KR20240093865A - 라디칼 종 전달을 위한 구멍 크기를 갖는 샤워헤드 - Google Patents
라디칼 종 전달을 위한 구멍 크기를 갖는 샤워헤드 Download PDFInfo
- Publication number
- KR20240093865A KR20240093865A KR1020247017003A KR20247017003A KR20240093865A KR 20240093865 A KR20240093865 A KR 20240093865A KR 1020247017003 A KR1020247017003 A KR 1020247017003A KR 20247017003 A KR20247017003 A KR 20247017003A KR 20240093865 A KR20240093865 A KR 20240093865A
- Authority
- KR
- South Korea
- Prior art keywords
- holes
- showerhead
- component
- diameter
- base portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
- H01J37/32449—Gas control, e.g. control of the gas flow
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/14—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32642—Focus rings
-
- H01L21/67248—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0602—Temperature monitoring
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202163263290P | 2021-10-29 | 2021-10-29 | |
| US63/263,290 | 2021-10-29 | ||
| PCT/US2022/078786 WO2023077002A1 (en) | 2021-10-29 | 2022-10-27 | Showerhead with hole sizes for radical species delivery |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20240093865A true KR20240093865A (ko) | 2024-06-24 |
Family
ID=86158725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020247017003A Pending KR20240093865A (ko) | 2021-10-29 | 2022-10-27 | 라디칼 종 전달을 위한 구멍 크기를 갖는 샤워헤드 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20250006515A1 (https=) |
| JP (1) | JP2024539698A (https=) |
| KR (1) | KR20240093865A (https=) |
| CN (1) | CN118215980A (https=) |
| TW (1) | TW202336801A (https=) |
| WO (1) | WO2023077002A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10604841B2 (en) | 2016-12-14 | 2020-03-31 | Lam Research Corporation | Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition |
| KR20260046529A (ko) | 2019-08-23 | 2026-04-07 | 램 리써치 코포레이션 | 열 제어된 샹들리에 샤워헤드 |
| CN114929935A (zh) * | 2020-01-06 | 2022-08-19 | 朗姆研究公司 | 带有内部轮廓的面板的喷头 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101281188B1 (ko) * | 2007-01-25 | 2013-07-02 | 최대규 | 유도 결합 플라즈마 반응기 |
| KR101477602B1 (ko) * | 2012-10-30 | 2014-12-30 | 피에스케이 주식회사 | 기판 처리 장치 |
| US20140235069A1 (en) * | 2013-02-15 | 2014-08-21 | Novellus Systems, Inc. | Multi-plenum showerhead with temperature control |
| US10604841B2 (en) * | 2016-12-14 | 2020-03-31 | Lam Research Corporation | Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition |
| US20190119815A1 (en) * | 2017-10-24 | 2019-04-25 | Applied Materials, Inc. | Systems and processes for plasma filtering |
-
2022
- 2022-10-27 TW TW111140857A patent/TW202336801A/zh unknown
- 2022-10-27 JP JP2024525228A patent/JP2024539698A/ja active Pending
- 2022-10-27 KR KR1020247017003A patent/KR20240093865A/ko active Pending
- 2022-10-27 US US18/703,982 patent/US20250006515A1/en active Pending
- 2022-10-27 CN CN202280073138.7A patent/CN118215980A/zh active Pending
- 2022-10-27 WO PCT/US2022/078786 patent/WO2023077002A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023077002A1 (en) | 2023-05-04 |
| TW202336801A (zh) | 2023-09-16 |
| CN118215980A (zh) | 2024-06-18 |
| US20250006515A1 (en) | 2025-01-02 |
| JP2024539698A (ja) | 2024-10-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
|
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |