TW202336801A - 具有用於自由基物種輸送的孔尺寸之噴淋頭 - Google Patents

具有用於自由基物種輸送的孔尺寸之噴淋頭 Download PDF

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Publication number
TW202336801A
TW202336801A TW111140857A TW111140857A TW202336801A TW 202336801 A TW202336801 A TW 202336801A TW 111140857 A TW111140857 A TW 111140857A TW 111140857 A TW111140857 A TW 111140857A TW 202336801 A TW202336801 A TW 202336801A
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TW
Taiwan
Prior art keywords
holes
diameter
base
cylindrical portion
top surface
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TW111140857A
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English (en)
Chinese (zh)
Inventor
亞倫 布萊克 米勒
戈皮納特 比馬拉塞提
凱爾 瓦特 哈特
Original Assignee
美商蘭姆研究公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商蘭姆研究公司 filed Critical 美商蘭姆研究公司
Publication of TW202336801A publication Critical patent/TW202336801A/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H01J37/32449—Gas control, e.g. control of the gas flow
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/14—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
TW111140857A 2021-10-29 2022-10-27 具有用於自由基物種輸送的孔尺寸之噴淋頭 TW202336801A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202163263290P 2021-10-29 2021-10-29
US63/263,290 2021-10-29

Publications (1)

Publication Number Publication Date
TW202336801A true TW202336801A (zh) 2023-09-16

Family

ID=86158725

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111140857A TW202336801A (zh) 2021-10-29 2022-10-27 具有用於自由基物種輸送的孔尺寸之噴淋頭

Country Status (6)

Country Link
US (1) US20250006515A1 (https=)
JP (1) JP2024539698A (https=)
KR (1) KR20240093865A (https=)
CN (1) CN118215980A (https=)
TW (1) TW202336801A (https=)
WO (1) WO2023077002A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10604841B2 (en) 2016-12-14 2020-03-31 Lam Research Corporation Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition
KR20260046529A (ko) 2019-08-23 2026-04-07 램 리써치 코포레이션 열 제어된 샹들리에 샤워헤드
CN114929935A (zh) * 2020-01-06 2022-08-19 朗姆研究公司 带有内部轮廓的面板的喷头

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101281188B1 (ko) * 2007-01-25 2013-07-02 최대규 유도 결합 플라즈마 반응기
KR101477602B1 (ko) * 2012-10-30 2014-12-30 피에스케이 주식회사 기판 처리 장치
US20140235069A1 (en) * 2013-02-15 2014-08-21 Novellus Systems, Inc. Multi-plenum showerhead with temperature control
US10604841B2 (en) * 2016-12-14 2020-03-31 Lam Research Corporation Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition
US20190119815A1 (en) * 2017-10-24 2019-04-25 Applied Materials, Inc. Systems and processes for plasma filtering

Also Published As

Publication number Publication date
KR20240093865A (ko) 2024-06-24
WO2023077002A1 (en) 2023-05-04
CN118215980A (zh) 2024-06-18
US20250006515A1 (en) 2025-01-02
JP2024539698A (ja) 2024-10-29

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