JP2011054055A - Touch panel and manufacturing method for touch panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a touch panel to which a flexible printed board is easily connected, and a manufacturing method for the same. <P>SOLUTION: The touch panel includes a first and second transparent substrates 100a and 100b which are disposed facing each other, a first transparent electrode 300a arranged on an inner surface of the substrate 100a, a second transparent electrode 300b arranged on an inner surface of the substrate 100b, a first lead wire 400a arranged on the inner surface of the substrate 100a and connected to the transparent electrode 300a, a second lead wire 400b arranged on the inner surface of the substrate 100b and connected to the transparent electrode 300b, a transfer lead wire 500 arranged on the inner surface of the substrate 100a, a common transfer part 600 for electrically connecting the lead wire 400b and the transfer lead wire 500, and the flexible printed board 700 connected to the lead wire 400a and the transfer lead wire 500 on the inner surface of the substrate 100a. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a touch panel and a method for manufacturing a touch panel.

  As this type of touch panel, a flexible printed circuit board is inserted between transparent first and second substrates disposed opposite to each other, and the first surface of the flexible printed circuit board is a first surface on the surface of the first substrate. Among the lead wires, the second surface of the flexible printed circuit board is connected to the second lead wire on the surface of the second substrate (see FIG. 6 of Patent Document 1).

International Publication WO2005 / 017732

  In the touch panel, the flexible printed circuit board is inserted between the first and second substrates, and the first surface of the flexible printed circuit board is used as the first lead line on the surface of the first printed circuit board. Must be connected to a second lead line on the surface of the second substrate. Therefore, it is difficult to connect the flexible printed circuit board to the first and second lead lines of the first and second substrates, and the workability is poor.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide a touch panel capable of easily connecting a flexible printed circuit board and a method for manufacturing the touch panel.

  In order to solve the above-mentioned problems, a touch panel according to the present invention is provided on first and second bases that are arranged to face each other and at least one is transparent, and on a second base-facing surface of the first base. The first transparent electrode, the second transparent electrode provided on the first substrate facing surface of the second substrate, the second transparent electrode provided on the second substrate facing surface of the first substrate and the first transparent electrode A first lead line connected to the first transparent electrode; a second lead line provided on the first base-facing surface of the second base and connected to the second transparent electrode; A transition lead line provided on a second base-facing surface of one base body, a common transition portion for conducting the second lead line and the transition lead line, and a second base body of the first base body Flexible connected to the first lead wire and the transition lead wire on the opposite surface And a printed circuit boards.

  In the case of such a touch panel, the second lead-out line on the first base-facing surface of the second base becomes the transition lead-out line on the second base-facing surface of the first base by the common transition portion. Conducted. That is, a part of the second lead line on the first base-facing surface of the second base is moved to the second base-facing surface side of the first base as the transition lead-out line by the common transition portion. It has been transferred. For this reason, the flexible printed circuit board can be connected to the first lead wire and the transition lead wire at a time on the second substrate facing surface of the first substrate, so that the flexible printed circuit board and the first lead wire can be connected. Connection work with the wire and the transition lead wire is simplified. Further, since the first lead lines and the transition lead lines are concentrated on the first substrate side, the wiring of the first lead lines and the transition lead lines can be simplified. Furthermore, even when the flexible printed circuit board is crimped and connected to the second substrate-facing surface of the first substrate, crimping and fixing can be performed on one side of the flexible printed circuit board, so that an inexpensive flexible printed circuit board can be used. it can.

  It can be set as the structure filled with resin between the said 1st, 2nd base | substrate. By filling the resin between the first and second bases in this way, it becomes difficult for bubbles to be mixed between the first and second bases.

  A notch for exposing a part of the first lead line and the transition lead line may be provided at an end of the second base. The flexible printed circuit board is connected to the first lead-out line and the transition lead-out line in a state where the end of the flexible printed board is inserted into the notch. In this case, since a part of the first lead line and the transition lead line are exposed from the notch, the end portion of the flexible printed board can be easily connected. In addition, since a part of the second lead line on the second base is transferred to the first base side as the transition lead line by the common transition portion, the second lead line of the second base is moved to the first base side. The second lead line is not provided in a region facing one lead line and a part of the transition lead line. By providing the notch in the region, there is no need to provide a connection for connecting a flexible printed circuit board to the first base. That is, since it is not necessary to increase the outer shape of the first base, it is possible to prevent the touch panel from becoming large. In addition, since the first lead line and the transition lead line are partially exposed by the notch, the first lead line and the transition lead line are buried by the resin when the resin is filled. There is no end.

  The first and second bases may be provided with a cut-off portion that is continuous with the end portions of the first and second bases. The cut-off portion of the first or second base is provided with a recess that exposes a part of the cut-off portion of the second or first base, and the resin is dropped on a part of the cut-off portion. In addition, it is filled between the first and second substrates. In this case, when the resin is dropped onto a part of the cut-off portion, the resin advances between the first and second bases due to the surface tension of the resin and is filled between the first and second bases. Therefore, the resin can be easily filled between the first and second substrates.

  The first or second base may be provided with a convex cut-out portion. The resin is dropped on the cut-off portion and filled between the first and second substrates. In this case, when the resin is dropped onto the cut-off portion, the resin advances between the first and second substrates and is filled between the first and second substrates. Therefore, the resin can be easily filled between the first and second substrates.

  The first and second bases can be arranged such that a part of the first base and a part of the second base do not face each other. The resin is dropped onto a part of the first or second substrate and filled between the first and second substrates. In this case, when the resin is dropped onto a part of the first or second substrate, the resin advances between the first and second substrates and is filled between the first and second substrates. Therefore, the resin can be easily filled between the first and second substrates.

  As the common transition portion, a conductive paste or an adhesive resin containing conductive particles can be used. In particular, when the adhesive resin is used, since the second lead wire and the transition lead wire are conducted by the conductive particles, a stable conduction state can be maintained even if the touch panel is bent. it can. The transition lead line can be a metal wire. In this case, the wiring resistance of the transition lead line can be reduced. Furthermore, the resin may contain a gap agent that maintains the distance between the first and second substrates. In this case, the gap agent can stably maintain the distance between the first and second substrates.

  The touch panel manufacturing method of the present invention includes first and second substrates at least one of which is transparent, the first substrate having a first transparent electrode, a first lead line connected thereto, and a transition lead. The line is a method of manufacturing a touch panel in which a second transparent electrode and a second lead line connected to the second transparent electrode are provided on the second base. In this method, an adhesive resin containing a conductive paste or conductive particles is applied onto the transition lead line of the first base or the second lead line of the second base, and then the first base and the first base And the second lead line or the transition lead line are attached to the conductive paste or adhesive resin, whereby the transition lead line and the second lead line are attached to the conductive paste or adhesive resin. Then, the end portion of the flexible printed circuit board is connected to the first lead line and the transition lead line on the second base-facing surface of the first base.

  In such a touch panel manufacturing method, a conductive paste or an adhesive resin containing conductive particles is applied onto the transition lead line of the first base or the second lead line of the second base, and the first base The second lead line on the first substrate-facing surface of the second substrate and the second substrate of the first substrate are simply overlapped with the second substrate by the conductive paste or adhesive resin. The transition lead line on the surface facing the substrate is electrically connected. That is, a part of the second lead line on the second base body can be transferred to the second base surface facing side of the first base body as the transition lead line by the common transition portion. Therefore, the flexible printed circuit board can be connected to the first lead line and the transition lead line at a time on the second base facing surface of the first base body, so that the flexible printed circuit board and the first lead line can be connected. Connection work with the wire and the transition lead wire is simplified. Further, since the first lead lines and the transition lead lines are concentrated on the first substrate side, the wiring of the first lead lines and the transition lead lines can be simplified. Furthermore, even when the flexible printed circuit board is crimped and connected to the second substrate facing surface of the first substrate, since the crimping and fixing is performed on one side of the flexible printed circuit board, an inexpensive flexible printed circuit board can be used. .

  Before applying the conductive paste or the adhesive resin on the transition lead line of the first base or the second lead line of the second base, a notch is formed at the end of the second base. be able to. In this case, when the first base and the second base are overlapped, a part of the first lead line and the transition lead line is exposed from the notch. Then, after the transition lead line and the second lead line are made conductive through the conductive paste or adhesive resin, the resin is filled between the first and second substrates. Thereafter, the end of the flexible printed circuit board is inserted into the notch and connected to the first lead line and the transition lead line on the second base-facing surface of the first base. Thus, after exposing a part of said 1st lead wire and transition lead wire from the said notch part, it fills between the said 1st, 2nd base | substrate, and this 1st lead wire is filled. It is possible to avoid the line and the transition lead line from being buried. Moreover, since a part of said 1st lead line and transition lead line is exposed from the said notch part, the edge part of a flexible printed circuit board can be connected easily. In addition, the cutout portion has moved a part of the second lead line to the first base side as a transition lead line by the common transition portion, so that the first lead line of the second base and The second lead line is not provided in a region facing a part of the transition lead line. By providing the notch in the region, there is no need to provide a connection for connecting a flexible printed circuit board to the first base. That is, since it is not necessary to increase the outer shape of the first base, it is possible to prevent the touch panel from becoming large.

  Before applying the conductive paste or the adhesive resin on the transition lead line of the first base or the second lead line of the second base, a cut-off portion continuous with the end of the first base or the second base A recess can be provided. In this case, when the first base and the second base are overlaid, the cut-out portion of the first base and the cut-out portion of the second base are arranged to face each other, and the concave portion A part of the cut-off portion of the second or first base is exposed. After the transition lead line and the second lead line are made conductive through the conductive paste or adhesive resin, a resin is dropped on the part of the cut-off portion between the first and second bases. Fill. Thereafter, the cut-off portion may be separated from the first and second bases. In this way, just by dropping the resin onto the part of the cut-off portion, the resin advances between the first and second bases by surface tension and fills between the first and second bases. Is done. Therefore, the resin can be easily filled between the first and second substrates.

  In addition, before applying the conductive paste or the adhesive resin on the transition lead line of the first base or the second lead line of the second base, a convex cut-off portion is formed on the first base or the second base. It can be provided. In this case, when the first base and the second base are overlapped, the cut-off portion is disposed so as not to overlap the second or first base. Then, after the transition lead line and the second lead line are made conductive through the conductive paste or adhesive resin, the resin is dropped into the cut-off portion and filled between the first and second bases. Then, the cut-off portion may be cut off from the first or second base. In this way, simply by dropping the resin onto the cut-off portion, the resin advances between the first and second substrates by surface tension and is filled between the first and second substrates. Therefore, the resin can be easily filled between the first and second substrates.

  When the first base and the second base are overlapped, a part of the first base and a part of the second base can be arranged so as not to overlap each other. In this case, after the transition lead line and the second lead line are made conductive through the conductive paste or the adhesive resin, a resin is dropped on the part of the first or second base to drop the first lead line. It is preferable to fill between the second bases, and then to cut off the portions of the first and second bases. In this way, simply by dropping the resin onto the cut-off portion, the resin advances between the first and second substrates by surface tension and is filled between the first and second substrates. Therefore, the resin can be easily filled between the first and second substrates.

1 is a schematic plan view of a touch panel according to an embodiment of the present invention. (A) is typical AA sectional drawing in FIG. 1 of the said touch panel, (b) is typical BB sectional drawing in FIG. 1 of the said touch panel. (A) is a schematic diagram which shows the inner surface of the 1st base | substrate of the said touch panel, (b) is a schematic diagram which shows the inner surface of the 2nd base | substrate of the said touch panel. (A) is a schematic diagram which shows the inner surface of the 1st film used for manufacture of the said touch panel, (b) is a schematic diagram which shows the inner surface of the 2nd film used for manufacture of the said touch panel. It is a schematic diagram which shows the process of laminating | stacking the said 1st, 2nd film and filling resin among the manufacturing processes of the said touch panel, Comprising: (a) is a top view, (b) is FIG.5 (a). CC sectional drawing, (c) is DD sectional drawing in Fig.5 (a). It is a figure which shows the example of a change of the process of filling resin between the 1st, 2nd films of the said touch panel, Comprising: (a) dripping resin to the convex-shaped cut-off part provided in the 1st film The top view which shows a state, (b) is EE sectional drawing in Fig.6 (a). It is a figure which shows the example of a change of the process of laminating | stacking the 1st, 2nd film of the said touch panel, Comprising: (a) is a top view which shows the state which shifted | superposed the 1st, 2nd film, and superimposed. FIG. 7B is a sectional view taken along line FF in FIG.

  Hereinafter, a touch panel according to an embodiment of the present invention will be described with reference to FIGS. 1 to 3. The touch panel shown in FIGS. 1 and 2 is a capacitive touch panel. The touch panel includes first and second bases 100a and 100b, a resin adhesive 200 (resin), a plurality of first and second transparent electrodes 300a and 300b, and a plurality of first and second lead lines. 400a, 400b, a transition lead line 500, a common transition portion 600, and a flexible printed circuit board 700 are provided. Hereinafter, each part will be described in detail.

  The first and second substrates 100a and 100b are rectangular transparent films made of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), or the like. The first and second bases 100a and 100b are arranged to face each other with a space therebetween. A resin adhesive 200 is filled between the first and second bases 100a and 100b. As this resin adhesive 200, UV curable resin containing gap agents (transparent spherical plastic fine particles of about 10 μm) such as SP-210 manufactured by Sekisui Chemical Co., Ltd. is used. A gap between the first and second bases 100a and 100b is maintained by the gap agent. As shown in FIG. 3A, the first transparent electrode 300a, the first lead line 400a, and the transition lead line 500 are provided on the inner surface of the first base body 100a (ie, the second base surface). It has been. As shown in FIG. 3B, a second transparent electrode 300b and a second lead line 400b are provided on the inner surface of the second substrate 100b (that is, the first substrate-facing surface). In addition, in the region facing the first lead line 400a and the part of the transition lead line 500 (the other end part in the length direction to be described later) on the outer peripheral edge of the second base body 100b, the second lead line 300b is provided. Not provided. A substantially rectangular notch 110b is provided in the region. The width dimension of the notch 110 b is larger than the width dimension of the flexible printed circuit board 700.

  Each first transparent electrode 300a is an X-row electrode formed by depositing or applying the following material on the inner surface of the first base 100a. Each second transparent electrode 300b is a Y-row electrode formed by evaporating or applying the following material on the inner surface of the second substrate 100b. As shown in FIG. 1, the first transparent electrode 300a and the second transparent electrode 300b are orthogonally arranged in a planar position. As materials for the first and second transparent electrodes 300a and 300b, ITO (indium oxide + tin oxide), IZO (indium oxide + zinc oxide), AZO (AI-doped zinc oxide), conductive polymer (PEDOT) or PSS or the like is used.

  As shown in FIG. 2A, when the outer surface of the second base 100b is touched with a finger, a capacitance is generated between the first transparent electrode 300a closest to the finger and the finger, and A capacitance is generated between the second transparent electrode 300b closest to the finger and the finger. Along with this, the capacitance between the first and second transparent electrodes 300a and 300b closest to the finger becomes higher than the others, and as a result, the position of the finger is specified.

  Each first lead line 400a is a lead formed by depositing or applying the same material as the first transparent electrode 300a on the inner surface of the first base body 100a. One end of the first lead line 400a in the length direction is connected to the end of the first transparent electrode 300a as shown in FIGS. 1 and 3A. The other end in the length direction of the first lead line 400a is exposed from the notch 110b of the second base body 100b, as shown in FIG. Each second lead line 400b is a lead formed by depositing or applying the same material as the second transparent electrode 300b on the inner surface of the second base body 100b. One end of the second lead line 400b in the length direction is connected to the end of the second transparent electrode 300b as shown in FIGS. 1 and 3B. The other end portion in the length direction of the second lead line 400b is located above one end portion in the length direction of the transition lead line 500, as shown in FIGS. 1 and 2B.

  Each transition lead-out line 500 is a metal film (that is, a metal line) formed on the inner surface of the first base body 100a. One end of the transition lead line 500 in the length direction is connected to the other end of the second lead line 400b via a common transition part 600 as shown in FIGS. 1 and 2B. . That is, a part of the second lead line 400b on the second base body 100b is transferred to the first base body 100a as the transfer lead line 500 by the common transfer portion 600. As shown in FIG. 1, the other end of the transition lead line 500 in the length direction is exposed from the notch 110b of the second base body 100b. The other end portion of the transition lead wire 500 and the other end portion of the first lead wire 400a are arranged in a row at a distance from the notch portion 110b on the inner surface of the first base body 100a.

  As shown in FIG. 2B, the common transition portion 600 is a silver paste or a UV curable resin (adhesive resin) that electrically connects the one end portion of the transition lead wire 500 and the other end portion of the second lead wire 400b. ). The UV curable resin contains a conductive spacer (for example, AU-210 manufactured by Sekisui Chemical Co., Ltd. (plastic fine particles of about 10 μm whose surface is gold-plated)) in which resin balls are subjected to conductive plating. Yes. The conductive spacer exhibits a function of establishing conduction between the one end portion of the transition lead line 500 and the other end portion of the second lead line 400b and maintaining a constant gap therebetween.

  The flexible printed circuit board 700 is well known. An end portion of the flexible printed circuit board 700 in the length direction is inserted into the cutout portion 110b of the second base body 100b, and is crimped to a portion exposed from the cutout portion 110b on the inner surface of the first base body 100a. In this state, the conductive lines (not shown) of the flexible printed circuit board 700 are connected to the first lead lines 400a and the transition lead lines 500, respectively.

  Hereinafter, the assembly procedure of the touch panel having the above-described configuration will be described with reference to FIGS. First, first and second films F1 and F2 which are rectangular transparent films are prepared. The first and second films F1 and F2 are made of the same material as the first and second substrates 100a and 100b. As shown in FIG. 4, the first and second films F1 and F2 are formed on the base body portions 10a and 10b, which are portions forming the first and second base bodies 100a and 100b, and outside the base body portions 10a and 10b. It has frame-shaped cut-out portions 20a and 20b that are continuous with the peripheral portion. That is, the outer shapes of the first and second films F1 and F2 are larger than the outer shapes of the first and second substrates 100a and 100b.

  Next, ITO or the like is vapor-deposited or applied on the surface of the base body portion 10a of the first film F1, thereby forming the first transparent electrode 300a and the first lead line 400a. Then, a transition lead line 500 is formed by depositing or coating a metal film on the surface of the base body 10a. On the other hand, ITO or the like is vapor-deposited or applied on the surface of the base body portion 10b of the second film F2, thereby forming the second transparent electrode 300b and the second lead line 400b. Thereafter, both long side portions of the cut-off portion 20b of the second film F2 are partially cut to form four concave portions 21b. Further, the short side portion of the cut-off portion 20b of the second film F2 and the base body portion 10b following the cut-off portion 20b are partially cut to form a cutout portion 22b. On the other hand, the part corresponding to the notch part 22b of the short side part of the cut-off part 20a of the 1st film F1 is cut, and the notch part 21a is formed.

  Thereafter, as shown in FIG. 4A, a UV curable resin containing a silver paste or a conductive spacer is applied on one end of the transition lead wire 500 of the first film F1. Thereafter, as shown in FIG. 5, the first film F1 and the second film F2 are overlapped, and the base body 10a and the base body 10b are made to face each other with the cut-off portion 20a and the cut-off portion 20b. Thereby, the silver paste or the UV curable resin adheres to the other end portion of the second lead line 400b of the second base body 100b. Thereafter, the silver paste or UV curable resin is cured. In the case of a UV curable resin, the UV curable resin is irradiated with UV using a UV lamp or the like to cure the UV curable resin. The common paste 600 is formed by curing the silver paste or the UV curable resin.

  Then, the resin adhesive 200 is dripped at the part exposed from the recessed part 21b of the cut-off part 20a of the 1st film F1. The viscosity of the resin adhesive 200 at this time shall be 10,000 cp or less. The dropped resin adhesive 200 advances between the first and second films F1 and F2 by surface tension and is filled between the first and second films F1 and F2. At this time, since the surface tension does not act on the notches 21a and 22b of the first and second films F1 and F2, the resin adhesive 200 is not filled. Therefore, the resin adhesive 200 does not adhere to the portion (the other end portion) exposed from the cutout portion 22b of the first lead wire 400a and the transition lead wire 500, and the connection with the flexible printed circuit board 700 described later is hindered. I can't.

  When the resin adhesive 200 is filled between the first and second films F1 and F2, the resin adhesive 200 is irradiated with UV using a UV lamp or the like to cure the resin adhesive 200. Thereafter, the cut-off portions 20a and 20b of the first and second films F1 and F2 are separated from the base body portions 10a and 10b. Thereby, the base body portions 10a and 10b become the first and second base bodies 100a and 100b, and the cutout portion 22b of the base body portion 10b becomes the cutout portion 110b of the second base body 100b.

  Thereafter, as shown in FIG. 1, the end portion of the flexible printed circuit board 700 is inserted into the notch portion 110b, and is crimped and connected to the portion exposed from the notch portion 110b of the first base body 100a. At this time, the conductive lines of the flexible printed circuit board 700 are in contact with and connected to the exposed portions (the other end portions) of the first lead lines 400a and the transition lead lines 500.

  In the case of such a touch panel, the second lead line 300b on the inner surface of the second base body 100b is electrically connected to the transition lead line 500 on the inner surface of the first base body 100a by the common transition portion 600. That is, a part of the second lead line 300b on the second base body 100b is transferred to the inner surface of the first base body 100a by the common transition portion 600 as the transition lead line 500. For this reason, the flexible printed circuit board 700 is simply inserted into the cutout portion 110b of the second base body 100b and crimped and connected to the exposed portion of the first base body 100a from the cutout section 110b. The line can be connected to the first lead line 400a and the transition lead line 500 exposed from the notch 110b at a time. Therefore, the connection work between the conductive line of the flexible printed circuit board 700, the first lead line 400a, and the transition lead line 500 can be easily performed. Further, since the first lead lines 400a and the transition lead lines 500 are concentrated on the first substrate 100a side, the first lead lines 400a and the transition lead lines 500 can be arranged in a line. That is, the wiring of the first lead line 400a and the transition lead line 500 can be simplified. Also in this respect, the connection between the conductive line of the flexible printed circuit board 700, the first lead line 400a, and the transition lead line 500 is simplified. In addition, since crimping and fixing are performed on one side of the flexible printed circuit board 700, an inexpensive flexible printed circuit board 700 can be used.

  Further, since a part of the second lead line 300b is moved to the first base body 100a side by the common transition part 600 as the transition lead line 500, the first outer peripheral edge part of the second base body 100b is arranged. The second lead line 300 b is not provided in a region facing the other end of the lead line 400 a and the transition lead line 500. Since the notch portion 110b is provided in the region, it is not necessary to provide a connection portion for connecting the flexible printed circuit board 700 to the first base body 100a. That is, since it is not necessary to increase the outer shape of the first base 100a, it is possible to prevent the touch panel from increasing in size.

  In addition, the touch panel mentioned above is not limited to the said embodiment, It can change arbitrarily in the range of description of a claim. Details will be described below.

  In the said embodiment, although the 1st, 2nd base | substrate 100a, 100b was a transparent film, it is not limited to this. For example, as the first and second bases 100a and 100b, transparent glass plates or resin plates can be used. In addition, both the first and second bases 100a and 100b are transparent. However, if the touch panel is not mounted on a liquid crystal display device or the like, only one of them may be transparent. . In the above embodiment, the resin adhesive 200 is filled between the first and second bases 100a and 100b. However, the present invention is not limited to this. For example, the first and second bases 100a and 100b can be bonded with a photocurable resin other than the UV curable resin, a thermosetting resin, a double-sided tape, or the like. Even if the first and second bases 100a and 100b are bonded with a double-sided tape or the like, a part of the second lead line 400b on the second base 100b is used as the transition lead line 500 by the common transition part 600. It is possible to transfer to the base 100a side and connect to the flexible printed circuit board 700 on the first base 100a.

  Further, although the second base 100b is provided with the notch 110b, the present invention is not limited to this. For example, a convex tongue can be provided on the outer peripheral edge of the first base body 100a, and the other ends of the first lead wire 400a and the transition lead wire 500 can be exposed on the tongue. In this case, the end of the flexible printed circuit board 700 is crimped on the tongue and connected to the other ends of the first lead wire 400a and the transition lead wire 500. When the second base 100b is not provided with the notch 110b, the first and second films F1 and F2 do not need to be provided with the notch 21a and the notch 22b.

  In the above embodiment, the common transition portion 600 is a UV curable resin containing a silver paste or a conductive spacer. However, as long as the second lead line and the transition lead line can be made conductive, May be used. For example, as the common transition portion 600, an adhesive resin containing conductive paste or conductive particles other than silver paste can be used. Examples of the adhesive resin include a photocurable resin or a thermosetting resin other than the UV curable resin containing conductive particles.

  In the above embodiment, the cut-off portion 20b is provided with the recess 21b. However, the cut-off portion 20a can be provided with a recess. In this case, the first film F1 may be placed facing upward, and the resin adhesive 200 may be dropped onto the portion of the second film F2 exposed from the recess. The cut-off portions 20a and 20b can be arbitrarily changed in design as long as they are continuous to the outside of the base body portions 10a and 10b.

  In the above embodiment, the first and second films F1 and F2 are configured to include the base body portions 10a and 10b and the cut-off portions 20a and 20b. However, the present invention is not limited to this. For example, as shown in FIG. 6, it is possible to provide a convex cut-off portion 10a 'on the first film F1'. In this case, the outer shapes of the first and second substrates F1 'and F2' are the same as the outer shapes of the first and second substrates 100a and 100b. The resin adhesive 200 is dropped on the cut-off portion 10a ', and the resin adhesive 200 is filled between the first and second bases F1' and F2 '. Thereafter, the cut-off portion 10a 'is separated from the first base body 100a, whereby the first and second base bodies F1' and F2 'become the first and second base bodies 100a and 100b. It is also possible to provide the convex cut-out part 10a 'on the second film F2'. In this case, the resin adhesive 200 is dropped on the cut-off portion 10a 'with the first film F1' facing upward.

  The second film F2 'can be provided with a notch 22b'. In this case, the notch 22b 'becomes the notch 110b. However, in the case where the notch 110b is not provided in the second base 100b, it is not necessary to provide the notch 22b 'in the second film F2'.

  In the above-described embodiment, the first and second films F1 and F2 are overlapped so as to be entirely overlapped. However, as shown in FIG. 7, the first and second substrates F1 ″ and F2 are overlapped. It is possible to superimpose by shifting the position so that one long side of '' does not overlap. In this case, the overlapping portions of the first and second bases F1 "and F2" become base body portions 10a "and 10b", and the non-overlapping portions become cut-off portions 20a "and 20b". The resin adhesive 200 is dropped on the cut-off portion 20a ″, and the resin adhesive 200 is filled between the first and second bases F1 ″ and F2 ″. Thereafter, the cut-off portions 20a '' and 20b '' are separated from the base body portions 10a '' and 10b '', so that the base body portions 10a '' and 10b '' become the first and second base bodies 100a and 100b. . Note that the resin adhesive 200 may be dropped on the cut-off portion 20b ″ with the first film F1 ″ facing upward. The first and second bases F1 ″ and F2 ″ are overlapped so that one long side portion does not overlap. However, the first and second bases overlap so that part of the first and second bases do not overlap. Just add.

  The second film F <b> 2 ″ can be provided with a notch 22 b ″. In this case, the notch 22b '' becomes the notch 110b. However, in the case where the cutout portion 110b is not provided in the second base 100b, it is not necessary to provide the cutout portion 22b ″ in the second film F2 ″.

  In the above embodiment, the materials, shapes, dimensions, arrangement, etc. constituting each part of the touch panel have been described as examples, and the design can be arbitrarily changed as long as the same function can be realized. is there. In addition, although the touch panel of the above embodiment is a capacitive type, it can be a resistive film type. Even in a resistive film type touch panel, a part of the second lead line 400b on the second base body 100b is transferred to the first base body 100a side by the common transition portion 600 as the transition lead line 500, and the first base body 100a side is transferred. It is possible to connect to the flexible printed circuit board 700 on the substrate 100a.

DESCRIPTION OF SYMBOLS 100a ... 1st base | substrate 100b ... 2nd base | substrate 110b ...... Notch part 200 ...... Resin adhesive 300a ... 1st transparent electrode 300b ... 2nd transparent electrode 400a ... ··· First lead line 400b ··· Second lead wire 500 ··· Transfer lead wire 600 ··· Common transfer portion 700 ··· Flexible printed circuit board F1 ··· First substrate 10a ··· Base body 20a ··· Cut-off portion 21a · Notch portion F2 ·········· Second base 10b · ··· Base body portion 20b · · Cut-off portion 21b · Recess portion 22b · Notch portion

Claims (14)

First and second substrates disposed opposite to each other and at least one of which is transparent;
A first transparent electrode provided on a second substrate-facing surface of the first substrate;
A second transparent electrode provided on the first substrate-facing surface of the second substrate;
A first lead line provided on the second substrate facing surface of the first substrate and connected to the first transparent electrode;
A second lead line provided on the first substrate facing surface of the second substrate and connected to the second transparent electrode;
A transition lead line provided on a second substrate-facing surface of the first substrate;
A common transition portion for conducting the second lead line and the transition lead line;
A touch panel comprising: a flexible printed circuit connected to the first lead line and the transition lead line on a second base facing surface of the first base. The touch panel according to claim 1.
A touch panel, wherein a resin is filled between the first and second substrates. The touch panel according to claim 2,
The end of the second base is provided with a notch for exposing a part of the first lead line and the transition lead line,
A touch panel, wherein an end portion of the flexible printed board is inserted into the cutout portion and is connected to the first lead wire and the transition lead wire. The touch panel according to claim 2 or 3,
The first and second bases are provided with a cut-off portion that is continuous with the ends of the first and second bases,
The cut-off portion of the first or second base is provided with a recess that exposes a part of the cut-off portion of the second or first base,
The touch panel, wherein the resin is dropped onto a part of the cut-off portion and filled between the first and second substrates. The touch panel according to claim 2 or 3,
The first or second base is provided with a convex cut-out portion,
The touch panel, wherein the resin is dropped into the cut-off portion and filled between the first and second substrates. The touch panel according to claim 2 or 3,
The first and second bases are arranged so that a part of the first base and a part of the second base do not face each other.
The touch panel, wherein the resin is dropped onto a part of the first or second base and filled between the first and second bases. The touch panel according to claim 1, 2, 3, 4, 5 or 6,
The touch panel, wherein the common transition portion is an adhesive resin containing conductive paste or conductive particles. The touch panel according to claim 1, 2, 3, 4, 5, 6 or 7,
The touch panel, wherein the transition lead line is a metal wire. The touch panel according to claim 2,
The touch panel, wherein the resin contains a gap agent that maintains a distance between the first and second substrates. First and second bases, at least one of which is transparent, have a first transparent electrode on the first base, and a first lead line and a transition lead line connected to the first base. A manufacturing method of a touch panel provided with a second transparent electrode and a second lead wire connected to the second transparent electrode,
Applying an adhesive resin containing a conductive paste or conductive particles on the transition lead line of the first base or the second lead line of the second base,
Thereafter, the first substrate and the second substrate are overlaid, and the second lead wire or the transition lead wire is attached to the conductive paste or adhesive resin, whereby the transition lead wire and the second lead wire are adhered to each other. Conducting the lead wire through the conductive paste or adhesive resin,
Thereafter, the end of the flexible printed board is connected to the first lead line and the transition lead line on the second base-facing surface of the first base. The touch panel manufacturing method according to claim 10,
Before applying the conductive paste or the adhesive resin on the transition lead line of the first base or the second lead line of the second base, a notch is formed at the end of the second base. ,
When the first base and the second base are overlapped, a part of the first lead line and the transition lead line is exposed from the notch,
After conducting the transition lead line and the second lead line through the conductive paste or adhesive resin, filling the resin between the first and second bases,
Then, the end of the flexible printed circuit board is inserted into the notch and connected to the first lead line and the transition lead line on the second base facing surface of the first base. Manufacturing method. The touch panel manufacturing method according to claim 10,
Before applying the conductive paste or the adhesive resin on the transition lead line of the first base or the second lead line of the second base, a cut-off portion continuous with the end of the first base or the second base A recess,
When the first base and the second base are overlaid, the cut-out portion of the first base and the cut-out portion of the second base are arranged to face each other, and the first base and the second base are opposed to each other. Exposing a part of the cut-off portion of 2 or the first substrate,
After the transition lead line and the second lead line are made conductive through the conductive paste or adhesive resin, a resin is dropped on the part of the cut-off portion between the first and second bases. Filling,
After that, the touch panel manufacturing method is characterized in that the cut-off portion is separated from the first and second bases. The touch panel manufacturing method according to claim 10,
Before applying the conductive paste or the adhesive resin on the transition lead line of the first base or the second lead line of the second base, a convex cut-off portion is provided on the first base or the second base. Every
When the first base and the second base are overlaid, the cut-off portion is disposed so as not to overlap the second or first base,
After conducting the transition lead wire and the second lead wire through the conductive paste or adhesive resin, the resin is dropped into the cut-off portion and filled between the first and second substrates,
Then, the said cut-off part is cut off from the said 1st or 2nd base | substrate, The manufacturing method of the touchscreen characterized by the above-mentioned. The touch panel manufacturing method according to claim 10,
When the first base and the second base are overlapped, a part of the first base and a part of the second base are arranged so as not to overlap each other.
After the transition lead line and the second lead line are made conductive through the conductive paste or adhesive resin, a resin is dropped on the part of the first or second base to add the first and second Filling between the substrates of
Then, the said 1st, 2nd base | substrate is cut off, The manufacturing method of the touchscreen characterized by the above-mentioned.

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