JP2024539698A - ラジカル種供給のための穴サイズを有するシャワーヘッド - Google Patents

ラジカル種供給のための穴サイズを有するシャワーヘッド Download PDF

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Publication number
JP2024539698A
JP2024539698A JP2024525228A JP2024525228A JP2024539698A JP 2024539698 A JP2024539698 A JP 2024539698A JP 2024525228 A JP2024525228 A JP 2024525228A JP 2024525228 A JP2024525228 A JP 2024525228A JP 2024539698 A JP2024539698 A JP 2024539698A
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JP
Japan
Prior art keywords
holes
showerhead
diameter
cylindrical portion
top surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024525228A
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English (en)
Japanese (ja)
Other versions
JP2024539698A5 (https=
Inventor
ミラー・アーロン・ブレイク
ビマラセッティ・ゴピナス
ハート・カイル・ワット
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of JP2024539698A publication Critical patent/JP2024539698A/ja
Publication of JP2024539698A5 publication Critical patent/JP2024539698A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/14—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H01J37/32449—Gas control, e.g. control of the gas flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
JP2024525228A 2021-10-29 2022-10-27 ラジカル種供給のための穴サイズを有するシャワーヘッド Pending JP2024539698A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163263290P 2021-10-29 2021-10-29
US63/263,290 2021-10-29
PCT/US2022/078786 WO2023077002A1 (en) 2021-10-29 2022-10-27 Showerhead with hole sizes for radical species delivery

Publications (2)

Publication Number Publication Date
JP2024539698A true JP2024539698A (ja) 2024-10-29
JP2024539698A5 JP2024539698A5 (https=) 2025-10-28

Family

ID=86158725

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024525228A Pending JP2024539698A (ja) 2021-10-29 2022-10-27 ラジカル種供給のための穴サイズを有するシャワーヘッド

Country Status (6)

Country Link
US (1) US20250006515A1 (https=)
JP (1) JP2024539698A (https=)
KR (1) KR20240093865A (https=)
CN (1) CN118215980A (https=)
TW (1) TW202336801A (https=)
WO (1) WO2023077002A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10604841B2 (en) 2016-12-14 2020-03-31 Lam Research Corporation Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition
KR20260046529A (ko) 2019-08-23 2026-04-07 램 리써치 코포레이션 열 제어된 샹들리에 샤워헤드
CN114929935A (zh) * 2020-01-06 2022-08-19 朗姆研究公司 带有内部轮廓的面板的喷头

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101281188B1 (ko) * 2007-01-25 2013-07-02 최대규 유도 결합 플라즈마 반응기
KR101477602B1 (ko) * 2012-10-30 2014-12-30 피에스케이 주식회사 기판 처리 장치
US20140235069A1 (en) * 2013-02-15 2014-08-21 Novellus Systems, Inc. Multi-plenum showerhead with temperature control
US10604841B2 (en) * 2016-12-14 2020-03-31 Lam Research Corporation Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition
US20190119815A1 (en) * 2017-10-24 2019-04-25 Applied Materials, Inc. Systems and processes for plasma filtering

Also Published As

Publication number Publication date
KR20240093865A (ko) 2024-06-24
WO2023077002A1 (en) 2023-05-04
TW202336801A (zh) 2023-09-16
CN118215980A (zh) 2024-06-18
US20250006515A1 (en) 2025-01-02

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