TW202332344A - Electroplating method of through holes of circuit board - Google Patents

Abstract

An electroplating method of through holes of a circuit board is provided. The electroplating method of the through holes of the circuit board includes a providing step, a drilling step and a copper plating step. In the providing step, the circuit board is provided. In the drilling step, the circuit board is drilled to form a plurality of through holes thereon. In the copper plating step, the circuit board is electroplated to form a copper plating layer on an inner wall of each of the through holes, and the current density during the copper plating step is inversely proportional to a thickness of the copper plating layer.

Description

Electroplating method for circuit board through hole

The invention relates to an electroplating method, in particular to an electroplating method for a through hole of a circuit board.

In recent years, with the rapid development of artificial intelligence, image recognition and other technologies, under the development requirements of high density, multi-function and miniaturization, the size of printed circuit boards needs to be further reduced, which undoubtedly increases the cost of printed circuit boards. Difficulty and cost of production. Among them, the copper plating process of through holes is particularly prone to the problem of corner cracks. Therefore, how to overcome the above-mentioned defects by improving the manufacturing process method and structural design has become one of the important issues that this enterprise intends to solve.

The embodiment of the present invention provides an electroplating method for through-holes of circuit boards, which can effectively improve defects that may occur in existing through-holes of circuit boards.

The embodiment of the present invention discloses a method for electroplating through-holes of a circuit board, which includes: providing a circuit board; drilling step: drilling the circuit board to form a plurality of through-holes corresponding to the circuit board ; and a copper plating step: electroplating the circuit board so that the inner walls of a plurality of through holes are respectively formed with a copper plating layer; Thickness is inversely proportional.

One of the beneficial effects of the present invention is that the electroplating method of the through-holes of the circuit board provided by the present invention can pass through "the copper plating step: electroplating the circuit board, so that the plurality of through-holes The inner wall is respectively formed with the copper plating layer; wherein, the current density during the implementation of the copper plating step is inversely proportional to the thickness of the copper plating layer” to solve the problem of the through hole of the circuit board. Corner crack problem.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings related to the present invention. However, the provided drawings are only for reference and description, and are not intended to limit the present invention.

The following is a description of the implementation of the "electroplating method for circuit board through-holes" disclosed in the present invention through specific specific examples. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple illustration, and are not drawn according to the actual size, which is stated in advance. In addition, if it is pointed out below that please refer to the specific drawing or as shown in the specific drawing, it is only used to emphasize the follow-up description. Most of the relevant content mentioned appears in the specific drawing, but not In this ensuing description, reference may be made to only the specific drawings described. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.

It should be understood that although terms such as "first", "second", and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are mainly used to distinguish one element from another element, or one signal from another signal. In addition, the term "or" used herein may include any one or a combination of more of the associated listed items depending on the actual situation.

Please refer to Figures 1 to 5, which are embodiments of the present invention. It should be noted that the drawings corresponding to this embodiment and the relevant quantities and shapes mentioned are only used for specific description The embodiments of the present invention are used to facilitate the understanding of the content of the present invention, and are not used to limit the protection scope of the present invention.

As shown in Figure 1 and Figure 5, the embodiment of the present invention provides a method S100 for electroplating through-holes of circuit boards, which includes in sequence: a providing step S101, a baking step S103, a drilling step S105, and a copper plating step S107 and a grinding step S109, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the electroplating method S100 for through-holes of the circuit board may not include the baking step S103 and the grinding step S109 .

For the convenience of description and understanding, the providing step S101 , the baking step S103 , the drilling step S105 , the copper plating step S107 and the grinding step S109 will be described in sequence. As shown in FIG. 1 and FIG. 4 and FIG. 5, in the providing step S101, a circuit board 100 is provided, and the circuit board 100 includes a circuit layer (not shown), and the circuit board 100 is provided in In this embodiment, it is preferably a multi-layer circuit board (Multi-Layer PCB), but the present invention is not limited thereto. For example, in other embodiments of the present invention, the circuit board 100 may also be a single-layer circuit board (Single-Layer PCB) or a double-layer circuit board (Double-Layer PCB).

Since the providing step S101 is not the main improvement point of the present invention, it will not be repeated here. The baking step S103 will be described below. As shown in FIG. 1 , in the baking step S103 , the circuit board 100 is baked at a temperature of 120°C˜130°C. In this way, the residual stress of the circuit board 100 in the previous process can be effectively eliminated, thereby improving the yield rate of the circuit board 100 in subsequent steps.

The baking step S103 has been introduced so far, and the drilling step S105 will be introduced below. As shown in FIGS. 1 to 5 , in the drilling step S105 , the circuit board 100 is drilled to form a plurality of through holes 1 corresponding to the circuit board 100 (not shown). Since the drilling step S105 is not the main improvement point of the present invention, it will not be repeated here.

The copper plating step S107 will be described below. As shown in FIGS. There is a copper plating layer 2 . Wherein, the current density during the implementation of the copper plating step S107 is inversely proportional to the thickness of the copper plating layer 2 .

Furthermore, after the copper plating layer 2 is electroplated on the plurality of through holes 1 of the circuit board 100 , a series of other related processes and reflow are usually performed subsequently, especially infrared reflow is often used. However, after multiple times of infrared reflow for the plurality of through-holes 1 after electroplating, corner cracks are prone to occur at the corners of the plurality of through-holes 1 .

In this regard, when the copper plating step S107 is implemented, if the current density during implementation is reduced, for example, the current density during the implementation of the copper plating step S107 is limited between 10ASF-20ASF, then more The thickness of the copper plating layer 2 at the corner of the through hole 1 (for convenience of description, hereinafter referred to as the corner copper thickness) will increase, so the probability of corner cracks at the corner will obviously decrease. Specifically, as shown in Table 1 below and shown in FIG. 2 , under the condition that a plurality of said through holes 1 have the same aperture and the same hole density, the experimental group with higher current density when the copper plating step S107 is implemented usually Has a relatively thick corner copper thickness. For example, comparing the experimental group 1.1 with the experimental group 3.1, the corner copper thickness of the experimental group 1.1 with a current density of 10.18 will be relatively thicker.

It should be noted that, for the experimental groups listed in Table 1, each group carried out 10 experiments in total, and the corner copper thickness of each group in Table 1 is the average value of the corner copper thickness of each of the 10 experiments. In order to avoid misunderstanding, hereby explain. Table 1 Current density (ASF) Aperture (mil) Pore density (pcs/cm²) Corner Copper Thickness (mil) Experimental group 1.1 10.18 7.9 70 0.5944375 Experimental group 1.2 10.18 7.9 90 0.5794375 Experimental group 1.3 10.18 7.9 120 0.5299375 Experimental group 1.4 10.18 7.9 150 0.53825 Experimental group 1.5 10.18 7.9 180 0.5061875 Experimental group 1.6 10.18 7.9 210 0.5240625 Experimental group 2.1 10.18 9.8 70 0.547875 Experimental group 2.2 10.18 9.8 90 0.5338125 Experimental group 2.3 10.18 9.8 120 0.511857143 Experimental group 2.4 10.18 9.8 150 0.517125 Experimental group 2.5 10.18 9.8 180 0.51 Experimental group 2.6 10.18 9.8 210 0.5062 Experimental group 3.1 15.27 7.9 70 0.4675 Experimental group 3.2 15.27 7.9 90 0.4499 Experimental group 3.3 15.27 7.9 120 0.448666667 Experimental group 3.4 15.27 7.9 150 0.45715 Experimental group 3.5 15.27 7.9 180 0.438277778 Experimental group 3.6 15.27 7.9 210 0.452 Experimental group 4.1 15.27 9.8 70 0.487583333 Experimental group 4.2 15.27 9.8 90 0.45805 Experimental group 4.3 15.27 9.8 120 0.44125 Experimental group 4.4 15.27 9.8 150 0.45375 Experimental group 4.5 15.27 9.8 180 0.42255 Experimental group 4.6 15.27 9.8 210 0.471045455

It should be added that the thickness of the copper plating layer 2 (corner copper thickness) can also be adjusted by adjusting the hole density of a plurality of the through holes 1 . Wherein, the thickness of the copper plating layer 2 is inversely proportional to the hole density of the plurality of through holes 1, and in this embodiment, the hole density of the plurality of through holes 1 is between 70/cm ² -210 Between pieces/cm ² .

Specifically, as shown in Table 1 above and shown in FIG. 3, when the copper plating step S107 is implemented, it can be found that under the same conditions, the lower the hole density of the plurality of through holes 1 is, the thicker the corner copper is. The thickness will be greater. For example, comparing the experimental groups 1.1 to 1.6, the lower the hole density of the plurality of through holes 1 is, the larger the corner copper thickness will be.

It should be added that the thickness of the copper plating layer 2 can also be adjusted by adjusting the diameters of the plurality of through holes 1 . Wherein, the thickness of the copper plating layer 2 is inversely proportional to the diameters of the plurality of through holes 1 . Specifically, as shown in Table 1 above, when the copper plating step S107 is implemented, it can be found that under the same conditions, the smaller the diameter of the plurality of through holes 1, the larger the corner copper thickness will be. . For example, comparing Experiment 1.1 to Experiment 2.1, the corner copper thickness of Experiment 1.1 with a hole size of 7.9 mil will be relatively larger.

It should be noted that although the thickness of the copper plating layer 2 at the corners of the plurality of through holes 1 is related to the current density when the copper plating step S107 is carried out, the diameter of the plurality of through holes 1 and the plurality of the through holes 1 The hole density of the through hole 1 has a certain trend relationship, but it is not without limitation. Specifically, in this embodiment, the opening size of each through hole 1 is at least 1 times the total thickness of the corresponding copper plating layer 2, and the current density, multi- The diameter of each through-hole 1 and the hole density of the plurality of through-holes 1 cannot be increased or decreased without limit, otherwise the openings of the plurality of through-holes 1 will be blocked. In addition, the thickness of the copper plating layer 2 at the corners of the plurality of through holes 1 is also limited by the line width of the circuit layer. proportional to the thickness.

The copper plating step S107 has been introduced so far, and the grinding step S109 will be introduced below. As shown in FIG. 1, in the grinding step S109, a grinding brush wheel 200 grinds the copper plating layer 2, and cuts the copper plating layer 2 on the opening of each through hole 1, and In this embodiment, the abrasive brush wheel 200 is preferably a wound abrasive brush wheel, and the material of the abrasive brush wheel 200 is selected from the group consisting of nylon, ceramic, diamond, and non-woven fabric. Wherein, the grinding brush wheel 200 is not a flocking type grinding brush wheel.

Further, assuming that the grinding brush wheel 200 is a flocking type grinding brush wheel, when the grinding brush wheel 200 grinds the copper plating layer 2, due to the bristles (not shown) of the flocking type grinding brush wheel The bristles are radial, so the bristles are likely to scratch the corners of the openings of each of the through holes 1 too much because the bristles are too long, resulting in a large proportion of the opening of each of the through holes 1 being cut.

When the grinding brush wheel 200 is a winding type grinding brush wheel, since the winding type grinding brush wheel is almost entirely in contact with the opening of each of the through holes 1, the opening of each of the through holes 1 will not be enlarged. Cut proportionally. In more detail, as shown in Table 2 below, it can be observed that under the same corner copper thickness, the average amount of copper reduction for the copper plating layer 2 of the wound-type abrasive brush wheel is significantly less than that of the hair-planted abrasive brush wheel for The average amount of copper reduction of the copper plating layer 2. Table 2 Corner copper thickness (u) test group Flocking winding Before scrubbing 709 709 After brushing 609 685 Experimental group a 599 686 Experimental group b 592 685 Experimental group c 610 685 Experimental group d 609 690 Experimental group e 615 695 Experimental group f average copper reduction 103.3 21.3

[Advantageous Effects of Embodiment]

One of the beneficial effects of the present invention is that the electroplating method S100 of the circuit board through hole provided by the present invention can pass through "the copper plating step S107: electroplating the circuit board 100, so that a plurality of the The inner walls of the through holes 1 are respectively formed with the copper plating layer 2; wherein, the current density during the implementation of the copper plating step S107 is inversely proportional to the thickness of the copper plating layer 2", to solve the problem of the circuit The problem of corner cracking of said through hole 1 of the board 100 .

Furthermore, the electroplating method S100 of the through-hole of the circuit board can pass "the grinding brush wheel 200 is a winding type grinding brush wheel, and the material of the grinding brush wheel 200 is selected from nylon, ceramics, The technical means of "a group composed of diamonds and non-woven fabrics" reduces the average copper reduction of the copper plating layer 2, thereby reducing the probability of corner cracks at the corners of the plurality of through holes 1.

The content disclosed above is only a preferred feasible embodiment of the present invention, and does not therefore limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

S100: Electroplating method for circuit board through hole S101: providing steps S103: baking step S105: Drilling step S107: copper plating step S109: grinding step 100: circuit board 1: Through hole 2: Copper plating layer 200: grinding brush wheel

FIG. 1 is a schematic flowchart of an electroplating method for through holes of a circuit board according to an embodiment of the present invention.

2 is a schematic diagram of the experimental data of the current density corresponding to the number of corner cracks during the copper plating step according to an embodiment of the present invention.

FIG. 3 is a schematic diagram of experimental data of the circuit board hole density corresponding to the number of corner cracks according to an embodiment of the present invention.

FIG. 4 is a schematic diagram of the action of the grinding brush wheel grinding the copper plating layer according to the embodiment of the present invention.

5 is a schematic diagram of another action of the grinding brush wheel grinding the copper plating layer according to the embodiment of the present invention.

S100: Electroplating method for circuit board through hole

S101: providing steps

S103: baking step

S105: Drilling step

S107: copper plating step

S109: grinding step

Claims (10)

A method for electroplating a through hole of a circuit board, comprising: providing step: providing a circuit board; Drilling step: drilling the circuit board to form a plurality of through holes corresponding to the circuit board; and Copper plating step: electroplating the circuit board so that the inner walls of the plurality of through holes are respectively formed with a copper plating layer; wherein, the current density during the implementation of the copper plating step is in a relationship with the thickness of the copper plating layer inverse ratio. The electroplating method for circuit board through-holes as described in claim 1, further comprising a baking step: baking the circuit board at a temperature of 120°C to 130°C; wherein, the baking step is carried out at the Carried out before the drilling step described above. The electroplating method for circuit board through holes as claimed in claim 1, which further includes a grinding step: grinding the copper plating layer with a grinding brush wheel, and cutting the plating on the opening of each through hole. copper layer. The electroplating method of circuit board through-hole as claimed in item 3, wherein, described grinding brush wheel is a winding type grinding brush wheel, and the material system of described grinding brush wheel is selected from nylon, pottery, diamond, non-woven cloth formed groups. The electroplating method for circuit board through holes according to claim 3, wherein the grinding brush wheel is not a flocking type grinding brush wheel. The electroplating method for circuit board through holes according to claim 1, wherein the thickness of the copper plating layer is inversely proportional to the hole density of the plurality of through holes. The electroplating method for circuit board through holes according to claim 6, wherein the hole density of the plurality of through holes is between 70 pcs/cm2 and 210 pcs/cm2. The electroplating method for through holes of circuit boards as claimed in claim 1, wherein the current density during the copper plating step is between 10ASF and 20ASF. The electroplating method for circuit board through holes according to claim 1, wherein the opening size of each through hole is at least 1 times the total thickness of the corresponding copper plating layer. The electroplating method for through holes of a circuit board according to claim 1, wherein the circuit board includes a circuit layer, and the line width of the circuit layer is proportional to the thickness of the copper plating layer.

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