a pigment dispersion liquid (MW-17) was added instead of the pigment dispersion liquid (MW-1).

Example 27 Resin composition for partition walls (P-27) As quinone, 10.4 g of polysiloxane (PSL-3) solution, 6.03 g of MW-1, 1.00 g of yellow precursor compound solution (YZ-1), and 0.025 g of tert-butylhydroquinone were used. 2.00 g of diazide compound THP-17 (trade name, manufactured by Toyo Gosei Industry Co., Ltd.), 0.25 g of RS-72A, 0.020 g of Celloxide 2021P, 0.10 g of BYK-352 A 10% by weight dilute solution of PGMEA was dissolved in 0.16 g of solvent PGMEA and stirred. The obtained mixture was filtered with a 5.0 μm filter to obtain a resin composition for partition walls (P-27).

Comparative Example 1 Resin composition for partition walls (P-28) Mix 0.030 g of blue pigment PB15:6N as a shading pigment, 0.020 g of purple pigment PV23, 1.00 g of DISPERBYK-111 as a dispersant, and 4.00 g of PGMEA as a solvent, and use A grinding type disperser filled with zirconia beads was used to disperse the pigment dispersion (MW-18). Make 13.4 g of polysiloxane (PSL-1) solution, 2.42 g of MW-18, 0.80 g of yellow precursor compound solution (YZ-1), 0.16 g of OXE-02, and 0.16 g of Ominilla Omnirad-819, tert-butyl hydroquinone 0.020 g, 1.60 g DPHA, 0.20 g RS-72A, 0.016 g Celloxide 2021P, BYK-352 PGMEA 10% by weight Dissolve 0.10 g of the diluted solution in 1.00 g of solvent PGMEA and stir. The obtained mixture was filtered through a 5.0 μm filter to obtain a resin composition for partition walls (P-28).

Comparative Example 2 Resin composition for partition walls (P-29) The yellow precursor compound solution (YZ-1) was not added, the added amount of the polysiloxane (PSL-1) solution was set to 9.66 g, and the added amount of PGMEA was set to 1.51 g. Otherwise, the same conditions were used as in the Examples. 1 Obtain the resin composition for partition walls (P-29) in the same manner.

Comparative Example 3 Resin composition for partition walls (P-30) Use 5.00 g of CR-97 as a white pigment, 0.033 g of titanium nitride as a black pigment as a shading pigment, 1.00 g of DISPERBYK-111 as a dispersant, and 4.00 g of PGMEA as a solvent. Mix and disperse using a grinding type disperser filled with zirconia beads to obtain a pigment dispersion (MW-19). Add 6.02 g of pigment dispersion (MW-19) instead of the pigment dispersion (MW-1), set the added amount of polysiloxane (PSL-1) solution to 9.42 g, and set the added amount of PGMEA to A resin composition (P-30) for partition walls was obtained in the same manner as in Example 1 except that the weight was 0.75 g. The compositions of Examples 1 to 27 and Comparative Examples 1 to 3 are summarized in Table 2.

[Table 2-1] [Table 2-1] Resin composition for partition walls Resin (wt%) Sensitizer (weight%) white pigment Yellow precursor compound (wt%) shading pigment Reducing agent (weight %) Phosphate polyester (wt%) Liquid repellent compound (weight %) Photopolymerizable compound (weight %) Solvent (weight%) Other additives (wt%) Pigments (wt%) surface treatment Blue pigment (wt%) Purple pigment (wt%) Weight ratio of blue pigment to purple pigment Other opaque pigments (wt%) polymerization inhibitor Adhesion improver surfactant Example 1 P-1 PSL-1(18.8) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al ₂ O ₃ /ZrO ₂ Silver neodecanoate (0.5) PB15: 6N (0.09) PV23 (0.06) 60/40 - tert-butylhydroquinone (0.13) DISPERBYK-111 (3.0) RS-72A (0.25) DPHA (10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 2 P-2 PSL-1(18.8) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al ₂ O ₃ /ZrO ₂ Silver neodecanoate (0.5) PB15: 6N (0.05) PV23 (0.11) 30/70 - tert-butylhydroquinone (0.13) DISPERBYK-111 (3.0) RS-72A (0.25) DPHA (10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 3 P-3 PSL-1(18.8) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al ₂ O ₃ /ZrO ₂ Silver neodecanoate (0.5) PB15: 6N (0.11) PV23 (0.05) 70/30 - tert-butylhydroquinone (0.13) DISPERBYK-111 (3.0) RS-72A (0.25) DPHA (10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 4 P-4 PSL-1(18.8) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al ₂ O ₃ /ZrO ₂ Silver neodecanoate (0.5) PB15: 6N (0.02) PV23 (0.13) 15/85 - tert-butylhydroquinone (0.13) DISPERBYK-111 (3.0) RS-72A (0.25) DPHA (10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 5 P-5 PSL-1(18.8) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al ₂ O ₃ /ZrO ₂ Silver neodecanoate (0.5) PB15: 6N (0.13) PV23 (0.02) 85/15 - tert-butylhydroquinone (0.13) DISPERBYK-111 (3.0) RS-72A (0.25) DPHA (10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 6 P-6 PSL-1 (18.7) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al ₂ O ₃ /ZrO ₂ Silver neodecanoate (0.5) PB15: 6N (0.18) PV23 (0.12) 60/40 - tert-butylhydroquinone (0.13) DISPERBYK-111 (3.0) RS-72A (0.25) DPHA (10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 7 P-7 PSL-1(18.5) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al ₂ O ₃ /ZrO ₂ Silver neodecanoate (0.5) PB15: 6N (0.30) PV23 (0.20) 60/40 - tert-butylhydroquinone (0.13) DISPERBYK-111 (3.0) RS-72A (0.25) DPHA (10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 8 P-8 PSL-1 (17.2) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al ₂ O ₃ /ZrO ₂ Silver neodecanoate (0.5) PB15: 6N (1.08) PV23 (0.72) 60/40 - tert-butylhydroquinone (0.13) DISPERBYK-111 (3.0) RS-72A (0.25) DPHA (10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 9 P-9 PSL-1 (18.9) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al ₂ O ₃ /ZrO ₂ Silver neodecanoate (0.5) PB15: 6N (0.06) PV23 (0.04) 60/40 - tert-butylhydroquinone (0.13) DISPERBYK-111 (3.0) RS-72A (0.25) DPHA (10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 10 P-10 PSL-1 (18.9) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al ₂ O ₃ /ZrO ₂ Silver neodecanoate (0.5) PB15: 6N (0.03) PV23 (0.02) 60/40 - tert-butylhydroquinone (0.13) DISPERBYK-111 (3.0) RS-72A (0.25) DPHA (10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 11 P-11 PSL-1 (19.0) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al ₂ O ₃ /ZrO ₂ Silver neodecanoate (0.5) PB15: 6N (0.002) PV23 (0.001) 60/40 - tert-butylhydroquinone (0.13) DISPERBYK-111 (3.0) RS-72A (0.25) DPHA (10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm)

[Table 2-2] [Table 2-2] Resin composition for partition walls Resin (wt%) Sensitizer (weight%) white pigment Yellow precursor compound (wt%) shading pigment Reducing agent (weight %) Phosphate polyester (wt%) Liquid repellent compound (weight %) Photopolymerizable compound (weight %) Solvent (weight%) Other additives (wt%) Pigments (wt%) surface treatment Blue pigment (wt%) Purple pigment (wt%) Weight ratio of blue pigment to purple pigment Other opaque pigments (wt%) polymerization inhibitor Adhesion improver surfactant Example 12 P-12 PSL-1(18.8) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al ₂ O ₃ /ZrO ₂ APAG-1 (0.5) PB15: 6N (0.09) PV23 (0.06) 60/40 - tert-butylhydroquinone (0.13) DISPERBYK-111 (3.0) RS-72A (0.25) DPHA (10) PGMEA (45) EDM (5) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 13 P-13 PSL-1(18.8) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al ₂ O ₃ /ZrO ₂ Copper neodecanoate (0.5) PB15: 6N (0.09) PV23 (0.06) 60/40 - tert-butylhydroquinone (0.13) DISPERBYK-111 (3.0) RS-72A (0.25) DPHA (10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 14 P-14 PSL-1 (17.8) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al ₂ O ₃ /ZrO ₂ 1,4-Dihydroxyanthrahydroquinone (1.5) PB15: 6N (0.09) PV23 (0.06) 60/40 - tert-butylhydroquinone (0.13) DISPERBYK-111 (3.0) RS-72A (0.25) DPHA (10) PGMEA (49) EDM (11) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 15 P-15 PSL-1 (18.3) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al ₂ O ₃ /ZrO ₂ Silver Neodecanoate (1.0) PB15: 6N (0.09) PV23 (0.06) 60/40 - tert-butylhydroquinone (0.13) DISPERBYK-111 (3.0) RS-72A (0.25) DPHA (10) PGMEA (53) EDM (7) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 16 P-16 PSL-1 (16.3) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al ₂ O ₃ /ZrO ₂ Silver Neodecanoate (3.0) PB15: 6N (0.09) PV23 (0.06) 60/40 - tert-butylhydroquinone (0.13) DISPERBYK-111 (3.0) RS-72A (0.25) DPHA (10) PGMEA (38) EDM (22) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 17 P-17 PSL-1 (19.1) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al ₂ O ₃ /ZrO ₂ Silver neodecanoate (0.25) PB15: 6N (0.09) PV23 (0.06) 60/40 - tert-butylhydroquinone (0.13) DISPERBYK-111 (3.0) RS-72A (0.25) DPHA (10) PGMEA (48) EDM (2) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 18 P-18 PSL-1 (19.3) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al ₂ O ₃ /ZrO ₂ Silver neodecanoate (0.04) PB15: 6N (0.09) PV23 (0.06) 60/40 - tert-butylhydroquinone (0.13) DISPERBYK-111 (3.0) RS-72A (0.25) DPHA (10) PGMEA (49.6) EDM (0.4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 19 P-19 PSL-1(18.8) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al ₂ O ₃ /ZrO ₂ Silver neodecanoate (0.5) PB15: 6N (0.09) PV23 (0.06) 60/40 - - DISPERBYK-111 (3.0) RS-72A (0.25) DPHA (10) PGMEA (46) EDM (4) IRGANOX 1010 (0.13) Celloxide 2021P (0.10) BYK-352 (500 ppm)

[Table 2-3] [Table 2-3] Resin composition for partition walls Resin (wt%) Sensitizer (weight%) white pigment Yellow precursor compound (wt%) shading pigment Reducing agent (weight %) Phosphate polyester (wt%) Liquid repellent compound (weight %) Photopolymerizable compound (weight %) Solvent (weight%) Other additives (wt%) Pigments (wt%) surface treatment Blue pigment (wt%) Purple pigment (wt%) Weight ratio of blue pigment to purple pigment Other opaque pigments (wt%) polymerization inhibitor Adhesion improver surfactant Example 20 P-20 PSL-1(18.8) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al ₂ O ₃ /ZrO ₂ Silver neodecanoate (0.5) PB15: 6N (0.09) PV23 (0.06) 60/40 - tert-butylhydroquinone (0.13) DISPERBYK-109 (3.0) RS-72A (0.25) DPHA (10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 21 P-21 PSL-2 (18.8) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al ₂ O ₃ /ZrO ₂ Silver neodecanoate (0.5) PB15: 6N (0.09) PV23 (0.06) 60/40 - tert-butylhydroquinone (0.13) DISPERBYK-111 (3.0) RS-72A (0.25) DPHA (10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 22 P-22 PSL-1 (19.0) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al ₂ O ₃ /ZrO ₂ Silver neodecanoate (0.5) - - - - tert-butylhydroquinone (0.13) DISPERBYK-111 (3.0) RS-72A (0.25) DPHA (10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 23 P-23 PSL-1(18.8) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al ₂ O ₃ /ZrO ₂ Silver neodecanoate (0.5) - PV23 (0.15) 0/100 - tert-butylhydroquinone (0.13) DISPERBYK-111 (3.0) RS-72A (0.25) DPHA (10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 24 P-24 PSL-1(18.8) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al ₂ O ₃ /ZrO ₂ Silver neodecanoate (0.5) PB15: 6N (0.15) - 100/0 - tert-butylhydroquinone (0.13) DISPERBYK-111 (3.0) RS-72A (0.25) DPHA (10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 25 P-25 PSL-1(18.8) OXE-02 (1.0) Omnirad-819 (1.0) PFC105(15.0) Al ₂ O ₃ /ZrO ₂ /SiO ₂ Silver neodecanoate (0.5) PB15: 6N (0.09) PV23 (0.06) 60/40 - tert-butylhydroquinone (0.13) DISPERBYK-111 (3.0) RS-72A (0.25) DPHA (10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 26 P-26 PSL-1(18.8) OXE-02 (1.0) Omnirad-819 (1.0) R960 (15.0) Al ₂ O ₃ /SiO ₂ Silver neodecanoate (0.5) PB15: 6N (0.09) PV23 (0.06) 60/40 - tert-butylhydroquinone (0.13) DISPERBYK-111 (3.0) RS-72A (0.25) DPHA (10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Example 27 P-27 PSL-3 (20.8) THP-17(10) CR-97 (15.0) Al ₂ O ₃ /ZrO ₂ Silver neodecanoate (0.5) PB15: 6N (0.09) PV23 (0.06) 60/40 - tert-butylhydroquinone (0.13) DISPERBYK-111 (3.0) RS-72A (0.25) - PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Comparative example 1 P-28 PSL-1 (33.8) OXE-02 (1.0) Omnirad-819 (1.0) - - Silver neodecanoate (0.5) PB15: 6N (0.09) PV23 (0.06) 60/40 - tert-butylhydroquinone (0.13) DISPERBYK-111 (3.0) RS-72A (0.25) DPHA (10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Comparative example 2 P-29 PSL-1 (19.3) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al ₂ O ₃ /ZrO ₂ - PB15: 6N (0.09) PV23 (0.06) 60/40 - tert-butylhydroquinone (0.13) DISPERBYK-111 (3.0) RS-72A (0.25) DPHA (10) PGMEA(50) - Celloxide 2021P (0.10) BYK-352 (500 ppm) Comparative example 3 P-30 PSL-1 (18.9) OXE-02 (1.0) Omnirad-819 (1.0) CR-97 (15.0) Al ₂ O ₃ /ZrO ₂ - - - - TiN (0.10%) tert-butylhydroquinone (0.13) DISPERBYK-111 (3.0) RS-72A (0.25) DPHA (10) PGMEA (46) EDM (4) - Celloxide 2021P (0.10) BYK-352 (500 ppm)

Preparation Example 1 Color-changing luminescent material composition (CL-1) 20 parts by weight of a green quantum dot material (Lumidot 640 CdSe/ZnS, average particle size 6.3 nm: manufactured by Aldrich) in 0.5% by weight toluene solution, 45 parts by weight of DPHA, 5 30 parts by weight of "Irgacure" (registered trademark) 907 (manufactured by BASF Co., Ltd.), 166 parts by weight of acrylic resin (SPCR-18 (trade name), manufactured by Showa Denko Co., Ltd.) %PGMEA solution and 97 parts by weight of toluene were mixed and stirred to dissolve uniformly. The obtained mixture was filtered using a 0.45 μm syringe filter to prepare a color-changing luminescent material composition (CL-1).

Preparation Example 2 Color-changing luminescent material composition (CL-2) The same procedure as Preparation Example 1 was used except that 0.4 parts by weight of the green phosphor G-1 obtained in Synthesis Example 4 was used instead of the green quantum dot material and the amount of toluene added was changed to 117 parts by weight. The color-changing luminescent material composition (CL-2) is prepared by the method.

Preparation Example 3 Color-changing luminescent material composition (CL-3) The same procedure as Preparation Example 1 was used except that 0.4 parts by weight of the red phosphor R-1 obtained in Synthesis Example 5 was used instead of the green quantum dot material and the amount of toluene added was changed to 117 parts by weight. The color-changing luminescent material composition (CL-3) was prepared by the method.

Preparation Example 4 Color filter forming material (CF-1) Mix 90 g of C.I. Pigment Green 59, 60 g of C.I. Pigment Yellow 150, and 75 g of polymer dispersant ("BYK" (registered trademark)-6919 (trade name) manufactured by BYK-Chemie Co., Ltd. (hereinafter) "BYK-6919")), 100 g of adhesive resin ("ADEKA ARKLS" (registered trademark) WR301 (trade name) manufactured by ADEKA Co., Ltd.), and 675 g of PGMEA to make a slurry. Use a tube to connect the beaker containing the slurry to the Dyno-Mill, use zirconia beads with a diameter of 0.5 mm as the medium, and conduct dispersion processing at a circumferential speed of 14 m/s for 8 hours. Prepare Pigment Green 59 dispersion (GD-1).

Mix 56.54 g of Pigment Green 59 dispersion (GD-1) and 3.14 g of acrylic resin ("Cyclomer" (registered trademark) P (ACA) Z250 (trade name) Daicel-Allnex (hereinafter "P(ACA)Z250")), 2.64 g of DPHA, photopolymerization initiator ("Optomer" (registered trademark) NCI-831 (trade name) Adico Manufactured by ADEKA Co., Ltd. (hereinafter "NCI-831")) 0.330 g, 0.04 g of surfactant ("BYK" (registered trademark)-333 (trade name) manufactured by BYK-Chemie Co., Ltd. ( Mix "BYK-333" below), 0.01 g of BHT as a polymerization inhibitor, and 37.30 g of PGMEA as a solvent to prepare a color filter forming material (CF-1).

Preparation Example 5 Resin composition for light-shielding partition walls Mix 150 g of carbon black (MA100 (trade name) manufactured by Mitsubishi Chemical Co., Ltd.), 75 g of polymer dispersant BYK-6919, 100 g of P(ACA)Z250, and 675 g of PGMEA to prepare a slurry. Use a tube to connect the beaker containing the slurry to the Dyno mill, use zirconia beads with a diameter of 0.5 mm as the medium, and conduct dispersion processing at a peripheral speed of 14 m/s for 8 hours to prepare a pigment dispersion (MB-1 ).

56.54 g of pigment dispersion (MB-1), 3.14 g of P(ACA) Z250, 2.64 g of DPHA, 0.330 g of NCI-831, 0.04 g of BYK-333, and tert-butyl as a polymerization inhibitor Mix 0.01 g of tea phenol and 37.30 g of PGMEA to prepare a resin composition for light-shielding partition walls.

Preparation Example 6 Organic silver compound (APAG-1) 5.0 g of a 30% by weight PGMEA solution of SPCR-10P ((trade name), manufactured by Showa Denko Co., Ltd.) which is a (meth)acrylic acid polymer solution was dissolved in 5.0 g of acetone, and 0.0555 g of diethanolamine (vs. (1.5 molar equivalent to (meth)acrylic acid polymer), and stirred at room temperature for 1 hour to produce an amine salt of a (meth)acrylic acid polymer solution. Next, 0.0287 g of silver nitrate (I) was added to the solution and stirred at room temperature for 1 hour. As a result, precipitation occurred. After filtering with a 5.0 μm filter, PGMEA was added so that the solid content became 10%, and an organic silver compound (APAG-1) was obtained.

Examples 28 to 54 and Comparative Examples 4 to 6 A 10 cm square alkali-free glass substrate (manufactured by AGC Techno Glass Co., Ltd., thickness 0.7 mm; the same below) was used as the base substrate. The resin composition for partition walls shown in Tables 2 to 4 was spin-coated thereon, using a hot plate (trade name SCW-636, manufactured by Dainippon Screen Manufacturing Co., Ltd.; the same below), and dried at a temperature of 80°C for 3 minutes to make a dry film. For the produced dry film, a parallel light mask was used to align the exposure machine (trade name PLA-501F, manufactured by Cannon (Cannon) Co., Ltd.; the same below), an ultra-high-pressure mercury lamp was used as a light source, and the mask was used to expose Expose with a dose of 300 mJ/cm ² (g-ray, h-ray, i-ray). Thereafter, using an automatic developing device ("AD-2000 (trade name)" manufactured by Takizawa Sangyo Co., Ltd.; the same below), spray development was performed using a 0.045% by weight potassium hydroxide aqueous solution for 100 seconds, followed by water for 30 seconds. Rinse. Furthermore, using an oven (trade name IHPS-222, manufactured by Espec Co., Ltd.; the same below), it was heated in the air at a temperature of 230° C. for 30 minutes to form a glass substrate with a height of 10 μm and a width of 10 μm. The 20 μm partition walls are formed in a grid-like pattern with intervals of 80 μm on the short side and 280 μm on the long side.

The color-changing luminescent material composition shown in Table 3 to Table 4 was applied to the area separated by the partition walls of the obtained substrate with partition walls in a nitrogen atmosphere using the inkjet method, and dried at 100° C. for 30 minutes. Pixels with a thickness of 5.0 μm were formed to obtain a substrate with partition walls having the structure shown in FIG. 2 .

Example 55 A 10 cm square alkali-free glass substrate was used as the base substrate. The resin composition for partition walls (P-27) was spin-coated thereon, and dried at a temperature of 80° C. for 3 minutes using a hot plate to prepare a dry film. For the produced dry film, use a parallel light mask to align the exposure machine, use an ultra-high-pressure mercury lamp as the light source, and expose through the light mask at an exposure dose of 300 mJ/cm ² (g-ray, h-ray, i-ray). Thereafter, an automatic developing device was used to perform spray development using a 2.38% by weight tetramethylammonium hydroxide aqueous solution for 90 seconds, followed by rinsing with water for 30 seconds. Thereafter, in the same manner as before, exposure was performed at an exposure dose of 500 mJ/cm ² (g rays, h rays, and i rays) without interposing a light mask, and bleaching was performed. Furthermore, using an oven, it was heated in the air at a temperature of 230° C. for 30 minutes to form a lattice-like pattern in which partition walls with a height of 10 μm and a width of 20 μm were formed at intervals of 80 μm on the short side and 280 μm on the long side on the glass substrate. next door.

The color-converting luminescent material composition (CL-2) was applied to the area separated by the partitions of the obtained substrate with partitions in a nitrogen atmosphere using the inkjet method, and dried at 100°C for 30 minutes to form a thickness of 5.0 μm pixels, a substrate with barrier ribs having the structure shown in Figure 2 is obtained.

Example 56 A 10 cm square alkali-free glass substrate was used as the base substrate. The light-shielding partition forming material obtained in Preparation Example 5 was spin-coated thereon, and dried at a temperature of 90° C. for 2 minutes using a hot plate to prepare a dry film. For the produced dry film, use a parallel light mask to align the exposure machine, use an ultra-high-pressure mercury lamp as the light source, and expose through the light mask at an exposure dose of 40 mJ/cm ² (g-ray, h-ray, i-ray). Thereafter, an automatic developing device was used to develop with a 0.3% by weight tetramethylammonium aqueous solution for 50 seconds, and then rinsed with water for 30 seconds. Furthermore, using an oven, it was heated in the air at a temperature of 230° C. for 30 minutes to obtain a substrate with light-shielding partitions on a glass substrate having a height of 2.0 μm, a width of 20 μm, and an OD value per 1.0 μm of thickness of 2.0. The partition walls are formed in a lattice-like pattern with pitch intervals of 40 μm on the short side and 280 μm on the long side.

Thereafter, by the same method as in Example 29, a substrate with partition walls was obtained in which partition walls with a height of 10 μm and a width of 20 μm were formed on the light-shielding partition walls at a distance from the short side of 40 μm and the long side of 280 μm. The spaced light-blocking partitions have the same grid pattern. The color-converting luminescent material composition (CL-2) obtained in Preparation Example 2 was applied to the area separated by the partitions of the obtained substrate with partitions in a nitrogen atmosphere using the inkjet method, and the temperature was maintained at 100°C. The film was dried for 30 minutes to form a pixel with a thickness of 5.0 μm, and a substrate with partition walls having the structure shown in Figure 3 was obtained.

Example 57 The film prepared in Preparation Example 4 was applied to the area separated by the partition walls of the substrate with partition walls before pixel formation, which was obtained by the same method as Example 29, so that the film thickness after curing became 2.5 μm. The obtained color filter forming material (CF-1) was vacuum dried. Exposure was performed at an exposure dose of 40 mJ/cm ² (g-ray, h-ray, i-ray) through a photomask designed so that the opening area of the substrate with partition walls was exposed. After developing with a 0.3% by weight tetramethylammonium aqueous solution for 50 seconds, it was heated and hardened at 230°C for 30 minutes to form a color with a height of 2.5 μm, a short side of 40 μm, and a long side of 280 μm in the area separated by the partition wall. Filter layer. Thereafter, the color-changing luminescent material composition (CL-2) obtained by Preparation Example 2 was coated on the color filter in a nitrogen atmosphere using an inkjet method, and dried at 100°C for 30 minutes to form With a pixel thickness of 5.0 μm, a substrate with partition walls having the structure shown in Figure 4 was obtained. The structures of each Example and Comparative Example are shown in Tables 3 and 4.

[Table 3] [Table 3] Resin composition for partition walls next door pixel blackout partition color filter layer Resin content (weight%) White pigment content (weight %) Total content of blue pigment and purple pigment (% by weight) Theoretical content of silver oxide and/or silver particles (% by weight) Content rate of other shading pigments (% by weight) Color changing luminescent material composition Pixel height (μm) Height of light-shielding partition (μm) Color filter height (μm) Example 28 P-1 37.7 30 0.3 1.0 - CL-1 5.0 - - Example 29 P-1 37.7 30 0.3 1.0 - CL-2 5.0 - - Example 30 P-2 37.7 30 0.3 1.0 - CL-2 5.0 - - Example 31 P-3 37.7 30 0.3 1.0 - CL-2 5.0 - - Example 32 P-4 37.7 30 0.3 1.0 - CL-2 5.0 - - Example 33 P-5 37.7 30 0.3 1.0 - CL-2 5.0 - - Example 34 P-6 37.4 30 0.6 1.0 - CL-2 5.0 - - Example 35 P-7 37.0 30 1.0 1.0 - CL-2 5.0 - - Example 36 P-8 34.4 30 3.6 1.0 - CL-2 5.0 - - Example 37 P-9 37.8 30 0.2 1.0 - CL-2 5.0 - - Example 38 P-10 37.9 30 0.1 1.0 - CL-2 5.0 - - Example 39 P-11 37.9 30 0.005 1.0 - CL-2 5.0 - - Example 40 P-12 37.7 30 0.3 1.0 - CL-2 5.0 - - Example 41 P-13 37.7 30 0.3 1.0 - CL-2 5.0 - - Example 42 P-14 35.6 30 0.3 3.0 - CL-2 5.0 - - Example 43 P-15 36.6 30 0.3 2.0 - CL-2 5.0 - -

[Table 4] [Table 4] Resin composition for partition walls next door pixel blackout partition color filter layer Resin content (weight%) White pigment content (weight %) Total content of blue pigment and purple pigment (% by weight) Theoretical content of silver oxide and/or silver particles (% by weight) Content rate of other shading pigments (% by weight) Color changing luminescent material composition Pixel height (μm) Height of light-shielding partition (μm) Color filter height (μm) Example 44 P-16 32.6 30 0.3 6.0 - CL-2 5.0 - - Example 45 P-17 38.2 30 0.3 0.5 - CL-2 5.0 - - Example 46 P-18 38.6 30 0.3 0.1 - CL-2 5.0 - - Example 47 P-19 37.7 30 0.3 1.0 - CL-2 5.0 - - Example 48 P-20 37.7 30 0.3 1.0 - CL-2 5.0 - - Example 49 P-21 37.7 30 0.3 1.0 - CL-2 5.0 - - Example 50 P-22 38.0 30 - 1.0 - CL-2 5.0 - - Example 51 P-23 37.7 30 0.3 1.0 - CL-2 5.0 - - Example 52 P-24 37.7 30 0.3 1.0 - CL-2 5.0 - - Example 53 P-25 37.7 30 0.3 1.0 - CL-2 5.0 - - Example 54 P-26 37.7 30 0.3 1.0 - CL-2 5.0 - - Example 55 P-27 37.7 30 0.3 1.0 - CL-2 5.0 - - Example 56 P-1 37.7 30 0.3 1.0 - CL-2 5.0 2.0 - Example 57 P-1 37.7 30 0.3 1.0 - CL-2 5.0 - 2.5 Comparative example 4 P-28 67.6 - 0.3 1.0 - CL-2 5.0 - - Comparative example 5 P-29 38.7 30 0.3 - - CL-2 5.0 - - Comparative example 6 P-30 37.8 30 - 1.0 0.2 CL-2 5.0 - -

The evaluation methods of each Example and Comparative Example are shown below.

＜Height＞ Regarding each layer of the substrate with partition walls obtained in each of the Examples and Comparative Examples, a SURFCOM stylus type film thickness measuring device was used to measure the film thickness before and after the formation of each layer, and the difference was calculated to measure the height. .

＜Crack resistance＞ The partition wall-forming resin composition used in each of the Examples and Comparative Examples was spin-coated so that the film thickness after heating became 10 μm, 15 μm, 20 μm, and 25 μm, respectively. Regarding the steps after the partition wall forming resin composition used in Examples 28 to 54, Examples 56 to 57, and Comparative Examples 4 to 6, the entire body was exposed without a light shield during exposure. Except for this, processing was performed under the same conditions as in each Example and Comparative Example to produce a monolithic film on the glass substrate. Regarding the steps after the partition-forming resin composition used in Example 55, it was processed under the same conditions except that it was developed without exposure and then bleached to form a monolithic film on a glass substrate. The obtained whole film was used as a model of the partition wall of the partition board-equipped substrate obtained by each Example and Comparative Example, and the glass substrate with the whole film was visually observed, and the presence or absence of cracks in the whole film was evaluated. When even one crack is confirmed, it is judged that the film thickness has no crack resistance. For example, if there are no cracks when the film thickness is 15 μm and there are cracks when the film thickness is 20 μm, the crack-resistant film thickness is judged to be "≧15 μm". In addition, the crack-resistant film thickness when there are no cracks even if it is 25 μm is judged as "≧25 μm", and the crack-resistant film thickness when there are cracks even if it is 10 μm is judged as "<10 μm", as the crack resistance .

<Resolution> The resin composition for partition walls used in each Example and Comparative Example was spin-coated on a 10 cm square alkali-free glass substrate so that the film thickness after heating became 10 μm. Using a hot plate, the resin composition was heated at a temperature of 100 Dry at ℃ for 3 minutes to produce a dry film with a film thickness of 10 μm. For the produced dry film, use a parallel light mask to align the exposure machine, use an ultra-high-pressure mercury lamp as the light source, and separate the widths of 100 μm, 80 μm, 60 μm, 50 μm, 40 μm, 30 μm and 20 μm. The line and space pattern mask was exposed with a gap of 100 μm at an exposure dose of 150 mJ/cm ² (g-ray, h-ray, i-ray). Thereafter, an automatic developing device was used to perform spray development using a 0.045% by weight potassium hydroxide aqueous solution for 100 seconds, followed by rinsing with water for 30 seconds.

＜Reflectivity＞ The partition wall-forming resin compositions used in Examples 28 to 54, Examples 56 to 57, and Comparative Examples 4 to 6 were exposed as a whole without interposing a light barrier. , processing was performed under the same conditions as in each example and comparative example, and a monolithic film with a height of 10 μm was produced on a glass substrate. The partition-forming resin composition used in Example 55 was processed under the same conditions except that it was developed without exposure and then bleached to produce a monolithic film with a height of 10 μm on a glass substrate.

The obtained glass substrate with the integral film was measured in the SCI mode from the integral film side using a spectrophotometer (trade name: CM-2600d, manufactured by Konica Minolta Co., Ltd.) in the wavelength range of 360 nm. Reflectance in ~740 nm. The minimum and maximum reflectance values in the wavelength range of 430 nm to 630 nm are respectively designated as "minimum reflectance" and "maximum reflectance".

＜OD value＞ As a model of the partition wall of the substrate with partition walls obtained in each of the Examples and Comparative Examples, a whole film with a height of 10 μm was produced on a glass substrate in the same manner as in the evaluation of reflectance. The transmittance of the obtained glass substrate with a monolithic film was measured in the wavelength range of 360 nm to 740 nm using a spectrophotometer (U-4100 manufactured by Hitachi High-tech), and the transmittance was calculated by the above-mentioned formula (1). OD value in the wavelength range 360 nm to 740 nm. The values of the minimum and maximum OD values in the wavelength range of 430 nm to 630 nm are respectively set as "minimum OD value" and "maximum OD value".

In addition, regarding Example 56, as a model of the light-shielding partition wall (A-2), a whole film was produced on a glass substrate in the same manner. The transmittance of the obtained glass substrate with a monolithic film was measured in the wavelength range of 360 nm to 740 nm using a spectrophotometer (U-4100 manufactured by Hitachi High-tech), and the transmittance was calculated by the above-mentioned formula (1). OD value at wavelength 550 nm.

＜Chroma＞ As a model of the partition wall of the substrate with partition walls obtained in each of the Examples and Comparative Examples, a whole film with a height of 10 μm was produced on a glass substrate in the same manner as in the evaluation of reflectance. Regarding the obtained glass substrate with the integral film, the colorimetric (L *value, a* and b*value). Furthermore, regarding the b* value, the entire film before the heating step and the b* value after the heating step were measured, and the difference (Δb*) was recorded in Tables 5 and 6 as "Δb* before and after the heating step".

＜Δb* before and after low-temperature heating＞ The resin composition for partition wall formation used in each of the Examples and Comparative Examples was used, except that the final heating conditions were changed to 60 minutes in the air at 100° C. in the same manner as the evaluation of the reflectance. An overall film with a height of 10 μm was fabricated on a glass substrate. Regarding the obtained entire film, the b* value was calculated in the same manner as in the evaluation of the chromaticity. The b* value of the entire film before the heating step and after the heating step was measured, and the difference (Δb*) was calculated, whereby the change in the OD value during low-temperature heating was evaluated based on the following standards. A：Δb*＞15 B：10≦Δb*≦15 C: Δb*<10.

<Light resistance> The resin composition for partition walls used in each Example and Comparative Example was spin-coated on a 10 cm square alkali-free glass substrate, and dried using a hot plate at a temperature of 90°C for 3 minutes to produce a film thickness of 10 μm. dry film. The transmittance at a wavelength of 436 nm was measured using a spectrophotometer (U-4100 manufactured by Hitachi High-Technologies) on the glass substrate having the obtained dry film. For the produced dry film, use a parallel light mask to align the exposure machine, use an ultra-high-pressure mercury lamp as the light source, and expose with an exposure dose of 1000 mJ/cm ² (g-ray, h-ray, i-ray) without intervening the light shield. . The transmittance at a wavelength of 436 nm was measured again in the same manner as for the glass substrate having the obtained exposed film. By calculating the transmittance difference (ΔT _{436 nm} ) of the film before and after exposure, the light resistance was evaluated based on the following criteria. A: ΔT _{436 nm} ＜3% B: 3% ≦ ΔT _{436 nm} ≦ 5% C: 5% ＜ ΔT _{436 nm} .

＜Low temperature hardening＞ The partition wall formation resin composition used in each Example and Comparative Example was used, and the partition walls were formed in the same manner except that the final heating conditions were changed to 100° C. and 60 minutes in air. For the obtained substrate with partition walls, 1,6-hexanediol diacrylate was used as the ink for the pixel portion surrounded by the grid-like partitions, and an inkjet coating device (InkjetLabo) was used. , manufactured by Cluster Technology (Co., Ltd.), for inkjet coating. Thereafter, the inside of the pixel was observed after 1 hour and 3 hours, and the low-temperature curability of the partition walls was evaluated based on the following criteria. The less bleeding into adjacent pixels, the better the low-temperature curability of the partition wall is. A: 3 hours after inkjet application, no bleeding of ink into adjacent pixels was seen. B: No leaching of ink into adjacent pixels was observed 1 hour after inkjet application, but leaching was visible after 3 hours. C: Immediately after inkjet coating, ink bleeding into adjacent pixels is visible.

＜Taper angle＞ In each of the Examples and Comparative Examples, an optical microscope (FE-SEM (S-4800); manufactured by Hitachi, Ltd.) was used to observe an arbitrary cross-section of the substrate with partition walls before pixel formation at an accelerating voltage of 3.0 kV. Determine the cone angle.

<Storage Stability> The resin composition for partition wall formation used in each Example and Comparative Example was evaluated by spin coating on a glass substrate after storage at 25°C for 7 days and 30 days from preparation. , depending on the state of the coating film, the storage stability was evaluated according to the following criteria. A: In the evaluation performed after storage at 25°C for 7 days and after storage at 25°C for 30 days, no aggregation was generated after spin coating. B: In the evaluation performed after storage at 25°C for 7 days, the result was No aggregates were generated after spin coating, but in the evaluation conducted after storage at 25°C for 30 days, aggregates were generated after spin coating. C: In the evaluation conducted after storage at 25°C for 7 days, the results showed that aggregates were generated after spin coating. Condensation was generated behind the cloth <Brightness> A planar light-emitting device equipped with a commercially available LED backlight (peak wavelength 465 nm) was used as a light source, and the pixel portion was placed on the light source side. According to each example and comparative example The obtained substrate with partition walls. A current of 30 mA was passed through the planar light-emitting device to light up the LED element, and a spectroradiometer (CS-1000, manufactured by Konica Minolta) was used to measure the brightness (unit) based on the CIE1931 standard. : cd/cm ² ), as the initial brightness. Among them, the brightness was evaluated by using the initial brightness of Comparative Example 7 as a relative value to the standard 100. In addition, after lighting the LED element at room temperature (23° C.) for 48 hours, the brightness was measured in the same manner to evaluate changes in brightness over time. Among them, the brightness was evaluated by using the initial brightness of Comparative Example 4 as a relative value to the standard 100.

＜Color characteristics＞ The substrate with partition walls obtained in each of the Examples and Comparative Examples was placed on a commercially available white reflective plate so that the pixels were arranged on the white reflective plate side. Using a spectrophotometer (CM-2600d, manufactured by Konica Minolta, measuring diameter ψ8 mm), light was irradiated from the base substrate side of the substrate with the partition wall, and the spectrum including regular reflected light was measured.

The color gamut defined by the color standard BT.2020, which can almost reproduce the colors of nature, stipulates red, green and blue on the spectral locus shown in the chromaticity diagram as the three primary colors. The wavelengths of red, green and blue are respectively equivalent to 630 nm. , 532 nm and 467 nm. Based on the reflectance (R) of the three wavelengths of 470 nm, 530 nm and 630 nm of the obtained reflection spectrum, the luminescent color of the pixel is evaluated according to the following criteria. A: R ₅₃₀ / (R ₆₃₀ + R ₅₃₀ + R ₄₇₀ ) ≧ 0.60 B: 0.55 ≦ R ₅₃₀ / ( R ₆₃₀ + R ₅₃₀ + R ₄₇₀ ) < 0.60 C: R ₅₃₀ / ( R ₆₃₀ + R ₅₃₀ + R ₄₇₀ )<0.55.

＜Display characteristics＞ The display characteristics of the display device produced by combining the substrate with barrier ribs obtained in each of the Examples and Comparative Examples and the organic EL element were evaluated based on the following criteria. A: The green display is very bright, and it is a display device with sharp and excellent contrast. B: Although the colors look slightly unnatural, this is a problem-free display device.

＜Color Mixing＞ In the substrate with partition walls before forming pixels obtained in each of the Examples and Comparative Examples, a color-converting luminescent material composition ( CL-2), dried at 100°C for 30 minutes to form a pixel with a thickness of 5.0 μm. Thereafter, in the pixel portion surrounded by the grid-like partition walls, the color-converting luminescent material composition (CL-2) is applied using an inkjet method in an area adjacent to the area where the color-converting luminescent material composition (CL-2) is applied. CL-3), dried at 100°C for 30 minutes to form a pixel with a thickness of 5.0 μm.

On the other hand, a blue organic EL unit having the same width as the pixel portion surrounded by lattice-shaped partition walls is produced, and the substrate with the partition walls and the blue organic EL unit are opposed to each other, and are bonded together with a sealant. A display device having the structure shown in Fig. 8 is obtained.

In the blue organic EL unit 7 in FIG. 8 , the blue organic EL unit is bonded only directly below the pixel 3 (CL-2) formed of the color conversion luminescent material composition (CL-2). In the lit state, a microspectrophotometer LVmicro-V (Lambda Vision) is used for the pixel 3 (CL-3) portion formed by the color-changing luminescent material composition (CL-3). (manufactured by Co., Ltd.), measure the absorbance intensity A (630 nm) at a wavelength of 630 nm. The smaller the value of the absorbance intensity A (630 nm), the less likely color mixing will occur. Color mixture is judged based on the following criteria. A：A（630 nm）＜0.01 B: 0.01≦A (630 nm)≦0.5 C: 0.5＜A (630 nm).

The evaluation results of each Example and Comparative Example are shown in Tables 5 and 6.

[Table 5] [Table 5] Crack resistance Resolution (μm) Reflectivity(%) OD value Color after heating step Δb* before and after heating step Δb* before and after low temperature heating Lightfastness Low temperature hardenability Cone angle (°) Storage stability Brightness (relative value) color properties display properties Mixed colors minimum reflectivity maximum reflectivity Minimum OD value Maximum OD value L* a* b* initial 48 hours later Example 28 ≧20 μm 30 29 37 1.6 2.4 63 -3.3 -0.5 15.0 A B A 87 A 165 162 B B A Example 29 ≧20 μm 30 29 37 1.6 2.4 63 -3.3 -0.5 15.0 A B A 87 A 159 155 B B A Example 30 ≧20 μm 30 27 35 1.6 2.4 63 -1.0 0.5 15.0 A B A 90 A 159 155 B B A Example 31 ≧20 μm 30 30 38 1.6 2.4 63 -3.9 -1.0 15.0 A B A 85 A 159 155 B B A Example 32 ≧20 μm 30 27 34 1.6 2.4 63 -0.5 0.4 15.0 A B A 92 B 155 151 B B A Example 33 ≧20 μm 30 31 38 1.5 2.4 63 -2.0 -3.2 15.0 A B A 79 A 160 157 B B A Example 34 ≧20 μm 30 25 34 1.7 2.4 60 -3.7 -4.2 15.0 A B A 92 A 152 148 B B A Example 35 ≧20 μm 30 twenty one 29 1.8 2.4 57 -4.9 -4.9 15.0 A B A 95 A 149 146 B B A Example 36 ≧20 μm 30 15 25 2.3 2.4 48 -7.0 -8.2 15.0 A B A 111 A 134 129 C B A Example 37 ≧20 μm 30 31 38 1.6 2.4 65 -2.7 -0.1 15.0 A B A 88 A 161 159 B B A Example 38 ≧20 μm 30 32 42 1.5 2.4 68 -2.1 2.0 15.0 A B A 89 A 164 162 B B A Example 39 ≧20 μm 30 32 50 1.3 2.4 72 -0.8 12.0 15.0 A B A 89 A 167 164 C B A Example 40 ≧20 μm 30 35 37 1.6 2.4 67 -4.5 -3.0 12.5 B B A 87 A 161 158 B B A Example 41 ≧20 μm 30 27 29 1.8 2.8 55 -6.0 -7.5 8.0 C B A 111 A 134 129 C B A Example 42 ≧20 μm 50 35 37 1.6 2.4 67 -4.5 -5.0 10.5 C B A 105 A 161 158 B B A Example 43 ≧20 μm 30 28 36 1.6 3.0 59 -3.3 4.5 20.0 A B A 91 A 155 152 B B A

[Table 6] [Table 6] Crack resistance Resolution (μm) Reflectivity(%) OD value Color after heating step Δb* before and after heating step Δb* before and after low temperature heating Lightfastness Low temperature hardenability Cone angle (°) Storage stability Brightness (relative value) color properties display properties Mixed colors minimum reflectivity maximum reflectivity Minimum OD value Maximum OD value L* a* b* initial 48 hours later Example 44 ≧20 μm 30 25 36 1.6 3.5 55 -3.3 14.5 30.0 A B A 92 B 154 151 C B A Example 45 ≧20 μm 30 33 37 1.6 2.2 67 -3.0 -3.0 12.5 A B A 87 A 160 156 B B A Example 46 ≧20 μm 30 34 44 1.6 1.7 68 -3.0 -10.5 5.0 A B A 89 A 161 157 C B A Example 47 ≧20 μm 30 29 37 1.6 2.4 63 -3.3 -3.5 12.0 C B A 87 A 159 155 B B A Example 48 ≧20 μm 30 29 37 1.6 2.4 63 -3.3 -0.5 15.0 A B A 87 C 159 155 B B A Example 49 ≧25 μm 30 29 37 1.6 2.4 63 -3.3 -0.5 15.0 A B C 87 A 159 155 B B A Example 50 ≧20 μm 30 29 59 0.8 2.4 79 -1.5 20.0 15.00 A B A 86 A 165 157 C B B Example 51 ≧20 μm 30 25 42 1.4 2.4 66 -5.0 5.0 15.00 A B A 105 C 159 155 B B B Example 52 ≧20 μm 30 25 42 1.4 2.4 66 -15.0 4.5 15.00 A B A 90 A 159 155 C B A Example 53 ≧20 μm 30 29 37 1.6 2.4 63 -3.3 -0.5 15.0 A A A 87 A 159 155 B B A Example 54 ≧20 μm 30 29 37 1.7 2.5 61 -3.0 1.0 15.0 A C A 95 A 159 155 B B A Example 55 ≧20 μm 20 30 37 1.6 2.4 63 -3.3 -0.5 15.0 A B C 106 B 159 155 B B A Example 56 ≧20 μm 30 29 37 1.6 2.4 63 -3.3 -0.5 15.0 A B A 87 A 148 146 B A A Example 57 ≧20 μm 30 29 37 1.6 2.4 63 -3.3 -0.5 15.0 A B A 87 A 148 146 A B A Comparative example 4 ≧15 μm 20 4 7 1.5 1.6 25 3.0 3.0 10.0 B B A 90 A 100 90 B B C Comparative example 5 ≧20 μm 30 29 50 1.4 1.5 72 -3.3 -15.0 0.50 C B A 88 A 161 157 C B B Comparative example 6 ≧20 μm 50 35 45 1.5 2.0 67 3.5 -2.5 0.20 C B A 120 A 150 145 B B A

1: Base substrate 2:next door 3: Pixel 3 (CL-2): Pixels formed from color-changing luminescent material composition (CL-2) 3 (CL-3): Pixels formed from color-changing luminescent material composition (CL-3) 4: Blackout next door 5: Color filter 6: Light source selected from organic EL unit, mini LED unit and micro LED unit 7: Blue organic EL unit H: Thickness of partition wall L: width of next door θ: cone angle

FIG. 1 is a cross-sectional view showing an aspect of a substrate with partition walls of the present invention having patterned partition walls. 2 is a cross-sectional view illustrating an aspect of a substrate with barrier ribs of the present invention having patterned barrier ribs and pixels containing a color-converting luminescent material. 3 is a cross-sectional view illustrating an aspect of the substrate with barrier ribs of the present invention having patterned barrier ribs, a color-converting luminescent material, and light-shielding barrier ribs. 4 is a cross-sectional view showing an aspect of the substrate with partition walls of the present invention having patterned partition walls, a color-converting luminescent material, and a color filter. 5 is a cross-sectional view showing an aspect of the substrate with partition walls of the present invention having patterned partition walls, a color-converting luminescent material, a light-shielding partition wall, and a color filter. 6 is a cross-sectional view showing an aspect of a substrate with partition walls of the present invention having pixels including patterned partition walls and a light emitting source selected from an organic EL unit, a mini LED unit, and a micro LED unit. 7 shows an aspect of the substrate with partition walls of the present invention having pixels including patterned partition walls, a color-converting luminescent material, and a light source selected from an organic EL unit, a mini LED unit, and a micro LED unit. Sectional view. 8 is a cross-sectional view showing the structure of a display device used for color mixture evaluation in the embodiment.

1: Base substrate

2:next door

3: Pixel

4: Blackout next door

5: Color filter

Claims (20)

A resin composition contains a resin, a photosensitizer, a white pigment, a yellow precursor compound and a light-shielding pigment. In the resin composition, the light-shielding pigment contains a blue pigment and a purple pigment. The resin composition according to claim 1, wherein the white pigment is treated with at least one selected from the group consisting of SiO ₂ and Al ₂ O ₃ and ZrO ₂ . The resin composition according to claim 1, wherein the white pigment is treated with ZrO ₂ , Al ₂ O ₃ and SiO ₂ . The resin composition according to claim 1, wherein the weight ratio of the blue pigment to the purple pigment is 20/80 to 80/20. A resin composition containing a photosensitizer, a white pigment, and a yellow precursor compound. In the resin composition, the white pigment is formed by at least one selected from the group consisting of SiO ₂ and Al ₂ O ₃ and ZrO ₂ for processing. The resin composition according to claim 5, wherein the white pigment is treated with ZrO ₂ , Al ₂ O ₃ and SiO ₂ . The resin composition according to claim 5 further contains a light-shielding pigment. The resin composition according to claim 1 or 5, wherein the yellow precursor compound is an organic silver compound. The resin composition according to claim 1 or 5, containing a reducing agent. The resin composition according to claim 1 or 5, containing phosphoric acid polyester. A light-shielding film obtained by hardening the resin composition according to claim 1 or 5. A method for manufacturing a light-shielding film, which sequentially includes: a film-making step, coating the resin composition as described in claim 1 or 5 on a base substrate and drying to obtain a dry film; and an exposure step, subjecting the obtained dry film to pattern exposure. ; The developing step is to dissolve and remove the part of the exposed dry film that is soluble in the developer; and the heating step is to harden the developed dry film by heating it. In the manufacturing method of the light-shielding film, In the heating step, the b* value per 10 μm of film thickness measured by the specular reflection method is increased by more than 10 by heating the developed dry film at a temperature of 100°C or more and 250°C or less. A substrate with partition walls having (A-1) patterned partition walls on a base substrate using the resin composition according to claim 1 or 5, wherein the substrate with partition walls, The reflectivity per 10 μm thickness in the wavelength range 430 nm to 630 nm is within the range of 20% to 50%, and The optical density value per 10 μm thickness in the wavelength range of 430 nm to 630 nm is in the range of 1.5 to 3.0. A substrate with partition walls having (A-1) patterned partition walls on a base substrate using the resin composition according to claim 1 or 5, wherein the substrate with partition walls, The L* value per 10 μm film thickness measured using the specular reflection method is 50 to 70, the a* value is -5.0 to 5.0, and the b* value is -5.0 to 5.0. A substrate with partition walls, having (A-1) patterned partition walls on a base substrate, wherein the substrate with partition walls, The patterned partition walls contain resin, white pigment, blue pigment, purple pigment, silver oxide and/or silver particles. The substrate with partition walls according to claim 13, having (A-1) patterned partition walls on the base substrate, wherein the substrate with partition walls, The patterned partition walls contain resin, white pigment, blue pigment, purple pigment, silver oxide and/or silver particles. The substrate with partition walls according to claim 14, having (A-1) patterned partition walls on the base substrate, wherein the substrate with partition walls, The patterned partition walls contain resin, white pigment, blue pigment, purple pigment, silver oxide and/or silver particles. The substrate with barrier ribs according to claim 13, further comprising (B) a pixel layer containing a color-converting luminescent material arranged and separated by the patterned barrier ribs (A-1). The substrate with partition walls according to claim 18, wherein a color filter with a thickness of 1 μm to 5 μm is further provided between the base substrate and (B) the pixel layer containing a color-changing luminescent material. A display device, comprising: a substrate with partition walls as described in claim 13; and a light source selected from the group consisting of a liquid crystal unit, an organic electroluminescence unit, a mini light-emitting diode unit and a micro-light-emitting diode unit.