TW202334714A - Soft film display screen, display and display screen manufacturing process - Google Patents

Abstract

The invention relates to the technical field of display screens, and particularly discloses a soft film display screen, a displayer and a display screen manufacturing process. The soft film display screen comprises a flexible transparent substrate, a grid substrate and an LED (light-emitting diode) substrate, wherein the flexible transparent substrate, the grid substrate and the LED substrate are sequentially laminated. And the flexible transparent substrate forms a supporting main body. And the grid substrate is of a flexible grid-shaped thin-layer metal structure and is used for forming a conductive structure. The LED substrate comprises a substrate layer and a display unit; the display unit is fixedly connected to the substrate layer, located between the substrate layer and the grid substrate and connected to the welding position of the grid substrate. Transparent and Mini LED display and reel-to-reel ribbon type production are achieved, and direct cutting can be achieved. The production cost of the grid substrate and the cost of back section packaging are greatly reduced, the grid substrate does not need to be bound with an FPC, an FPC branch circuit does not need to be designed, no additional buckle splicing problem exists, cutting of any size can be carried out according to customer requirements, and the precision is high.

Description

Soft film display screen, display and display screen manufacturing process

The present invention relates to the technical field of display screens, and in particular to a soft film display screen, a display and a display screen manufacturing process.

Currently, the design method for flexible LED display films on the market is mainly based on the arrangement method of PMLCD (abbreviation for Passive-Matrix LCD), which is a passive matrix liquid crystal display. The power supply VCC or VDD and grounding GND are connected between the LED screen film and the motherboard. and signal port (Signal), all use FPC cables as the connection between the motherboard and the LED screen film. There are two ways to design this FPC transfer circuit: one is directly connected to the LED display film, which is to use the circuit on the LED display film to directly extend into an FPC cable. Another way is to make additional FPC cables, and then conduct conductive connection between the LED display film and the FPC cable interface by (spot) welding or binding with anisotropic conductive glue (ACF), no matter which None of the methods can achieve large-volume roll-to-roll one-time forming and production.

In order to solve the above technical problems, the present invention provides a soft film display screen. The soft film display screen includes a flexible transparent substrate, a grid substrate and an LED substrate. The flexible transparent substrate, the grid substrate and the LED substrate are stacked in sequence;

Flexible transparent substrate forms the supporting body;

The grid substrate is a flexible grid-like thin-layer metal structure used to form a conductive structure;

The LED substrate includes a substrate layer and a display unit; the display unit is fixedly connected to the substrate layer, is between the substrate layer and the grid substrate, and is connected to the welding position of the grid substrate. The substrate layer can be made of a single layer, mixture, or composite of PVB, EVA, SGP, POE, silicone and acrylic glue. Its thickness can be the same as that of the display unit, and preferably the thickness is 5/3 times or more of the display unit. Do not cover its position with the connector pins.

Preferably: the flexible transparent substrate is flexible glass or a flexible transparent substrate, and the flexible transparent substrate is PA, PET, PEEK, CPI, PEI, PEN, PMMA, COC, COP, PC, LSR, FEP, One or more materials from SMMA, GPPS, PETG or PPSU are mixed.

Preferably: the thickness of the flexible transparent substrate is between 9um and 3cm.

Preferably: the grid substrate is made of gold, silver, copper, stainless steel or alloy materials thereof.

Preferably: the grid line width of the grid substrate is between 1 um and 5 mm; the grid line thickness is between 0.1 um and 300 um; and the grid line spacing is between 1 um and 10 mm.

Preferably: the display unit includes: SMD lamp beads, SMD resistors and SMD capacitors.

The invention also provides a soft film display, including a control board and a connector, and the above-mentioned soft film display screen. The connector is connected with pins, and the pins are inserted into the display screen and welded to the grid substrate. The control board A slot is provided, and the connector is stuck inside the slot.

The present invention also provides a soft film display screen manufacturing process for producing the above-mentioned Soft film display screen, the soft film display screen manufacturing process includes the following steps:

S1. Make a primer on the flexible transparent substrate, and then coat it with a metal film;

S2. Install photosensitive resin on the metal film and obtain a grid substrate after processing;

S3. Install the display unit at the welding position of the substrate layer to form an LED substrate, and adhere the LED substrate corresponding to the grid substrate;

S4. Cut the ribbon roll material.

Preferred: Step S2 is specifically:

S21. Set photosensitive resin on the metal film;

S22. Install a photomask on the photosensitive resin and expose the photosensitive resin on the metal film;

S23. Use a developer to remove the uncured photosensitive resin from the metal film;

S24. Use etching liquid to remove the metal layer in the photosensitive resin area that is not light-cured;

S25. Use a film removal solution to remove the remaining photosensitive resin to obtain a grid substrate;

S26. Use protective liquid and nickel chemical or tin chemical liquid to deposit a protective layer and a nickel or tin layer on the grid substrate.

Preferred: Step S3 is specifically:

S31. Print solder paste on the screen or steel plate at the welding position of the substrate layer;

S32. Place the chip lamp beads, chip resistors and chip capacitors at the welding positions on the substrate layer;

S33. After degreasing the solder paste remover at the soldering position, soften and melt the base The board layer is closely adhered to the chip lamp beads, chip resistors and chip capacitors.

Technical effects and advantages of the present invention: The present invention uses SMD lamp beads for display, which can fully reduce the size and volume of the display unit, thereby increasing the number of display elements, improving the clarity of the display, and realizing Mini LED display. Using flexible transparent substrates, transparent displays can be made and can be rolled up at will. The display screen can be cut to any size, realizing roll-to-roll ribbon production and arbitrary cutting. It greatly reduces production costs and back-end packaging costs. There is no need to bind FPC or additional buckle splicing issues. It reduces the overall product volume design and combines the flexibility and transparency of the transparent substrate. No need to design FPC, it can be cut to any size according to customer needs with high precision. When the cutting size needs to be changed, there is no need to adjust the processing parameters, and the processing is convenient and fast. When customers need to produce displays with FPC, they can reserve the length of the grid substrate in advance. There is no need to change the processing technology and equipment parameters, and the conversion is quick and easy.

1: Flexible transparent substrate

2: Grid substrate

3:LED substrate

4:Display unit

5: Connector

6:Control panel

7:Power cord

Figure 1 is a three-dimensional schematic diagram of a soft film display screen proposed by the present invention.

Figure 2 is a schematic diagram of two types of SMD lamp beads of a display unit in a soft film display screen proposed by the present invention.

Figure 3 is a cutting schematic diagram of a soft film display screen proposed by the present invention.

Figure 4 is a schematic three-dimensional view of a soft film display proposed by the present invention.

Figure 5 is a flow chart of a soft film display screen manufacturing process proposed by the present invention.

FIG. 6 is a schematic flow chart of a soft film display screen manufacturing process proposed by the present invention.

FIG. 7 is a flow chart of S2 in the manufacturing process of a soft film display screen proposed by the present invention.

FIG. 8 is a flow chart of S3 in the manufacturing process of a soft film display screen proposed by the present invention.

The present invention will be described in further detail below with reference to the accompanying drawings and specific embodiments. The embodiments of the present invention are presented for purposes of illustration and description, and are not intended to be exhaustive or to limit the invention to the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention and design various embodiments with various modifications as are suited to the particular use contemplated.

Example 1

Referring to Figure 1, this embodiment proposes a soft film display screen, which includes a flexible transparent substrate 1, a grid substrate 2, and an LED substrate 3. The flexible transparent substrate 1, the grid substrate 2, and the LED substrate 3 are stacked in sequence.

The flexible transparent substrate 1 forms a supporting body, has a certain degree of flexibility, and can be rolled up and folded. The flexible transparent substrate 1 can be flexible glass or a flexible transparent substrate, ensuring a certain light transmittance and flexibility. The flexible transparent substrate can be one or a mixture of more than one of PA, PET, PEEK, CPI, PEI, PEN, PMMA, COC, COP, PC, LSR, FEP, SMMA, GPPS, PETG or PPSU, but not This is the limit. This ensures the light transmittance and flexibility of the flexible transparent substrate. Wherein, the thickness of the flexible transparent substrate 1 is between 9um and 3cm; preferably, it is between 25um and 1cm, but is not limited to this. Its ultra-thin characteristics and stable support capabilities are guaranteed by existing technology.

The grid substrate 2 is a flexible grid-like thin-layer metal structure, used to form a conductive structure. The grid substrate 2 can be made of gold, silver, copper, stainless steel, etc. or alloy materials thereof. Among them, copper is suitable, but it is not limited to this. Among them, the grid line width is between 1um and 5mm; preferably between 5um and 1.5mm, but not limited to this. The thickness of the grid line is between 0.1um and 300um; preferably between 1um and 200um, but not limited to this. The grid pitch is between 1um and 10mm, preferably between 3-1mm, but not limited to this.

The LED substrate 3 includes a substrate layer and a display unit 4. The display unit 4 is fixedly connected to the substrate layer, is between the substrate layer and the grid substrate 2, and is connected to the welding position of the grid substrate 2. The flexible transparent substrate 1 and the substrate layer form a sealing structure, which can separate the display unit 4 from the external environment, avoid the impact of the external environment on the display unit 4, and make the display screen waterproof, easy to clean, and easy to install, which will not be described in detail here. The substrate layer can be made of a single layer, mixture, or composite of PVB, EVA, SGP, POE, silicone and acrylic glue. Its thickness can be the same as that of the display unit, and preferably the thickness is 5/3 times or more of the display unit. Do not cover its position with the connector pins.

The display unit 4 may include: chip lamp beads, chip resistors and chip capacitors. The specific structure will not be described here. During the design process, the SMD lamp beads can be four-pin LEDs or six-pin LEDs, which will not be described in detail here. At the same time, the design of the four-legged LED lamp bead interruption point resume function can also be realized, as shown in Figure 2. The solid circuit in the figure can also be designed in a grid shape to improve its invisibility.

The above-designed grid substrate 2 and LED substrate 3 can not only be placed on a single surface of the flexible transparent substrate 1, but also on both sides of the flexible transparent substrate 1. The interruption point resume line can even be buried in the flexible transparent substrate 1. Reduce overall thickness and metal line resistance value, which will not be described in detail here. Due to the use of SMD lamp beads for display, the size and volume of the display unit 4 can be sufficiently reduced, thereby increasing the number of display elements and improving the clarity of the display. Using the flexible transparent substrate 1, transparent display can be performed, it can be applied to various types of glass, buildings, etc. for display, and signage can be made. Referring to Figure 3, the display screen can be cut to any size, achieving roll-to-roll ribbon production and direct cutting. It greatly reduces production costs and reduces the cost of back-end packaging. There is no need to bind FPC or additional buckle splicing issues. It reduces the overall product volume design and combines the flexibility and transparency of the transparent substrate.

Example 2

Referring to Figure 4, a soft film display includes a control board 6 and a connector 5, as well as the above-mentioned soft film display screen. The connector 5 is electrically connected to the grid substrate 2 on the soft film display screen, and the connector 5 is electrically connected to the grid substrate 2 on the soft film display screen. The control board 6 is connected. The control board 6 can be connected to the power supply through the power cord 7 . Pins are connected to the connector 5 . The pins are inserted into the display screen and electrically connected to the grid substrate 2 . The power cord 7 can be plugged into a power source or connected to a battery, which will not be described in detail here. The grid substrate 2 is provided with pin positions, and the pins of the connector 5 are directly welded at the pin positions. There is no need to set pin positions on the soft film display screen, so that the connector 5 can be connected at any position on the soft film display screen, thereby achieving control The board 6 is electrically connected to the respective display unit 4 . There is a slot on the control board 6, and the connector 5 can be directly stuck inside the slot, making the assembly of the control board 6 and the connector 5 quick and easy. The soft film display screen can be cut and manufactured to any size without designing an FPC. The process is simple and the applicability is strong. There is no need to set up an FPC, and there is no need to set up an additional connection area for connector 5. Display reduced The occupied area of the non-display interval.

The pin spacing of connector 5 needs to match the width of the electrode lines of VCC, GND and Signal grid substrate 2, and cannot be smaller than the width of the electrode lines. The electrode line size is between 5um and 15mm, preferably between 7um and 2mm. The spacing between the display units 4 needs to be smaller than the internal pin spacing of the connector 5; among them, the side length of the display unit 4 is between 5um and 10mm, preferably between 7um and 5mm. This enables MiniLED display. Connector 5 is directly connected to the soft-film display screen, realizing the invisible line FPC in/on cell design, enabling full-screen display, super-narrow borders, and borderless display.

Example 3

Referring to Figures 5 and 6, in this embodiment, a soft film display screen manufacturing process is proposed for producing the above-mentioned soft film display screen. The soft film display screen manufacturing process includes the following steps:

S1. Plate a metal film on the flexible transparent substrate 1; the metal film may be a copper film. The flexible transparent substrate 1 is primed by sputtering (RTR sputtering machine) or evaporation (RTR evaporating machine), and then electroplating or chemical plating (RTR electroplating machine or RTR chemical plating machine) is applied on it. A layer of copper film can be applied on one side or both sides.

S2. Install photosensitive resin on the metal film, and obtain the grid substrate 2 after processing. The production process of roll-to-roll lines is realized.

Referring to Figure 7, in S2: S21, heat paste (RTR laminating machine) or coat (RTR coating machine) photosensitive resin on the metal film.

S22. Install a photomask on the photosensitive resin, and expose the photosensitive resin on the metal film.

S23. Use (RTR development-etching-film removal line) developer to remove the uncured photosensitive resin from the metal film. The cured photosensitive resin is to protect the metal film circuit.

S24. Use (RTR development-etching-film removal line) etching solution to remove the metal layer in the uncured photosensitive resin area, leaving a metal layer protected by the resin.

S25. Use the (RTR development-etching-film removal line) film removal liquid to remove the remaining photosensitive resin to obtain the grid substrate 2.

S26. Use (RTR protection solution-nickel/tin wire) protection solution and nickel or tin solution to deposit a protective layer and a nickel or tin layer on the grid substrate 2.

S3. Mounting of LED substrate 3. The roll-to-roll LED substrate 3 mounting process is realized.

Referring to Figure 8, in S3: S31. Screen or stencil print (RTR automatic printer) solder paste at the soldering position of the substrate layer.

S32. Use (RTR chip placement machine) to mount the chip lamp beads, chip resistors and chip capacitors at the welding positions on the substrate layer.

S33. Use (RTR reflow oven) to remove the solder paste at the soldering position and degrease it, then soften and melt it to tightly adhere the substrate layer to the chip lamp beads, chip resistors, and chip capacitors.

S4. Use (RTS cutting machine) to cut ribbon roll material according to customer requirements.

The roll-to-sheet finished product line separation process has been realized. The working machines in the steps are only in this implementation One possibility of use, but not limited to this type. It can be cut to any size according to customer needs with high precision. When the cutting size needs to be changed, there is no need to adjust the processing parameters, and the processing is convenient and fast. When customers need to produce displays with FPC, they can reserve 2 lengths of grid substrates in advance. There is no need to change the processing technology and equipment parameters, and the conversion is quick and easy.

Obviously, the described embodiments are only some of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in this field and related fields without creative efforts should fall within the scope of protection of the present invention. The structures, devices and operating methods that are not specifically described and explained in the present invention are all implemented according to conventional means in the art unless otherwise specified or limited.

1: Flexible transparent substrate

2: Grid substrate

3:LED substrate

4:Display unit

Claims (10)

A soft film display screen, characterized in that the soft film display screen includes a flexible transparent substrate, a grid substrate and an LED substrate, and the flexible transparent substrate, the grid substrate and the LED substrate are stacked in sequence; Flexible transparent substrate forms the supporting body; The grid substrate is a flexible grid-like thin-layer metal structure, which is used for conductive structures; The LED substrate includes a substrate layer and a display unit; the display unit is fixedly connected to the substrate layer, is between the substrate layer and the grid substrate, and is connected to the welding position of the grid substrate; The substrate layer material is one or more of PVB, EVA, POE, SGP, silicone, and acrylic glue; the thickness of the substrate layer is greater than 5/3 times the thickness of the display unit. According to a soft film display screen according to claim 1, the flexible transparent substrate is flexible glass or a flexible transparent substrate, and the flexible transparent substrate is PA, PET, PEEK, CPI, PEI, PEN, PMMA, COC , COP, PC, LSR, FEP, SMMA, GPPS, PETG or PPSU. According to the soft film display screen of claim 1, the thickness of the flexible transparent substrate is between 9um and 3cm. According to the soft film display screen of claim 1, the grid substrate is made of gold, silver, copper, stainless steel or an alloy material thereof. According to a soft film display screen according to claim 1, the grid line width of the grid substrate is between 1um and 5mm; the grid line thickness is between 0.1um and 300um; and the grid line spacing is between 1um and 10mm. between. According to a soft film display screen according to claim 1, the display unit includes: SMD lamp beads, SMD resistors and SMD capacitors. A soft film display, including a control board and a connector, applied to a soft film display screen according to any one of claims 1-6, characterized in that the connector is connected with pins, and the pins are inserted into the display screen and connected with the soft film display screen. The grid substrate is welded, a slot is provided on the control board, and the connector is stuck inside the slot. A soft film display screen manufacturing process, used to produce the soft film display screen described in any one of claims 1-6, the soft film display screen manufacturing process includes the following steps: S1. Make a primer on the flexible transparent substrate, and then coat it with a metal film; S2. Install photosensitive resin on the metal film and obtain a grid substrate after processing; S3. Install the display unit at the welding position of the substrate layer to form an LED substrate, and adhere the LED substrate corresponding to the grid substrate; S4. Cut the ribbon roll material. A soft film display screen manufacturing process according to claim 8, characterized in that step S2 is specifically: S21. Set photosensitive resin on the metal film; S22. Install a photomask on the photosensitive resin and expose the photosensitive resin on the metal film; S23. Use a developer to remove the uncured photosensitive resin from the metal film; S24. Use etching liquid to remove the metal layer in the photosensitive resin area that is not light-cured; S25. Use a film removal solution to remove the remaining photosensitive resin to obtain a grid substrate; S26. Use protective liquid and nickel chemical or tin chemical liquid to deposit a protective layer and a nickel or tin layer on the grid substrate. A soft film display screen manufacturing process according to claim 8, characterized in that step S3 is specifically: S31. Print solder paste on the screen or steel plate at the welding position of the substrate layer; S32. Place the chip lamp beads, chip resistors and chip capacitors at the welding positions on the substrate layer; S33. After degreasing the solder paste remover at the soldering position, soften and melt the substrate layer to tightly adhere to the chip lamp beads, chip resistors and chip capacitors.

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